CN218695063U - Circuit board face cutting device - Google Patents
Circuit board face cutting device Download PDFInfo
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- CN218695063U CN218695063U CN202222845895.1U CN202222845895U CN218695063U CN 218695063 U CN218695063 U CN 218695063U CN 202222845895 U CN202222845895 U CN 202222845895U CN 218695063 U CN218695063 U CN 218695063U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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Abstract
The utility model relates to a circuit board processing technology field, concretely relates to circuit board face cutting device, include: mounting bracket, installation gomphosis board, sliding plate, diaxon portal frame and laser cutting head, mounting bracket inner diameter face both sides fixed mounting have the sliding plate, installation gomphosis board sliding connection be in the sliding plate top surface, diaxon portal frame fixed mounting is in the mounting bracket top surface, laser cutting head fixed mounting is in on the power seat of diaxon portal frame. By designing the multilayer movable circuit board mounting and embedding groove, the circuit board can be flatly embedded in the circuit board mounting and embedding groove. Meanwhile, the circuit board is vertically cut by the laser cutting head, and the laser cutting head can cut the stacked circuit boards through the installation embedding groove, so that the processing efficiency is improved, and the processing effect is enhanced.
Description
Technical Field
The utility model relates to a circuit board processing technology field, concretely relates to circuit board face cutting device.
Background
The circuit board mainly comprises a bonding pad, a through hole, a mounting hole, a lead, a component, a plug connector, filling, an electrical boundary and the like. The circuit board is classified into three major categories, namely a single-sided board, a double-sided board and a multilayer circuit board according to the number of layers, wherein the single-sided board is the most basic PCB, parts are concentrated on one side of the single-sided board, and wires are concentrated on the other side of the single-sided board. Such PCB circuit boards are referred to as single-sided circuit boards because the conductors are present on only one side thereof. The single-panel is generally simple to manufacture and low in cost, but has the disadvantage that the single-panel cannot be applied to a complex product, the double-panel is an extension of the single-panel, and when the single-layer wiring cannot meet the requirement of an electronic product, the double-panel is used. The multilayer board is a printed board which is formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals, and the conductive patterns between the conductive pattern layers are interconnected according to requirements. The multilayer circuit board is a product of the development of electronic information technology towards high speed, multifunction, large capacity, small volume, thinning and light weight, and the circuit board is divided into a soft board, a hard board and a soft-hard combined board according to characteristics.
At present in the middle of carrying out the circuit board course of working, probably need cut the circuit board according to the in service behavior, and among the prior art, can only cut single board to cut and need artifical location, it is relatively poor to cut the effect, causes positioning error easily, thereby leads to becoming the circuit board specification of processing in batches non-uniform, influences the result of use.
In view of the above, it is desirable to provide a circuit board cutting device, which can be used to tile and embed a circuit board in a circuit board mounting and embedding slot by designing a multi-layer movable circuit board mounting and embedding slot. Meanwhile, the circuit board is vertically cut by the laser cutting head, and the laser cutting head can cut the stacked circuit boards through the installation embedding groove, so that the processing efficiency is improved, and the processing effect is enhanced.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model aims to provide a circuit board face cutting device, through designing the movable circuit board installation gomphosis groove of multilayer, the gomphosis of circuit board can tile in the middle of the circuit board installation gomphosis groove. Meanwhile, the circuit board is vertically cut by the laser cutting head, and the laser cutting head can cut the stacked circuit boards through the installation embedding groove, so that the processing efficiency is improved, and the processing effect is enhanced.
In order to realize the above object, the technical scheme of the utility model is that: a circuit board face cutting device includes: mounting bracket, installation gomphosis board, sliding plate, diaxon portal frame and laser cutting head, mounting bracket inner diameter face both sides fixed mounting have the sliding plate, installation gomphosis board sliding connection be in the sliding plate top surface, diaxon portal frame fixed mounting is in the mounting bracket top surface, laser cutting head fixed mounting is in on the power seat of diaxon portal frame.
Further, the mounting bracket includes: the mounting frame comprises a mounting frame and a sliding plate mounting seat, wherein the sliding plate mounting seat is fixedly mounted on the inner wall surface of the mounting frame, the cross section of the sliding plate mounting seat is L-shaped, and the sliding plate is fixedly mounted on the top surface of the sliding plate mounting seat.
Further, the sliding plate includes: the sliding strip is fixedly arranged on the top surface of the sliding plate, and the sliding seat is slidably engaged on the outer diameter surface of the sliding strip.
Further, the mounting-fitting plate includes: the sliding seat comprises an embedded plate, an embedded groove and a limiting groove, wherein the embedded groove is formed in the top surface of the embedded plate in a penetrating mode, the limiting groove is formed in the bottom of the embedded groove, the groove diameter of the limiting groove is smaller than that of the embedded groove, and the sliding seat is fixedly installed on two sides of the bottom surface of the embedded plate.
Further, the two-axis portal frame comprises: the laser cutting machine comprises a Y-axis track, a Y-axis sliding seat, a Y-axis driving assembly, a linkage shaft, an X-axis track, an X-axis sliding seat and an X-axis driving assembly, wherein the Y-axis track is fixedly installed on the top surface of the installation frame, the Y-axis sliding seat is connected to the Y-axis track in a sliding mode, the Y-axis driving assembly is fixedly installed at the tail end of the Y-axis track, the Y-axis driving assembly and the Y-axis sliding seat are connected through a transmission belt in a driving mode, the side wall surface of the Y-axis driving assembly is connected with the linkage shaft in a power mode, the linkage shaft is connected between the Y-axis tracks in a bridging mode, the X-axis track is connected to the top surface of the Y-axis sliding seat in a bridging mode, the X-axis sliding seat is connected to the X-axis track in a sliding mode, the X-axis driving assembly is fixedly installed at one end of the X-axis track, the X-axis driving assembly is connected with the X-axis sliding seat in a driving mode, and the laser cutting head is fixedly installed on the top surface of the X-axis sliding seat.
Further, the laser cutting head includes: laser head, connection hoop and fixing base, the fixing base fixed mounting be in X axle sliding seat top surface, the laser head passes through the connection hoop to be installed on the fixing base, the laser head perpendicular to installation gomphosis board.
Has the advantages that:
the utility model provides a pair of circuit board face cutting device, through designing multilayer movable's circuit board installation gomphosis groove, the gomphosis of circuit board can tiling in the middle of circuit board installation gomphosis groove. Meanwhile, the circuit board is vertically cut by the laser cutting head, and the laser cutting head can cut the stacked circuit boards through the installation embedding groove, so that the processing efficiency is improved, and the processing effect is enhanced.
Drawings
Fig. 1 is a schematic view of a three-dimensional structure of a circuit board surface cutting device of the present invention;
fig. 2 is the utility model relates to a circuit board face cutting device planar structure sketch map.
In the figure: 1-mounting frame, 2-mounting embedded plate, 3-sliding plate, 4-two-axis portal frame, 5-laser cutting head, 11-mounting frame, 12-mounting seat, 21-embedded plate, 22-embedded groove, 23-limiting groove, 31-sliding strip, 32-sliding seat, 41-Y-axis track, 42-Y-axis sliding seat, 43-Y-axis driving assembly, 44-linkage shaft, 45-X-axis track, 46-X-axis sliding seat, 47-X-axis driving assembly, 51-laser head, 52-connecting hoop and 53-fixing seat.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention belong to the protection scope of the present invention.
As shown in fig. 1-2, the utility model discloses a circuit board face cutting device, include: mounting bracket 1, installation gomphosis board 2, sliding plate 3, diaxon portal frame 4 and laser cutting head 5, 1 internal diameter face both sides fixed mounting of mounting bracket has sliding plate 3, installation gomphosis board 2 sliding connection is in the 3 top surfaces of sliding plate, diaxon portal frame 4 fixed mounting is in 1 top surface of mounting bracket, laser cutting head 5 fixed mounting is in on the power seat of diaxon portal frame 4.
In this embodiment, the mounting bracket 1 includes: the mounting device comprises a mounting frame 11 and a sliding plate 3 mounting seat 12, wherein the sliding plate 3 mounting seat 12 is fixedly mounted on the inner wall surface of the mounting frame 11, the cross section of the sliding plate 3 mounting seat 12 is L-shaped, and the sliding plate 3 is fixedly mounted on the top surface of the sliding plate 3 mounting seat 12.
In the present embodiment, the slide plate 3 includes: a sliding bar 31 and a sliding seat 32, wherein the sliding bar 31 is fixedly arranged on the top surface of the sliding plate 3, and the sliding seat 32 is slidingly engaged on the outer diameter surface of the sliding bar 31.
In the present embodiment, the mounting-fitting plate 2 includes: the sliding seat structure comprises a tabling plate 21, a tabling groove 22 and a limiting groove 23, wherein the tabling groove 22 is arranged on the top surface of the tabling plate 21 in a penetrating way, the limiting groove 23 is arranged on the bottom of the tabling groove 22, the groove diameter of the limiting groove 23 is smaller than that of the tabling groove 22, and the sliding seat 32 is fixedly arranged on two sides of the bottom surface of the tabling plate 21.
In this embodiment, the two-axis gantry 4 includes: the laser cutting head comprises a Y-axis rail 41, a Y-axis sliding seat 42, a Y-axis driving assembly 43, a linkage shaft 44, an X-axis rail 45, an X-axis sliding seat 46 and an X-axis driving assembly 47, wherein the Y-axis rail 41 is fixedly installed on the top surface of the installation frame 11, the Y-axis rail 41 is connected with the Y-axis sliding seat 42 in a sliding manner, the Y-axis driving assembly 43 is fixedly installed at the tail end of the Y-axis rail 41, the Y-axis driving assembly 43 and the Y-axis sliding seat 42 are connected through a transmission belt in a driving manner, the linkage shaft 44 is dynamically connected to the side wall surface of the Y-axis driving assembly 43, the linkage shaft 44 is bridged between the Y-axis rails 41, the X-axis rail 45 is bridged on the top surface of the Y-axis sliding seat 42, the X-axis sliding seat 46 is connected onto the X-axis rail 45 in a sliding manner, the X-axis driving assembly 47 is fixedly installed at one end of the X-axis rail 45, the X-axis driving assembly 47 is connected with the X-axis sliding seat 46 through a transmission belt, and the laser cutting head 5 is fixedly installed on the top surface of the X-axis sliding seat 46.
In this embodiment, the laser cutting head 5 includes: laser head 51, connection hoop 52 and mount pad 12, mount pad 12 fixed mounting be in X axle sliding seat 46 top surface, laser head 51 is installed through connection hoop 52 on the mount pad 12, laser head 51 is perpendicular to installation gomphosis board 2.
The working principle is as follows:
first, since the mounting frame 11 has the mounting block 12 of the slide plate 3 fixedly mounted on the inner wall surface thereof, the slide plate 3 is fixedly mounted on the top surface of the mounting block 12 of the slide plate 3, and the slide plate 3 is provided with the slide bar 31 and the slide block 32, the slide block 32 is slidably engaged with the outer diameter surface of the slide bar 31. The slide holder 32 is fixedly mounted on the bottom surface of the mounting and fitting plate 2, and the mounting and fitting plate 2 is slidably drawn and pulled along the slide bar 31 with respect to the inner wall surface of the mounting frame 11 by the slide holder 32.
Since the mounting-fitting plate 2 is provided with the fitting plate 21, the fitting plate 21 is provided with the fitting groove 22, the circuit board blank is fitted with the fitting groove 22, the groove bottom of the fitting groove 22 is provided with the limiting groove 23, the groove diameter of the limiting groove 23 is smaller than that of the fitting groove 22, and when the circuit board is fitted in the fitting groove 22, the limiting groove 23 is used for limiting the circuit board to prevent the circuit board from sliding out of the mounting-fitting plate 2.
Here, since the mounting-fitting plates 2 are slidably connected in the mounting frame 11 in a stacked manner in the vertical direction, the circuit boards fitted to the mounting-fitting plates 2 are correspondingly arranged in the vertical direction.
The two-axis portal frame 4 is fixedly mounted on the top surface of the mounting frame 11, the two-axis portal frame 4 is provided with a Y-axis rail 41 and an X-axis rail 45, the top surface of the Y-axis rail 41 is connected with a Y-axis sliding seat 42 in a sliding manner, a Y-axis driving assembly 43 is fixedly mounted at the tail end of the Y-axis rail 41, and the Y-axis driving assembly 43 is linked with the Y-axis rails 41 mounted on the two sides through a linkage shaft 44. And the Y-axis drive assembly 43 is power connected to the Y-axis slide block 42 via a belt so that the Y-axis slide block 42 can slide along the Y-axis rail 41. The X-axis track 45 is bridged on the top surface of the Y-axis sliding seat 42, the X-axis track 45 is connected with an X-axis sliding seat 46 in a sliding manner, one end of the X-axis track 45 is fixedly provided with an X-axis driving assembly 47, and the X-axis driving assembly 47 drives the X-axis sliding seat 46 to move along the X-axis track 45.
Because the top surface of the X-axis sliding seat 46 is fixedly provided with the laser cutting head 5,X, the top surface of the X-axis sliding seat 46 is fixedly provided with the fixed seat 53, the fixed seat 53 is fixedly provided with the laser head 51 through the connecting hoop 52, and the laser head 51 is vertical to the installation and embedding plate 2.
The utility model provides a pair of circuit board face cutting device, through designing multilayer movable's circuit board installation gomphosis groove 22, the gomphosis of circuit board can tiling in the middle of circuit board installation gomphosis groove 22. Meanwhile, the circuit board is vertically cut by the laser cutting head 5, and the laser cutting head 5 can cut the stacked circuit boards through the installation embedding groove 22, so that the processing efficiency is improved, and the processing effect is enhanced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A circuit board face cutting device includes: mounting bracket (1), installation gomphosis board (2), sliding plate (3), diaxon portal frame (4) and laser cut head (5), its characterized in that, mounting bracket (1) inner diameter face both sides fixed mounting have sliding plate (3), installation gomphosis board (2) sliding connection be in sliding plate (3) top surface, diaxon portal frame (4) fixed mounting be in mounting bracket (1) top surface, laser cuts head (5) fixed mounting be in on the power seat of diaxon portal frame (4).
2. A circuit board plane cutting device according to claim 1, characterized in that the mounting frame (1) comprises: the mounting structure comprises a mounting frame (11) and a sliding plate (3) mounting seat (12), wherein the sliding plate (3) mounting seat (12) is fixedly mounted on the inner wall surface of the mounting frame (11), the cross section of the sliding plate (3) mounting seat (12) is L-shaped, and the sliding plate (3) is fixedly mounted on the top surface of the sliding plate (3) mounting seat (12).
3. A board plane cutting device according to claim 2, characterized in that the sliding plate (3) comprises: the sliding bar (31) is fixedly arranged on the top surface of the sliding plate (3), and the sliding seat (32) is slidably engaged on the outer diameter surface of the sliding bar (31).
4. A board surface cutting device according to claim 3, wherein said mounting-fitting plate (2) comprises: the sliding seat structure comprises a mosaic plate (21), a mosaic groove (22) and a limiting groove (23), wherein the mosaic groove (22) is arranged on the top surface of the mosaic plate (21) in a penetrating way, the limiting groove (23) is arranged at the bottom of the mosaic groove (22), the groove diameter of the limiting groove (23) is smaller than that of the mosaic groove (22), and the sliding seat (32) is fixedly arranged on two sides of the bottom surface of the mosaic plate (21).
5. The board surface cutting device of claim 4, wherein the two-axis gantry (4) comprises: the laser cutting machine comprises a Y-axis track (41), a Y-axis sliding seat (42), a Y-axis driving assembly (43), a linkage shaft (44), an X-axis track (45), an X-axis sliding seat (46) and an X-axis driving assembly (47), wherein the Y-axis track (41) is fixedly installed on the top surface of the installation frame (11), the Y-axis sliding seat (42) is connected onto the Y-axis track (41) in a sliding mode, the Y-axis driving assembly (43) is fixedly installed at the tail end of the Y-axis track (41), the Y-axis driving assembly (43) is connected with the Y-axis sliding seat (42) through a transmission belt in a driving mode, the linkage shaft (44) is connected onto the side wall surface of the Y-axis driving assembly (43) in a power mode, the linkage shaft (44) is connected between the Y-axis track (41) in a bridging mode, the X-axis track (45) is connected onto the top surface of the Y-axis sliding seat (42) in a sliding mode, the X-axis sliding seat (46) is connected onto the X-axis track (45) in a sliding mode, the X-axis driving assembly (47) is fixedly installed at one end of the X-axis track (45), and the top surface of the X-axis driving assembly (5) is connected with the X-axis driving head (46) through a laser cutting head (46).
6. The board surface cutting device according to claim 5, wherein the laser cutting head (5) comprises: laser head (51), connection hoop (52) and fixing base (53), fixing base (53) fixed mounting be in X axle sliding seat (46) top surface, install laser head (51) through connecting hoop (52) on fixing base (53), laser head (51) perpendicular to installation gomphosis board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222845895.1U CN218695063U (en) | 2022-10-27 | 2022-10-27 | Circuit board face cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222845895.1U CN218695063U (en) | 2022-10-27 | 2022-10-27 | Circuit board face cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218695063U true CN218695063U (en) | 2023-03-24 |
Family
ID=85593319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222845895.1U Active CN218695063U (en) | 2022-10-27 | 2022-10-27 | Circuit board face cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218695063U (en) |
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2022
- 2022-10-27 CN CN202222845895.1U patent/CN218695063U/en active Active
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