CN218767501U

CN218767501U - Optical mechanism and electronic apparatus

Info

Publication number: CN218767501U
Application number: CN202223153831.1U
Authority: CN
Inventors: 卢超; 王婷; 疏达
Original assignee: Benewake Beijing Co Ltd
Current assignee: Benewake Beijing Co Ltd
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-03-28
Anticipated expiration: 2032-11-24

Abstract

The application provides an optical mechanism and electronic equipment, relates to the photoelectric technology field. The application provides an optical mechanism includes optical component and supporting component, and one of optical component and supporting component is provided with the boss, and the other is provided with some glue holes, and the boss is inserted and is located some glue downthehole and with the point glue hole between the inner wall form the clearance, and the clearance intussuseption is filled with the binder in order to be connected optical component and supporting component fixed connection. The embodiment of the application adopts the mode of matching the boss, the dispensing hole and the binder, so that the binder does not need to be coated in a large area, the optical component and the supporting component can be stably bonded only by applying the glue at the dispensing hole point, and other devices are not easily interfered due to the overlarge gluing area. The electronic device provided by the application comprises the optical mechanism.

Description

Optical mechanism and electronic apparatus

Technical Field

The application relates to the field of photoelectric technology, in particular to an optical mechanism and electronic equipment.

Background

In the assembly process of optical imaging products, most of the optical components need to be adjusted to ensure the accuracy of the optical path or the optimal imaging effect. To find this optimum position, it is common to first adjust the position of the optical component. When the observation target achieves the best effect, the optical component and the supporting component are generally fixed by glue to achieve a better assembly effect. However, in the current product, a relatively large area of glue needs to be laid between the optical component and the supporting component to maintain the stability between the two components, so that the glue may occupy more surface and affect the arrangement of other components.

SUMMERY OF THE UTILITY MODEL

An object of the present application is to provide an optical mechanism and an electronic apparatus capable of reducing an adhesive application area and reducing interference of an adhesive with other devices while ensuring stability between an optical member and a supporting member.

The embodiment of the application is realized as follows:

in a first aspect, the present application provides an optical mechanism, including an optical component and a support component, one of the optical component and the support component is provided with a boss, and the other is provided with a dispensing hole, the boss is inserted into the dispensing hole and forms a gap with an inner wall of the dispensing hole, and the gap is filled with an adhesive to fixedly connect the optical component and the support component.

In an alternative embodiment, the optical component includes a lens barrel and a lens disposed in the lens barrel, wherein a boss is disposed at one end of the lens barrel, and a dispensing hole is disposed on the supporting component.

In an alternative embodiment, the lens barrel is provided with a plurality of bosses, which are spaced around the axis of the lens barrel.

In an optional embodiment, the lens barrel comprises a barrel body and a connecting plate arranged at one end of the barrel body, the connecting plate is perpendicular to the axis of the barrel body, a light through hole is formed in the connecting plate, an optical axis of the lens penetrates through the light through hole, and the boss is arranged on the surface of the connecting plate.

In an alternative embodiment, the boss is provided at the edge of the connecting plate.

In an alternative embodiment, the support member is a circuit board, and a side of the circuit board facing the optical member is provided with a light receiving device for receiving light passing through the optical member.

In an alternative embodiment, the light receiving device is an avalanche photodiode.

In an alternative embodiment, the dispensing hole is a through hole.

In an alternative embodiment, the adhesive is a UV glue.

In a second aspect, the present application provides an electronic device comprising the optical mechanism of any one of the preceding embodiments.

The beneficial effects of the embodiment of the application are that:

the application provides an optical mechanism includes optical component and supporting component, and one of optical component and supporting component is provided with the boss, and the other is provided with some glue holes, and the boss is inserted and is located some glue downthehole and with the point glue hole between the inner wall form the clearance, and the clearance intussuseption is filled with the binder in order to be connected optical component and supporting component fixed connection. The embodiment of the application adopts the mode of matching the boss, the glue dispensing hole and the binder, so that the binder does not need large-area coating, the optical component and the supporting component can be firmly bonded only by applying glue at the point position of the glue dispensing hole, and other devices are not easily interfered due to overlarge glue applying area. And the clearance that exists between some glue holes and the boss also can satisfy certain regulating variable of optical component when guaranteeing certain sizing volume for still can adjust the relative position of optical component and support component after the boss inserts some glue holes. Therefore, the glue dispensing hole and the boss can provide the function of preliminary positioning, the adjustment requirement of a certain degree can be met, and the assembly of the optical mechanism is facilitated. The electronic equipment provided by the embodiment of the application comprises the optical mechanism.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a schematic diagram illustrating an optical mechanism from a first perspective in one embodiment of the present application;

FIG. 2 is a schematic diagram illustrating an optical mechanism from a second viewing angle in an embodiment of the present application;

fig. 3 is a schematic view illustrating a lens barrel according to an embodiment of the present application from a first viewing angle;

fig. 4 is a schematic view of a lens barrel under a second viewing angle according to an embodiment of the present application.

010-optical mechanism; 100-an optical component; 110-a lens barrel; 111-a cylinder; 112-a connecting plate; 113-light through hole; 114-a boss; 200-a support member; 210-dispensing holes.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience of describing the present application and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the assembling process of the optical imaging product, the relative position of the optical component and the supporting component is adjusted, and when the observation target achieves the optimal effect, the optical component and the supporting component are fixed by using the adhesive. However, in the current product, a large area of glue is applied between the optical component and the supporting component to bond the supporting component and the two surfaces of the optical component. There are two main types of commonly used bonding schemes in the optical industry, such as Camera (AA process), AR glasses, etc.: firstly, drawing a circle of glue with certain thickness on the supporting component, then adjusting the position of the optical component on the supporting component, and curing the glue after adjusting the position to a proper position so as to fix the two structures; and secondly, the supporting component surrounds the optical component, a certain gap is reserved between the supporting component and the optical component, and when the position of the adjusting device reaches a proper position, the supporting component and the optical component are fixed through glue. The above bonding method has some disadvantages, such as large glue consumption and high cost. Moreover, the large adhesive coating area may lead to a large bonding area on the optical component or the supporting component, which may limit the design space of other structures on the surfaces of the optical component and the supporting component, and the adhesive may interfere with other devices more easily.

Therefore, the optical component and the supporting component in the optical mechanism are matched through the boss, the dispensing hole and the adhesive, the point where the dispensing hole is located is used for dispensing the adhesive, the adhesive dispensing area and the adhesive using amount are reduced, and the interference of the adhesive on other devices is also reduced. The electronic equipment provided by the embodiment of the application comprises the optical mechanism, and the electronic equipment can be equipment such as a camera, a laser radar and AR glasses.

FIG. 1 is a schematic diagram illustrating an optical mechanism 010 from a first viewing angle according to an embodiment of the present application; fig. 2 is a schematic diagram of the optical mechanism 010 under a second viewing angle according to an embodiment of the present application. As shown in fig. 1 and 2, an optical mechanism 010 provided in an embodiment of the present application includes an optical component 100 and a support member 200, and the optical component 100 and the support member 200 are connected by an adhesive, so that the relative positions of the two are kept fixed. Specifically, one of the optical component 100 and the support member 200 is provided with a boss 114, the other is provided with a dispensing hole 210, the boss 114 is inserted into the dispensing hole 210 and forms a gap with the inner wall of the dispensing hole 210, and the gap is filled with an adhesive to fixedly connect the optical component 100 and the support member 200.

In the present embodiment, the optical member 100 is a lens assembly, and the support member 200 is a circuit board (PCB) provided with a light receiving device for receiving light passing through the optical member 100 on a side thereof facing the optical member 100. In the present embodiment, the circuit board is substantially perpendicular to the optical axis of the lens assembly, thereby improving the receiving efficiency of the light receiving device.

Further, the optical member 100 includes a lens barrel 110 and a lens (not shown) disposed in the lens barrel 110, and one end of the lens barrel 110 is opposite to the light receiving device on the circuit board, so that the light passing through the lens barrel 110 can be irradiated onto the light receiving device. In this embodiment, a boss 114 is disposed at an end of the lens barrel 110 facing the support member 200, a dispensing hole 210 is disposed on the support member 200, and the boss 114 is inserted into the dispensing hole 210 and is adhered to an inner wall of the dispensing hole 210 by an adhesive.

Fig. 3 is a schematic view of a lens barrel 110 under a first viewing angle according to an embodiment of the present disclosure; fig. 4 is a schematic view of the lens barrel 110 at a second viewing angle according to an embodiment of the present application. As shown in fig. 3 and 4, in the present embodiment, the lens barrel 110 includes a barrel 111 and a connection plate 112 disposed at one end of the barrel 111, and a lens is disposed in the barrel 111. One lens or a plurality of lenses with coincident optical axes can be arranged in the cylinder 111; preferably, the optical axis of the lens is parallel to or coincides with the axis of the cylinder 111. In this embodiment, the connecting plate 112 is perpendicular to the axis of the lens barrel 110, the connecting plate 112 is provided with a light passing hole 113, and the optical axis of the lens passes through the light passing hole 113, so that the light passing through the lens can pass through the light passing hole 113 to reach the light receiving device. In this embodiment, the boss 114 is disposed on the surface of the connecting plate 112.

Specifically, the lens barrel 110 is provided with a plurality of bosses 114, and the plurality of bosses 114 are arranged at intervals around the axis of the lens barrel 110. The axis of the light-passing hole 113 and the axis of the lens barrel 110 may be coincident or parallel, and as shown in fig. 4, a plurality of bosses 114 are dispersed around the light-passing hole 113, and may be uniformly spaced around the light-passing hole 113 or non-uniformly spaced.

In the present embodiment, the boss 114 is disposed at the edge of the connection plate 112, so as to avoid the light-passing hole 113 as much as possible, thereby avoiding the light-receiving device on the circuit board as much as possible after being assembled to the circuit board. The boss 114 may be a cylindrical structure perpendicular to the connecting plate 112 and thus also parallel to the axis of the lens barrel 110.

In the present embodiment, the number of the bosses 114 is four, which can better ensure the connection stability between the optical component 100 and the supporting component 200; in alternative embodiments, the number of bosses 114 may be increased or decreased as desired, such as two, three, five, or more than six.

In the present embodiment, the positions and the number of the dispensing holes 210 correspond to the bosses 114 one by one. The inner diameter of the dispensing hole 210 should be larger than the outer diameter of the boss 114, so that a gap can be left between the boss 114 and the inner wall of the dispensing hole 210 after the boss 114 is inserted into the dispensing hole 210 to accommodate a proper amount of adhesive, and at the same time, the position of the optical component 100 relative to the support component 200 can be adjusted within a certain range.

Specifically, the dispensing hole 210 may be a through hole, and in this case, the boss 114 may pass through the dispensing hole 210, thereby having a wider position adjustment space. Of course, in alternative embodiments, the dispensing hole 210 may also be a blind hole, which is beneficial for accommodating the adhesive, and relatively speaking, the adhesive is not easy to spread around.

In the embodiment, since the optical component 100 and the supporting component 200 are actually fixed by the boss 114 and the glue hole 210, the glue is applied in multiple points instead of a large area, so that the amount of the adhesive is saved, the area of the circuit board is prevented from being occupied by the large area glue, no special bonding area is required to be arranged on the circuit board, and the adhesive is not easy to interfere with other devices on the circuit board.

It should be understood that, in the case that the optical component 100 is a lens assembly and the supporting component 200 is a circuit board, the dispensing hole 210 is disposed on the circuit board, and the boss 114 is disposed on the lens barrel 110, which is easy to implement and has high reliability; however, in other embodiments, the boss 114 may be disposed on the support member 200, and the dispensing hole 210 may be disposed on the optical member 100, which can also achieve similar effects.

Further, in this embodiment, the electronic device applied to the optical mechanism 010 is a laser radar, and the light receiving device is a photodiode, specifically, an APD avalanche photodiode; in other embodiments, the light receiving device may be replaced by a light sensing chip, an emitting device of AR, a liquid crystal, and the like according to the type of the optical mechanism 010. In the present embodiment, the adhesive is a UV glue, which can be cured by ultraviolet irradiation. Of course, the light receiving device and the adhesive may be of other types, for example, the adhesive is a common structural adhesive and cured by baking.

In the present embodiment, the optical mechanism 010 is assembled as follows:

(1) Fixing a lens assembly as an optical component 100 on a tool;

(2) Mounting a circuit board as a support member 200 on a tool adjusting jig;

(3) When the electronic device is powered on (or other light source is used), light will pass through the lens barrel 110 and be focused at a certain position;

(4) The tool adjusting frame adjusts the spatial position of the circuit board in multiple dimensions, and after the position of the circuit board is locked by observing the imaged point cloud, the adhesive is filled in the adhesive dispensing hole 210 and is cured, so that the optical mechanism 010 is assembled.

In this embodiment, the optical component 100 and the supporting component 200 are bonded by the bosses 114 and the glue holes 210, so that it is not necessary to draw a circle of adhesive on the circuit board and consider the avoidance of the device. Positions are reserved at a plurality of dispensing holes 210 to prevent interference during adjustment. And the adhesive is only needed to be applied to the glue dispensing holes 210, so that the using amount of the adhesive is greatly reduced. In addition, the fixing strength of the optical mechanism 010 can be improved by adopting a hole-and-column fitting method at the adhesive fixing point.

The electronic device provided by the embodiment of the application includes the optical mechanism 010. The electronic device may be a camera, a laser radar, AR glasses, etc. according to the choice of the optical component 100 and the supporting component 200.

In summary, the optical mechanism 010 provided by the present application includes an optical component 100 and a supporting member 200, one of the optical component 100 and the supporting member 200 is provided with a boss 114, the other is provided with a dispensing hole 210, the boss 114 is inserted into the dispensing hole 210 and forms a gap with an inner wall of the dispensing hole 210, and the gap is filled with an adhesive to fixedly connect the optical component 100 and the supporting member 200. The embodiment of the application adopts the matching mode of the lug boss 114, the dispensing hole 210 and the adhesive, so that the adhesive is not coated in a large area, the optical component 100 and the supporting component 200 can be firmly bonded only by applying the adhesive at the point position of the dispensing hole 210, and other devices are not easily interfered due to the overlarge adhesive applying area. Moreover, the gap between the dispensing hole 210 and the boss 114 can also satisfy a certain adjustment amount of the optical component 100 while ensuring a certain dispensing amount, so that the boss 114 can still adjust the relative position between the optical component 100 and the support member 200 after being inserted into the dispensing hole 210. Therefore, the glue dispensing hole 210 and the boss 114 can provide a primary positioning function, and can also meet the adjustment requirement to a certain extent, thereby facilitating the assembly of the optical mechanism 010. The electronic device provided by the embodiment of the application includes the optical mechanism 010.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An optical mechanism is characterized by comprising an optical component and a supporting component, wherein one of the optical component and the supporting component is provided with a boss, the other one of the optical component and the supporting component is provided with a dispensing hole, the boss is inserted into the dispensing hole and forms a gap with the inner wall of the dispensing hole, and the gap is filled with a bonding agent so as to fixedly connect the optical component and the supporting component.

2. The optical mechanism according to claim 1, wherein the optical component includes a lens barrel and a lens disposed in the lens barrel, the boss is disposed at one end of the lens barrel, and the dispensing hole is disposed on the supporting member.

3. The optical mechanism according to claim 2, wherein the barrel is provided with a plurality of said bosses spaced around an axis of the barrel.

4. The optical mechanism according to claim 2, wherein the lens barrel includes a barrel body and a connecting plate disposed at one end of the barrel body, the connecting plate is perpendicular to an axis of the barrel body, a light hole is disposed on the connecting plate, the optical axis of the lens passes through the light hole, and the boss is disposed on a surface of the connecting plate.

5. The optical mechanism of claim 4, wherein the boss is disposed at an edge of the connecting plate.

6. An optical mechanism according to any one of claims 1 to 5, wherein the support member is a circuit board, and a side of the circuit board facing the optical member is provided with a light receiving device for receiving light passing through the optical member.

7. The optical mechanism of claim 6, wherein said light receiving device is an avalanche photodiode.

8. The optical mechanism of claim 6, wherein the dispensing hole is a through hole.

9. Optical mechanism according to any of claims 1-5, characterized in that the adhesive is a UV glue.

10. An electronic device, characterized in that it comprises an optical mechanism according to any one of claims 1 to 9.