CN218769428U - Chip arrangement machine - Google Patents

Abstract

The utility model relates to a chip arrangement machine, comprises a workbench, be equipped with the vibration dish on the workstation, a vision sensor, snatch the subassembly, remove frame and tray, be equipped with the straw on the removal frame, whether overlap of a vision sensor detection chip, calculate the overlap thickness of chip, it includes servo motor to snatch the subassembly, servo motor's output distance is in response to a vision sensor's calculation result, be equipped with the drive wheel on servo motor's the output shaft, it has from the driving wheel to remove to erect, be range from top to bottom from driving wheel and drive wheel, the drive wheel with from being equipped with the drive belt on the driving wheel, be equipped with the lift seat on the drive belt, the straw is located on the lift seat. This application shoots the chip overlap condition on the vibration dish through first vision sensor, and the thickness of chip overlap is calculated to backstage computer, changes servo motor's distance of action, makes the lift distance of seat of going up and down can carry out the adaptation according to the thickness of piling up of actual chip, avoids the effect with the too big impact of chip.

Description

Chip arrangement machine

Technical Field

The application relates to the technical field of chip processing equipment, in particular to a chip arrangement machine.

Background

The chip is an electronic component which is commonly used in the electronic industry at present, and has a plurality of processing flows, wherein some processing flows need to place the chip on a tray and then process the chip. Because the front and back surfaces of the chip are different in structure, the back surface of the chip is made of plastic, and the front surface of the chip is embedded with a rectangular metal block. At present, chips are normally placed in a tray in the same direction by a tray placing machine so as to facilitate subsequent processing of the chips.

In the prior art, a tray placing machine includes a vibration tray, a vision sensor, a manipulator, and a tray. The vibration disc overturns the internal chips, the scattered chips are photographed through the visual sensor, and the photographed pictures are processed to identify the front and back sides of the chips. And then the chip position in the positive and negative directions is sent to the control end of the manipulator, the manipulator is controlled to move to the chip position with the reverse side facing upwards, and the chip is sucked to the end part of the manipulator by sucking air through the sucking disc. And then transferring the chip to a tray for placing.

When the manipulator is sucking the chip, the manipulator needs to be controlled to move from high to low to the upper part of the chip, so that the distance between the bottom end of the manipulator and the chip can be within a proper distance for sucking. However, in general, in the industry, the robot is often controlled to move in a short distance by means of cylinder driving. The common air cylinder stroke distance can not be changed, namely, only two states of extension and retraction are provided, and the height between the bottom end of the manipulator and the chip can not be changed.

When a plurality of chips are the stack state for the chip at top is higher apart from the height between the vibration dish of bottom, and when the cylinder action drove the manipulator and descends, makes the manipulator directly strike to the chip on top easily, can produce great impact force to the chip, causes the damage of chip easily when serious.

SUMMERY OF THE UTILITY MODEL

In order to improve when current manipulator can't change the manipulator and absorb the chip according to actual conditions, the height between manipulator and the chip for the manipulator can cause great impact force to the chip under the pile-up state, can cause the phenomenon of damage to the chip when serious, this application provides a chip balance machine.

The application provides a chip arrangement machine adopts following technical scheme:

the utility model provides a chip balance machine, includes the workstation, be provided with vibration dish, first vision sensor on the workstation, snatch subassembly, drive snatch removal frame and tray that the subassembly triaxial removed, be provided with the straw on the removal frame, whether overlap of first vision sensor detection chip to calculate the overlap thickness of chip, snatch the subassembly including set up in remove servo motor on the frame, servo motor's output distance respond to the calculation result of first vision sensor, be provided with the drive wheel on servo motor's the output shaft, the tip of removing the frame still rotates and is provided with from the driving wheel, from the driving wheel with the drive wheel is range from top to bottom, the drive wheel with be provided with driving belt from the driving wheel, be provided with the lift seat on the driving belt, the straw set up in on the lift seat.

Through adopting the above technical scheme, when putting the dish to the chip, first visual sensor shoots the chip distribution state on the vibration dish, background computer handles the image, acquire the positive negative face distribution condition of chip, and the overlap condition of chip, calculate the height of overlapping chip and generate control servo motor's control command, servo motor can control the lift distance of lift seat according to actual conditions, make the lift seat drive the straw butt in the top of chip, make the straw can carry out the actuation to the chip with certain distance. Thereby avoiding the collision between the suction pipe and the chip and causing damage to the chip.

Preferably, the lifting seat is provided with a distance sensor for detecting the distance between the lifting seat and the surface of the vibration disc, and the distance sensor is electrically connected with the servo motor.

By adopting the technical scheme, the distance between the lifting seat and the chip is more accurately detected in the moving process of the lifting seat by utilizing the distance sensor, so that the output distance of the servo motor controlled by the background computer is more accurate, and the overlarge impact between the suction pipe and the chip is avoided.

Preferably, a bulb is arranged on the bottom surface of the lifting seat, a through hole for the straw to pass through is formed in the center of the bulb in a penetrating mode, a base is arranged on the lifting seat in a rotating mode towards one side of the chip, a bulb groove is formed in the base, the bulb is arranged in the bulb groove in a rotating mode, and a straw hole is formed in the center of the bulb groove.

Through adopting above-mentioned technical scheme, utilize bulb and bulb groove between base and the lift seat for base and lift seat can rotate relatively, thereby when the chip that piles up is the tilt state, the base centers on bulb turned angle, and then makes the top surface of base and chip laminate more, so that the straw can be more quick accurate suck up the chip.

Preferably, a sliding hole is vertically formed in the lifting seat, a lifting rod penetrates through the sliding hole in a sliding mode, the ball head is arranged at the bottom end of the lifting rod, a damping spring is arranged on the bottom surface of the lifting seat, one end of the damping spring abuts against the bottom surface of the lifting seat, and the other end of the damping spring abuts against the top surface of the base.

Through adopting above-mentioned technical scheme, on the base butt in the surface of chip, make the lifter slide along the hole that slides, compression damping spring this moment utilizes damping spring's elasticity to reduce the impact force between base and the chip to protect the chip.

Preferably, the edge of the base is provided with a counterweight ring.

By adopting the technical scheme, when the chip in the inclined state is sucked by the base, the inclined base is restored to the horizontal state by utilizing the weight of the counterweight ring, so that the chip is sucked by the base again.

Preferably, the end of the moving frame is vertically provided with a guide rod for guiding the lifting seat to move, the lifting seat is provided with a guide hole, and the guide rod penetrates through the guide hole.

Through adopting above-mentioned technical scheme, utilize the moving direction of guide pole guide lift seat for the vertical movement that lift seat can be stable.

Preferably, the workbench is provided with two movable frames, the two movable frames are respectively positioned at two sides of the tray, and the two movable frames alternately place the chips.

Through adopting above-mentioned technical scheme, be provided with two and remove the frame on the workstation, two remove the frame and inhale the chip on the vibration dish simultaneously, later place on the tray in turn to improve the balance speed to the chip.

Preferably, each moving frame is provided with a plurality of grabbing components which are arranged in a straight line.

Through adopting above-mentioned technical scheme, be provided with a plurality of subassemblies that snatch on removing the frame for when removing the frame decline and remove the top to the vibration dish, a chip is inhaled respectively to a plurality of subassemblies that snatch, thereby reduces the removal frequency who removes the frame, alright shift a plurality of chips simultaneously.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the overlapping condition of chips on the vibrating disk is shot through the first vision sensor, the background computer calculates the overlapping thickness of the chips, the action distance of the servo motor is changed, the lifting distance of the lifting seat can be matched according to the stacking thickness of the actual chips, overlarge impact with the chips is avoided, and the chips are protected;

2. utilize bulb and bulb groove between base and the lift seat for base and lift seat can rotate relatively, thereby when the chip that piles up is the tilt state, the base centers on bulb turned angle, and then makes the top surface of base and chip laminate more, so that the straw can be more quick accurate suck the chip up.

Drawings

FIG. 1 is a schematic view of the overall structure in the present embodiment;

FIG. 2 is a partial view of a gripper assembly;

fig. 3 is a sectional view for showing the elevating base and the connecting structure.

Description of reference numerals: 10. a work table; 11. feeding a hopper; 12. a vibrating pan; 13. a frame; 14. a first vision sensor; 15. a movable frame; 16. a second vision sensor; 20. a vertical plate; 21. a servo motor; 22. a drive wheel; 23. a driven wheel; 24. a guide rod; 25. a drive belt; 30. a fixed block; 31. a guide hole; 32. a lifting seat; 33. a distance sensor; 34. a sliding hole; 35. a lifting rod; 36. a limiting block; 37. a straw; 38. a damping spring; 39. a ball head; 310. perforating; 40. a ball cup seat; 41. a ball head groove; 42. correcting edges; 43. connecting holes; 44. a base; 45. a suction hole; 46. communicating the pipe hole; 47. a counterweight ring; 50. a tray.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

A chip tray arranging machine, referring to fig. 1, comprises a workbench 10, wherein a feeding hopper 11 is installed on the workbench 10, a plurality of chips to be separated are placed in the feeding hopper 11, and an opening on one side of the feeding hopper 11 faces the workbench 10. A vibration plate 12 is mounted on the table 10, and the vibration plate 12 is located below the opening of the upper hopper 11. Still install frame 13 on the workstation 10, install first vision sensor 14 on the frame 13, first vision sensor 14 is located the top of vibration dish 12, and first vision sensor 14 is used for shooing the chip on vibration dish 12 surface, acquires the image that the positive and negative of a plurality of chip on vibration dish 12 distributes. And then the image is sent to a background computer. Wherein, the thickness information of the chip is recorded into the computer in advance. The background computer classifies the chips in the image by taking the front and back sides as the distinction, and calculates the position of each chip relative to the vibration disk 12. And the positions where the plurality of chips are stacked are subjected to image recognition, the number of stacked chips is judged, and the distance between the uppermost chip and the vibration plate 12 is estimated.

A moving frame 15 is attached to the table 10, and the moving frame 15 is a moving frame 15 that can move in three axes with respect to the X axis, the Y axis, and the Z axis. The movable frame 15 is positioned below the machine frame 13, a vertical plate 20 is installed at the end part of the movable frame 15, and a grabbing component for grabbing the chip is installed on the vertical plate 20 in a lifting mode. The movement of the grabbing component is controlled by the instructions of the background computer.

Referring to fig. 2, in particular, the grabbing assembly comprises a servo motor 21 mounted on a vertical plate 20, and the servo motor 21 is fixedly connected with one side of the vertical plate 20. The output shaft of servo motor 21 sets up with riser 20 is perpendicular, and servo motor 21's output shaft passes riser 20 and is connected with drive wheel 22, and the one end of riser 20 is rotated and is installed from driving wheel 23, and drive wheel 22 and follow driving wheel 23 are upper and lower distribution. The output distance of the servo motor 21 is controlled by the instruction of the background computer. A guide rod 24 is vertically installed on the same side of the vertical plate 20 as the driving wheel 22, and the guide rod 24 is located between the driving wheel 22 and the driven wheel 23. A drive belt 25 is wound around the drive pulley 22 and the driven pulley 23. The driving belt 25 is fixedly mounted with a fixing block 30, and the fixing block 30 is positioned between the driving pulley 22 and the driven pulley 23. And the fixed block 30 is slidably mounted on the guide rod 24, a guide hole 31 is formed in the fixed block 30 in a penetrating manner, and the guide rod 24 is arranged in the guide hole 31 in a penetrating manner.

And a lifting seat 32 is fixedly connected with the fixed block 30, the lifting seat 32 is arranged in an L shape, and the fixed block 30 is fixedly connected with one vertical side of the lifting seat 32. A distance sensor 33 for detecting the distance between the elevating base 32 and the vibration plate 12 is mounted on the elevating base 32. The distance sensor 33 is electrically connected with the background computer, and the distance sensor 33 is used for acquiring the accurate distance between the lifting seat 32 and the vibration disk 12 and uploading the accurate distance to the background computer.

Referring to fig. 3, a sliding hole 34 is vertically formed on a horizontal surface of the lifting seat 32, and the sliding hole 34 penetrates through upper and lower surfaces of the lifting seat 32. The lifting rod 35 penetrates through the sliding hole 34 in a sliding mode, the top end of the lifting rod 35 is fixedly provided with a limiting block 36, and the size of the limiting block 36 is larger than the diameter of the sliding hole 34. The inside of lifter 35 is cavity setting, and the both ends of lifter 35 communicate with inside respectively. A suction pipe 37 is installed inside the lifting rod 35, one end of the suction pipe 37 is connected with an air pump, and the other end of the suction pipe 37 protrudes out of the bottom end of the lifting rod 35. The lifting rod 35 is sleeved with a damping spring 38, and one end of the damping spring 38 is fixedly abutted against the bottom surface of the lifting seat 32.

The bottom end of the lifting rod 35 is fixedly connected with a ball head 39, a through hole 310 penetrates through the center of the ball head 39, the through hole 310 is communicated with the inside of the lifting rod 35, and the end of the suction pipe 37 penetrates out of the through hole 310. The outer side of the ball head 39 is rotatably connected with a ball head 39 seat, a ball head 39 groove is formed in the ball head 39 seat, and the diameter of the ball head 39 groove is the same as that of the ball head 39. The top surface of the ball head 39 seat is fixedly provided with a correcting edge 42, the plane of the correcting edge 42 is perpendicular to the center line of the groove of the ball head 39, and the other end of the damping spring 38 is abutted against the correcting edge 42.

The center of the ball head 39 is provided with a connecting hole 43 for the suction pipe 37 to pass through. The bulb 39 is connected with a base 44, a plurality of air suction holes 45 are formed in the bottom surface of the base 44, communicating pipe holes 46 used for communicating the air suction holes 45 are formed in the base 44, the end portions of the communicating pipe holes 46 are collected to the center of the base 44, and the suction pipe 37 is connected with the collection portion of the connecting pipe holes so that the suction pipe 37 can suck air through the air suction holes 45. A weight ring 47 for restoring the base 44 to a horizontal state is installed at the edge of the base 44.

Referring to fig. 2, in the present embodiment, a plurality of grabbing components are mounted on the vertical plate 20, and the grabbing components are distributed in a line along the width direction of the vertical plate 20.

Referring to fig. 1, two vibration discs 12 are mounted on a worktable 10, the two vibration discs 12 are respectively located at two ends of the worktable 10, a tray 50 for placing a chip is mounted between the two vibration discs 12, and a plurality of chip grooves matched with the size of the chip are formed in the surface of the tray 50. A second vision sensor 16 for shooting the position of a vacant chip slot in the tray 50 is arranged above the tray 50, and the second vision sensor 16 is fixedly arranged on the frame 13. The second vision sensor 16 is in communication connection with the background computer, the second vision sensor 16 sends the image containing the positions of the chip slots to the background computer, and the background computer quickly calculates the positions of the vacant chip slots in the chip so as to control the movable frame 15 to place the chip in the vacant chip positions through the grabbing components.

Two moving frames 15 are installed on the workbench 10, and the two moving frames 15 are symmetrically distributed relative to the center of the workbench 10. The two moving frames 15 are simultaneously controlled by the background computer, and the two moving frames 15 are in alternate motion. Two moving frames 15 are used in cooperation with the two vibrating pans 12, respectively.

The implementation principle of the application is as follows: a plurality of chips to be placed are placed in the feeding hopper 11, the chips fall into the vibration disc 12 through the opening of the feeding hopper 11, and the vibration disc 12 vibrates to turn over the chips on the surface of the vibration disc 12. The first vision sensor 14 shoots the arrangement of the chips on the vibration disc 12 and sends the arrangement to the background computer, and the background computer processes the pictures shot by the first vision sensor 14, identifies the front and back sides of the chips and records the positions of the chips on the same side. And acquiring a plurality of chip overlapped parts in the picture, and calculating the height between the chip at the top end in the overlapped parts and the surface of the vibration disk 12 according to the picture.

The background computer generates a control instruction according to the position and the overlapping condition of the chips in the vibration disk 12, and the control instruction is sent to the moving frame 15. The moving frame 15 drives the grabbing component to move to the surface of the vibrating disk 12 according to the control instruction, and the servo motor 21 in the grabbing component adjusts the movement stroke according to the control instruction, so that the servo motor 21 drives the lifting seat 32 to descend. The elevator platform 32 moves to the surface of the vibratory pan 12 so that the base plate abuts the top surface of the chip on the vibratory pan 12. At this time, the distance sensor 33 on the lifting seat 32 detects the distance between the base 44 and the chip more accurately during the movement of the lifting seat 32, and the distance sensor 33 sends the distance to the background computer. The back-end computer controls the output distance of the servo motor 21 according to the distance detected by the distance sensor 33, so that the base 44 abuts against the top end of the chip. The air pump is started to suck air through the suction pipe 37, so that the chip is sucked on the bottom surface of the base 44.

If the distance between the base 44 and the chip is too short, the base 44 abuts against the chip, so that the lifting rod 35 slides through the sliding hole 34, and the shock absorbing spring 38 reduces the impact force between the base 44 and the chip. When the stacked chips are in the tilted state, the pedestal 44 is rotated around the ball head 39, so that the pedestal 44 is attached to the tilted chips, thereby facilitating more accurate chip suction. The moving frame 15 moves the chip into the tray 50. And the two moving frames 15 act simultaneously to alternately place the chips on the tray 50, thereby improving the chip placing efficiency.

The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides a chip balance machine, includes workstation (10), be provided with vibration dish (12), first vision sensor (14) on workstation (10), snatch the subassembly, drive snatch removal frame (15) and tray (50) that the subassembly triaxial removed, be provided with straw (37) on removing frame (15), its characterized in that: whether the first vision sensor (14) detects the overlapping of the chips or not, the overlapping thickness of the chips is calculated, the grabbing component comprises a servo motor (21) arranged on the moving frame (15), the output distance of the servo motor (21) responds to the calculation result of the first vision sensor (14), a driving wheel (22) is arranged on an output shaft of the servo motor (21), a driven wheel (23) is further arranged at the end part of the moving frame (15) in a rotating mode, the driven wheel (23) and the driving wheel (22) are arranged up and down, a driving belt (25) is arranged on the driving wheel (22) and the driven wheel (23), a lifting seat (32) is arranged on the driving belt (25), and a suction pipe (37) is arranged on the lifting seat (32).

2. The chip tray placing machine according to claim 1, wherein: be provided with on lift seat (32) and be used for detecting lift seat (32) with distance sensor (33) of distance between vibration dish (12) surface, distance sensor (33) with servo motor (21) electric connection.

3. The chip tray placing machine according to claim 1, wherein: be provided with bulb (39) on the bottom surface of lift seat (32), the center department of bulb (39) runs through to set up and supplies perforation (310) that straw (37) passed, lift seat (32) rotate towards one side of chip and are provided with base (44), be provided with bulb (39) groove on base (44), bulb (39) rotate set up in bulb (39) inslot, straw (37) hole has been seted up to the center department in bulb (39) groove.

4. The chip arrangement machine according to claim 3, wherein: the vertical hole (34) of sliding of having seted up on lift seat (32), lifter (35) are worn to be equipped with in the hole (34) that slides, bulb (39) set up in the bottom of lifter (35), the bottom surface of lift seat (32) is provided with damping spring (38), damping spring (38) one end butt in the bottom surface of lift seat (32), damping spring (38) other end butt in the top surface of base (44).

5. The chip tray placing machine according to claim 3, wherein: the edge of the base (44) is provided with a counterweight ring (47).

6. The chip tray placing machine according to claim 1, wherein: the end part of the moving frame (15) is vertically provided with a guide rod (24) used for guiding the lifting seat (32) to move, a guide hole (31) is formed in the lifting seat (32), and the guide rod (24) penetrates through the guide hole (31).

7. The chip tray placing machine according to claim 1, characterized in that: the workbench (10) is provided with two moving frames (15), the two moving frames (15) are respectively positioned on two sides of the tray (50), and the two moving frames (15) alternately place chips.

8. The chip tray placing machine according to claim 1, wherein: each moving frame (15) is provided with a plurality of grabbing components which are arranged in a straight line.

Images