CN218820747U - Radiation cooling system capable of being used outdoors - Google Patents
Radiation cooling system capable of being used outdoors Download PDFInfo
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- CN218820747U CN218820747U CN202222821268.4U CN202222821268U CN218820747U CN 218820747 U CN218820747 U CN 218820747U CN 202222821268 U CN202222821268 U CN 202222821268U CN 218820747 U CN218820747 U CN 218820747U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The utility model discloses a radiation cooling system which can be used outdoors, comprising a radiation refrigeration component, an anti-dewing component and a temperature control device; the anti-dewing component is closely attached to the cooling surface of the radiation refrigeration component. The semiconductor refrigerating element in the radiation refrigerating component is provided with a cold supply temperature control device, and is combined with the sky radiation refrigerating coating for heat dissipation to be used as a cold source of the system; the support frame is wrapped by a double-layer hollow infrared film, a closed gas layer is formed between the two layers of films and covers the lower surface of a metal plate in the radiation refrigeration component, and a low-temperature cold source is separated from indoor humid air to serve as an anti-condensation component. The technical scheme can lead outdoor high-temperature heat radiation to penetrate through the double-layer hollow infrared film and be taken away by the low-temperature cold source, thereby improving the radiation cooling capacity; the temperature of the outdoor air contact surface can be maintained above the dew point temperature of outdoor air, so that condensation is avoided; meanwhile, the refrigeration can be timely supplied according to the outdoor thermal environment and the personnel demand, the refrigeration efficiency is improved, and the energy-saving, low-carbon and environment-friendly effects are realized.
Description
Technical Field
The utility model relates to an outdoor refrigeration technology field, concretely relates to but radiation cooling system of outdoor use.
Background
In recent years, high-temperature weather frequently appears in summer and lasts for a long time. With the trend of people to good life and the improvement of the requirements on life quality, the requirements on outdoor thermal environment and thermal comfort are continuously improved. Outdoor air conditioning technology is in process of operation and develops rapidly. However, at present, no effective solution for the outdoor cooling problem exists.
The traditional air conditioning system takes away cold energy through air circulation to realize the cooling of the whole space, and then cools a human body in the space through indoor cold air, and a large amount of cold energy is consumed in the air and is not effectively utilized by the human body, so that energy waste is caused. It is not suitable for open places such as corridors, outdoor dining and drinking places, outdoor traveling or camping, outdoor kiosks, bus stations and the like. Even if the air conditioning is carried out all day long, the heat comfort is difficult to achieve, the energy consumption of the air conditioner is large, the power distribution cost is high, and the design concept of energy conservation and environmental protection is not met. The radiation cold supply air-conditioning system directly utilizes the cold energy by the human body through radiation heat exchange, does not need an intermediate medium, has higher energy-saving property and comfort, and can also be applied to outdoor places.
The radiation cooling system is more prone to the problems of condensation at the tail end of the metal plate and limited cooling capacity. According to statistics, the average temperature of most areas of the whole country in summer reaches 35 ℃, the highest temperature of part of areas even reaches more than 40 ℃, the dew point temperature of outdoor air is higher, and because the surface temperature of the metal plate is lower than the dew point temperature of the outdoor air, water vapor in the air can be condensed into water drops, so that local artificial rainfall is easier to form in high-humidity areas, and bacteria are bred. Condensation heat is released in the condensation process of water vapor, so that cold loss is caused, and the infrared emission performance of the emission layer on the surface of the metal plate is influenced. Therefore, it is urgently required to develop a radiation cooling system having an anti-dewing effect. In addition, the conventional radiation cooling system needs to manually adjust the cooling output according to the feeling of the ambient temperature, which is likely to cause the loss of cooling capacity, and thus, a design of a temperature control radiation cooling system that overcomes the above problems is urgently needed.
In view of the foregoing, in order to meet the demand of people for a good life and an improvement in quality of life, there is an urgent need to develop an energy-saving and low-carbon type radiant cooling system having an anti-condensation member for outdoor use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a but outdoor use's radiation cooling system to metal sheet surface dewfall in solving outdoor current radiation cooling system, the cold supply ability restricted and the outdoor environment problem that cold source transport cost is high.
In order to achieve the above object, the utility model provides a following technical scheme:
a radiant cooling system, characterized by: the device comprises a radiation refrigeration component, an anti-condensation component and a temperature control device; the anti-dewing component is tightly attached to the cooling surface of the radiation refrigeration component, and the temperature control device is electrically connected with the radiation refrigeration component.
The radiation refrigeration component comprises a semiconductor refrigeration element, a heat preservation and insulation layer, radiation refrigeration coating and a metal plate; the radiation refrigeration component is a refrigeration system formed by combining a plurality of semiconductor refrigeration elements, does not need to use a refrigerant, has short response time and can realize intermittent or continuous refrigeration; the semiconductor refrigeration element is wrapped by the heat-insulation layer and is integrally attached to the upper surface of the metal plate, the surface of the hot end of the semiconductor refrigeration element is coated with the radiation refrigeration coating as a heat dissipation material of the semiconductor refrigeration element, and when the hot end dissipates heat, the radiation refrigeration coating can quickly dissipate the heat of the hot end into the surrounding environment, so that the heat dissipation power consumption is saved, the refrigeration efficiency is improved, and the semiconductor refrigeration element is energy-saving and environment-friendly; the anti-condensation component comprises a double-layer hollow infrared membrane, a supporting frame and a sealed gas layer, the double-layer hollow infrared membrane comprises an upper radiation cooling supply membrane and a lower air contact membrane, the supporting frame is wrapped by the double-layer hollow infrared membrane, and the sealed gas layer is formed between the two membranes; the radiation cooling film covers the lower surface of the metal plate in the radiation cooling component to separate a low-temperature cold source from indoor humid air; the temperature control device comprises an outdoor environment thermal parameter and personnel thermal demand monitor, a parameter setting instrument, a parameter control instrument, a temperature sensor and a semiconductor refrigeration element, wherein the parameter setting instrument is connected with the outdoor environment thermal parameter and the personnel thermal demand monitor, the parameter control instrument is connected with a cooling temperature control instrument of the semiconductor refrigeration element, and the temperature sensor is respectively connected with the cooling temperature control instrument of the semiconductor refrigeration element, the outdoor environment thermal parameter and the personnel thermal demand monitor.
Furthermore, in the temperature control device, the outdoor environment thermal parameter and personnel thermal demand monitor is used for acquiring outdoor environment temperature and body surface parameters of personnel in an area as input variables; the parameter setting instrument comprises a display screen and is used for setting an environment thermal parameter and upper and lower limits of personnel thermal requirements; the parameter control instrument is a control algorithm and regulates and controls the cooling temperature of the semiconductor refrigeration element according to the parameter operation of the outdoor environment thermal parameter, the personnel thermal demand monitor and the parameter setting instrument; the temperature sensor measures the cooling temperature of the semiconductor refrigeration element as output quantity, feeds back the measurement result in time, and adjusts the cooling capacity in time according to the change requirements of environment and personnel parameters.
Preferably, the heat-insulating layer is made of polyurethane foam, and has good heat-insulating performance; the heat insulating layer is wrapped around the temperature control semiconductor refrigerating element radiation cooling device to prevent the cold and heat from dissipating to the periphery.
Preferably, the metal plate material can be aluminum, aluminum iron and the like, and has a high heat conductivity coefficient so as to realize high cooling capacity.
Further, the closed gas layer is a heat insulating layer formed by dry gas.
Preferably, the closed gas layer is a gas layer containing dry air, nitrogen or argon, a heat insulation layer with a very small heat conductivity coefficient is formed, and the closed interlayer structure is filled with the static dry gas layer, so that the overall heat conductivity coefficient can be effectively reduced, the overall thermal resistance is improved, and the double-layer hollow infrared membrane and the supporting frame thereof have the characteristics of low heat conductivity coefficient, high thermal resistance and high infrared transmittance on the whole; and a proper amount of drying agent is added into the closed gas layer, and the drying agent adsorbs water vapor in interlayer air, so that the interlayer air can be kept in a non-condensation state when being cooled, the condensation risk of the system is reduced, and the cooling capacity of the radiation air-conditioning system is improved.
Preferably, the radiation cooling film is tightly attached to the lower surface of the metal plate, the emissivity of the radiation cooling film in a wave band of 5-15 mu m is greater than 0.8, the film thickness is 10-100 mu m, and the surface temperature of the radiation cooling film is equal to the surface temperature of the metal plate. Its high penetrating ratio to infrared thermal radiation can make outdoor high temperature thermal radiation penetrate double-deck cavity infrared membrane and be taken away by low temperature cold source to promote the radiation cooling ability.
Preferably, the air contact film has a transmittance of more than 0.7 in a wave band of 5-15 microns, has low heat conduction resistance and high heat resistance to heat conduction, isolates a radiation cooling surface from indoor wet air, avoids direct contact with air, indirectly raises the temperature of the lower surface of the cooling surface in contact with the air, can maintain the temperature of the outdoor air contact surface above the dew point temperature of the outdoor air, and prevents the condensation phenomenon.
Further, the utility model provides a radiation cooling system provides power through photovoltaic board or battery.
The utility model provides a radiation cooling system technical scheme has following beneficial effect:
(1) The double-layer hollow infrared film is covered on the surface of the radiation refrigeration component, the surface of the radiation cooling component is separated from the contact surface of outdoor air, the radiation cooling component is used as an anti-condensation component of a radiation cooling system, wet air and a low-temperature cold source in the environment are separated, the condensation phenomenon can be prevented from occurring, the cooling capacity of the system is remarkably improved, the thermal injury to outdoor personnel in extremely high-temperature weather can be effectively reduced, the thermal comfort of outdoor workers and consumers is improved as much as possible, and a safe and good outdoor environment is created.
(2) The invention provides an outdoor radiation cooling system with a temperature control function, aiming at the problems of high energy consumption, large pollution and the like of the traditional outdoor air conditioning system. The semiconductor refrigeration element is pollution-free, noiseless, convenient and fast to install and long in service life, and the cooling capacity of the system can be timely regulated and controlled at any time through the temperature control device according to outdoor environment and personnel parameters, so that the semiconductor refrigeration element is more humanized and achieves the purposes of energy saving and carbon reduction.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic view of a radiant cooling system that may be used outdoors.
Fig. 2 is an exploded view of the radiant cooling member and the dewing prevention member.
Fig. 3 is a schematic sectional view of the radiation cooling member and the dew condensation preventing member.
Fig. 4 is a schematic diagram of temperature control of a radiant cooling system.
Description of the main elements and symbols:
1. a semiconductor refrigeration element; 2. a heat insulation layer; 3. sky radiation refrigeration coating; 4. a metal plate; 5. a radiation cooling film; 6. a support frame; 7. a closed gas layer; 8. the air contacts the membrane.
Detailed Description
The following description will further explain embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Examples
Referring to fig. 1 to 4, a radiant cooling system is characterized in that: the device comprises a radiation refrigeration component, an anti-condensation component and a temperature control device; the anti-dewing component is tightly attached to the cooling surface of the radiation refrigeration component, and the temperature control device is electrically connected with the radiation refrigeration component. The radiation refrigeration component comprises a semiconductor refrigeration element 1, a heat preservation and insulation layer 2, radiation refrigeration coating 3 and a metal plate 4; the radiation refrigeration component is a refrigeration system formed by combining a plurality of semiconductor refrigeration elements, does not need to use a refrigerant, has short response time and can realize intermittent or continuous refrigeration; the semiconductor refrigeration element is wrapped by the heat insulation layer and is integrally attached to the upper surface of the metal plate, the surface of the hot end of the semiconductor refrigeration element 1 is coated with the radiation refrigeration coating 3 as a heat dissipation material of the semiconductor refrigeration element, when the hot end dissipates heat, the radiation refrigeration coating 3 can quickly dissipate the heat of the hot end into the surrounding environment, and the temperature of the hot end can be cooled to be about 5-10 ℃ lower than the ambient temperature under the direct sunlight in the daytime; the anti-condensation component comprises a double-layer hollow infrared membrane, a supporting frame 6 and a sealed gas layer, the double-layer hollow infrared membrane comprises an upper radiation cooling supply membrane 5 and a lower air contact membrane 8, the supporting frame 6 is wrapped by the double-layer hollow infrared membrane, and the sealed gas layer 7 is formed between the two layers of membranes; a radiation cooling film cover 5 covers the lower surface of the metal plate 4 in the radiation cooling component to separate a low-temperature cold source from indoor humid air; the temperature control device comprises an outdoor environment thermal parameter and personnel thermal demand monitor, a parameter setting instrument, a parameter controller, a temperature sensor and a semiconductor refrigerating element, wherein the parameter setting instrument is connected with the outdoor environment thermal parameter and the personnel thermal demand monitor, the parameter controller is connected with a cooling temperature controller of the semiconductor refrigerating element 1, and the temperature sensor is respectively connected with the cooling temperature controller of the semiconductor refrigerating element 1, the outdoor environment thermal parameter and the personnel thermal demand monitor.
Referring to fig. 4, the outdoor environment thermal parameter and personnel thermal demand monitor of the radiant cooling system is used for acquiring outdoor environment temperature and body surface parameters of personnel in an area as input variables; the parameter setting instrument comprises a display screen and is used for setting an environment thermal parameter and upper and lower limits of personnel thermal requirements; the parameter control instrument is a control algorithm and regulates and controls the cooling temperature of the semiconductor refrigeration element 1 according to parameter operation of outdoor environment thermal parameters, a personnel thermal demand monitor and a parameter setting instrument; the temperature sensor measures the cooling temperature of the semiconductor refrigerating element 1, the measured cooling temperature is used as output quantity, the measuring result is fed back in time, and the cooling capacity is adjusted in time according to the change requirements of environment and personnel parameters.
Before the semiconductor refrigeration element 1 is installed, heat-conducting silicone grease is coated on the surface of a cold end and a hot end, the heat-conducting silicone grease is uniformly coated, the cold end of the semiconductor refrigeration element 1 is tightly attached to the upper surface of the metal plate 4, and refrigeration and adjustment can be started by radiating a refrigeration component after the semiconductor refrigeration element 1 is powered on.
The heat preservation and insulation layer 2 is made of polyurethane foam plastic sold on the market and wraps the periphery of the semiconductor refrigeration element 1, so that the loss of cold and heat is reduced.
The metal plate 4 is an aluminum plate or an aluminum-iron plate, the metal heat conductivity coefficient is large, and the heat transfer efficiency is improved.
The radiation cooling film 5 (upper film) is made of an infrared high-emissivity material, the emissivity of the material at a wave band of 5-15 mu m is greater than 0.8, the material is tightly attached to the lower surface of the metal plate, the film thickness is 10-100 mu m, the heat conduction resistance is low, and the surface temperature of the material is equal to the surface temperature of the metal plate and is used for absorbing infrared radiation energy from a heat source.
The air contact membrane 8 (lower membrane) selects infrared high transmittance material, the transmittance at 5-15 mu m wave band is more than 0.7, the air contact membrane directly contacts with outdoor air, and simultaneously, the heat exchange between the outdoor air and the surface of the metal plate is isolated, the surface temperature of the air contact surface is indirectly improved, the dewing risk is greatly reduced, the cold loss is reduced, and the cold supply capacity is obviously improved.
The support frame 6 is a wood frame, and the heat conductivity coefficient is reduced as much as possible. The radiation cooling film 5 (upper infrared film) and the air contact film 8 (lower infrared film) are made of commercially available infrared film materials with high emissivity and high transmittance, and the upper layer of the wood frame is wrapped by the radiation cooling film and the lower layer of the air contact film in a sealing manner by means of an adhesive to prepare a hollow structure with a double-layer film interlayer.
The closed gas layer 7 is a gas layer of dry air, nitrogen or argon and the like, and a proper amount of drying agent is added into the closed gas layer.
The outdoor usable radiant cooling system may be powered by photovoltaic panels or batteries.
In this embodiment, but the radiation cooling system that outdoor used has and is showing and reduce radiation end condensation risk, shows the characteristics such as promotion system cooling capacity, energy-concerving and environment-protective, automatic control, is particularly useful for the outdoor place in high humidity area, can realize energy-conserving carbon reduction.
Claims (7)
1. A radiant cooling system, characterized by: the device comprises a radiation refrigeration component, an anti-condensation component and a temperature control device; the anti-condensation component is tightly attached to the cooling surface of the radiation refrigeration component, and the temperature control device is electrically connected with the radiation refrigeration component; the radiation refrigeration component comprises a semiconductor refrigeration element, a heat preservation and insulation layer, radiation refrigeration coating and a metal plate; the radiation refrigeration component is a refrigeration system formed by combining a plurality of semiconductor refrigeration elements, the semiconductor refrigeration elements are wrapped by a heat insulation layer and are integrally attached to the upper surface of the metal plate, and radiation refrigeration coating is coated on the surface of the hot end of each semiconductor refrigeration element to serve as a heat dissipation material of the semiconductor refrigeration element; the anti-condensation component comprises a double-layer hollow infrared membrane, a support frame and a sealed gas layer, the double-layer hollow infrared membrane comprises an upper radiation cooling supply membrane and a lower air contact membrane, the support frame is wrapped by the double-layer hollow infrared membrane, and the sealed gas layer is formed between the two membranes; the radiation cooling film covers the lower surface of the metal plate in the radiation cooling component to separate a low-temperature cold source from indoor humid air; the temperature control device comprises an outdoor environment thermal parameter and personnel thermal demand monitor, a parameter setting instrument, a parameter controller, a temperature sensor and a semiconductor refrigerating element, wherein the parameter setting instrument is connected with the outdoor environment thermal parameter and the personnel thermal demand monitor, the parameter controller is connected with a cooling temperature controller of the semiconductor refrigerating element, and the temperature sensor is respectively connected with the cooling temperature controller of the semiconductor refrigerating element, the outdoor environment thermal parameter and the personnel thermal demand monitor.
2. A radiant cooling system as claimed in claim 1, said thermal insulation layer being comprised of polyurethane foam.
3. A radiant cooling system as claimed in claim 1, the sheet metal material being aluminium or ferro-aluminium.
4. A radiant cooling system as claimed in claim 1 wherein the containment gas layer is a thermal insulation layer formed of dry gas.
5. A radiant cooling system as claimed in claim 1 wherein the closed gas layer is a thermal insulation layer comprising air, nitrogen or argon, and wherein the closed gas layer has a desiccant therein.
6. A radiant cooling system as claimed in claim 1, wherein the radiant cooling film is closely attached to the lower surface of the metal plate, the emissivity in the band of 5-15 μm is >0.8, and the film thickness is 10-100 μm; the air contact film has a transmittance of >0.7 in a wavelength band of 5-15 μm.
7. A radiant cooling system as claimed in claim 1, wherein the radiant cooling system is powered by photovoltaic panels or batteries.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222821268.4U CN218820747U (en) | 2022-10-25 | 2022-10-25 | Radiation cooling system capable of being used outdoors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222821268.4U CN218820747U (en) | 2022-10-25 | 2022-10-25 | Radiation cooling system capable of being used outdoors |
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| Publication Number | Publication Date |
|---|---|
| CN218820747U true CN218820747U (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222821268.4U Active CN218820747U (en) | 2022-10-25 | 2022-10-25 | Radiation cooling system capable of being used outdoors |
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| CN (1) | CN218820747U (en) |
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2022
- 2022-10-25 CN CN202222821268.4U patent/CN218820747U/en active Active
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