CN218788377U - Radio frequency product packaging structure - Google Patents
Radio frequency product packaging structure Download PDFInfo
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- CN218788377U CN218788377U CN202223216703.7U CN202223216703U CN218788377U CN 218788377 U CN218788377 U CN 218788377U CN 202223216703 U CN202223216703 U CN 202223216703U CN 218788377 U CN218788377 U CN 218788377U
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Abstract
The utility model provides a radio frequency product packaging structure, include: the circuit board comprises a substrate, wherein a chip pin is arranged on the substrate in an opposite manner, one end of the chip pin is connected with the substrate through a scaling powder and solder paste mixing layer, the other end of the chip pin is connected with a first chip to form a cavity which is prevented from being contacted with the external pressure, and a second chip, an element and a filter are arranged in the cavity which is prevented from being contacted with the external pressure; its simple structure saves space, and encapsulation back product occupation space is less, effectively avoids when the product touches external pressure, and chip copper post and base plate junction produce the technical problem that breaks because of the uneven scheduling reason of atress appear.
Description
Technical Field
The utility model relates to a chip packaging structure technical field, concretely relates to radio frequency product packaging structure.
Background
The existing chip mounting mode is mostly a mode of tiling and stacking chips, but the former mode occupies larger space for ensuring corresponding functions, so that the size of the chip is overlarge; the latter is only a chip, and is not suitable for products requiring various components and filters in radio frequency.
The existing radio frequency products have the following problems in design:
1) In the design of radio frequency products, chips, components, filters and the like are laid flatly, and the packaged products occupy larger space;
2) When the radio frequency product is in contact with the external pressure, the welding position of the chip copper column and the substrate is broken due to the reasons of uneven stress and the like.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a radio frequency product packaging structure, its simple structure saves space, and encapsulation back product occupation space is less, effectively avoids when the product contacts ambient pressure, and chip copper post and base plate welding department produce the technical problem appearance that breaks because the inequality reason of atress produces.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a radio frequency product packaging structure, comprising: the base plate, be relative chip pin on the base plate, chip pin one end is mixed the layer and is connected with the base plate through scaling powder and tin cream, the chip pin other end avoids contacting the ambient pressure cavity with the formation of can connecting with first chip, it is equipped with second chip, components and parts and wave filter to avoid contacting in the ambient pressure cavity.
The utility model provides a radio frequency product packaging structure, its simple structure saves space, and encapsulation back product occupation space is less, effectively avoids when the product contacts ambient pressure, and chip copper post and base plate welding department produce the technical problem appearance that breaks because of reasons such as the atress is uneven.
According to the preferable technical scheme, the soldering flux and solder paste mixed layer covers the substrate.
According to a preferable technical scheme, the component is connected with the substrate through the soldering flux and solder paste mixed layer.
As a preferred technical scheme, a plurality of second chip copper columns are arranged in the cavity which is prevented from contacting with the external pressure, and one ends of the second chip copper columns are connected with the substrate through the soldering flux and solder paste mixing layer.
As a preferred technical scheme, the other end of the second chip copper column is connected with the second chip.
As a preferred technical solution, the length of the first chip is larger than the total length of the second chip and the component.
Preferably, the length of the substrate is greater than the length of the first chip.
As a preferred technical scheme, the two groups of chip pins which are oppositely arranged are a first chip pin and a second chip pin.
The utility model provides a radio frequency product packaging structure has following beneficial effect:
1) The utility model provides a radio frequency product packaging structure, which has simple structure and saves space, compared with the design of tiled radio frequency products, the upper and lower layers of a first chip and a second chip are arranged more space-saving, and the space occupied by the packaged product is smaller;
2) The utility model provides a radio frequency product packaging structure uses the vacuum coating technology in the operation of upper first chip surface, and the easy chip copper post that takes place produces ruptured second chip in the lower floor with the base plate welding department because the uneven reason of atress, second chip copper post set up in avoid contacting in the external pressure cavity, can effectively avoid when the product contacts external pressure, chip copper post and base plate welding department produce ruptured technical problem because the uneven reason of atress appear.
Drawings
Fig. 1 is a structural diagram of a radio frequency product packaging structure provided by the present invention;
wherein, 1-a substrate; 2-chip pins; 3-avoiding contact with the external pressure cavity; 4-components; 5-a second chip copper pillar; 6-a first chip; 7-a second chip; 8-first chip pin; 9-second chip pin.
Detailed Description
It should be noted that the terms "first" and "second" are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It is understood that the present invention is achieved by some embodiments.
As shown in fig. 1, the utility model provides a radio frequency product packaging structure, include: the circuit board comprises a substrate 1, wherein a soldering flux and solder paste mixing layer covers the substrate 1, opposite chip pins 2 are arranged on the substrate 1, the two groups of oppositely arranged chip pins 2 are a first chip pin 8 and a second chip pin 9, one end of each chip pin 2 is connected with the substrate 1 through the soldering flux and solder paste mixing layer, and the other end of each chip pin 2 is connected with a first chip 6 to form a cavity 3 which can be prevented from contacting with the external pressure; a second chip 7, a component 4, a filter and the like are arranged in the cavity 3 which is prevented from contacting the external pressure, the component 4 is connected with the substrate 1 through the scaling powder and tin paste mixed layer, a plurality of second chip copper columns 5 and second chips 7 are arranged in the cavity 3 which is prevented from contacting the external pressure, one end of each second chip copper column 5 is connected with the substrate 1 through the scaling powder and tin paste mixed layer, the other end of each second chip copper column 5 is connected with the corresponding second chip 7, the length size of each first chip 6 is larger than the total length size of the corresponding second chip 7 and the corresponding component 4, and the length size of the substrate 1 is larger than the length size of the corresponding first chip 6; its simple structure saves space, and the encapsulation back product occupation space is less, effectively avoids when the product contacts ambient pressure, and chip copper post and base plate welding department produce the technical problem appearance that breaks because the uneven reason of atress waits.
In some embodiments, the method comprises: the substrate 1, be relative chip pin 2 on the substrate 1, 2 one ends of chip pin are passed through scaling powder and the mixed layer of tin cream and are connected with substrate 1, 2 other ends of chip pin and first chip 6 avoid contacting external pressure cavity 3 with can connecting the formation, avoid contacting and be equipped with second chip 7, components and parts 4 and wave filter in the external pressure cavity 3.
Adopt above-mentioned embodiment, its simple structure, convenient operation, the formation avoid contacting external pressure cavity 3 not only saves space, and the product occupation space is less after the encapsulation, effectively avoids when the product contacts external pressure, and chip copper post and base plate welding department produce the technical problem appearance that breaks because the uneven reason of atress etc. produces.
In some embodiments, the mixed layer of flux and solder paste is coated on the substrate 1.
By adopting the embodiment, the structure is simple, the operation is convenient, and the arrangement of the soldering flux and solder paste mixing layer is beneficial to adhering the chip pin 2, the component 4 and the copper column 5 on the substrate 1.
In some embodiments, the component 4 is connected to the substrate 1 through the mixed layer of flux and solder paste.
Adopt above-mentioned embodiment, components and parts 4 set up in not only protect components and parts 4 in avoiding contacting external pressure cavity 3, more avoided tiling such as first chip 6, second chip 7, components and parts 4 and wave filter to set up the big problem of increase encapsulation back product occupation space to appear, saved the space.
As a preferred technical scheme, a plurality of second chip copper columns 5 are arranged in the cavity which is prevented from contacting with the external pressure, and one ends of the second chip copper columns 5 are connected with the substrate 1 through the soldering flux and solder paste mixing layer.
Adopt above-mentioned embodiment, its simple structure, convenient operation, second chip copper post 5 set up in avoid contacting in the external pressure cavity 3, it is not only right second chip copper post 5 has protected, has more avoided tiling such as first chip 6, second chip 7, components and parts 4 and wave filter to set up the big problem of increase encapsulation back product occupation space and has appeared, saves space.
As a preferred technical solution, the other end of the second chip copper pillar 5 is connected to the second chip 7.
Adopt above-mentioned embodiment, its simple structure, convenient operation, second chip 7 set up in avoid contacting in the external pressure cavity 3, not only avoided second chip copper post 5 and base plate 1 junction produce cracked problem because reasons such as the atress is uneven appear, have more avoided tiling such as first chip 6, second chip 7, components and parts 4 and wave filter to set up the problem that the increase encapsulation back product occupation space is big to appear, save space.
Preferably, the length of the first chip 6 is greater than the total length of the second chip 7 and the component 4.
By adopting the embodiment, the structure is simple, the operation is convenient, and the component 4 and the second chip 7 are conveniently accommodated in the cavity 3 which is prevented from contacting the external pressure.
Preferably, the length of the substrate 1 is greater than the length of the first chip 6.
By adopting the embodiment, the structure is simple, the operation is convenient, and the integral stability of the radio frequency product packaging structure is ensured.
As a preferred technical solution, the two sets of chip pins disposed oppositely are a first chip pin 8 and a second chip pin 9.
By adopting the embodiment, the structure is simple, the operation is convenient, and the stability of avoiding contacting the structure of the external pressure cavity 3 is ensured.
The utility model provides a radio frequency product packaging structure has following beneficial effect:
1) The utility model provides a radio frequency product packaging structure, which has simple structure and saves space, compared with the design of tiled radio frequency products, the upper and lower layers of a first chip and a second chip are arranged more space-saving, and the space occupied by the packaged product is smaller;
2) The utility model provides a radio frequency product packaging structure uses the operation of vacuum tectorial membrane technology at upper first chip surface, and the easy chip copper post that takes place produces cracked second chip in the lower floor because the uneven reason of atress produces with the base plate welding department, second chip copper post set up in avoiding contacting the external pressure cavity, can effectively avoid when the product contacts external pressure, chip copper post and base plate welding department produce cracked technical problem appearance because the uneven reason of atress produces.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not to be limited to the specific embodiments disclosed herein, and all modifications and equivalents that fall within the scope of the claims of the present application are intended to be embraced therein. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.
Claims (8)
1. A radio frequency product package structure, comprising: the base plate, be relative chip pin on the base plate, chip pin one end is mixed the layer and is connected with the base plate through scaling powder and tin cream, the chip pin other end is in order to connect formation with first chip and avoid contacting the external pressure cavity, avoid contacting and be equipped with second chip, components and parts and wave filter in the external pressure cavity.
2. The radio frequency product packaging structure of claim 1, wherein the mixed layer of flux and solder paste is coated on the substrate.
3. The radio frequency product packaging structure of claim 2, wherein the component is connected to the substrate through the mixed layer of flux and solder paste.
4. The radio frequency product packaging structure of claim 2, wherein a plurality of second chip copper pillars are disposed in the cavity for avoiding contact with external pressure, and one end of each second chip copper pillar is connected to the substrate through the mixed layer of the soldering flux and the solder paste.
5. The radio frequency product packaging structure of claim 4, wherein the second chip copper pillar is connected at another end to the second chip.
6. The radio frequency product packaging structure of claim 5, wherein a length dimension of the first chip is greater than a total length dimension of the second chip and the component.
7. The radio frequency product packaging structure of claim 1, wherein a length dimension of the substrate is greater than a length dimension of the first chip.
8. The radio frequency product packaging structure of claim 1, wherein the two sets of oppositely disposed chip pins are a first chip pin and a second chip pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223216703.7U CN218788377U (en) | 2022-12-02 | 2022-12-02 | Radio frequency product packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223216703.7U CN218788377U (en) | 2022-12-02 | 2022-12-02 | Radio frequency product packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218788377U true CN218788377U (en) | 2023-04-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223216703.7U Active CN218788377U (en) | 2022-12-02 | 2022-12-02 | Radio frequency product packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218788377U (en) |
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2022
- 2022-12-02 CN CN202223216703.7U patent/CN218788377U/en active Active
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