CN218783020U - Electronic packaging structure of light alloy cladding dissimilar material - Google Patents
Electronic packaging structure of light alloy cladding dissimilar material Download PDFInfo
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- CN218783020U CN218783020U CN202222996175.5U CN202222996175U CN218783020U CN 218783020 U CN218783020 U CN 218783020U CN 202222996175 U CN202222996175 U CN 202222996175U CN 218783020 U CN218783020 U CN 218783020U
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Abstract
The utility model relates to an electronic packaging technical field, in particular to electronic packaging structure of light alloy cladding dissimilar material. The embodiment of the utility model provides an electronic packaging structure of light alloy cladding dissimilar material, which comprises a mounting plate; the mounting panel includes light plate body and installation basement, the installation basement inlay in the light plate body, the preparation material of light plate body is light alloy, the preparation material of installation basement is high performance material, the installation basement is used for installing electronic components or integrated circuit, the performance of high performance material is including low inflation, high heat conduction, high reliable encapsulation nature, the installation basement with the metallurgical combination of light plate body. The embodiment of the utility model provides an electronic packaging structure of light alloy cladding dissimilar material can provide one kind and satisfy lightweight and high performance's electronic packaging structure simultaneously.
Description
Technical Field
The utility model relates to an electronic packaging technical field, in particular to electronic packaging structure of light alloy cladding xenogenesis material.
Background
With the rapid development of aerospace technology industry in China, military high-power electronic devices are applied in wider fields. The integration of electronic devices is becoming the main direction of current development. Therefore, the quality of the package casing is getting bigger and bigger, the development of the aerospace technology depends on the progress of the advanced electronic packaging technology, and the packaging technology becomes the key of the development of the semiconductor industry.
The aerospace system develops towards high performance, light weight and small volume, and the traditional metal-based electronic packaging material cannot meet the requirements of high performance such as low expansion, large size, light weight, high heat conduction and high reliability in packaging while ensuring light weight.
Therefore, in view of the above disadvantages, there is a need for an electronic package structure with light alloy coated with dissimilar materials, which can satisfy both light weight and high performance.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an electronic packaging structure of light alloy cladding xenogenesis material can provide one kind and satisfy lightweight and high performance's electronic packaging structure simultaneously.
The embodiment of the utility model provides an electronic packaging structure of light alloy cladding dissimilar material, which comprises a mounting plate;
the mounting panel includes light plate body and installation basement, the installation basement inlay in the light plate body, the preparation material of light plate body is light alloy, the preparation material of installation basement is high performance material, the installation basement is used for installing electronic components or integrated circuit, the performance of high performance material is including low inflation, high heat conduction, high reliable encapsulation nature, the installation basement with the metallurgical combination of light plate body.
In a possible design, still include heat dissipation mechanism, heat dissipation mechanism includes heat sinking board and heating panel along the thickness direction in proper order, heat sinking board be used for with the heat transfer of mounting panel is for the heating panel, the heating panel is used for the heat dissipation, heat sinking board with the mounting panel is connected, the heating panel includes the cavity, the heating panel includes inlet and liquid outlet, the inlet with the liquid outlet all with the cavity intercommunication, the coolant liquid by the inlet gets into the cavity absorbs discharge by above-mentioned liquid outlet behind the heat of heat sinking board.
In one possible design, the coolant is deionized water.
In one possible design, the heat sink plate is made of copper.
In one possible design, the heat dissipation plate is made of an aluminum alloy.
In one possible design, the light alloy is an aluminum alloy, a titanium alloy, or a magnesium alloy.
In one possible design, the high performance material is silicon aluminum, silicon aluminum carbide, molybdenum copper, diamond aluminum, or kovar.
In one possible design, the mounting substrate and the lightweight plate body are metallurgically bonded by a hot isostatic pressing process.
In one possible embodiment, the lightweight plate body is provided with a through-opening, in which the mounting base is arranged.
In one possible design, the lightweight plate body is provided with a recess in which the mounting base is arranged.
Compared with the prior art, the utility model following beneficial effect has at least:
in this embodiment, the lightweight plate body is made of a lightweight alloy, and therefore, the lightweight plate body has excellent lightweight properties. The light board body is embedded with a mounting substrate, the mounting substrate is used for mounting electronic components and/or an integrated circuit board, the preparation material of the mounting substrate is a high-performance material, the high-performance material has high performances such as low expansion, high heat conduction, high reliable encapsulation performance and the like, and the high-performance mounting substrate can provide the high performances for the electronic components or the integrated circuit mounted on the mounting substrate. With the arrangement, the light-weight plate body provides light-weight performance for the mounting plate, the mounting substrate made of high-performance materials is embedded at the position where the light-weight plate body needs to be provided with the electronic components and/or the integrated circuit board, and the high-performance materials provide high performance required by the electronic components and/or the integrated circuit board, so that the electronic packaging structure provided by the application has high performances such as light weight, low expansion, high heat conduction, high reliable packaging performance and the like.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic plan view of an electronic package according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of an electronic package structure according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of another electronic package structure according to an embodiment of the present invention.
In the figure:
1-a light plate body;
2-a mounting substrate;
3-heat sinking the board;
4-a heat sink;
41-cavity.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, rather than all embodiments, based on the embodiments in the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the scope of the present invention.
In the description of the embodiments of the present invention, unless explicitly specified or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless otherwise specified or indicated; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, it should be understood that the terms "upper" and "lower" used in the embodiments of the present invention are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element through intervening elements.
As shown in fig. 1, 2, and 3, an embodiment of the present invention provides an electronic package structure with light alloy cladding on dissimilar materials, which includes a mounting plate;
the mounting plate comprises a light plate body 1 and a mounting substrate 2, the mounting substrate 2 is embedded in the light plate body 1, the light plate body 1 is made of light alloy, the mounting substrate 2 is made of high-performance material, the mounting substrate 2 is used for mounting electronic components or integrated circuits, the high-performance material has the properties of low expansion, high heat conduction and high reliability, and the mounting substrate 2 is metallurgically combined with the light plate body 1.
In the present embodiment, the lightweight plate body 1 is made of a lightweight alloy, and therefore the lightweight plate body 1 has excellent lightweight properties. The light plate body 1 is embedded with the installation substrate 2, the installation substrate 2 is used for installing electronic components and/or integrated circuit boards, the preparation material of the installation substrate 2 is a high-performance material, the high-performance material has high performances such as low expansion, high heat conduction, high reliable encapsulation performance and the like, and the high-performance installation substrate 2 can provide the high performances for the electronic components or the integrated circuits installed on the high-performance installation substrate. So set up, light plate body 1 provides the light performance for the mounting panel, and the position that needs set up electronic components and/or integrated circuit board at light plate body 1 imbeds the installation basement 2 of being made by high performance material, and high performance material provides the required high performance of electronic components and/or integrated circuit board, and consequently, the electronic packaging structure that this application provided compromises high performance such as light and low inflation, high heat conduction, high reliable encapsulation nature.
It should be noted that after the electronic components and/or the integrated circuit board are mounted on the mounting substrate 2, the electronic components and/or the integrated circuit board may be packaged in a sealed space by using an aluminum plate.
It will be appreciated that the size, shape and location of the mounting substrate 2 on the mounting board is designed according to the size, shape and location of the electronic components and/or integrated circuit board.
It should be noted that the shape of the mounting substrate may be comb-shaped, rectangular and/or circular, and the specific shape may be flexibly changed according to the design requirement.
The utility model discloses an in some embodiments, still include heat dissipation mechanism, heat dissipation mechanism includes heat sinking plate 3 and heating panel 4 along the thickness direction in proper order, heat sinking plate 3 is used for transmitting the heat of mounting panel for heating panel 4, heating panel 4 is used for the heat dissipation, heat sinking plate 3 is connected with the mounting panel, heating panel 4 includes cavity 41, heating panel 4 includes inlet and liquid outlet, inlet and liquid outlet all communicate with cavity 41, the coolant liquid is discharged by above-mentioned liquid outlet after getting into cavity 41 and absorbing the heat of heat sinking plate 3 by the inlet.
In this embodiment, the heat dissipation mechanism is installed at the bottom of the mounting plate, and the heat dissipation mechanism can rapidly cool the mounting plate. The heat dissipation mechanism comprises a heat sink plate 3 and a heat dissipation plate 4, the electronic components and/or the integrated circuit board generate heat during working, the generated heat enables the mounting plate to be heated, the heat sink plate 3 transfers the heat of the mounting plate to the heat dissipation plate 4, the heat dissipation plate 4 adopts circulating water for heat dissipation, cooling liquid continuously flows through a cavity 41 of the heat dissipation plate 4, the flowing cooling liquid carries the heat, and finally the electronic components and/or the integrated circuit board are kept at low temperature.
In some embodiments of the present invention, the coolant is deionized water.
In this embodiment, the cooling water is deionized water, which is not conductive, and thus does not affect the electronic components and/or the integrated circuit board.
In some embodiments of the present invention, the heat sink plate 3 is made of copper.
In the present embodiment, the heat sink plate 3 is made of a copper material, preferably brass, so that the heat sink plate 3 has excellent performance of rapid heat conduction.
In some embodiments of the present invention, the heat dissipation plate 4 is made of aluminum alloy.
In the present embodiment, the heat dissipation plate 4 is made of an aluminum alloy, and has excellent lightweight and thermal conductivity, and at the same time, is low in cost.
In some embodiments of the present invention, the light weight alloy is an aluminum alloy, a titanium alloy, or a magnesium alloy.
In the embodiment, the light alloy plate is made of aluminum alloy, titanium alloy and magnesium alloy, preferably aluminum alloy, and has low density and low cost.
In some embodiments of the invention, the high performance material is silicon aluminum, silicon aluminum carbide, molybdenum copper, diamond aluminum, or kovar.
In this example, the silicon-aluminum alloy composite material: the material has the advantages of light weight, low thermal expansion coefficient, good heat conduction performance, easy precision machining, no toxicity, low cost and the like;
molybdenum-copper composite material: the material has high density, certain microwave shielding function, high strength, stability and reliability;
silicon aluminum carbide composite material: the material has high thermal conductivity, low thermal expansion coefficient, high strength and good electrical conductivity;
diamond aluminum composite material: the diamond has high thermal conductivity, elastic modulus and low thermal expansion coefficient, the material hardness is high, the machining performance is poorer, the forming performance is poorer, and the forming technology of the diamond/Al composite material can meet the requirement of the diamond performance and simultaneously can solve the problem of poor machining performance;
the molybdenum-copper composite material and the diamond-aluminum composite material are mainly used for matching a power chip; silicon-aluminium or silicon-aluminium carbide for matching LTCC
Kovar alloy: the alloy with relatively constant low or medium expansion coefficient is close to that of the sealed material such as glass or ceramic in the temperature range of-70-500 deg.c, so as to reach the effect of matching sealing.
In some embodiments of the invention, the mounting base 2 and the lightweight plate body 1 are metallurgically bonded by a hot isostatic pressing process.
In this embodiment, the hot isostatic pressing process is capable of processing the alloys in an isothermal and pressing environment to achieve a metallurgical bond between the different alloys.
As shown in fig. 2, in some embodiments of the present invention, the lightweight plate body 1 is provided with a through hole in which the mounting base 2 is disposed.
In this embodiment, the mounting substrate 2 is disposed in the through hole to form a mounting substrate penetrating through the light-weight board 1, and thus, the electronic component and/or the integrated circuit board can be disposed on both the upper and lower surfaces of the mounting board.
As shown in fig. 3, in some embodiments of the present invention, the lightweight plate body 1 is provided with a groove, and the mounting base 2 is provided in the groove.
In this embodiment, the mounting substrate 2 is disposed in the recess, one surface of the mounting board forms the mounting substrate 2, the electronic component and/or the integrated circuit board is mounted on the mounting substrate 2, and the water cooling plate can be mounted on the surface without the mounting substrate 2.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (9)
1. An electronic packaging structure of light alloy cladding dissimilar material is characterized by comprising a mounting plate;
the mounting plate comprises a light plate body (1) and a mounting substrate (2), wherein the mounting substrate (2) is embedded in the light plate body (1), the light plate body (1) is made of light alloy, the mounting substrate (2) is made of high-performance material, the mounting substrate (2) is used for mounting electronic components or integrated circuits, the high-performance material has the properties of low expansion, high heat conduction and high reliable encapsulation, and the mounting substrate (2) is metallurgically bonded with the light plate body (1);
the high-performance material is silicon-aluminum, silicon-aluminum carbide, molybdenum-copper, diamond aluminum or kovar alloy.
2. The electronic package structure according to claim 1, further comprising a heat dissipation mechanism, wherein the heat dissipation mechanism sequentially comprises a heat sink plate (3) and a heat dissipation plate (4) along a thickness direction, the heat sink plate (3) is used for transferring heat of the mounting plate to the heat dissipation plate (4), the heat dissipation plate (4) is used for dissipating heat, the heat sink plate (3) is connected to the mounting plate, the heat dissipation plate (4) comprises a cavity (41), the heat dissipation plate (4) comprises a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both communicated with the cavity (41), and cooling liquid enters the cavity (41) through the liquid inlet and is discharged from the liquid outlet after absorbing the heat of the heat sink plate (3).
3. The electronic package structure of claim 2, wherein the cooling fluid is deionized water.
4. The electronic package structure according to claim 2, wherein the heat sink plate (3) is made of copper.
5. The electronic package structure according to claim 2, wherein the heat spreader plate (4) is made of an aluminum alloy.
6. The electronic package structure of claim 1, wherein the light alloy is an aluminum alloy, a titanium alloy, or a magnesium alloy.
7. The electronic package structure according to claim 1, characterized in that the mounting substrate (2) and the lightweight plate body (1) are metallurgically bonded by a hot isostatic pressing process.
8. Electronic package according to claim 1, characterized in that the lightweight board body (1) is provided with a through-going hole in which the mounting substrate (2) is provided.
9. The electronic packaging structure according to claim 1, characterized in that the lightweight board body (1) is provided with a recess in which the mounting substrate (2) is disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222996175.5U CN218783020U (en) | 2022-11-10 | 2022-11-10 | Electronic packaging structure of light alloy cladding dissimilar material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222996175.5U CN218783020U (en) | 2022-11-10 | 2022-11-10 | Electronic packaging structure of light alloy cladding dissimilar material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218783020U true CN218783020U (en) | 2023-03-31 |
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ID=85716402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222996175.5U Active CN218783020U (en) | 2022-11-10 | 2022-11-10 | Electronic packaging structure of light alloy cladding dissimilar material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218783020U (en) |
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2022
- 2022-11-10 CN CN202222996175.5U patent/CN218783020U/en active Active
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