CN218772476U - Thick film heating disc for beaker - Google Patents
Thick film heating disc for beaker Download PDFInfo
- Publication number
- CN218772476U CN218772476U CN202222626870.2U CN202222626870U CN218772476U CN 218772476 U CN218772476 U CN 218772476U CN 202222626870 U CN202222626870 U CN 202222626870U CN 218772476 U CN218772476 U CN 218772476U
- Authority
- CN
- China
- Prior art keywords
- heat
- heating
- conducting substrate
- medium layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Surface Heating Bodies (AREA)
Abstract
The application discloses a thick film heating disc for a beaker, which comprises a heat-conducting substrate, a heat-conducting medium layer, a heating resistance layer and an insulating medium layer; one side of the heat-conducting substrate is fixed on the cup body through welding, a closed accommodating cavity is formed by the heat-conducting substrate and the inner cavity of the cup body, a heat-conducting medium layer is arranged on the other side of the heat-conducting substrate, the heating resistor layer is arranged on the heat-conducting medium layer, and the insulating medium layer covers the heating resistor layer and the heat-conducting medium layer; the heating resistor layer is formed by a plurality of connecting sections with different shapes formed by the same resistor wire in a reciprocating and surrounding way, the resistor wire is symmetrically distributed along the center of the heat-conducting substrate, and conductor blocks with corresponding shapes are covered above the corners of the resistor wire; two ends of the resistance wire are connection points which are communicated with the circuit to realize the heating effect; the heat conducting substrate is provided with a temperature sensor and is positioned in an interval area formed by the resistance wires; the thick film heating plate solves the technical problems that the thick film heating plate of the existing water boiling cup is complex in structure, low in heat conduction speed, low in temperature rising speed and prone to causing uneven heating.
Description
Technical Field
The application relates to the technical field of heating electrical equipment, in particular to a thick film heating disc for a beaker.
Background
Along with the improvement of science and technology development and people's standard of living, more and more the beaker is used for people in various scenes, and the beaker carries out rapid heating, and the volume is less, portable through setting up heatable chassis to water. Compared with the traditional water boiling cup using an electric heating wire type heater, the existing water boiling cup adopts a thick film heating plate and has the characteristics of high power density, good heat conduction performance, large heat dissipation area and high safety performance; however, the thick film heating plate of the conventional water boiling cup has a complex structure, more fixed connection structures with the cup body, low heat conduction speed, reduced heating speed, and easy occurrence of the phenomenon of uneven heating caused by unreasonable heating resistor arrangement, thereby reducing the use experience of users.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem, provide a thick film dish that generates heat that beaker was used, the thick film of this application dish that generates heat simple structure, heat conduction speed is fast, and the heating resistor layer sets up rationally, and the heating is even.
In order to achieve the above purpose, the technical scheme of the utility model is that:
a thick film heating plate for a beaker comprises a heat-conducting substrate, a heat-conducting medium layer, a heating resistor layer and an insulating medium layer; the heat conducting substrate is made of metal, one side of the heat conducting substrate is fixed to the cup body through welding, a closed accommodating cavity is formed by the heat conducting substrate and the inner cavity of the cup body, a heat conducting medium layer is arranged on the other side of the heat conducting substrate, the heating resistor layer is arranged on the heat conducting medium layer, and the insulating medium layer covers the heating resistor layer and the heat conducting medium layer; the heating resistor layer is formed by a plurality of connecting sections which are different in shape and are formed by the same resistor wire in a reciprocating surrounding mode, the resistor wire is symmetrically distributed along the center of the heat conducting substrate, and conductor blocks which are corresponding in shape are covered above the corners of the resistor wire; two ends of the resistance wire are connection points which are communicated with a circuit to realize the heating effect; the heat conducting substrate is provided with a temperature sensor and is positioned in an interval area formed by the resistance wires, and the temperature measuring end of the temperature sensor is arranged in the accommodating cavity.
In the application, the heat-conducting substrate of the thick-film heating plate is directly fixed in the inner cavity of the cup body through welding, so that the sealing property of the bottom of the accommodating cavity is ensured, and the mounting mode is simple; the heat conducting substrate made of metal is provided with a heat conducting medium layer, the heat of the heating resistance layer is quickly conducted to the heat conducting substrate, and the heat is directly conducted into the accommodating cavity through the heat conducting substrate, so that the liquid in the accommodating cavity can be quickly heated without conducting heat through other parts; the areas of the heating resistance layer formed by the resistance wire and the resistance wire of the heat-conducting medium layer are covered with the insulating medium layer so as to ensure safety; the heating resistor layer is formed by surrounding the same resistor wire, the interval that forms can be regarded as the mounted position of temperature-sensing ware, the rational utilization space, the setting of conductor piece, prevent that the corner of resistor wire from concentrating because of the great heat of electric current, the phenomenon of generating heat inhomogeneous or thermal breakdown appears, make the heating area of heating plate even and improved life, through the rational distribution of the resistor wire of heating resistor layer, utilize the space of whole heating plate effectively, realize the even and fast effect of heat conduction speed of heating.
Preferably, the resistance lines near the central region of the heat conductive substrate are formed in a zigzag shape, and the resistance lines near the outer side are formed in a W shape.
Preferably, the heat conducting substrate is made of stainless steel, aluminum plate or copper plate.
Preferably, a mounting hole is formed in the heat conducting substrate, the temperature sensor is fixed in the mounting hole, and a sealing ring is arranged between the temperature sensor and the mounting hole.
Preferably, the insulating medium layer is made of a ceramic composite material.
Preferably, the thickness of the heat conducting medium layer is 1 to 1.5mm.
Preferably, a fixing column extends downwards from one side of the heat conducting substrate on which the heating resistance layer is arranged.
Drawings
Fig. 1 is a schematic view of an installation state structure of a thick film heating plate for a beaker of the utility model;
fig. 2 is a schematic structural view of the thick film heating plate provided by the utility model.
Detailed Description
The embodiment of the application provides a thick film dish that generates heat that beaker was used for the thick film that solves current beaker generates heat to set up the structure complicacy, more with the fixed connection structure of cup, heat conduction speed is slow, has reduced the programming rate, and easily appears because the heating resistor sets up the phenomenon that unreasonable and lead to heating inhomogeneous, has reduced user's use experience's technical problem.
In order to make the objects, features and advantages of the present invention more apparent and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the embodiments described below are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 2, an embodiment of the present invention provides a thick film heating plate for a beaker, including a heat conducting substrate 100, a heat conducting medium layer 200, a heating resistor layer 300 and an insulating medium layer (not shown); the heat conducting substrate 100 is made of metal, one side of the heat conducting substrate 100 is fixed to the cup body 400 by welding, a closed accommodating cavity is formed by the heat conducting substrate and the inner cavity of the cup body 400, the other side of the heat conducting substrate is provided with a heat conducting medium layer 200, the heating resistor layer 300 is arranged on the heat conducting medium layer 200, and an insulating medium layer (not shown) covers the heating resistor layer 300 and the heat conducting medium layer 200; the heating resistor layer 300 is formed by a plurality of connecting segments with different shapes formed by the same resistor wire 310 in a reciprocating and surrounding manner, the resistor wire 310 is symmetrically distributed along the center of the heat conducting substrate 100, and the conductor blocks 320 with corresponding shapes are covered above the corners of the resistor wire 310; the two ends of the resistance wire 310 are connection points 330, which are connected to the circuit to achieve the heating effect; the heat conducting substrate 100 is mounted with the temperature sensor 500 and located in the interval region formed by the resistance wires 310, and the temperature measuring end of the temperature sensor 500 is disposed in the accommodating cavity. The heat conductive substrate 100 is made of stainless steel, aluminum plate or copper plate.
Specifically, the outer ring edge of the heat-conducting substrate 100 is fixed to the inner cavity of the cup body 400 by welding, a liquid accommodating cavity is formed between the outer ring edge and the inner cavity of the cup body 400, the heat-conducting substrate 100 directly conducts heat to the accommodating cavity, the heat is conducted to the liquid to the greatest extent, the temperature is rapidly raised, the heat utilization rate is high, and the heat-conducting medium layer 200 covers the other side of the heat-conducting substrate 100, so that heat produced by the heating resistor layer 300 arranged on the heat-conducting medium layer 200 is rapidly conducted to the heat-conducting substrate 100; the areas of the surfaces of the heating resistor layer 300 and the heat conducting medium layer 200, where the heating resistor layer 300 is not arranged, are covered with an insulating medium layer (not shown) to improve the safety of the heating disc; the heating resistance layer 300 is formed by a plurality of connected connecting sections formed by the same resistance wire 310 in a reciprocating and surrounding manner on two sides of the heat conducting substrate 100, the two sides are symmetrically distributed, the reciprocating corners of the resistance wire 310 are covered with the conductor blocks 320, and the conductor blocks are matched with the corners, in the embodiment, the conductor blocks 320 are made of rare metal palladium-gold, the palladium-gold can be printed on the heating resistance layer 300 after being in a liquid state and is communicated to realize heating, the resistance value is low, so that the conductivity at the corners of the resistance wire 310 is improved, and the phenomenon that the heating area is uneven or the use is influenced due to the thermal breakdown phenomenon caused by the overlarge current at the corners is prevented; the head end and the tail end of the resistance wire 310 are connection points 330, and a point circuit is connected through the connection points 330; temperature-sensing ware 500 is located the interval position that resistance wire 310 formed after encircleing, even make the resistance wire 310 of the dish top that generates heat have sufficient distribution area, also ensure that temperature-sensing ware 500's position has sufficient heating area, and the dish during operation that generates heat heats evenly, has improved the use experience of product.
Further, the resistance line 310 near the central region of the heat conductive substrate 100 is formed in a zigzag shape, and the resistance line 310 near the outer side is formed in a W shape. The recessed space formed by the W-shaped resistance wire 310 can be used for mounting other components, and does not affect the operation of the heating resistance layer 300; the heat conducting substrate 100 is made of stainless steel, aluminum plate or copper plate, which has good heat conductivity and can be directly contacted with liquid without affecting eating, so that the heating plate can be directly welded on the cup body 400 to rapidly conduct heat; in this embodiment, the insulating dielectric layer (not shown) is made of a ceramic composite material; the ceramic composite material has good high temperature resistance; the thickness of the heat-conducting medium layer 200 is 1 to 1.5mm; and the heat conducting medium layer 200 is made of rare earth nano materials, so that the heat conduction is good and the performance is stable.
Further, a mounting hole 110 is formed on the heat conducting substrate 100, the temperature sensor 500 is fixed to the mounting hole 110, and a sealing ring 510 is disposed between the temperature sensor 500 and the mounting hole 110. The mounting hole 110 communicates the upper and lower both sides of heating plate, and the response end of temperature-sensing ware 500 stretches into the holding intracavity through mounting hole 110, and the setting of sealing washer 510 ensures the leakproofness between mounting hole 110 and temperature-sensing ware 500. A fixing post 120 extends downwards from one side of the heat conducting substrate 100 on which the heating resistor layer 300 is disposed. The fixing post 120 is located in the space formed by the W-shaped area of the resistance wire 310, and can be used for fixing a temperature control or other structures, and reasonably utilizing the space of the heating plate.
In this embodiment, one side of the thick film heating plate is directly welded to the inner cavity of the cup 400, and the other side is provided with the heat conducting medium layer 200 and the heating resistor layer 300, heat generated by the operation of the heating resistor layer 300 is quickly conducted to the heat conducting substrate 100 through the heat conducting medium layer 200 to heat liquid in the accommodating cavity, so that the heat conduction speed is high, the utilization rate is high, and the condition of low heat conduction efficiency is generated without conducting heat through other components; the resistance layer of the heating resistance layer 300 can be used for arranging other parts through the interval position formed by reciprocating surrounding, so that the space is reasonably utilized, and meanwhile, the enough heating area is ensured, and the heating plate is uniformly heated.
Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (7)
1. A thick film heating plate for a beaker is characterized by comprising a heat-conducting substrate, a heat-conducting medium layer, a heating resistor layer and an insulating medium layer; the heat-conducting substrate is made of metal, one side of the heat-conducting substrate is fixed on the cup body through welding, a closed accommodating cavity is formed by the heat-conducting substrate and the inner cavity of the cup body, a heat-conducting medium layer is arranged on the other side of the heat-conducting substrate, the heating resistor layer is arranged on the heat-conducting medium layer, and the insulating medium layer covers the heating resistor layer and the heat-conducting medium layer; the heating resistor layer is formed by a plurality of connected arc-shaped sections formed by the same resistor wire in a reciprocating and surrounding mode, the resistor wire is symmetrically distributed along the center of the heat-conducting substrate, and conductor blocks corresponding to the resistor wire in shape are covered above the corners of the resistor wire; two ends of the resistance wire are connection points which are communicated with a circuit to realize the heating effect; the heat conducting substrate is provided with a temperature sensor and is positioned in an interval area formed by the resistance wires, and the temperature measuring end of the temperature sensor is arranged in the accommodating cavity.
2. The thick film heat generating plate for a beaker according to claim 1, wherein the resistance line near the central region of said heat conductive substrate is formed in a zigzag shape, and the resistance region near the outer side is formed in a W shape.
3. The thick film heating plate for the beaker according to claim 1, wherein the material of the heat conducting substrate is stainless steel, aluminum plate or copper plate.
4. The thick film heating plate for the beaker according to claim 1, wherein a mounting hole is formed on the heat conducting substrate, the temperature sensor is fixed in the mounting hole, and a sealing ring is arranged between the temperature sensor and the mounting hole.
5. A thick film heat generating plate for a beaker according to claim 1, wherein said insulating medium layer is made of a ceramic composite material.
6. The thick film heat generating plate for the beaker of claim 1, wherein the thickness of said heat conducting medium layer is 1 to 1.5mm.
7. The thick film heating plate for the beaker according to claim 1, wherein a fixing post extends downwards from one side of the heat conducting substrate on which the heating resistance layer is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222626870.2U CN218772476U (en) | 2022-09-30 | 2022-09-30 | Thick film heating disc for beaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222626870.2U CN218772476U (en) | 2022-09-30 | 2022-09-30 | Thick film heating disc for beaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218772476U true CN218772476U (en) | 2023-03-28 |
Family
ID=85696993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222626870.2U Active CN218772476U (en) | 2022-09-30 | 2022-09-30 | Thick film heating disc for beaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218772476U (en) |
-
2022
- 2022-09-30 CN CN202222626870.2U patent/CN218772476U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201431327Y (en) | Liquid heating device with thick film circuit heating plate | |
| CN201066936Y (en) | Heater | |
| EP4023081A1 (en) | Heating assembly for use in smoking apparatus | |
| CN208284306U (en) | A kind of heat radiating type power resistor | |
| CN201054804Y (en) | A thick film porcelain heating plate | |
| CN218772476U (en) | Thick film heating disc for beaker | |
| CN215611090U (en) | Magnetic stirrer | |
| CN203912229U (en) | Tubular PTC constant-current electrical heating tube for heating liquid | |
| CN209642996U (en) | It is a kind of without blowing High-Power PTC Heaters | |
| CN108777199A (en) | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure | |
| CN210043750U (en) | Nano-film heating ceramic inner container health-preserving rice cooker | |
| CN210725383U (en) | Self-limiting temperature electrothermal film | |
| CN208208459U (en) | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure | |
| CN210053598U (en) | Signal enhancement temperature control system | |
| CN202206562U (en) | Electric heating chassis and electric kettle | |
| CN208368274U (en) | Converter valve flash, ultrahigh power resistor | |
| CN208337903U (en) | A kind of PTC standard component fever aluminum component | |
| CN205943622U (en) | Metal sheet cement resistor ware for precision type current detection | |
| CN204155683U (en) | A kind of high-power heating resistor | |
| CN217471746U (en) | Electric kettle chassis and electric kettle | |
| CN206380101U (en) | A kind of ptc heater | |
| CN201119009Y (en) | Electrical heater for heating liquid in container by section | |
| CN204560109U (en) | A kind of heat-conducting pad of packaged chip | |
| CN210617131U (en) | High-efficient drying apparatus of injection molding machine drying hopper | |
| CN211557524U (en) | Ceramic heating body capable of heating uniformly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |