CN214676302U

CN214676302U - Vapor radiator with tapered water hole design

Info

Publication number: CN214676302U
Application number: CN202120722051.0U
Authority: CN
Inventors: 郭永斌
Original assignee: Chia Cherne Industry Co ltd
Current assignee: Chia Cherne Industry Co ltd
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2021-11-09
Anticipated expiration: 2031-04-09

Abstract

A vapor chamber radiator with a tapered water hole design, comprising a cavity, a heat dissipation fin and a vapor chamber, wherein the chamber has a chamber, an inlet pipe and an outlet pipe, and the chamber has A partition plate and a partition wall are provided, the partition plate divides the chamber into an upper area and a lower area, and has a tapered water hole and a peripheral gap connecting the upper and lower areas, and the upper area is The partition wall is divided to have a water inlet space communicating with the inlet pipe and the tapered water inlet hole and a water outlet space communicating with the outlet pipe and the peripheral gap, and the tapered water inlet hole has a water inlet space that gradually increases as it moves away from the inlet pipe A reduced tapered width, the vapor chamber is fixed on the cavity, and the heat dissipation fin is disposed on the vapor chamber and located in the lower area; accordingly, a cooling fluid will have a distance from the vapor chamber due to the tapered width The kinetic energy of the inlet pipe flowing to the outlet pipe can increase the fluidity of the cooling fluid and improve the heat dissipation effect.

Description

Temperature equalizing plate radiator with design of gradually-reduced water inlet hole

Technical Field

The present invention relates to a radiator, particularly to a structure of a water-cooling radiator.

Background

The core of the water cooling system is a water cooling type heat sink, and the water cooling system is usually used for high-load IT equipment because the heat dissipation efficiency is higher than that of an air cooling type heat sink. A conventional water-cooled heat sink, such as taiwan patent No. M464724, discloses a water-cooled heat sink, in which an upper heat exchanging fin set and a lower heat exchanging fin set are alternately inserted into each other to form a water flow channel, so as to quickly take away heat of the upper heat exchanging fin set and the lower heat exchanging fin set through a cooling fluid passing through the water flow channel.

However, the flow channel of the conventional heat sink has no flow guiding design, which results in slow or even stagnation of the cooling fluid entering into a partial area of the flow channel, such as an area away from the inlet pipe or the side edge, thereby causing heat accumulation and reducing heat dissipation effect.

Therefore, taiwan patent No. M606241 discloses a uniform temperature radiator structure, in which a flow channel of the cooling fluid is designed, the cooling fluid entering from an inlet pipe and having a lower initial temperature directly enters from top to bottom into a central region having a higher temperature, so as to perform sufficient heat exchange and take away heat, and the cooling fluid after being heated flows toward a peripheral region, flows from bottom to top, and is discharged from an outlet pipe. Therefore, through the heat flow phenomena of the cooler cooling fluid descending and the hotter cooling fluid ascending, the fluidity of the cooling fluid is increased, and the stagnant area without flowing is avoided to increase the heat dissipation effect.

However, the flow channel of the cooling fluid is designed to be vertical S-shaped, and the inlet pipe and the outlet pipe are located at two horizontal sides, so that the cooling fluid has poor fluidity from the inlet pipe to the outlet pipe, and back pressure is easily generated to cause stagnation of the cooling fluid near the inlet pipe, thereby reducing heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to disclose a heat sink structure capable of increasing the fluidity of cooling fluid and increasing the heat dissipation effect.

To achieve the above object, the present invention provides a vapor chamber heat sink with a tapered inlet hole, which comprises a cavity, a heat sink and a vapor chamber. The cavity has a chamber, an inlet pipe and an outlet pipe, a partition board and a partition wall are arranged in the chamber, and the partition board divides the chamber into an upper area and a lower area. The partition plate has a gradually shrinking water inlet hole and a peripheral gap, the gradually shrinking water inlet hole is communicated with the upper region and the lower region, and the peripheral gap is also communicated with the upper region and the lower region. The upper area is separated by the partition wall and has a water inlet space and a water outlet space, the water inlet space is communicated with the inlet pipe and the gradually-reduced water inlet hole, the gradually-reduced water inlet hole has a gradually-reduced width gradually reduced along with the distance from the inlet pipe, and the water outlet space is communicated with the outlet pipe and the peripheral gap. The heat radiating fins are arranged on the temperature equalizing plate, and the temperature equalizing plate is fixed on the cavity and seals the cavity, and the heat radiating fins extend into the cavity and are positioned in the lower area.

In an embodiment of the present invention, the partition plate has a plurality of first fixing holes, and the partition wall has a plurality of second fixing holes corresponding to the plurality of first fixing holes, and the plurality of first fixing holes and the plurality of second fixing holes are respectively fixed by a plurality of fixing posts passing through the plurality of first fixing holes and the plurality of second fixing holes.

In an embodiment of the present invention, the shape of the heat dissipation fin is selected from any one of a cylinder and a square.

In an embodiment of the present invention, the peripheral gap surrounds the partition plate.

In an embodiment of the present invention, the cavity has an inlet hole communicating with the water inlet space, and the inlet pipe is coupled to the inlet hole.

In an embodiment of the present invention, the cavity has an outlet hole communicating with the water outlet space, and the outlet pipe is coupled to the outlet hole.

Therefore, the inlet pipe can introduce a cooling fluid, the cooling fluid enters the lower area through the water inlet space and the tapered inlet hole, flows through the temperature equalization plate and the heat dissipation fins, returns to the upper area through the peripheral gap, and is finally discharged from the outlet pipe through the water outlet space.

Drawings

FIG. 1A is a structural appearance diagram of the present invention;

FIG. 1B is a cross-sectional view taken at 1B-1B of FIG. 1A in accordance with the present invention;

FIG. 1C is a cross-sectional view of the present invention at 1C-1C of FIG. 1A;

fig. 2 is an exploded view of the present invention;

fig. 3 is a diagram showing the position correspondence between the partition plate and the heat dissipation fins of the present invention;

fig. 4 is a first schematic view of the flow of the cooling fluid of the present invention;

fig. 5 is a schematic view of the flow of the cooling fluid according to the present invention.

Detailed Description

The detailed description and technical contents of the present invention will now be described with reference to the accompanying drawings as follows:

referring to fig. 1A, fig. 1B, fig. 1C and fig. 2, the present invention is a temperature-uniforming plate heat sink with a tapered inlet hole design, which includes a cavity 10, a heat sink 20 and a temperature-uniforming plate 30. Wherein the chamber 10 has a chamber 11, an inlet pipe 12 and an outlet pipe 13. A partition plate 14 and a partition wall 15 are disposed in the chamber 11, and the partition plate 14 divides the chamber 11 into an upper region 111 and a lower region 112. As shown in fig. 1B, the partition plate 14 has a tapered inlet hole 141 and a peripheral gap 142, the tapered inlet hole 141 communicates the upper region 111 and the lower region 112, the tapered inlet hole 141 has a tapered width gradually decreasing with distance from the inlet tube 12, and the peripheral gap 142 also communicates the upper region 111 and the lower region 112. In one embodiment, as shown in FIG. 1C, the peripheral indentation 142 is disposed around the divider 14.

Referring to fig. 1B and 1C, the upper region 111 is separated by the partition wall 15 to form a water inlet space 113 and a water outlet space 114, the water inlet space 113 is connected to the inlet pipe 12 and the tapered inlet hole 141, and the water outlet space 114 is connected to the outlet pipe 13 and the peripheral gap 142. In one embodiment, the chamber 10 has an inlet hole 16, the inlet hole 16 communicates with the water inlet space 113, and the inlet pipe 12 engages the inlet hole 16. Similarly, the chamber 10 has an outlet hole 17, the outlet hole 17 communicates with the outlet space 114, and the outlet pipe 13 engages with the outlet hole 17.

The heat dissipation fins 20 are disposed on the temperature equalization plate 30, and the temperature equalization plate 30 is fixed to the cavity 10 and seals the cavity 11, and the heat dissipation fins 20 extend into the cavity 11 and are located in the lower region 112. The radiator fins 20 may have various shapes in practical implementation, for example, the radiator fins 20 may be cylindrical or square as drawn in fig. 3, and so on.

Referring to fig. 1B, fig. 2 and fig. 3, the partition plate 14 may have a plurality of first fixing holes 143, the partition wall 15 has a plurality of second fixing holes 151 corresponding to the plurality of first fixing holes 143, and the plurality of first fixing holes 143 and the plurality of second fixing holes 151 are respectively fixed by a plurality of fixing posts 18 passing through the fixing posts.

Referring to fig. 4 and 5, the inlet pipe 12 can introduce a cooling fluid 40, the cooling fluid 40 with a lower initial temperature directly enters the lower region 112 from top to bottom through the water inlet space 113 and the tapered inlet holes 141, when the cooling fluid 40 passes through the tapered inlet holes 141, because the tapered width of the tapered inlet holes 141 gradually decreases with distance from the inlet pipe 12, according to the theory of hydrodynamics, the tapered inlet holes near the inlet pipe have a larger passing flow rate, and the tapered inlet holes far from the inlet pipe have a smaller passing flow rate, after passing through the tapered inlet holes, the cooling fluid has kinetic energy far from the inlet pipe and flowing to the outlet pipe due to the difference of flow rates, so as to increase the fluidity of the cooling fluid. The cooling fluid 40 absorbs heat when flowing through the vapor chamber 30 and the heat sink 20, and the central areas of the vapor chamber 30 and the heat sink 20 are usually the highest temperature areas, so that heat exchange can be performed sufficiently to remove heat. The cooling fluid 40 heated by the heat absorption flows toward the peripheral region to return to the upper region 111 from bottom to top through the peripheral gap 142 (see also fig. 1C), and finally is discharged from the outlet pipe 13 through the outlet space 114.

As mentioned above, the advantages of the present invention over the prior art include at least:

1. the tapering width of the tapering inlet hole gradually decreases with distance from the inlet pipe, so that the tapering inlet hole close to the inlet pipe has a larger passing flow rate, and the tapering inlet hole away from the inlet pipe has a smaller passing flow rate, so that after passing through the tapering inlet hole, the cooling fluid has kinetic energy away from the inlet pipe and flowing to the outlet pipe due to flow difference, and the flowing property of the cooling fluid can be increased to improve the heat dissipation effect.

2. The cooling fluid with lower initial temperature directly enters the central area with higher temperature of the temperature equalizing plate and the heat radiating fins from top to bottom, and can fully exchange heat to take away heat.

3. The heated cooling fluid flows towards the peripheral area and returns to the upper area from bottom to top through the peripheral gap to be discharged from the outlet pipe through the water outlet space, so that the cooling fluid meets the heat flow phenomena of cold fluid descending and hot fluid ascending, the fluidity of the cooling fluid can be increased, a stagnant area which does not flow is avoided, and the cooling fluid can be ensured to fully contact the temperature equalizing plate and the heat radiating fins to increase the heat radiating effect.

Claims

1. A vapor chamber radiator with a tapered water hole design, characterized in that, comprising:

a cavity, the cavity has a cavity, an inlet pipe and an outlet pipe, a partition plate and a partition wall are arranged in the cavity, the partition plate divides the cavity into an upper area and a lower area, And the partition plate has a tapered water inlet connecting the upper area and the lower area and a peripheral notch connecting the upper area and the lower area, and the upper area is separated by the partition wall and has the inlet pipe that communicates with the lower area. A water inlet space of the tapered water inlet hole and a water outlet space communicated with the outlet pipe and the peripheral gap, and the tapered water inlet hole has a tapered width that gradually decreases as it moves away from the inlet pipe;

a cooling fin; and

a temperature equalizing plate, the heat dissipation fin is disposed on the temperature equalizing plate, and the temperature equalizing plate is fixed on the cavity and closes the cavity, and the heat dissipation fin extends into the cavity and is located in the lower area.

2 . The vapor chamber radiator of claim 1 , wherein the partition plate has a plurality of first fixing holes, and the partition wall has corresponding first fixing holes. 3 . A plurality of second fixing holes of the holes, and the plurality of first fixing holes and the plurality of second fixing holes are respectively passed through and fixed by a plurality of fixing posts.

3 . The vapor chamber radiator with a tapered water hole design according to claim 1 , wherein the shape of the heat dissipation fins is any one selected from cylindrical and square. 4 .

4 . The vapor chamber radiator of claim 1 , wherein the peripheral notch surrounds the partition plate. 5 .

5 . The vaporizing plate radiator of claim 1 , wherein the cavity has an inlet hole communicating with the water inlet space, and the inlet pipe is engaged with the inlet hole. 6 .

6 . The vapor chamber radiator of claim 1 , wherein the cavity has an outlet hole communicating with the water outlet space, and the outlet pipe is engaged with the outlet hole. 7 .