CN218735713U - Heat radiation structure and electronic equipment - Google Patents

Abstract

The application provides a heat radiation structure and electronic equipment relates to heat dissipation technical field, heat radiation structure includes: the first heat transfer portion covers a first surface of the heat generating device, bends from the first surface of the heat generating device to a second surface of the circuit carrier, which is away from the first surface, and extends along the second surface of the circuit carrier. It wraps up the circuit carrier through the U type structure of first heat transfer portion, can make the device that generates heat in the circuit carrier dispel the heat with the help of first heat transfer portion on the one hand, and on the other hand can make the produced heat of the device that generates heat in the circuit carrier conduct the heat dissipation to the electronic equipment casing on two relative lateral walls through first heat transfer portion, has improved the radiating effect of product when using effectively, has solved this technical problem of the heat dissipation demand that most products can't satisfy the product more than 15W consumption among the prior art.

Description

Heat radiation structure and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation structure and an electronic device.

Background

With the progress of semiconductor technology, the size of integrated circuits has been gradually reduced, and in order to make integrated circuits process more data, integrated circuits with the same size can accommodate more than several times more computing devices than before, and the execution efficiency is higher and higher as the number of computing devices in integrated circuits is increased, so that the heat energy generated by the computing devices during operation is also increased, and the heat dissipation problem of integrated circuits has become an important issue.

In the use scenes such as industrial environment and medical environment, high computational power units such as video acquisition and AI operation are required, and in the use scenes such as medical environment, the mute requirement is very high, and the volume of the operation unit is required to be miniaturized, so that the high operation unit without a fan is a new trend. However, most of the current fan-free high-operation unit products can only solve the heat dissipation of products with power consumption within 15W, and cannot meet the heat dissipation requirement of products with power consumption above 15W, and the whole volume is above 2L, and cannot meet the requirement of miniaturization.

Therefore, further solution to the above technical problems is needed.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a heat dissipation structure and an electronic device, so as to solve the problem of how to satisfy the heat dissipation requirement and the miniaturization requirement of the product with more than 15W power consumption.

In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:

the application provides a heat radiation structure for the device heat dissipation that generates heat to electronic equipment casing inside, the device that generates heat is located on the circuit carrier, heat radiation structure includes:

the first heat transfer portion covers the first surface of the heating device, bends from the first surface of the heating device to the second surface of the circuit carrier, which is deviated from the first surface, and extends along the second surface of the circuit carrier.

The purpose of the utility model and the technical problem to be solved can be further realized by adopting the following technical measures.

Optionally, in the heat dissipation structure, the first heat transfer portion includes a first heat dissipation element and a second heat dissipation element, the second heat dissipation element includes a first portion, a second portion, and a third portion that are sequentially connected, the first portion covers the first surface of the heat generating device, the second portion is bent from the first surface of the heat generating device to a second surface of the circuit carrier that is away from the first surface, the third portion extends along the second surface of the circuit carrier, and the first heat dissipation element and the first portion are stacked;

wherein the first heat transfer part is connected with at least one sidewall of the case.

Optionally, in the heat dissipation structure, the first heat dissipation element includes a first soaking plate and a second soaking plate that are stacked, the first soaking plate covers the first surface of the heat generating device, and a side surface of the second soaking plate away from the first soaking plate is connected to the first portion;

at least one first protrusion is arranged on one side surface of the first soaking plate, which is far away from the second soaking plate, and the first protrusion is positioned on the side surface of the heating device, which is adjacent to the first surface; and at least one second bulge is arranged on one side surface of the second soaking plate, which is far away from the first soaking plate, and the second bulge is inserted into the first part.

Optionally, the heat dissipation structure further includes:

the second heat transfer part is connected to the surface of the first heat transfer part, which is away from the heat generating device, and the second heat transfer part is connected with at least one side wall of the shell.

Alternatively, the heat dissipation structure may further include a second heat transfer portion extending from the first portion toward the third portion, wherein the second heat transfer portion has a first end and/or a second end opposite to the first end, and the first end of the second heat transfer portion is connected to a first side wall of the case peripheral side, and/or the second end of the second heat transfer portion is connected to a second side wall of the case peripheral side opposite to the first side wall.

Optionally, the heat dissipation structure further includes:

and the third heat transfer part is connected to the surface of the third part, which is far away from the heat generating device, and is connected with at least one side wall of the shell.

Alternatively, in the heat dissipation structure, a fourth portion protrudes from the third portion in a direction toward the first portion, and the fourth portion is connected to a third side wall, which is connected to the first side wall and the second side wall, of the casing periphery side.

Optionally, the heat dissipation structure further includes:

the first heat pipe assembly is embedded on a fourth side wall connected with the periphery of the shell;

a second heat pipe assembly embedded in a fifth side wall of the housing opposite the fourth side wall;

wherein the first heat pipe assembly and the second heat pipe assembly each comprise a plurality of heat pipe units arranged at intervals.

Optionally, the heat dissipation structure further includes:

a heat dissipation plate disposed between the third portion and the third heat transfer portion;

a heat conduction portion provided on a surface of the first heat dissipation member opposite to the heat generating device, between the second heat dissipation member and the second heat transfer portion, and/or between the heat dissipation plate and the third heat transfer portion.

In another aspect, the present application provides an electronic device comprising:

a heat dissipation structure;

the heat radiation structure includes:

the first heat transfer portion covers the first surface of the heating device, bends from the first surface of the heating device to the second surface of the circuit carrier, which deviates from the first surface, and extends along the second surface of the circuit carrier.

Borrow by above-mentioned technical scheme, the utility model discloses electronic equipment heat dissipation casing and electronic equipment have following advantage at least:

the embodiment of the utility model provides a heat radiation structure and electronic equipment, its U type structure through first heat transfer portion wraps up the circuit carrier, on the one hand can make the device that generates heat in the circuit carrier dispel the heat with the help of first heat transfer portion, on the other hand can make the produced heat of the device that generates heat in the circuit carrier conduct through first heat transfer portion and dispel the heat to two relative lateral walls of electronic equipment casing, the radiating effect of product when using has been improved effectively, this technical problem of the heat dissipation demand of the product more than the 15W consumption can't be satisfied to most products among the prior art has been solved. In addition, because the U type structure of first heat transfer portion can conduct to two faces of electronic equipment casing, so, after having increased the radiating surface of electronic equipment casing, still can dwindle the volume of electronic equipment casing to the demand that the product was miniaturized has been satisfied, the volume of having solved product among the prior art effectively all is more than 2L, this technical problem of the demand that can't satisfy the product miniaturization.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

FIG. 1 schematically illustrates a heat dissipation structure having a schematic view of an electronic device housing;

fig. 2 schematically shows a structural view of a heat dissipation structure;

FIG. 3 schematically illustrates a first perspective structural view of a heat dissipation structure without a second heat transfer portion;

FIG. 4 is a schematic diagram of a heat dissipation structure from a second perspective without a second heat transfer portion;

fig. 5 schematically illustrates a structural view of a first heat pipe assembly of a heat dissipation structure;

fig. 6 schematically shows a structural view of a second heat pipe assembly of a heat dissipation structure.

The reference numerals in fig. 1-6 are:

1. a first heat transfer portion; 11. a first heat sink; 111. a first vapor chamber 112, a second vapor chamber; 12. a second heat sink; 2. a second heat transfer portion; 3. a third heat transfer portion; 4. a fourth part; 5. a first heat pipe assembly; 6. a second heat pipe assembly; 7. a heat dissipation plate; 8. a heat generating device; 9. a heat conducting portion; 10. a housing.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.

Example one

As shown in fig. 1-4, a heat dissipation structure according to an embodiment of the present invention is used for dissipating heat of the heat generating device 8 inside the electronic device casing 10, the heat generating device 8 is disposed on the circuit carrier, and the heat dissipation structure includes: a first heat transfer portion 1;

the first heat transfer portion 1 covers the first surface of the heat generating device 8, bends from the first surface of the heat generating device 8 to the second surface of the circuit carrier, which is deviated from the first surface, and extends along the second surface of the circuit carrier.

Specifically, the first surface of the heat generating device 8 is an upper surface of the heat generating device 8 facing away from the bearing surface, the bearing surface is a surface for supporting the electronic device housing 10, and the bearing surface may be a ground surface, a table top, or the like. The surface of the electronic device case 10, which is attached to the bearing surface, is a lower sidewall, the surface of the electronic device case 10, which is away from the bearing surface, is an upper sidewall, and the side surface between the upper sidewall and the lower sidewall of the electronic device case 10 is the peripheral side of the electronic device case 10. The first heat transfer part 1 is arranged for transferring heat generated by the heating device 8, the first heat transfer part 1 can be directly contacted with the upper side wall and the lower side wall of the electronic equipment shell 10, the heat generated by the heating device 8 can be transferred to the upper side wall and the lower side wall of the electronic equipment shell 10 through the first heat transfer part 1, and heat dissipation is performed through the upper side wall and the lower side wall of the electronic equipment shell 10, by the structural design, the heat dissipation performance of a product in use can be effectively improved, the technical problem that most products in the prior art cannot meet the heat dissipation requirement of products with power consumption of more than 15W is solved, and the multi-surface heat dissipation effect of the electronic equipment shell 10 is realized; the first heat transfer portion 1 may also achieve an effect of contacting at least two side walls of the electronic device case 10 by other devices, and at the same time, the electronic device case 10 has a multi-surface heat dissipation performance, so as to improve a heat dissipation effect of the product in use. In addition, the first heat transfer portion 1 and the heat generating device 8 may be connected by a fixed connection or a detachable connection.

It should be noted that in the existing usage scenarios such as industrial environment and medical environment, there are many demands for high computational power units such as video capture and AI operation, and in the usage scenarios such as medical environment, there is a very high demand for silence, and at the same time, the volume of the operation unit needs to be miniaturized, so that the high operation unit without a fan is a new trend. However, the existing fanless high-performance arithmetic unit product can only solve the heat dissipation problem of the product with the power consumption of 15W, that is, it adopts a single-side heat dissipation mode to perform fanless heat dissipation, but when the power consumption exceeds 15W, the single-side heat dissipation mode of the product causes the high-performance arithmetic unit to have a reduced heat dissipation performance, therefore, the application provides a heat dissipation structure, so that the heat dissipation structure can conduct the heat generated by the heating device 8 to a plurality of side walls of the electronic device shell 10, and dissipate the heat generated by the heating device 8 through the plurality of side walls, so that the power consumption of the product with the power consumption exceeding 15W can be realized, and the heat dissipation performance of the fanless heat dissipation of the product can be improved.

The embodiment of the utility model provides a heat radiation structure, its U type structure through first heat transfer portion 1 wraps up the circuit carrier, on the one hand can make the device 8 that generates heat in the circuit carrier dispel the heat with the help of first heat transfer portion 1, on the other hand can make the produced heat of the device 8 that generates heat in the circuit carrier conduct through first heat transfer portion 1 to two relative lateral walls of electronic equipment casing 10 and dispel the heat, the radiating effect of product when using has been improved effectively, this technical problem of the heat dissipation demand of the product more than the unable satisfying 15W consumption of majority product among the prior art has been solved. In addition, because the U-shaped structure of the first heat transfer portion 1 can conduct to two surfaces of the electronic device housing 10, the size of the electronic device housing 10 can be reduced after the heat dissipation surface of the electronic device housing 10 is added, so that the requirement of product miniaturization is met, and the technical problem that the size of the product in the prior art is more than 2L and the requirement of product miniaturization cannot be met is effectively solved.

As shown in fig. 1 to 4, in a specific implementation, the first heat transfer component 1 includes a first heat dissipation component 11 and a second heat dissipation component 12, the second heat dissipation component 12 includes a first portion, a second portion, and a third portion, which are connected in sequence, the first portion covers a first surface of the heat generating device 8, the second portion is bent from the first surface of the heat generating device 8 to a second surface of the circuit carrier, which is away from the first surface, the third portion extends along the second surface of the circuit carrier, and the first heat dissipation component 11 and the first portion are stacked; wherein the first heat transfer part 1 is connected with at least one sidewall of the housing 10.

Specifically, the first heat dissipation element 11 may conduct the absorbed heat thermally in a direction from the first heat dissipation element 11 to the first portion. The second heat dissipation member 12 may conduct the absorbed heat in accordance with the shape of the second heat dissipation member 12, wherein the first and second heat dissipation members 11 and 12 are used to conduct the heat generated by the heat generating device 8. The first heat dissipation member 11 may uniformly conduct heat generated by the heat generating device 8 to any portion of the first heat dissipation member 11. The second heat dissipation member 12 includes a first portion, a second portion and a third portion, which are sequentially connected, the first portion covers the first surface of the heat generating device 8, the second portion is bent from the first surface of the heat generating device 8 to the second surface of the circuit carrier away from the first surface, the third portion extends along the second surface of the circuit carrier, that is, the second heat dissipation member 12 is U-shaped, the second heat dissipation member 12 can conduct the heat generated by the heat generating device 8 to the side away from the first surface, and is matched with the first heat dissipation member 11 and the second heat dissipation member 12 and directly contacts with the upper side wall and the lower side wall of the electronic device housing 10 or indirectly contacts with at least two side walls of the electronic device housing 10, so as to conduct the heat generated by the heat generating device 8 to at least two side walls of the electronic device housing 10, and dissipate the heat through at least two side walls of the electronic device housing 10, so as to improve the heat dissipation effect of the product when in use.

Wherein, for the convenience of the later maintenance of the device in this application, adopt bolted connection's mode to be connected between first heat sink 11 and the device 8 that generates heat. The first heat dissipation element 11 and the second heat dissipation element 12 may be connected by a fixed connection manner, or may be connected by a detachable connection manner, in order to ensure that the first heat dissipation element 11 and the second heat dissipation element 12 have a high heat transfer performance, the first heat dissipation element 11 and the second heat dissipation element 12 are fixedly connected by a welding manner. The first portion, the second portion and the third portion can be fixedly connected or detachably connected, and in order to ensure that the second heat dissipation member 12 has high heat conductivity, the first portion, the second portion and the third portion are processed into an integrated structure by an integrated process.

As shown in fig. 1 to 4, in a specific implementation, the first heat sink 11 includes a first soaking plate 111 and a second soaking plate 112, which are stacked, the first soaking plate 111 covers the first surface of the heat generating device 8, and a side of the second soaking plate 112 facing away from the first soaking plate 111 is connected to the first portion; at least one first protrusion is arranged on one side surface of the first soaking plate 111, which is far away from the second soaking plate 112, and the first protrusion is positioned on the side surface of the heat generating device 8, which is adjacent to the first surface; at least one second bulge is arranged on one side surface of the second soaking plate 112, which is far away from the first soaking plate 111, and the second bulge is inserted into the first part.

Specifically, the first soaking plate 111 and the second soaking plate 112 are of the same structure, the first soaking plate 111 and the second soaking plate 112 are VC soaking plates, which are abbreviated as Vapor chambers and are fully called as vacuum Chamber soaking plate heat dissipation technologies, the VC soaking plates can be obtained through purchase, and the VC soaking plates are equivalent to dimension increase from line to surface, so that heat can be better taken away from all directions. The first soaking plate 111 and the second soaking plate 112 are integrally welded by laser.

The second heat dissipation element 12 is a heat pipe, which is commercially available, and the heat pipe technology is a heat transfer element called "heat pipe" invented by g.m. grover in los alamos national laboratory in 1963, which makes full use of the heat conduction principle and the rapid heat transfer property of the refrigerant, and the heat of the heat-generating object is rapidly transferred out of the heat source through the heat pipe, and the heat conduction capability of the heat transfer element exceeds the heat conduction capability of any known metal.

Holistic VC soaking plate forms the U-shaped structure with the welding of heat pipe tin-plating together, device 8 that generates heat is connected with holistic VC soaking plate through the bolt, so that device 8 that generates heat is located the U-shaped structure, the U-shaped structure that forms with the help of holistic VC soaking plate and heat pipe will generate heat the produced heat direct conduction of device 8 to electronic equipment casing 10 on last lateral wall and the lower lateral wall, or indirectly conduct to two at least lateral walls of electronic equipment casing 10 through other devices on, and dispel the heat through two at least lateral walls of electronic equipment casing 10, not only can improve the heat dispersion of product when using, can also realize that electronic equipment casing 10 carries out the radiating effect of multiaspect.

In addition, at least one first protrusion is arranged on one side surface of the first soaking plate 111, which is far away from the second soaking plate 112, and at least one second protrusion is arranged on one side surface of the second soaking plate 112, which is far away from the first soaking plate 111, so that the heat transfer performance of the first soaking plate 111 and the second soaking plate 112 can be improved, and the heat dissipation effect of the heat dissipation structure can be enhanced, wherein the method for processing the first protrusions on the first soaking plate 111 and the method for processing the second protrusions on the second soaking plate 112 are conventional technologies, and the specific method is mastered by technical personnel, and is not described herein again. The first bulges are positioned on the side surface of the heating device 8 adjacent to the first surface, and the second bulges are inserted in the first part, so that the whole VC soaking plate and the heating device 8 can be well attached to each other, the heat generated by the heating device 8 can be conducted by the whole VC soaking plate conveniently, and the electronic equipment shell 10 has good heat dissipation performance.

As shown in fig. 2, further, the method further includes: a second heat transfer part 2;

the second heat transfer portion 2 is connected to a surface of the first heat transfer portion 1 away from the heat generating device 8, and the second heat transfer portion 2 is connected to at least one side wall of the housing 10.

Specifically, the second heat transfer portion 2 is a graphite sheet, which is a brand new heat conductive and heat dissipating material and can uniformly conduct heat in two directions, and can be obtained by purchasing. The second heat transfer portion 2 is attached to the surface of the first heat transfer portion 1 away from the heat generating device 8, so that the first heat transfer portion 1 can transfer heat generated by the heat generating device 8 to at least one side wall of the electronic device casing 10 through the second heat transfer portion 2, and dissipate heat through at least one side wall of the electronic device casing 10, thereby improving the heat dissipation effect of the product in use.

In a specific implementation, in which oppositely disposed first and/or second ends of the second heat transfer part 2 respectively project from the first portion in the direction of the third portion, the first end of the second heat transfer part 2 is connected to a first side wall of the circumferential side of the housing 10, and/or the second end of the second heat transfer part 2 is connected to a second side wall of the circumferential side of the housing 10, which is opposite to the first side wall, as shown in fig. 2.

Specifically, the second heat transfer portion 2 may be L-shaped or U-shaped, and since the second heat transfer portion 2 can conduct heat uniformly in two directions, the first heat transfer portion 1 can conduct heat generated by the heat generating device 8 to the upper side wall of the electronic equipment housing 10 and the first side wall and/or the second side wall of at least the peripheral side through the second heat transfer portion 2, and dissipate heat through the upper side wall of the electronic equipment housing 10 and the first side wall and/or the second side wall of at least the peripheral side, so as to improve the heat dissipation effect of the product in use.

As shown in fig. 2-4, further, it includes: a third heat transfer portion 3;

the third heat transfer part 3 is connected to a surface of the third portion facing away from the heat generating device 8, and the third heat transfer part 3 is connected to at least one side wall of the housing 10.

Specifically, the third heat transfer portion 3 is a graphite sheet. The third heat transfer portion 3 and the surface of the third portion departing from the heat generating device 8 are directly attached or indirectly attached through other devices, so that the first heat transfer portion 1 can transfer the heat generated by the heat generating device 8 to at least one side wall of the electronic device casing 10 through the third heat transfer portion 3, and dissipate the heat through at least one side wall of the electronic device casing 10, thereby improving the heat dissipation effect of the product in use.

In the embodiment, as shown in fig. 4, a fourth portion 4 protrudes from the third portion toward the first portion of the third heat transfer portion 3, and the fourth portion 4 is connected to a third side wall, which is connected to the first side wall and the second side wall, of the peripheral side of the casing 10.

Specifically, the third heat transfer portion 3 in the present application is L-shaped, and since the third heat transfer portion 3 can conduct heat uniformly in two directions, the first heat transfer portion 1 can conduct heat generated by the heat generating device 8 to the lower side wall and the third side wall of the peripheral side of the electronic equipment case 10 through the third heat transfer portion 3, and dissipate heat through the lower side wall and the third side wall of the peripheral side of the electronic equipment case 10, so as to improve the heat dissipation effect of the product in use.

As shown in fig. 5-6, further, it includes: a first heat pipe assembly 5 and a second heat pipe assembly 6;

the first heat pipe assembly 5 is embedded on a fourth side wall connected with the periphery of the shell 10; the second heat pipe assembly 6 is embedded in a fifth side wall of the case 10, which is opposite to the fourth side wall; wherein the first heat pipe assembly 5 and the second heat pipe assembly 6 each comprise a plurality of heat pipe units arranged at intervals.

Specifically, the structural design can uniformly dissipate heat of the upper side wall and the lower side wall of the electronic device shell 10, and improve the heat dissipation effect of the product in use.

The fourth side wall of the electronic device housing 10 is an upper side wall of the electronic device housing 10, and the fifth side wall of the electronic device housing 10 is a lower side wall of the electronic device housing 10. The heat pipe unit is a heat pipe. The heat pipe unit is arranged on the surface of the lower side wall opposite to the heating device 8, and the heat pipe unit and the lower side wall are connected in a detachable connection mode, for example: and (4) gap connection. The heat pipe unit is arranged on the surface of the upper side wall opposite to the heating device 8, and the heat pipe unit and the upper side wall are connected in a detachable connection mode, for example: and (4) gap connection.

As shown in fig. 2-4, further, the method further includes: a heat sink 7 and a heat conduction portion 9;

the heat dissipation plate 7 is disposed between the third portion and the third heat transfer portion 3; the heat conduction portion 9 is provided on a surface of the first heat dissipation member 11 opposite toward the heat generating device 8, between the second heat dissipation member 12 and the second heat transfer portion 2, and/or between the heat dissipation plate 7 and the third heat transfer portion 3.

In particular, the heat dissipation plate 7 is a heat dissipation copper plate, and the heat dissipation copper plate is arranged to improve the heat transfer effect between the third portion and the third heat transfer portion 3. The heat-radiating plate 7 can be purchased. Two opposite surfaces of the heat dissipation plate 7 are respectively attached to the third portion and a surface of the third heat transfer portion 3 facing away from the lower side wall of the electronic device case 10.

The heat conduction part 9 is heat conduction silica gel, the accessible purchase obtains, the effect of heat conduction can be played on the one hand to the heat conduction part 9, on the other hand can play the effect of protection, because heat conduction silica gel's pliability is better, heat conduction silica gel sets up between device 8 and the first heat dissipation piece 11 that generates heat, between second heat dissipation piece 12 and the second heat transfer portion 2, and/or can protect between the device between heating panel 7 and the third heat transfer portion 3, and do not influence the heat transfer effect between the device. The heat conduction portion 9 located between the heat generating device 8 and the first heat sink 11 is attached to the heat generating device 8 and the first heat sink 11, respectively. The heat conduction portion 9 located between the second heat dissipation member 12 and the second heat transfer portion 2 is attached to the second heat dissipation member 12 and the second heat transfer portion 2, respectively. The heat conduction portion 9 located between the heat dissipation plate 7 and the third heat transfer portion 3 is bonded to the heat dissipation plate 7 and the third heat transfer portion 3, respectively.

It should be noted that, because the electronic device housing 10 is a split structure, the heat dissipation structure is clamped by the electronic device housing 10, so that the heat dissipation structure can be stably installed in the electronic device housing 10, and the heat generated by the heat generating device 8 is conducted to multiple surfaces of the electronic device housing 10 by the heat dissipation structure, so that the electronic device housing 10 has a multi-surface heat dissipation performance, so as to improve the heat dissipation effect of the product in use, and effectively solve the technical problem that most products in the prior art cannot meet the heat dissipation requirement of products with power consumption of more than 15W.

Example two

The second embodiment of the present invention provides an electronic device, which includes a heat dissipation structure; as shown in fig. 1 to 6, the heat dissipation structure includes: a first heat transfer portion 1;

the first heat transfer portion 1 covers the first surface of the heat generating device 8, bends from the first surface of the heat generating device 8 to the second surface of the circuit carrier, which is deviated from the first surface, and extends along the second surface of the circuit carrier.

Specifically, the electronic device described in the second embodiment may directly use the heat dissipation structure provided in the first embodiment, and the specific implementation structure may refer to the related contents described in the first embodiment, which is not described herein again.

The embodiment of the utility model provides an electronic equipment uses the heat radiation structure that above-mentioned embodiment provided, it wraps up the circuit carrier through the U type structure of first heat transfer portion 1, on the one hand can make the device 8 that generates heat in the circuit carrier dispel the heat with the help of first heat transfer portion 1, on the other hand can make the produced heat of the device 8 that generates heat in the circuit carrier dispel the heat through conducting to two relative lateral walls of electronic equipment casing 10 on first heat transfer portion 1, the radiating effect of product when using has been improved effectively, this technical problem of the heat dissipation demand of the product more than the 15W consumption can't be satisfied to most products among the prior art has been solved. In addition, because the U-shaped structure of the first heat transfer portion 1 can conduct to two surfaces of the electronic device housing 10, the size of the electronic device housing 10 can be reduced after the heat dissipation surface of the electronic device housing 10 is added, so that the requirement of product miniaturization is met, and the technical problem that the size of the product in the prior art is more than 2L and the requirement of product miniaturization cannot be met is effectively solved.

It will be appreciated that the relevant features of the devices described above may be referred to one another. In addition, "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent merits of the embodiments.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a heat radiation structure for to the inside device heat dissipation that generates heat of electronic equipment casing, the device that generates heat is located on the circuit carrier, its characterized in that, heat radiation structure includes:

the first heat transfer portion covers the first surface of the heating device, bends from the first surface of the heating device to the second surface of the circuit carrier, which is deviated from the first surface, and extends along the second surface of the circuit carrier.

2. The heat dissipation structure according to claim 1,

the first heat transfer part comprises a first heat dissipation part and a second heat dissipation part, the second heat dissipation part comprises a first part, a second part and a third part which are sequentially connected, the first part covers the first surface of the heating device, the second part bends from the first surface of the heating device to the second surface of the circuit carrier, which is deviated from the first surface, the third part extends along the second surface of the circuit carrier, and the first heat dissipation part and the first part are arranged in a laminated manner;

wherein the first heat transfer part is connected with at least one sidewall of the case.

3. The heat dissipation structure according to claim 2,

the first heat dissipation part comprises a first soaking plate and a second soaking plate which are arranged in a laminated mode, the first soaking plate covers the first surface of the heating device, and one side face, away from the first soaking plate, of the second soaking plate is connected with the first part;

at least one first protrusion is arranged on one side face, away from the second soaking plate, of the first soaking plate, and the first protrusion is located on the side face, adjacent to the first surface, of the heating device; and at least one second bulge is arranged on one side surface of the second soaking plate, which is far away from the first soaking plate, and the second bulge is inserted into the first part.

4. The heat dissipation structure according to claim 2 or 3, further comprising:

the second heat transfer part is connected to the surface of the first heat transfer part, which is away from the heat generating device, and the second heat transfer part is connected with at least one side wall of the shell.

5. The heat dissipation structure according to claim 4,

the first end and/or the second end of the second heat transfer portion, which are arranged opposite to each other, extend from the first portion in the direction of the third portion, and the first end of the second heat transfer portion is connected to a first side wall of the housing peripheral side, and/or the second end of the second heat transfer portion is connected to a second side wall of the housing peripheral side, which is opposite to the first side wall.

6. The heat dissipation structure according to claim 4, further comprising:

and the third heat transfer part is connected to the surface of the third part, which is far away from the heat generating device, and is connected with at least one side wall of the shell.

7. The heat dissipation structure according to claim 6,

the third heat transfer portion is provided with a fourth portion protruding from the third portion in a direction toward the first portion, and the fourth portion is connected to a third side wall, which is connected to the first side wall and the second side wall, of the peripheral side of the housing.

8. The heat dissipation structure of claim 6, further comprising:

the first heat pipe assembly is embedded on a fourth side wall connected with the peripheral side of the shell;

a second heat pipe assembly embedded in a fifth side wall of the housing opposite the fourth side wall;

wherein the first heat pipe assembly and the second heat pipe assembly each comprise a plurality of heat pipe units arranged at intervals.

9. The heat dissipation structure of claim 6, further comprising:

a heat dissipation plate disposed between the third portion and the third heat transfer portion;

a heat conduction portion provided on a surface of the first heat dissipation member opposite to the heat generating device, between the second heat dissipation member and the second heat transfer portion, and/or between the heat dissipation plate and the third heat transfer portion.

10. An electronic device, comprising:

the heat dissipation structure as defined in any one of claims 1 to 9.

Images