CN218735701U - Heat sink device - Google Patents

Heat sink device Download PDF

Info

Publication number
CN218735701U
CN218735701U CN202222470950.3U CN202222470950U CN218735701U CN 218735701 U CN218735701 U CN 218735701U CN 202222470950 U CN202222470950 U CN 202222470950U CN 218735701 U CN218735701 U CN 218735701U
Authority
CN
China
Prior art keywords
flow channel
inlet
heat dissipation
outlet
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202222470950.3U
Other languages
Chinese (zh)
Inventor
林明贤
陈家熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Champ Tech Optical Foshan Corp
Original Assignee
Champ Tech Optical Foshan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Champ Tech Optical Foshan Corp filed Critical Champ Tech Optical Foshan Corp
Priority to CN202222470950.3U priority Critical patent/CN218735701U/en
Application granted granted Critical
Publication of CN218735701U publication Critical patent/CN218735701U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to the technical field of heat dissipation, which aims to solve the problems that the flow resistance of the coolant of the known heat dissipation structure is large, the pressure drop is fast and the heat cannot be efficiently taken away, and provides a heat dissipation device, which comprises a heat dissipation fin group, wherein the heat dissipation fin group comprises a plurality of heat dissipation fins which are arranged at intervals in sequence along a first direction, and a branch flow channel is defined between the adjacent heat dissipation fins; the heat dissipation device further comprises an inlet flow channel and an outlet flow channel, wherein one end of the inlet flow channel is communicated with the liquid inlet, and the other end of the inlet flow channel extends through at least part of the heat dissipation fins along the first direction and is communicated with the inlet ends of the corresponding branch flow channels; the radiating fins are wave-shaped and are arranged at intervals in sequence, so that the branch flow channel is wave-shaped. The beneficial effects of the utility model are that coolant flow resistance is less, the radiating efficiency is high.

Description

Heat sink device
Technical Field
The utility model relates to a heat dissipation technical field particularly, relates to heat abstractor.
Background
In the existing heat dissipation structure, the heat dissipation fins are straight fins, that is, the heat dissipation fins are arranged in a manner of being perpendicular to the flow direction of the inlet fluid.
However, in this arrangement, the resistance of the fluid flowing through the flow channel between the fins is large, the pressure drop is fast, and the fluid flow and the heat removal are not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat abstractor to solve known heat radiation structure coolant liquid flow resistance big, the pressure drop is fast, the unable high efficiency problem of taking away the heat.
The utility model provides a heat dissipation device, which comprises a heat dissipation fin group, wherein the heat dissipation fin group comprises a plurality of heat dissipation fins which are arranged at intervals along a first direction in sequence, and a branch flow channel is limited between every two adjacent heat dissipation fins; the branch flow channel is provided with an inlet end and an outlet end;
the heat dissipation device is provided with a liquid inlet and a liquid outlet, the liquid inlet is used for the inflow of cooling liquid, and the liquid outlet is used for the outflow of the cooling liquid;
the heat dissipation device further comprises an inlet flow channel and an outlet flow channel, wherein one end of the inlet flow channel is communicated with the liquid inlet, and the other end of the inlet flow channel extends through at least part of the heat dissipation fins along a first direction and is communicated with the inlet ends of the corresponding branch flow channels; the outlet flow channel is communicated with the liquid outlet and the outlet ends of at least part of the branch flow channels;
the liquid inlet, the inlet flow channel, the inlet end of the branch flow channel, the outlet end of the branch flow channel, the outlet flow channel and the liquid outlet are sequentially communicated to form a heat dissipation flow channel for cooling liquid to pass through;
the radiating fins are wave-shaped and are arranged at intervals in sequence, so that the branch flow channel is wave-shaped.
The utility model provides a when heat abstractor used, thermal coupling to the source that generates heat that needs the refrigerated, the heat that the source that generates heat produced can transmit to on the radiating fin. The cooling liquid enters from the liquid inlet, flows into each branch flow channel from the inlet end of each branch flow channel through the inlet flow channel, and flows out from the liquid outlet after passing through the outlet flow channel. When the cooling liquid passes through each branch flow channel, the heat on the radiating fins is taken away through heat exchange, so that the heating source is cooled.
In an embodiment, the inlet end is located at a trough in the middle of the extension direction of the branch flow channel, and there are two outlet ends, and the two outlet ends are located at two ends of the extension direction of the branch flow channel respectively.
In one embodiment, there are two outlet flow channels, two outlet flow channels are respectively located at two sides of the inlet flow channel, and at least part of the flow section extends along the first direction;
two outlet ends of each branch flow channel are respectively communicated to the outlet flow channel on the corresponding side.
In one embodiment, the heat dissipation device includes a first plate and a second plate, and the first plate and the second plate cooperate to define a fluid chamber;
the first plate body is provided with a first surface and a second surface which are opposite, the first surface is positioned on one side of the first plate body, which is far away from the second plate body, and is used for being thermally coupled to a heating source, and the second surface is positioned on one side of the first plate body, which is close to the second plate body; the second plate body has a third surface P3, the third surface and the second surface being spaced apart to define the fluid chamber; the third surface is provided with a first channel formed by an inner recess, and the first channel is communicated with the liquid inlet and extends along a first direction;
the radiating fin group is arranged on the second surface in a protruding mode and extends into the fluid cavity towards one side of the third surface;
the inlet flow channel is defined between the top of the radiating fin group and the first channel, and the inlet flow channel is communicated with each branch flow channel limited by the radiating fin group from the top.
In one embodiment, the inlet ends of a plurality of continuous heat dissipation fins of the heat dissipation fin group at the end far away from the liquid inlet are cut off to form second channels, and the second channels extend along the first direction and are communicated with the inlet flow passages.
In one embodiment, the second board body includes a bottom plate having a third surface facing the first board body, and a surrounding wall connected to a side of the third surface of the bottom plate, and an inner peripheral surface of the surrounding wall, the third surface and the second surface together enclose the fluid chamber.
In one embodiment, the set of heat dissipating fins has two first sides opposite to each other along a second direction, and the second direction is perpendicular to the first direction; the first side surface is an outer contour surface which is defined by the extending ends of the plurality of radiating fins together;
the inner circumferential surface of the surrounding wall is provided with two second side surfaces opposite to each other along a second direction, and the two second side surfaces are respectively spaced from the first side surfaces of the corresponding sides to respectively limit the two outlet flow passages.
In one embodiment, the third surface is provided with a concave groove, and the groove extends along the second direction;
the liquid outlet is formed in the middle of the groove along the second direction and penetrates through the surface of one side, far away from the first plate body, of the bottom plate;
the two outlet flow passages are respectively communicated with two ends of the groove along the second direction.
In one embodiment, the grooves and the heat dissipating fin groups are sequentially arranged along a first direction.
In one embodiment, the heat dissipation device further comprises a liquid inlet connector and a liquid outlet connector, wherein the liquid inlet connector and the liquid outlet connector are respectively connected to one side of the second plate body, which is far away from the first plate body;
the liquid inlet connector is communicated with the liquid inlet, and the liquid outlet connector is communicated with the liquid outlet.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive efforts.
Fig. 1 is a schematic view illustrating a usage state of a heat dissipation device according to an embodiment of the present application;
FIG. 2 is a three-dimensional view of a heat dissipation device in an embodiment of the present application;
fig. 3 is a schematic structural view of a first plate and heat dissipation fins in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a second plate in the embodiment of the present application;
FIG. 5 is a top view of a heat sink in an embodiment of the present application (the invisible lines are shown in phantom);
FIG. 6 is a longitudinal cross-sectional view of a heat dissipation device in an embodiment of the present application;
FIG. 7 is an enlarged view taken at A of FIG. 6;
fig. 8 is a schematic view of two heat dissipation fins forming a branch flow channel (for clarity, the distance between the two heat dissipation fins is shown enlarged);
fig. 9 is a cross-sectional view of the heat sink of fig. 2 taken along line B-B.
Description of the main element symbols:
heat source 200
Heat sink 100
First plate body 10
Second plate body 11
Heat radiating fin set 12
Fluid chamber 13
Liquid inlet 14
Liquid outlet 15
Liquid inlet connector 16
Liquid outlet connector 17
First surface 18
Second surface 19
Third surface 20
First channel 21
Heat dissipating fin 22
Branch flow channel 23
Inlet end 24
Outlet end 25
Inlet flow passage 26
Outlet flow passage 27
Heat dissipation flow channel 28
Second direction 29
First direction 30
Peak 31
Wave trough 32
Bottom plate 33
Enclosure wall 34
Inner peripheral surface 35
First side 36
Second side 37
Groove 38
Second channel 39
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
Some embodiments of the present application are described in detail. In the following embodiments, features of the embodiments may be combined with each other without conflict.
Examples
Referring to fig. 1 to 9, the present embodiment provides a heat dissipation apparatus 100.
As shown in fig. 1, the heat sink 100 can dissipate heat from a heat source 200 through a cooling fluid. The heat generating source 200 may be any product that generates heat, such as a heat generating electronic component (e.g., a CPU) of an electronic device. In use, the heat sink 100 is thermally coupled to the heat source 200, for example, by bonding the heat source 200 with a heat conductive silicone adhesive, so that the heat generated by the heat source 200 can be conducted to the heat sink 100 and carried away by the cooling liquid passing through the heat sink 100, thereby achieving heat dissipation. The cooling liquid can be water, oil or other cooling liquid. In some cases, the cooling liquid may also be replaced by a gaseous cooling medium.
Referring to fig. 2 to 9, the heat dissipation device 100 in the embodiment of the present invention includes a first plate 10, a second plate 11, and a heat dissipation fin set 12, the first plate 10 and the second plate 11 cooperate to define a fluid chamber 13, and the heat dissipation fin set 12 is disposed on the first plate 10 and extends into the fluid chamber 13. The heat dissipation device 100 has a liquid inlet 14 and a liquid outlet 15 respectively connected to the fluid chamber 13, the liquid inlet 14 is used for the inflow of the cooling fluid, and the liquid outlet 15 is used for the outflow of the cooling fluid.
Optionally, the heat dissipation apparatus 100 further includes a liquid inlet connector 16 and a liquid outlet connector 17, which are respectively connected to a side of the second board 11 away from the first board 10, and are used for connecting a liquid inlet pipe and a liquid outlet pipe. The liquid inlet connector 16 and the liquid outlet connector 17 can adopt a quick-insertion pipe connector form so as to be convenient to insert and pull out. The liquid inlet connector 16 is communicated with the liquid inlet 14, and the liquid outlet connector 17 is communicated with the liquid outlet 15. The liquid inlet pipe can be connected to a cooling liquid supply source and is used for supplying cooling liquid with lower temperature; the cooling liquid flowing out of the liquid outlet pipe can be cooled by a refrigeration device and then flows back to the cooling liquid supply source to form cooling liquid circulation. Of course, the liquid inlet pipe and the liquid outlet pipe may be respectively connected to a cooling device, and the liquid outlet of the liquid outlet pipe flows into the cooling device for cooling and then flows into the heat dissipation device 100 through the liquid inlet pipe to form a cooling cycle.
In this embodiment, the first plate body 10 has a first surface 18 and a second surface 19 opposite to each other. The first surface 18 is located on a side of the first board body 10 away from the second board body 11 for thermally coupling to a heat generating source 200 (see fig. 1). The second surface 19 is located on the side of the first plate 10 adjacent to the second plate 11. The second plate 11 has a third surface 20, and the third surface 20 and the second surface 19 are spaced apart to define the fluid chamber 13. The third surface 20 is provided with a first channel 21 formed concavely, which first channel 21 communicates with the liquid inlet 14 and extends in a first direction 30.
The heat dissipating fin set 12 includes a plurality of heat dissipating fins 22, the plurality of heat dissipating fins 22 are sequentially arranged at intervals along a first direction 30, and a branch flow channel 23 is defined between adjacent heat dissipating fins 22; the branch flow channel 23 has an inlet end 24 and an outlet end 25. The heat dissipating fin set 12 is protruded from the second surface 19 and extends into the fluid chamber 13 toward the third surface 20. The set of cooling fins 12 may be integrally formed with the first plate 10 (e.g., by casting or machining), or may be separately formed and then connected together by welding or bonding, although it is necessary to ensure thermal coupling between the set of cooling fins 12 and the first plate 10.
The heat dissipation device 100 further includes an inlet channel 26 and an outlet channel 27, wherein one end of the inlet channel 26 is communicated with the liquid inlet 14, and the other end of the inlet channel 26 extends through at least part of the heat dissipation fins 22 along the first direction 30 and is communicated with the inlet end 24 of the corresponding branch channel 23; an outlet flow passage 27 communicates between the outlet port 15 and the outlet end 25 of at least a portion of the branch flow passage 23. In this embodiment, the inlet flow channel 26 is defined between the top of the cooling fin group 12 and the first channel 21, and the inlet flow channel 26 communicates with the branch flow channels 23 defined by the cooling fin group 12 from the top.
The liquid inlet 14, the inlet flow passage 26, the inlet end 24 of the branch flow passage 23, the outlet end 25 of the branch flow passage 23, the outlet flow passage 27 and the liquid outlet 15 are sequentially communicated to form a heat dissipation flow passage 28 for passing cooling liquid.
The radiating fins are wave-shaped and are arranged at intervals in sequence, so that the branch flow channel is wave-shaped.
When the heat dissipation device 100 of the present invention is used, the thermal coupling is coupled to the heat source 200 that needs to be cooled, and the heat generated by the heat source 200 can be transferred to the heat dissipation fins 22. The cooling liquid enters from the liquid inlet 14, flows into each branch flow channel 23 from the inlet end 24 of each branch flow channel 23 through the inlet flow channel 26, and flows out from the liquid outlet 15 after flowing out from the outlet end 25 of each branch flow channel 23 through the outlet flow channel 27. When the cooling liquid passes through each branch flow channel 23, the heat on the heat dissipation fins 22 is taken away through heat exchange, so that the heat source 200 is cooled. And, branch runner is the wave, compares in the runner of straight setting, and its flow is more smooth and easy, and the resistance is littleer.
In this embodiment, the heat dissipating fins 22 are wavy, and the branch flow channels 23 between adjacent heat dissipating fins 22 are correspondingly wavy. The wave shape herein means a wave shape having a plurality of peaks 31 and valleys 32 arranged in series, wherein the valleys 32 are projected to a side away from the liquid outlet 15 and the peaks 31 are projected to a side close to the liquid outlet 15.
The shape of the cooling fins 22 may also be a saw-tooth shape or other shape with a circular arc transition at the turn.
The inlet end 24 of the branch flow path 23 is located at a valley 32 at an intermediate position in the extending direction of the branch flow path 23. The extending direction of the branch flow path 23 is a direction along the longitudinal direction of the wave shape. The number of the outlet ends 25 is two, and the two outlet ends 25 are respectively located at two ends of the extension direction of the branch flow passage 23. Optionally, the two outlet ends 25 are symmetrically arranged with respect to the inlet end 24.
Correspondingly, there are two outlet flow channels 27, two outlet flow channels 27 being located on either side of the inlet flow channel 26 and at least part of the flow section extending in the first direction 30. Two outlet ends 25 of each branch flow passage 23 are respectively communicated to the outlet flow passages 27 on the corresponding sides.
In this embodiment, optionally, the second board 11 includes a bottom plate 33 and a surrounding wall 34, the bottom plate 33 has a third surface 20 facing the first board 10, the surrounding wall 34 is connected to the third surface 20 side of the bottom plate 33, and the inner peripheral surface 35 of the surrounding wall 34, the third surface 20 and the second surface 19 together define the fluid chamber 13.
Optionally, the set of cooling fins 12 has two first sides 36 opposite to each other along the second direction 29, and the second direction 29 is perpendicular to the first direction 30. The first side 36 is an outer contoured surface collectively defined by the ends of the plurality of cooling fins 22 in the direction of extension. The inner peripheral surface 35 of the surrounding wall 34 has two second side surfaces 37 opposed in the second direction 29, and the two second side surfaces 37 are spaced apart from the corresponding first side surfaces 36 to define the two outlet flow passages 27, respectively.
Optionally, the third surface 20 is provided with a concave groove 38, the groove 38 and the heat dissipating fin group 12 are sequentially arranged along the first direction 30, and the groove 38 extends along the second direction 29. The liquid outlet 15 opens at a middle position of the groove 38 along the second direction 29 and penetrates to a side surface of the bottom plate 33 away from the first plate body 10. The two outlet flow passages 27 communicate with both ends of the groove 38 in the second direction 29, respectively.
In this embodiment, the inlet ends 24 of the plurality of continuous fins 22 of the set 12 away from the inlet 14 are optionally cut away to form second channels 39, and the second channels 39 extend along the first direction 30 and connect to the inlet channels 26.
The following describes the operation and principle of the heat dissipation device 100 in the embodiment of the present application.
Referring to fig. 1 to 9, when the heat dissipation device 100 of the embodiment of the present application is used, the heat dissipation device 100 is thermally coupled to a heat source 200 that needs to be cooled, for example, the first surface 18 is attached to the heat source 200, and heat generated by the heat source 200 is transferred to the heat dissipation fin group 12 through the first plate 10.
In conjunction with the coolant flow paths shown by the arrows in fig. 5-8, after entering from the inlet connectors 16 and the inlet ports 14, the coolant with lower temperature flows vertically (in the thickness direction of the first plate body 10 and the second plate body 11) downward into the inlet end 24 of each branch flow channel 23 while flowing along the inlet flow channel 26 or the first channel 21 in the first direction 30.
Further, with the embodiment in which the second channel 39 is provided, the coolant flows into the second channel 39 in the vertical direction at the rear end that flows in the first direction 30 through the inlet flow channel 26, and flows into the outlet flow channel 27 through the corresponding branch flow channel 23 via the second channel 39. The second channel 39 is provided to prevent the cooling liquid from flowing too high to the branch flow channel 23 defined by the portion of the cooling fin 22 far from the liquid outlet 15 during the flowing process.
Then, the coolant flows from the inlet end 24 along both sides of the branch flow paths 23, and flows out from both side outlet ends 25 of each branch flow path 23. In the process, the coolant removes heat from the radiator fins 22. As for the wavy heat dissipation fins 22, under the premise that the height (the distance from the protrusion of the wavy heat dissipation fins 22 to the first plate 10) is constant, the extending length of the wavy heat dissipation fins is longer than that of the straight heat dissipation fins 22, so that the wavy heat dissipation fins also have a larger surface area, and are beneficial to more efficiently transferring heat to the cooling liquid. Meanwhile, the extension length of the wave-shaped branch flow channel 23 limited by the cooling device is also larger, so that the flow path of the cooling liquid is larger, and the heat transfer efficiency is improved.
The cooling liquid flowing out from the outlet end 25 of each branch flow passage 23 converges in the outlet flow passages 27 at both sides, flows to the side of the liquid outlet 15, vertically upwards enters the groove 38, and flows out from the liquid outlet 15 and the liquid outlet connector 17 through the groove 38.
The effluent cooling liquid can be cooled by an external refrigeration device and then flows back to the liquid inlet 14 again for recycling.
In summary, the cooling liquid of the heat dissipation apparatus 100 in the embodiment of the present application flows smoothly, and the heat dissipation effect is good.
Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims (10)

1. A heat dissipation device, characterized in that:
the heat dissipation device comprises a heat dissipation fin group, the heat dissipation fin group comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at intervals in sequence along a first direction, and branch flow channels are defined between the adjacent heat dissipation fins; the branch flow channel is provided with an inlet end and an outlet end;
the heat dissipation device is provided with a liquid inlet and a liquid outlet, the liquid inlet is used for the inflow of cooling liquid, and the liquid outlet is used for the outflow of the cooling liquid;
the heat dissipation device further comprises an inlet flow channel and an outlet flow channel, wherein one end of the inlet flow channel is communicated with the liquid inlet, and the other end of the inlet flow channel extends through at least part of the heat dissipation fins along a first direction and is communicated with the inlet ends of the corresponding branch flow channels; the outlet flow passage is communicated with the liquid outlet and the outlet ends of at least part of the branch flow passages;
the liquid inlet, the inlet flow channel, the inlet end of the branch flow channel, the outlet end of the branch flow channel, the outlet flow channel and the liquid outlet are sequentially communicated to form a heat dissipation flow channel for cooling liquid to pass through;
the radiating fins are wave-shaped and are arranged at intervals in sequence, so that the branch flow channel is wave-shaped.
2. The heat dissipating device of claim 1, wherein:
the inlet end is located a trough of the extending direction of the branch flow channel, the outlet ends are two, and the two outlet ends are located at two ends of the extending direction of the branch flow channel respectively.
3. The heat dissipating device of claim 2, wherein:
the two outlet flow passages are respectively positioned at two sides of the inlet flow passage, and at least part of flow sections extend along a first direction;
two outlet ends of each branch flow channel are respectively communicated to the outlet flow channel on the corresponding side.
4. The heat dissipating device of claim 3, wherein:
the heat dissipation device comprises a first plate body and a second plate body, wherein a fluid cavity is formed by the first plate body and the second plate body in a matched and enclosed mode;
the first plate body is provided with a first surface and a second surface which are opposite, the first surface is positioned on one side of the first plate body, which is far away from the second plate body, and is used for being thermally coupled to a heating source, and the second surface is positioned on one side of the first plate body, which is close to the second plate body; the second plate body having a third surface spaced from the second surface to define the fluid chamber; the third surface is provided with a first channel formed by an inner recess, and the first channel is communicated with the liquid inlet and extends along a first direction;
the radiating fin group is arranged on the second surface in a protruding mode and extends into the fluid cavity towards one side of the third surface;
the inlet flow channel is defined between the top of the radiating fin group and the first channel, and the inlet flow channel is communicated with each branch flow channel limited by the radiating fin group from the top.
5. The heat dissipating device of claim 4, wherein:
the inlet ends of a plurality of continuous radiating fins of the radiating fin group, which are far away from one end of the liquid inlet, are cut off to form second channels, and the second channels extend along the first direction and are communicated with the inlet flow passages.
6. The heat dissipating device of claim 4, wherein:
the second plate body comprises a bottom plate and a surrounding wall, the bottom plate is provided with a third surface facing the first plate body, the surrounding wall is connected to one side of the third surface of the bottom plate, and the inner peripheral surface of the surrounding wall, the third surface and the second surface jointly form the fluid cavity.
7. The heat dissipating device of claim 6, wherein:
the radiating fin group is provided with two first side surfaces opposite to each other along a second direction, and the second direction is vertical to the first direction; the first side surface is an outer contour surface which is defined by the extending ends of the plurality of radiating fins together;
the inner circumferential surface of the surrounding wall is provided with two second side surfaces opposite to each other along a second direction, and the two second side surfaces are respectively spaced from the first side surfaces of the corresponding sides to respectively limit the two outlet flow passages.
8. The heat dissipating device of claim 7, wherein:
the third surface is provided with a groove formed by concave inwards, and the groove extends along a second direction;
the liquid outlet is formed in the middle of the groove along the second direction and penetrates through the surface of one side, far away from the first plate body, of the bottom plate;
the two outlet flow passages are respectively communicated with two ends of the groove along the second direction.
9. The heat dissipating device of claim 8, wherein:
the groove and the radiating fin group are sequentially arranged along a first direction.
10. The heat dissipating device of claim 4, wherein:
the heat dissipation device further comprises a liquid inlet connector and a liquid outlet connector, wherein the liquid inlet connector and the liquid outlet connector are respectively connected to one side of the second plate body, which is far away from the first plate body;
the liquid inlet connector is communicated with the liquid inlet, and the liquid outlet connector is communicated with the liquid outlet.
CN202222470950.3U 2022-09-16 2022-09-16 Heat sink device Active CN218735701U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222470950.3U CN218735701U (en) 2022-09-16 2022-09-16 Heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222470950.3U CN218735701U (en) 2022-09-16 2022-09-16 Heat sink device

Publications (1)

Publication Number Publication Date
CN218735701U true CN218735701U (en) 2023-03-24

Family

ID=85635147

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222470950.3U Active CN218735701U (en) 2022-09-16 2022-09-16 Heat sink device

Country Status (1)

Country Link
CN (1) CN218735701U (en)

Similar Documents

Publication Publication Date Title
CN208609321U (en) Cooling system and water-cooling row
CN211831654U (en) Efficient liquid cooling plate and equipment
CN109982543B (en) Liquid cooling radiator
CN109668346B (en) Novel semiconductor refrigeration heat dissipation module
CN110035642A (en) A kind of liquid-cooled heat-conducting block and water-cooling type radiator
CN215418156U (en) Microchannel copper-aluminum composite relieving liquid cooling radiator
CN111490448A (en) Laser module
CN107787157B (en) Liquid cooling type heat radiation module
CN212629071U (en) Cold plate
CN208300202U (en) Radiator water cold plate
CN218735701U (en) Heat sink device
CN105514064A (en) Heat sink
CN210272336U (en) Improved structure of liquid-cooled heat dissipation head
CN209527045U (en) Liquid-cooling heat radiator
CN105810805A (en) Liquid cooling heat sink
CN213586758U (en) Heat dissipation tooth
CN109671690B (en) Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component
KR20180080019A (en) Apparatus of Cold and Hot Mat
CN114071955A (en) Cooling device and electronic equipment comprising same
KR20180080022A (en) Apparatus of Cold and Hot Mat
CN208572652U (en) A kind of aluminum profile water-cooled radiator
CN214676302U (en) Temperature equalizing plate radiator with design of gradually-reduced water inlet hole
CN110996619A (en) Single-phase immersion type liquid cooling cabinet
AU2021102059A4 (en) A laser module
CN209896179U (en) Liquid cooling radiator

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant