CN218804522U - High-heat-conduction type high-frequency copper-clad plate structure - Google Patents
High-heat-conduction type high-frequency copper-clad plate structure Download PDFInfo
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- CN218804522U CN218804522U CN202221167877.6U CN202221167877U CN218804522U CN 218804522 U CN218804522 U CN 218804522U CN 202221167877 U CN202221167877 U CN 202221167877U CN 218804522 U CN218804522 U CN 218804522U
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- heat conduction
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Abstract
The utility model belongs to the technical field of the copper-clad plate layered structure, especially, relate to a high heat conduction type high frequency copper-clad plate structure. The utility model discloses a set gradually heat conduction strip unit, first tie coat, heat conduction resin film unit again between prepreg and every copper foil to and the mode of second tie coat, guarantee that this multilayer structure's high frequency copper-clad plate has outstanding result of use. The utility model has the advantages of it is following: the first and second groups of heat conduction strip units are respectively positioned on two sides of the prepreg, so that the heat conduction efficiency of the high-frequency copper-clad plate can be remarkably improved; secondly, the heat-conducting resin film unit is provided with heat-conducting particles which are in a sheet shape and are uniformly dispersed, so that the heat-conducting capability of the copper-clad plate can be further enhanced; the third, first adhesive layer and second adhesive layer can provide sufficient and suitable bonding capability to provide sufficient peel strength to the copper foil.
Description
Technical Field
The utility model belongs to the technical field of the copper-clad plate layered structure, especially, relate to a high heat conduction type high frequency copper-clad plate structure.
Background
The structure of the existing high-frequency copper-clad plate product mainly comprises a prepreg, an adhesive layer and a copper foil. In addition, because the PTFE resin has the advantages of good heat resistance, outstanding electrical insulation, strong aging resistance and the like, the PTFE-based prepreg and the PTFE-based bonding sheet prepared from the PTFE resin are mostly used in the field of high-frequency copper-clad plates.
In addition, chinese utility model patent with patent publication No. CN206181538U and publication No. 2017.05.17 discloses a high-frequency copper-clad plate, the structure of which comprises an epoxy glass fiber cloth substrate; prepregs which are respectively arranged on two side surfaces of the epoxy glass fiber cloth substrate; and a copper foil layer consolidated on the outer side of each prepreg; and a frosted structure is arranged on one side surface of each copper foil layer opposite to the prepreg.
However, the high-frequency copper-clad plate in the utility model has at least 2 following disadvantages when being used for electronic components with higher and higher integration level and finer circuit.
Firstly, the heat conduction efficiency is not enough, which severely limits the normal use of electronic components.
Secondly, the structural strength of the copper-clad plate is low, the peeling strength of the copper foil is insufficient, and the whole copper-clad plate is easy to bend.
Therefore, a high-thermal-conductivity structure-reinforced high-frequency copper-clad plate product is urgently needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high heat conduction type high frequency copper-clad plate structure, it can be through setting gradually heat conduction strip unit, first tie coat, heat conduction resin film unit again between prepreg and every copper foil to and the mode of second tie coat, guarantee that this multilayer structure's high frequency copper-clad plate has outstanding result of use.
The utility model provides a technical scheme that above-mentioned problem adopted is: the high-heat-conductivity high-frequency copper-clad plate structure comprises a prepreg, two copper foils, two groups of heat-conducting strip units, a first bonding layer, a heat-conducting resin film unit and a second bonding layer, wherein the two copper foils are respectively positioned at two sides of the prepreg, the two groups of heat-conducting strip units are respectively arranged on two sides of the prepreg, the first bonding layer is arranged on the prepreg and used for covering the heat-conducting strip units, the heat-conducting resin film unit is arranged on the first bonding layer, and the second bonding layer is arranged on the heat-conducting resin film unit and used for arranging the copper foils.
The further preferred technical scheme is as follows: the length direction of the heat conduction strip units is parallel to the long edge direction of the rectangular copper-clad plate, or parallel to the edge direction of the square copper-clad plate.
The further preferred technical scheme is as follows: the structure of the heat-conductive strip unit includes a strip body, and first heat-conductive particles disposed in the strip body.
The further preferred technical scheme is as follows: the cross section of the heat conduction strip unit is rectangular or semicircular, and the particle size D50 of the first heat conduction particles is 0.2-6.5 mu m.
The further preferred technical scheme is as follows: the number of the heat conduction strip units on one side of the prepreg is 4-10.
The further preferred technical scheme is as follows: the thickness of the first bonding layer is 75-120 mu m, and the thickness of the second bonding layer is 15-30 mu m.
The further preferred technical scheme is as follows: the structure of the heat-conducting resin film unit comprises a film main body, main cloth arranged in the film main body, and second heat-conducting particles arranged in the film main body and located at one side of the main cloth away from the prepreg.
The further preferred technical scheme is as follows: the thickness of the heat-conducting resin film unit is 80-100 μm, and the length and width dimensions of the main body cloth are correspondingly smaller than those of the film main body by 1.5-2.5mm.
The further preferred technical scheme is as follows: the particle size D50 of the second heat conduction particles is 5.0-8.0 μm.
The further preferred technical scheme is as follows: the thickness of the copper foil is 40-68 μm.
The utility model has the advantages of the following.
The first and second groups of heat conduction strip units are respectively positioned on two sides of the prepreg, so that the heat conduction efficiency of the high-frequency copper-clad plate can be remarkably improved.
And secondly, the heat-conducting resin film unit is provided with heat-conducting particles which are in a sheet shape and are uniformly dispersed, so that the heat-conducting capability of the copper-clad plate can be further enhanced.
The third, first adhesive layer and second adhesive layer can provide sufficient and suitable bonding capability to provide sufficient peel strength to the copper foil.
Fourthly, the number and the thickness of the heat conduction strip units are moderate, and finally the surface flatness of the copper-clad plate can still be ensured.
And fifthly, the glass fiber cloth is arranged in the heat-conducting resin film unit, so that the enough tensile capacity of the copper-clad plate is ensured.
Sixth, the heat conductive resin film unit has high structural stability and can be sufficiently bonded and fixed by the bonding layer.
And seventhly, through testing, the high-frequency copper-clad plate finally has relatively high thermal conductivity, and the copper foil has relatively high peel strength.
Drawings
Fig. 1 is a schematic diagram of the layered structure of the present invention.
Fig. 2 is a schematic diagram of a position distribution of the middle heat conducting strip unit of the present invention.
Fig. 3 is a schematic diagram of a position structure of the middle heat conducting strip unit of the present invention.
Fig. 4 is a schematic view of the position structure of the middle heat-conductive resin film unit according to the present invention.
In the drawings, the reference numerals have the following meanings: the heat-conducting film comprises a prepreg 1, a copper foil 2, a heat-conducting strip unit 3, a first bonding layer 4, a heat-conducting resin film unit 5, a second bonding layer 6, a strip main body 301, first heat-conducting particles 302, a film main body 501, a main cloth 502 and second heat-conducting particles 503.
Detailed Description
The following description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
As shown in fig. 1-4, a high-thermal-conductivity high-frequency copper-clad plate structure includes a prepreg 1, two copper foils 2 respectively located at two sides of the prepreg 1, two sets of heat-conducting strip units 3 respectively disposed on two sides of the prepreg 1, a first adhesive layer 4 disposed on the prepreg 1 and used for covering the heat-conducting strip units 3, a heat-conducting resin film unit 5 disposed on the first adhesive layer 4, and a second adhesive layer 6 disposed on the heat-conducting resin film unit 5 and used for disposing the copper foils 2.
In the embodiment, the prepreg 1 is a common PTFE-based prepreg without fiberglass cloth, and has a general thermal conductivity, and the copper foil 2 is an HVLP copper foil or any one of loz copper foils.
In addition, the heat conducting strip unit 3 and the heat conducting resin film unit 5 both have heat conducting particles therein, and the material of the heat conducting particles is common metal oxide particles, such as magnesium oxide particles, or zinc oxide particles. When actual heat conduction is carried out, the heat conduction operation of the former is characterized in that: the heat conduction device is relatively inner, linear heat conduction, local targeted heat conduction and used for enhancing heat conduction, and the latter is totally opposite, and has the heat conduction operation characteristics that: the high-frequency copper-clad plate can conduct heat relatively outwards and in a plane, integrally conduct heat and conduct heat for foundation, and finally has relatively high heat conductivity performance parameters.
Finally, the heat-conducting resin film unit 5 is prefabricated, and the heat-conducting strip unit 3, the first bonding layer 4 and the second bonding layer 6 are prepared by coating on site during the production of the copper-clad plate.
The length direction of the heat conduction strip unit 3 is parallel to the long side direction of the rectangular copper-clad plate or the side direction of the square copper-clad plate.
The structure of the heat conductive strip unit 3 includes a strip body 301, and first heat conductive particles 302 disposed within the strip body 301.
In this embodiment, the tape main body 301 is made of PTFE resin, and the resin is first fully mixed with the first heat conductive particles 302, and then coated on the side surface of the prepreg 1.
It should be noted that the PTFE resin contains relatively heavy metal oxide, so that the PTFE resin does not sufficiently adhere to the prepreg 1 at the initial stage of coating, and therefore both sets of the heat conductive tape units 3 on both sides need to be coated with the corresponding sides of the prepreg 1 facing upward. In the case of coating or bonding the first adhesive layer 4, the heat conductive resin film unit 5, and the copper foil 2, it is preferable to face the side upward.
The cross-sectional shape of the heat-conducting strip unit 3 is rectangular or semicircular, and the particle diameter D50 of the first heat-conducting particles 302 is 0.2-6.5 μm.
In this embodiment, the main heat transfer portion of the high-frequency copper-clad plate is the thermal resin film unit 5, and the heat conduction strip unit 3 only enhances and assists heat conduction, so the particle size of the first heat conduction particles 302 in the heat conduction strip unit 3 is relatively small and fine.
The number of the heat-conducting strip units 3 on one side of the prepreg 1 is 4-10.
The thickness of the first adhesive layer 4 is 75-120 μm, and the thickness of the second adhesive layer 6 is 15-30 μm.
In the present embodiment, the first adhesive layer 4 is used to cover the heat conductive tape unit 3 and to bond the heat conductive resin film unit 5, and the second adhesive layer 6 is used only to bond the copper foil 2, so that the required bonding strength of the former needs to be appropriately large, which is also a reason why the thickness of the former is relatively large.
The structure of the heat conductive resin film unit 5 includes a film main body 501, a main body cloth 502 disposed in the film main body 501, and second heat conductive particles 503 disposed in the film main body 501 at a position on a side of the main body cloth 502 away from the prepreg 1.
In this embodiment, the material of the film main body 501 is also PTFE resin, the main cloth 502 is one of glass fiber non-woven fabric or glass fiber woven fabric, and the material of the second heat conductive particles 503 is the same as that of the first heat conductive particles 302.
In addition, the second heat conducting particles 503 are located outside the main body fabric 502, and are therefore appropriately far away from the first heat conducting particles 302, and form an integral heat conducting effect of "inside and outside combination" with the first heat conducting particles 302.
The thickness of the heat-conductive resin film unit 5 is 80-100 μm, and the length and width dimensions of the main body cloth 502 are correspondingly smaller than those of the film main body 501 by 1.5-2.5mm.
In this embodiment, the main body cloth 502 cannot protrude to the outside of the film main body 501, otherwise, the entire copper-clad plate is easily pulled and hooked on the side edge thread of the main body cloth 502. Therefore, the length and width of the film body 501 are set to be relatively small and in a retracted state, so that the inconvenience in use can be avoided.
The particle diameter D50 of the second thermally conductive particle 503 is 5.0 to 8.0 μm.
The thickness of the copper foil 2 is 40-68 μm.
Finally, the copper-clad plate in the embodiment was subjected to performance testing, and the results are as follows.
1. The thermal conductivity of the heat-conducting resin film unit 5 is more than or equal to 0.4W/cm K.
2. The peel strength of the copper foil 2 is more than or equal to 1.0N/mm.
3. The thermal conductivity of the copper-clad plate is more than or equal to 0.9W/cm.K.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. These are non-inventive modifications and are intended to be protected by the following claims.
Claims (5)
1. The utility model provides a high heat conduction type high frequency copper-clad plate structure, includes prepreg (1) to and be located respectively two copper foils (2) of prepreg (1) both sides position department, its characterized in that: the prepreg comprises a prepreg (1) and is characterized by further comprising two groups of heat conduction strip units (3) which are arranged on two side faces of the prepreg (1) respectively, a first bonding layer (4) which is arranged on the prepreg (1) and used for covering the heat conduction strip units (3), a heat conduction resin film unit (5) which is arranged on the first bonding layer (4), and a second bonding layer (6) which is arranged on the heat conduction resin film unit (5) and used for arranging the copper foil (2).
2. The high-thermal-conductivity high-frequency copper-clad plate structure according to claim 1, characterized in that: the length direction of the heat conduction strip unit (3) is parallel to the long edge direction of the rectangular copper-clad plate, or is parallel to the edge direction of the square copper-clad plate.
3. The high-thermal-conductivity high-frequency copper-clad plate structure according to claim 1, wherein: the number of the heat conduction strip units (3) on one side of the prepreg (1) is 4-10.
4. The high-thermal-conductivity high-frequency copper-clad plate structure according to claim 1, wherein: the thickness of the first bonding layer (4) is 75-120 μm, and the thickness of the second bonding layer (6) is 15-30 μm.
5. The high-thermal-conductivity high-frequency copper-clad plate structure according to claim 1, wherein: the thickness of the copper foil (2) is 40-68 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221167877.6U CN218804522U (en) | 2022-05-16 | 2022-05-16 | High-heat-conduction type high-frequency copper-clad plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221167877.6U CN218804522U (en) | 2022-05-16 | 2022-05-16 | High-heat-conduction type high-frequency copper-clad plate structure |
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| Publication Number | Publication Date |
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| CN218804522U true CN218804522U (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221167877.6U Active CN218804522U (en) | 2022-05-16 | 2022-05-16 | High-heat-conduction type high-frequency copper-clad plate structure |
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| CN (1) | CN218804522U (en) |
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- 2022-05-16 CN CN202221167877.6U patent/CN218804522U/en active Active
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