CN218721310U

CN218721310U - LED lamp panel and LED lamp

Info

Publication number: CN218721310U
Application number: CN202222963991.6U
Authority: CN
Inventors: 周景超; 于洋; 陈桂明; 谢开旺
Original assignee: Beijing Dream Ink Technology Co Ltd
Current assignee: Beijing Dream Ink Technology Co Ltd
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-03-24
Anticipated expiration: 2032-11-08

Abstract

The utility model discloses a LED lamp panel, relating to the technical field of LED application; this LED lamp plate includes: an insulating substrate; the LED lamp comprises a first point electrode and a second point electrode which are formed on the insulating substrate, and an LED circuit which is arranged between the first point electrode and the second point electrode and is formed by at least 2 printed circuits and LED lamp beads; the LED lamp comprises a printed circuit, wherein one or more design elements of the line length, the line width, the line thickness and the number of LED lamp beads of the printed circuit are controlled, so that the LED circuits have the same equivalent resistance. The utility model discloses a control printed circuit's line length, line width, line thickness and one or more design element in the quantity of LED lamp pearl, make every LED circuit have the same equivalent resistance each other as far as possible to promote the luminance equilibrium nature between the different LED circuits on the LED lamp plate.

Description

LED lamp panel and LED lamp

Technical Field

The utility model belongs to the technical field of the LED is used, especially, relate to a LED lamp plate and LED lamps and lanterns.

Background

The LED lamp plate on the market mainly adopts a plurality of lamp strip structures of parallelly connected each other, every lamp strip is established ties by the lamp pearl of the same figure and is constituted, nevertheless because two extraction electrodes on a lamp plate can only set up two positions on the lamp plate, consequently in order to guarantee the evenly distributed of lamp pearl on the lamp plate, the conducting wire between every lamp strip of parallelly connected each other must have the difference in the aspect of the wiring, thereby lead to the wire resistance of every lamp strip different, this current that also causes lamp pearl in the branch road of connecting in parallel to obtain is different, finally cause the luminous luminance between every way LED circuit also can appear the difference.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present invention is to provide an LED lamp panel to solve the problem of uneven brightness between each LED circuit in the prior art.

In some illustrative embodiments, the LED light panel includes: an insulating substrate; the LED lamp comprises a first point electrode and a second point electrode which are formed on the insulating substrate, and an LED circuit which is arranged between the first point electrode and the second point electrode and is formed by at least 2 printed circuits and LED lamp beads; the LED lamp comprises a printed circuit, wherein one or more design elements of the line length, the line width, the line thickness and the number of LED lamp beads of the printed circuit are controlled, so that the LED circuits have the same equivalent resistance.

In some optional embodiments, there is a common printed line between at least 2 LED lines.

In some optional embodiments, the line width of the shared printed line is equal to or greater than the line width of the unshared printed line.

In some optional embodiments, each LED line comprises a plurality of line units, each line unit consisting of a printed line and/or an LED lamp bead; the LED circuits are in one-to-one correspondence with the circuit units, and the corresponding circuit units have the same equivalent resistance.

In some optional embodiments, the first dot electrode, the second dot electrode and the printed wiring are integrally formed by printing.

In some optional embodiments, the printed wiring comprises: the conductive wire layer is printed on the insulating substrate, and the pad layer is printed on the conductive wire layer; and the LED lamp beads are attached to the bonding pad layer.

In some optional embodiments, an integrated bonding structure is arranged between the lead layer and the pad layer.

In some optional embodiments, the pad layer covers a part or all of the wiring layer.

In some optional embodiments, the LED lamp panel further includes: a transparent protective layer covering the LED line.

Another object of the present invention is to provide a lamp, which uses the LED lamp panel according to any one of the above mentioned embodiments.

Compared with the prior art, the utility model has the advantages of as follows:

the utility model discloses a control printed circuit's line length, line width, line thickness and one or more design element in the quantity of LED lamp pearl, make every LED circuit have the same equivalent resistance each other as far as possible to promote the luminance equilibrium nature between the different LED circuits on the LED lamp plate.

Drawings

Fig. 1 is a first structural example of an LED lamp panel in an embodiment of the present invention;

fig. 2 is a second structural example of the LED lamp panel in the embodiment of the present invention;

fig. 3 is a third structural example of the LED lamp panel in the embodiment of the present invention;

fig. 4 is a fourth example of the structure of the LED lamp panel in the embodiment of the present invention;

fig. 5 is a first layer structure example of the LED lamp panel in the embodiment of the present invention;

fig. 6 is a second example of the layer structure of the LED lamp panel in the embodiment of the present invention.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. In this context, these embodiments of the invention may be referred to, individually or collectively, by the term "utility model" merely for convenience and without automatically limiting the scope of this application to any single utility model or utility model concept if more than one is in fact disclosed.

It should be noted that, in the present invention, the technical features may be combined with each other without conflict.

The embodiment of the present invention provides an LED lamp panel, and specifically, as shown in fig. 1-4, fig. 1 is a first structural example of an LED lamp panel in the embodiment of the present invention; fig. 2 is a second structural example of the LED lamp panel in the embodiment of the present invention; fig. 3 is a third structural example of the LED lamp panel in the embodiment of the present invention; fig. 4 is a fourth example of the structure of the LED lamp panel in the embodiment of the present invention; this LED lamp plate includes: an insulating substrate 10, a first dot electrode 21, a second dot electrode 22 formed on the insulating substrate 10, and at least 2 LED lines disposed between the first dot electrode 21 and the second dot electrode 22; each LED circuit is composed of a printed circuit 30 and an LED lamp bead 40; and one or more design elements of the line length, the line width, the line thickness and the number of the LED lamp beads of the printed circuit are controlled, so that the LED circuits have the same equivalent resistance.

Since it is known that R = ρ L/S, the resistance (resistance value) R is related to the conductive length L and the conductor cross-sectional area S on the basis of the same conductor material ρ, whereas in the case of the conversion to a printed wiring in the present scheme, i.e., the resistance R is related to the line length L of the printed wiring, the line width W of the printed wiring, and the line thickness H of the printed wiring, i.e., R = L/(W × H). Therefore, when the same conductive ink is used for manufacturing the printed circuit, the same equivalent resistance between each LED circuit can be achieved by controlling the line length, the line width and the line thickness of the printed circuit (all or part) in each LED circuit.

Moreover, because the LED lamp beads have certain element resistance, the equivalent resistance between each path of LED circuit can be achieved by controlling the wire, the line width and the line thickness of the printed circuit in each path of LED circuit and the number of the LED lamp beads in each path of LED circuit.

The utility model discloses a control printed circuit's line length, line width, line thickness and one or more design element in the quantity of LED lamp pearl, make every LED circuit have the same equivalent resistance each other as far as possible to luminance equilibrium nature between the different LED circuits on the promotion LED lamp plate.

The embodiment of the utility model provides an insulating substrate is flexible or rigid substrate. The flexible insulating substrate can be flexible base materials such as LCP, PTFE, PI, PET, PU, fabrics and the like, and can also be flexible stretchable base materials such as TPU and the like. The rigid insulating substrate can be selected from PC, ABS, FR4, PE, wood, glass, stone, etc.

The embodiment of the utility model provides an in the printing circuit accessible commercial conductive ink form through the printing, the printing mode is not limited to screen printing or bat printing etc. conductive ink can be the blend thick liquids that resin and conductive particle are given first place to, and conductive particle is not limited to gold, silver, copper, aluminium, silver-clad copper, low-melting metal etc..

The low-melting-point metal is a simple low-melting-point metal or an alloy having a melting point of 300 ℃ or lower, such as gallium, a gallium-based alloy, a gallium-indium alloy, and a tin-based alloy.

Example 1

As shown in fig. 1, the LED lines are connected in parallel to each other in a plurality of paths between the first point electrode 21 and the second point electrode 22, each path of LED lines has the same number of LED beads 40, and the printed lines 30 printed with the same conductive ink are connected in series; the line width and the line thickness of the printed circuit in each LED line are the same, and the total length of the printed circuit is the same although the shape of the printed circuit is different.

The original line in the LED line is short, and the LED line can be lifted to the same length as other LED lines by designing a roundabout winding structure.

Example 2

The LED lamp beads are connected in parallel in a plurality of paths of LED circuits between the first point electrode and the second point electrode, each path of LED circuit is provided with the same number of LED lamp beads, and printed circuits formed by printing the same conductive ink are connected in series; the total length of the printed circuit in each LED circuit is different, and for the LED circuit with a longer printed circuit, the equivalent resistance between each LED circuit can be the same by increasing the line width of the printed circuit or increasing the line thickness of the printed circuit (which can be increased by multiple overprinting).

Example 3

The LED lamp beads are connected in parallel in a plurality of paths of LED circuits between the first point electrode and the second point electrode, and each path of LED circuit is formed by printing the same conductive ink and connects the LED lamp beads in series; the total length of the printed circuit in each LED circuit is different, and the number of the LED lamp beads in each LED circuit can be controlled to achieve the effect that each equivalent resistance is the same. For example, the resistance of an LED lamp bead is measured, and then a section of printed wiring is used to achieve the same equivalent resistance effect.

In some embodiments, the utility model provides an in the LED lamp plate in there is the printed wiring of sharing between 2 at least way LED circuits, this design on the one hand can reduce the wiring complexity on the LED lamp plate, on the other hand, because there is the printed wiring of sharing between the LED circuit, consequently the part that shares between the two must be equivalent, can effectual reduction holistic equivalent design degree of difficulty.

Example 4

As shown in fig. 2, first printed circuits 31 serving as a common part are respectively extended oppositely between a first point electrode 21 and a second point electrode 22 which are oppositely arranged, and then the same LED conductive structure composed of a second printed circuit 32 and an LED bead 40 is connected in parallel between two close end points between the first printed circuits 31; at this time, the first printed wiring 31 of the common portion does not need to consider the equivalence problem, and therefore, only the unshared portion (i.e., the LED conductive structure) needs to be considered to have the equivalent resistance, and the wiring range thereof is small, and it is very easy to implement with the same structure.

Further, the present invention provides a line width of the shared printed circuit is equal to or greater than a line width of the unshared printed circuit. The common printed circuit 31 in this embodiment is usually used as a bus line of the parallel branches 32 (unshared printed circuit), so its current-carrying capacity needs to be larger than that of each parallel branch 32, and the problem of local overload and wire burnout can be avoided by the widening design. Meanwhile, when the line width design of the parallel shunt circuit reaches the maximum current use of the rated current, the consumption of the conductive ink can be reduced as much as possible under the condition that the line runs stably by means of local widening, thereby reducing the cost. Moreover, the fine rule design also plays the effect of hiding the circuit easily to promote the holistic aesthetic feeling of lamp plate.

In other embodiments, when the common printed circuit can satisfy the current-carrying capacity after the current converging, the common printed circuit may also be as wide as or smaller than the unshared printed circuit.

Example 5

On the basis of embodiment 4, the current carrying capacities of the parallel-connected and shunted printed circuits are 1A respectively, and the current carrying capacity of the shared part needs to be 2A; the widening design is the easiest and most effective means for increasing the current-carrying capacity of the printed circuit.

As shown in fig. 4, in some embodiments, each LED line includes a plurality of line units, each line unit being composed of a printed line and/or an LED lamp bead; the LED circuits are in one-to-one correspondence with the circuit units, and the corresponding circuit units have the same equivalent resistance.

In some embodiments, the first dot electrode, the second dot electrode, and the printed wiring in embodiments of the present invention are integrally formed by printing. Can utilize conductive ink to accomplish above-mentioned structure through once printing, then carry out the subsides of LED lamp pearl again and paste the dress, can accomplish the embodiment of the utility model provides an in the LED lamp plate. The wiring structure is simple, easy to implement, high in efficiency and low in cost.

As shown in fig. 5, in some embodiments, the printed wiring 30 includes: a wiring layer 30A printed on the insulating substrate, and a pad layer 30B printed on the wiring layer 30A; the LED lamp bead 40 is attached to the pad layer 30B. The lead layer is made of first conductive ink with high adhesive force, and then the pad layer is made on the conductive layer by utilizing weldable conductive ink; the first conductive ink for manufacturing the conductive layer and the second conductive ink for manufacturing the welding layer can both adopt commercially available conductive ink, for example, the first conductive ink can adopt commercially available conventional conductive silver paste, and the second conductive ink can adopt commercially available weldable conductive silver paste. In addition, the connection may be made by a conductive adhesive.

In some embodiments, the surfaces of the first point electrode and the second point electrode can also be provided with a welding layer, so that the external connection capacity of the first point electrode and the second point electrode is improved.

Optionally, the embodiment of the utility model provides an in the pad layer can cover the part or whole of wire layer, compare in covering whole, only apply the welding layer to the subsides dress area of LED lamp pearl (or point electrode), can the effectual control expensive quantity of welding conductive ink to practice thrift the cost.

As shown in fig. 6, further, an integrated bonding structure is provided between the wire layer and the pad layer in the embodiment of the present invention, specifically, after the wire layer is printed by using the first conductive ink, only the surface drying treatment is performed on the wire layer to meet the printing requirement thereon, then the soldering layer is printed by using the second conductive ink thereon, and then the soldering layer is integrally baked and cured, and in the baking and curing process, cross-linking fusion is generated between the resin carriers, thereby forming an integrated structure; the integrated structure between the pad layer and the lead layer can greatly improve the connection reliability between the pad layer and the lead layer, and avoid the falling failure of the LED lamp beads on the pad layer.

In some embodiments, the LED lamp panel in the embodiments of the present invention may further include: a transparent protective layer covering the LED line. The transparent protective layer comprises but is not limited to transparent three-proofing paint, and can effectively play a role in impedance, corrosion prevention and wear resistance; specifically, the transparent protective layer may be provided to cover all surfaces except the first and second dot electrodes.

In some embodiments, the insulating substrate in the embodiments of the present invention has a carrying surface with a profile structure or a planar structure, and the printed electrode is formed on the carrying surface of the insulating substrate. The first conductive ink and the second conductive ink in the embodiment of the present invention can be printed on the carrying surface of the insulating substrate by printing processes such as screen printing or pad printing; wherein, the transfer printing is preferably adopted for the bearing surface of the special-shaped structure, and the screen printing is preferably adopted for the bearing surface of the plane structure.

In some embodiments, the carrying surface of the insulating substrate is a roughened surface, so that the adhesion of the conductive ink is further improved by using a micro concave-convex surface.

In some embodiments, the LED lamp panel structure further includes: the heat dissipation plate is arranged on the side, far away from the LED lamp beads, of the insulating substrate. Can shift the produced heat of lamp plate as far as through the heating panel to avoid the local high fever problem that appears of lamp plate, the heating panel can select to use conventional heat dissipation material in the market.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims

1. The utility model provides a LED lamp plate which characterized in that includes:

an insulating substrate;

the LED lamp comprises a first point electrode and a second point electrode which are formed on the insulating substrate, and an LED circuit which is arranged between the first point electrode and the second point electrode and is formed by at least 2 printed circuits and LED lamp beads;

the LED lamp comprises a printed circuit, wherein one or more design elements of the line length, the line width, the line thickness and the number of LED lamp beads of the printed circuit are controlled, so that the LED circuits have the same equivalent resistance.

2. The LED lamp panel of claim 1, wherein there is a common printed wiring between at least 2 LED lines.

3. The LED lamp panel of claim 2, wherein the line width of the shared printed circuit is greater than or equal to the line width of the unshared printed circuit.

4. The LED lamp panel according to claim 1, wherein each LED line comprises a plurality of line units, and each line unit is composed of a printed line and/or an LED lamp bead;

the LED circuits are in one-to-one correspondence with the circuit units, and the corresponding circuit units have the same equivalent resistance.

5. The LED lamp panel of claim 1, wherein the first dot electrode, the second dot electrode and the printed circuit are integrally formed by printing.

6. The LED light panel of claim 1, wherein the printed wiring comprises: the conductive wire layer is printed on the insulating substrate, and the pad layer is printed on the conductive wire layer; and the LED lamp beads are attached to the bonding pad layer.

7. The LED lamp panel of claim 6, wherein an integrated bonding structure is provided between the wire layer and the pad layer.

8. The LED lamp panel of claim 6, wherein the pad layer covers part or all of the wire layer.

9. The LED lamp panel of claim 1, further comprising: a transparent protective layer covering the LED line.

10. A luminaire comprising an LED lamp panel as claimed in any one of claims 1 to 9.