CN218730854U - Jig for semiconductor equipment maintenance - Google Patents
Jig for semiconductor equipment maintenance Download PDFInfo
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- CN218730854U CN218730854U CN202222669397.6U CN202222669397U CN218730854U CN 218730854 U CN218730854 U CN 218730854U CN 202222669397 U CN202222669397 U CN 202222669397U CN 218730854 U CN218730854 U CN 218730854U
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- process chamber
- jig
- lateral wall
- protective layer
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000012423 maintenance Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 61
- 230000008569 process Effects 0.000 claims abstract description 60
- 238000001179 sorption measurement Methods 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 239000011241 protective layer Substances 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 26
- 238000010521 absorption reaction Methods 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 230000036541 health Effects 0.000 abstract description 7
- 231100000614 poison Toxicity 0.000 abstract description 4
- 230000007096 poisonous effect Effects 0.000 abstract description 4
- 241000252254 Catostomidae Species 0.000 description 5
- 231100000331 toxic Toxicity 0.000 description 5
- 230000002588 toxic effect Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a tool is used in semiconductor equipment maintenance, semiconductor equipment includes process chamber and electrostatic adsorption dish, be provided with the opening that supplies electrostatic adsorption dish to come in and go out on process chamber's the lateral wall, the tool includes and pastes the outside of placing in process chamber after electrostatic adsorption dish shifts out process chamber, and cover the lateral wall surface's at opening place inoxidizing coating, the inoxidizing coating includes main part and extension, the main part covers in the lateral wall surface at opening place, extension one end is connected with the main part, the other end extends to process chamber's the surface adjacent with the lateral wall surface at opening place. The application provides a tool is used in maintenance can carry out mimicry to the lateral wall and seal, therefore in the maintenance process of technology cavity, can effectively avoid external pollution source to get into in the cavity, help reducing the required time of maintenance of equipment, can avoid the poisonous and harmful substance outdiffusion in the cavity simultaneously, help improving occupational health security.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing, concretely relates to tool is used in semiconductor equipment maintenance.
Background
The electrostatic chuck (ESC) is an important spare part (part) in various semiconductor production equipment, for example, in the dry etching process, a wafer is placed on the ESC and is fixed through electrostatic adsorption of the ESC, after various gases enter a cavity, the gases are influenced by an electric field and are converted into Plasma (Plasma), and a bias electric field on the ESC guides the Plasma to bombard the wafer, so that the wafer is etched. In order to ensure the temperature uniformity of the wafer, helium gas is introduced into the electrostatic adsorption disc so as to conduct heat uniformly to the wafer. Therefore, in order to ensure that the electrostatic adsorption disc is in a good state, the equipment needs to be periodically shut down for maintenance, for example, the electrostatic adsorption disc is taken out from the cavity of the equipment for cleaning and maintenance. Because the volume of the electrostatic adsorption disc body is usually larger, the electrostatic adsorption disc body generally needs to be pushed out integrally from a special opening arranged on the side wall of the equipment, at the moment, the side wall of the cavity is completely exposed, no protection is provided, and the possibility of pollution to the cavity in the maintenance process is increased. Various toxic and harmful chemicals are used in processes such as a chemical vapor deposition process and etching, and in the case where the sidewall of the chamber is open, the residual toxic and harmful substances in the chamber may diffuse outward, which is harmful to the health of engineers.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings in the prior art, an object of the present application is to provide a jig for semiconductor device maintenance, which is used for solving the problems in the prior art that in the process of maintaining a semiconductor device, the sidewall of a cavity is completely exposed, which easily causes the cavity to be contaminated, and toxic and harmful substances inside the cavity may diffuse outwards, which endangers the health of engineers.
For realizing above-mentioned purpose and other relevant purposes, the application provides a tool is used in semiconductor device maintenance, semiconductor device includes process chamber and electrostatic adsorption dish, be provided with the opening that supplies electrostatic adsorption dish to come in and go out on process chamber's the lateral wall, the tool includes the electrostatic adsorption dish shifts out post-pasting of process chamber is placed in process chamber's the outside, and covers the inoxidizing coating on the lateral wall surface at opening place, the inoxidizing coating includes main part and extension, the main part cover in the lateral wall surface at opening place, extension one end with the main part is connected, and the other end extends to process chamber with the adjacent surface in lateral wall surface at opening place.
Optionally, a sealing ring is further disposed on the semiconductor device, the sealing ring is located on the surface of the side wall where the opening is located, and the protective layer is attached to the surface of the sealing ring.
And the protective layer is provided with a groove which is embedded with the sealing ring.
Optionally, the protective layer is a transparent material layer.
Optionally, the protective layer is an acrylic layer.
Optionally, the semiconductor equipment maintenance jig comprises an adsorption device and a supporting device used for fixing the protective layer, the supporting device comprises a supporting plate and a sucker located on the supporting plate, and the sucker is communicated with the adsorption device.
Optionally, the suction port of the suction cup is in a horn shape.
Optionally, the process chamber comprises any one of a vapor deposition chamber and a dry etching chamber.
Optionally, the thickness of the protective layer is less than or equal to 2cm.
As described above, the jig for semiconductor device maintenance of the present application has the following advantageous effects: the application provides a dedicated maintenance tool, after electrostatic adsorption dish shifts out the process chamber, laminate to the lateral wall surface at electrostatic adsorption dish access & exit place through the tool of special design to carry out mimicry to the lateral wall and seal, therefore in the maintenance process of process chamber, can effectively avoid external pollution source to get into in the cavity, help reducing the required time of equipment maintenance, can avoid the poisonous and harmful substance in the cavity to diffuse outward simultaneously, help improving occupational health security.
Drawings
Fig. 1 is a schematic view illustrating an exemplary structure of a fixture for repairing semiconductor devices according to the present disclosure.
Fig. 2 is a schematic view illustrating a connection between a supporting device and an adsorbing device of the jig for repairing semiconductor devices according to the present application.
Description of the element reference numerals
11. Process chamber
12. Electrostatic adsorption disc
13. Protective layer
131. Main body part
132. Extension part
14. Open at the top
15. Supporting plate
16. Suction cup
17. Adsorption pipeline
18. Power pump
Detailed Description
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. As in the detailed description of the embodiments of the present application, the cross-sectional views illustrating the structure of the device are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application and are not drawn according to the number, shape and size of the components in actual implementation, the type, quantity and proportion of each component in actual implementation may be changed freely, and the layout of the components may be more complicated. In order to keep the drawings as concise as possible, not all features of a single figure may be labeled in their entirety.
As shown in fig. 1, the present application provides a jig for maintaining semiconductor equipment, the semiconductor equipment includes process chamber 11 and electrostatic adsorption dish 12, be provided with the opening that supplies electrostatic adsorption dish 12 to come in and go out on the lateral wall of process chamber 11, the jig includes inoxidizing coating 13, inoxidizing coating 13 is in electrostatic adsorption dish 12 shifts out post-adhesion of process chamber 11 is located the outside of process chamber 11, and covers the lateral wall surface at opening place, will from this process chamber 11 lateral wall opening is sealed.
The size and shape of the protective layer 13 is generally determined according to the sidewall of the opening. In an example, the protective layer 13 includes a main body portion 131 and extension portions 132, the main body portion 131 covers a sidewall surface where the opening is located, that is, the size and shape of the main body portion 131 are matched with the sidewall surface where the opening is located, the area of the main body portion 131 is larger than the area of the opening, the main body portion may extend to a left side and a right side adjacent to the sidewall, as shown in fig. 1, one end of each extension portion 132 is connected to the main body portion 131, and the other end of each extension portion 132 extends to an upper surface and a lower surface of the process chamber 11 adjacent to the sidewall surface where the opening is located, that is, the number of the extension portions 132 may be one or more than 2; when the number of the extension portions 132 is plural, the extension portions 132 are distributed at intervals, for example, as shown in fig. 1, and are located on the same side of the main body portion 131, of course, the extension portions 132 may also be disposed on different sides of the main body portion 131, for example, the extension portions 132 extend to each surface adjacent to the sidewall surface where the opening is located, so as to ensure the fixation of the protection layer, prevent the protection layer 13 from sliding off, and the extension portions 132 are also disposed to facilitate the removal of the protection layer 13 from the extension portions 132 after the maintenance is finished.
The protective layer 13 is a non-metallic material layer, and is particularly preferably a corrosion-resistant organic material layer. When the semiconductor device is to be repaired and maintained, the electrostatic chuck 12 is removed from the process chamber 11 through the opening, so as to perform the maintenance operation on the electrostatic chuck 12, including but not limited to surface cleaning and surface defect repair. In the maintenance process, the protective layer 13 covers the surface of the opening, so that pollution sources such as external particle impurities cannot enter the process chamber 11 through the opening, and meanwhile, residual toxic and harmful gases in the process chamber 11 cannot diffuse to the outside of the semiconductor equipment through the opening, so that the health of workers can be ensured.
The utility model provides a tool is used in semiconductor device maintenance, also can say that this application provides a novel semiconductor device who has tool is used in maintenance, this tool through the special design, after electrostatic adsorption dish shifts out the process chamber, laminate this tool to the lateral wall surface at electrostatic adsorption dish access & exit place, in order to carry out mimicry to the lateral wall and seal (the big or small shape of inoxidizing coating matches with the big or small shape of the lateral wall of subsides and putting, in order to effectively cover the protection to the lateral wall), therefore in the maintenance process of process chamber, can effectively avoid external pollution source to get into in the cavity, help reducing the required time of maintenance of equipment, can avoid the interior poisonous and harmful substance of cavity to diffuse outward simultaneously, help improving occupational health safety.
It should be noted that the semiconductor apparatus generally has a top opening 14 and a top cover covering the top opening 14, and the process chamber 11 generally has a cylindrical structure, only a part of which is illustrated in this specification.
As an example, a sealing ring (not shown) is further disposed on the semiconductor device, the sealing ring is located on a surface of a sidewall where the opening is located, the sealing ring is generally disposed around a circumference of the opening, and the protective layer 13 is attached to a surface of the sealing ring. The sealing ring is arranged, so that the sealing performance of the semiconductor device in the process can be ensured, and meanwhile, the protective layer 13 and the sealing ring can be better attached to ensure the sealing performance. The sealing ring includes but is not limited to a teflon sealing ring. Certainly, under the condition that semiconductor equipment does not set up the sealing washer itself, the tool also can be located the circumference of inoxidizing coating from taking the sealing washer, not only is convenient for seal, and it is convenient simultaneously follow-up with the tool is peeled off from semiconductor equipment.
In order to make the protective layer 13 better fit with the sealing ring and facilitate observing the use condition of the sealing ring, as an example, the protective layer 13 is a transparent material layer, and more preferably a corrosion-resistant transparent material layer, for example, the protective layer 13 is an acrylic layer. The surface of the protective layer 13 which is attached to the sealing ring has a smooth surface so as to be attached to the sealing ring. In other examples, the protective layer may be provided with a groove for engaging with a sealing ring. When the protective layer 13 is attached to the sealing ring, the sealing ring can be embedded into the groove, so that the protective layer 13 and the sealing ring can be attached seamlessly. In other examples, an adhesive layer may be disposed on the circumferential direction of the protective layer 13, so as to be used for attaching and fixing the protective layer 13 and the sealing ring.
The jig provided by the application can be suitable for various types of semiconductor equipment, for example, the process chamber 11 can be any one of a vapor deposition chamber and a dry etching chamber, and the jig with the corresponding size can be adjusted and used according to different types of equipment.
In one example, the thickness of the protective layer is less than or equal to 2cm, and more preferably 0.5cm to 1.5cm, which can ensure that the protective layer has a certain hardness and can be fixed on the surface of the side wall, and can avoid falling off due to heavy weight caused by too large thickness.
The protective layer 13 may be a single structural layer, such as a single acrylic layer, which may be single use, and may be provided with a protective film on its surface to protect it from contamination, which is torn off before use. In other examples, the protective layer 13 may be a composite structure with more than two layers, each layer is stacked on another layer, and different layers are separated by a protective film, and a new layer is used according to the need of maintenance.
The fixture may be provided with the protective layer 13 only, and when in use, the protective layer is manually attached to the surface of the process chamber by a worker, and then manually torn off after the maintenance operation is completed. The advantages of this are simple structure and low cost, but the disadvantage is that it depends on the manual work of the worker. In the operation process, the staff easily touches the equipment and contacts the toxic and harmful substances remained on the equipment. Meanwhile, the protective layer is light and thin, so that the protective layer is difficult to be completely attached in place due to the curling of the protective layer and other reasons in the attaching process. Therefore, in another example provided by the present application, the jig further includes an adsorption device and a supporting device for fixing the protection layer, an exemplary structure of the supporting device can be shown in fig. 2, and the supporting device includes a supporting plate 15 and a suction cup 16 located on the supporting plate 15, and the suction cup 16 is preferably embedded on the supporting plate 15, so that the upper surface of the suction cup 16 does not protrude from the surface of the supporting plate 15. The support plate 15 has a profile adapted to the profile of the protective layer 13, for example, also provided with a portion corresponding to the main portion 131 and a portion corresponding to the extension 132 of the protective layer 13. The suckers 16 can be arranged at intervals around the center of the support plate 15 according to the requirement, for example, 4 suckers are shown in the figure, and the suckers can also be arranged at the center of the support plate 15, and the suckers 16 are communicated with a suction device comprising a suction pipeline 17 and a power pump 18, or the suckers 16 are communicated with the power pump 18 through the suction pipeline 17. The suction cup 16 may have a trumpet-shaped suction port to increase a suction area. In the case of providing the supporting device, an exemplary use method of the jig is that after the electrostatic chuck 12 is removed from the process chamber 11, the adsorbing device is activated to provide an adsorbing force, so that the chuck 16 of the supporting device adsorbs the protective layer 13 under a negative pressure, the main body 131 of the protective layer 13 is entirely attached to the surface of the supporting plate 15, then the protective layer 13 is moved to the side wall of the process chamber 11 and the protective layer 13 corresponds to the opening, after aligning, the adsorbing device provides a pushing force to release the protective layer 13, the main body 131 is attached to the surface of the side wall, the extending portion 132 is attached to the upper surface of the process chamber 11 shown in fig. 1 under the action of gravity, then the supporting device is moved away, after maintenance is completed, the supporting device is moved to the corresponding position, and the adsorbing device provides an adsorbing force to the chuck 16, so that the protective layer 13 is removed.
In other examples, the supporting device may be a support having a supporting portion for fixing the protective layer and a bracket for fixing the supporting portion, the supporting portion has a groove for accommodating the entire side surface of the process chamber, the protective layer may be fixed on the inner surface of the groove of the supporting portion by vacuum absorption, electrostatic absorption, or the like, and the groove of the supporting portion covers the side surface of the process chamber 11 and is closely attached to the side surface when the space allows.
The support means may have other arrangements, which are not strictly limited. Through the supporting device capable of fixing the protective layer, the bending deformation of the protective layer and the direct contact between workers and the process chamber are avoided as much as possible in the process of closing the side wall opening of the process chamber by the protective layer.
To sum up, the application provides a tool is used in semiconductor device maintenance, semiconductor device includes process chamber and electrostatic absorption dish, be provided with the opening that supplies electrostatic absorption dish to come in and go out on process chamber's the lateral wall, the tool includes the electrostatic absorption dish shifts out post-processing chamber pastes and places in process chamber's the outside, and covers the lateral wall surface's at opening place inoxidizing coating, the inoxidizing coating includes main part and extension, the main part cover in the lateral wall surface at opening place, extension one end with the main part is connected, and the other end extends to process chamber's with the surface that the lateral wall surface at opening place is adjacent. This application sets up special maintenance of semiconductor equipment and uses tool, after the electrostatic adsorption dish shifts out the process cavity, the tool through special design laminates to the lateral wall surface at electrostatic adsorption dish access & exit place to carry out the mimicry to the lateral wall and seal, therefore in the maintenance process of process cavity, can effectively avoid external pollution source to get into in the cavity, help reducing the required time of maintenance of equipment, can avoid the poisonous and harmful substance in the cavity to diffuse outward simultaneously, help improving occupational health security. Therefore, the application effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.
Claims (10)
1. The utility model provides a tool is used in semiconductor equipment maintenance, semiconductor equipment includes process chamber (11) and electrostatic absorption dish (12), be provided with the opening that supplies electrostatic absorption dish to come in and go out on the lateral wall of process chamber (11), its characterized in that, the tool includes electrostatic absorption dish shifts out post-processing chamber (11) pastes and puts in the outside of process chamber (11), and covers inoxidizing coating (13) on the lateral wall surface at opening place, inoxidizing coating (13) include main part (131) and extension (132), main part (131) cover in the lateral wall surface at opening place, extension (132) one end with main part (131) are connected, and the other end extends to process chamber (11) with the surface that the lateral wall surface at opening place is adjacent.
2. The jig for repairing semiconductor equipment according to claim 1, wherein a sealing ring is further disposed on the semiconductor equipment, the sealing ring is located on a surface of the side wall where the opening is located, and the protective layer (13) is attached to a surface of the sealing ring.
3. The jig for repairing semiconductor device according to claim 2, wherein the protective layer (13) is provided with a groove for fitting the seal ring.
4. The jig for repairing semiconductor device according to claim 1, wherein the protective layer (13) is a transparent material layer.
5. The jig for repairing semiconductor device according to claim 1, wherein the protective layer (13) is an acrylic layer.
6. A jig for repairing semiconductor device according to claim 1, wherein the jig for repairing semiconductor device comprises an adsorption device and a supporting device for fixing the protection layer, the supporting device comprises a supporting plate (15) and a suction cup (16) on the supporting plate, the suction cup (16) is in communication with the adsorption device.
7. The jig for repairing semiconductor device according to claim 6, wherein the suction port of the suction pad (16) is formed in a horn shape.
8. The jig for repairing semiconductor device as claimed in claim 1, wherein the number of the extending portions (132) is two or more, and the two or more extending portions are spaced apart from each other.
9. The jig for repairing semiconductor device according to claim 1, wherein the process chamber (11) comprises any one of a vapor deposition chamber and a dry etching chamber.
10. The jig for repairing semiconductor device according to claim 1, wherein the thickness of the protective layer (13) is 2cm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222669397.6U CN218730854U (en) | 2022-10-09 | 2022-10-09 | Jig for semiconductor equipment maintenance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222669397.6U CN218730854U (en) | 2022-10-09 | 2022-10-09 | Jig for semiconductor equipment maintenance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730854U true CN218730854U (en) | 2023-03-24 |
Family
ID=85583234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222669397.6U Active CN218730854U (en) | 2022-10-09 | 2022-10-09 | Jig for semiconductor equipment maintenance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730854U (en) |
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2022
- 2022-10-09 CN CN202222669397.6U patent/CN218730854U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 135 Binfu Avenue, Lingqiao Town, Fuyang District, Hangzhou City, Zhejiang Province, 311418 (Binfu Cooperation Zone) Patentee after: Hangzhou Fuxin Semiconductor Co.,Ltd. Address before: 310000 1-1301, No. 6, Lianhui street, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Fuxin Semiconductor Co.,Ltd. |