CN1949953A - Wiring method for printed circuitboard and printed circuitboard - Google Patents
Wiring method for printed circuitboard and printed circuitboard Download PDFInfo
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- CN1949953A CN1949953A CN 200610063428 CN200610063428A CN1949953A CN 1949953 A CN1949953 A CN 1949953A CN 200610063428 CN200610063428 CN 200610063428 CN 200610063428 A CN200610063428 A CN 200610063428A CN 1949953 A CN1949953 A CN 1949953A
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- pcb
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- printed circuit
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Abstract
The invention is applied to PCB making field, providing a PCB routing method and the PCB. As routing, it routes power and ground lines in parallel with signal lines. And it provides nearby power and ground return paths for signals, reducing signal circuit area and improving PCB EMC. Besides, it improves PCB EMC effect by placing filter capacitors in the signal layer transfer position on this basis according to actual requirements, or gridding power and ground network, or placing filter capacitors between power and ground network traces.
Description
Technical field
The invention belongs to the print circuit plates making field, relate in particular to a kind of wiring method and printed circuit board (PCB) of printed circuit board (PCB).
Background technology
Along with science and technology development, the signal rate of electronic product is more and more faster, noise margin is more and more lower, signal integrity (Signal Integrity, SI), power supply integrality (Power Integrity, PI), (Electro Magnetic Compatibility, problem EMC) is more and more outstanding for Electro Magnetic Compatibility.People require electronic product to have Electro Magnetic Compatibility usually, refer to that promptly electronic equipment or system move the ability that any equipment in its environment is not produced intolerable electromagnetic interference in its electromagnetic environment.Therefore, EMC comprises the requirement of two aspects: refer to that on the one hand equipment can not surpass certain limit value to the electromagnetic interference that the place environment produces in normal course of operation; Refer to that on the other hand equipment has to a certain degree immunity to interference, i.e. electromagnetic susceptibility to the electromagnetic interference that exists in the environment of place.So electronic product need be by relevant standard authentication, just can enter respective market, as china compulsory certification (China Compulsory Certification, 3C), (the Confomite Europeene of European Union, CE) FCC of authentication, the U.S. (FederalCommunications Commission, FCC) relevant EMC authentication such as authentication.
In order to make electronic product can satisfy Electro Magnetic Compatibility, measure commonly used is for printed circuit board (PCB) adds shielding box, product is shielded, thereby reach the requirement of satisfying Electro Magnetic Compatibility.Because the user wishes the electronic terminal product good looking appearance usually, low price, and the standard authentication of satisfied relevant Electro Magnetic Compatibility.Therefore, electronic terminal product preferably can satisfy the requirement of Electro Magnetic Compatibility at circuit board level under the situation of not taking any shielding measure.
Usually generally have differential mode radiation and two kinds of radiation modes of common mode radiation on the circuit board, the differential mode radiation is to influence a very important aspect of Electro Magnetic Compatibility.As shown in Figure 1, signal sends to receiving terminal by drive end, arrives after the receiving terminal, and signal demand turns back in the drive end and goes, and produces electric current loop.
The electric field strength expression formula of signal differential mode radiation is:
Wherein, | E| represents the electric field strength of Electromagnetic Interference, and f represents signal frequency, and I represents signal magnitude, and A represents the loop area that signal flow is crossed, and d represents the distance with radiation source.As can be seen, the far-field radiation electric field strength of signal is directly proportional with the loop area of signal from following formula, therefore by reducing the radiation that the signal circuit area can effectively reduce signal.
In order to reduce the signal circuit area, usually adopting during existing plate level EMC designing wiring makes the power supply ground level complete as far as possible, provide desirable reference planes to signal, shorten the signal return flow path, as shown in Figure 2, when ground plane provides complete reference planes for the signal lead layer when, the signal circuit area minimum that sense and signal backflow direction are formed, thereby differential mode radiation minimum.Fig. 3 shows the wiring example of printed circuit board (PCB) in this case.
Power supply, the ground level ration of division is more or the situation of 2 laminates under, situation about cutting apart inevitably can appear striding in holding wire.As shown in Figure 4, online striding under the situation about cutting apart, some indentation, there of drive end and receiving end signal line on the plane, so the reference planes of holding wire are imperfect, the signal return flow path need be taken a devious route, thereby causes the signal circuit area to increase, radiation strengthens, and the EMC performance reduces.
In order to solve striding appears in reference planes can not provide the complete reference plane for holding wire when cutting apart problem, adopted in the prior art at the other ground cabling that wraps of holding wire, utilize the ground wire on holding wire next door that holding wire is shielded, for holding wire provides the signal return flow path, reach and satisfy the purpose that EMC requires nearby.As shown in Figure 5, because holding wire connects up side by side with ground wire, so when the signal backflow is cut apart the place through striding, signal refluxes and selects ground wire as return flow path nearby, littler than not adopting the signal return flow path under the holding wire bag ground disposition like this, the signal circuit area reduces, so radiation reduces.But because signal can only reflux on ground wire, for the signal that refluxes with power supply, can only the backflow signal on the ground wire be transferred on the power supply by the mode of displacement current at terminal point at last, owing to adopted the mode of displacement current, radiated emission is still relatively more serious.
Summary of the invention
The object of the present invention is to provide a kind of wiring method of printed circuit board (PCB), because the signal circuit area is bigger, cause radiation to strengthen the problem that Electro Magnetic Compatibility is low when being intended to solve printed circuit board wiring.
Another object of the present invention is to provide a kind of printed circuit board (PCB).
The present invention is achieved in that a kind of wiring method of printed circuit board (PCB), and described method comprises:
In when wiring, with power supply cabling, ground wire along with holding wire cabling side by side.
Described method further comprises:
When the electric power network that zone network that constitutes when ground wire or power supply cabling constitute is distributed in the different layers of printed circuit board (PCB), with the zone network or the electric power network gridding respectively of different layers.
Described method further comprises:
When holding wire changes layer cabling, place a filter capacitor at the described layer place that change, connect a holding wire that changes layer place.
Described method further comprises:
Between power supply, zone network wiring, place filter capacitor.
A kind of printed circuit board (PCB) comprises power supply cabling, ground wire and holding wire, and described power supply cabling, ground wire are along with holding wire cabling side by side.
When the electric power network that zone network that constitutes when ground wire or power supply cabling constitute is distributed in the different layers of printed circuit board (PCB), the gridding respectively of zone network of each layer or electric power network.
When holding wire changed layer cabling, the described layer place that change was placed with filter capacitor, connects a holding wire that changes layer place.
Be placed with filter capacitor between the power supply of described printed circuit board (PCB), the zone network wiring.
The present invention takes power supply cabling, ground wire and drains, and be to attend by the mode that holding wire is walked, for refluxing, signal provides power supply and ground return flow path nearby, reduced the signal circuit area, improved the Electro Magnetic Compatibility of printed circuit board (PCB), and according to actual needs on this basis by change the mode that filter capacitor is placed at layer place at signal, perhaps power supply, earth cord network gridding, the mode of perhaps placing filter capacitor between power supply, zone network wiring has further improved the electromagnetic compatibility effect of printed circuit board (PCB).
Description of drawings
Fig. 1 is the schematic diagram of differential mode radiation in the prior art;
Fig. 2 is the signal circuit schematic diagram of complete reference planed signal cabling in the prior art;
Fig. 3 is the wiring exemplary plot of complete reference plane cabling in the prior art;
Fig. 4 is that the prior art center line is striden the signal circuit schematic diagram when cutting apart;
Fig. 5 is the signal backflow schematic diagram when holding wire and ground wire connect up side by side in the prior art;
Fig. 6 A, B are the principle schematic that power supply refluxes and ground refluxes;
Fig. 7 is the principle schematic that power supply cabling, ground wire and holding wire connect up side by side among the present invention;
Fig. 8 is the wiring exemplary plot that power supply cabling, ground wire and holding wire connect up side by side among the present invention;
Fig. 9 is the wiring exemplary plot of power supply cabling gridding among the present invention;
Figure 10 is the wiring exemplary plot of placing filter capacitor among the present invention between power supply, zone network wiring;
Figure 11 changes the wiring exemplary plot that filter capacitor is placed at layer place at signal among the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
During the wiring of in the present invention printing electric current plate, take power supply cabling, ground wire and drain, and be to attend by the mode that holding wire is walked, provide return flow path to signal nearby, effectively reduced the loop area of signal, improved the electric capacity compatibility of printed circuit board (PCB).
The signal reflux type can be divided into power supply and reflux and two kinds of ground backflows, with supply power voltage low-voltag transistor-transistor logic (Low Voltage Transister-Transister-Logic that is 3.3V, LVTTL) level signal is an example, its input and output are shown in Fig. 6 A, 6B, left end is output buffer, i.e. drive end; Right-hand member is input buffer, i.e. receiving terminal.When drive end was output as high level, as shown in Figure 6A, its desirable return flow path should be ground wire and refluxes, and when drive end sends signal to receiving terminal, the signal that arrives receiving terminal is back to drive end by ground wire.When drive end was output as low level, shown in Fig. 6 B, its desirable return flow path should be the power supply wiring inverse flow, when drive end when receiving terminal sends signal, the signal that arrives receiving terminal by the power supply wiring inverse flow to drive end.
Therefore, in the present invention, when reflux no desirable reference planes or when not having preferred reference planes of signal, in order to reflux nearby and the power supply return flow path for signal with providing, in the holding wire cabling, allowing ground wire and power supply cabling and holding wire connect up side by side, is that power supply refluxes and do not need to distinguish the mode that signal refluxes, still backflow.When signal refluxes, automatically select suitable return flow path by signal, return drive end, the wires design principle as shown in Figure 7, power supply cabling and ground wire cabling side by side adopts ground wire, power supply cabling and holding wire to connect up side by side between chip 1, chip 2,3 three chips of chip between chip 1, chip 3 and the power supply, make signal no matter during in which kind of backflow situation, less return flow path is all arranged, reduced radiation, improved the EMC performance.Fig. 8 shows wiring example in this case, and according to the actual conditions of circuit, in practical wiring, just there are a power supply cabling, a ground wire in per 2 to 3 holding wire both sides, for signal provides power supply to reflux nearby and the ground return flow path.
As one embodiment of the present of invention, when printed circuit board (PCB) is multi-layer sheet or two-ply, will be distributed in the zone network gridding respectively that electric power network that the power supply cabling of different layers constitutes or ground wire constitute by via hole.After the electric power network that is distributed in different layers or zone network fully connect, can provide short as far as possible return flow path for signal refluxes.For the big problem of signal return flow path that may occur, signal refluxes can the choice of more return flow paths, selects wherein the shortest return flow path, reduces the area that refluxes.Example as shown in Figure 9 under the situation that side circuit allows, by top layer (component side) electric power network with printed circuit board (PCB), fully is connected with bottom (solder side) electric power network via hole, the electric power network gridding wiring after obtaining synthesizing.Equally, under the situation that side circuit allows, by the component side zone network fully is connected the zone network gridding wiring after synthesizing with solder side zone network via hole.
Because there is transfer impedance in power-supply system, in order to reduce transfer impedance, for refluxing, signal provides short as far as possible return flow path, as another embodiment of the present invention, can between power supply, zone network wiring, place the filter capacitor of some, the quantity of placing filter capacitor can be according to the circuit conditions of reality, placement filter capacitor as much as possible, and the wiring example is as shown in figure 10.
As another embodiment of the present invention, when printed circuit board (PCB) is 2 layers or multi-layer sheet, exist holding wire need change the situation of layer.When holding wire when the last layer cabling is changed to down one deck cabling, holding wire must can not find desirable reference planes and provide return flow path for it.At this moment, change layer place at signal and place filter capacitor, connect the holding wire that changes layer place, for the holding wire that changes layer provides return flow path nearby, the wiring example as shown in figure 11.
When concrete wiring, can be used in combination above-mentioned several modes according to actual needs, further reduce radiation, improve the electromagnetic compatibility effect of printing electric current plate, specifically can take the power supply cabling, ground wire and holding wire parallel routing and the mode of changing placement filter capacitor in layer place at signal, perhaps power supply cabling, ground wire and holding wire parallel routing and power supply, the earth cord network gridding, and the mode of changing placement filter capacitor in layer place at signal, perhaps power supply cabling, ground wire and holding wire parallel routing and power supply, the earth cord network gridding, and at power supply, the mode of placing filter capacitor between the zone network wiring, concrete wiring example repeats no more.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1, a kind of wiring method of printed circuit board (PCB) is characterized in that, described method comprises:
In when wiring, with power supply cabling, ground wire along with holding wire cabling side by side.
2, the wiring method of printed circuit board (PCB) as claimed in claim 1 is characterized in that, described method further comprises:
When the electric power network that zone network that constitutes when ground wire or power supply cabling constitute is distributed in the different layers of printed circuit board (PCB), with the zone network or the electric power network gridding respectively of different layers.
3, the wiring method of printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that, described method further comprises:
When holding wire changes layer cabling, place a filter capacitor at the described layer place that change, connect a holding wire that changes layer place.
4, the wiring method of printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that, described method further comprises:
Between power supply, zone network wiring, place filter capacitor.
5, a kind of printed circuit board (PCB) comprises power supply cabling, ground wire and holding wire, it is characterized in that, described power supply cabling, ground wire are along with holding wire cabling side by side.
6, printed circuit board (PCB) as claimed in claim 5 is characterized in that, when the electric power network that zone network that constitutes when ground wire or power supply cabling constitute is distributed in the different layers of printed circuit board (PCB), and the gridding respectively of the zone network of different layers or electric power network.
As claim 5 or 6 described printed circuit board (PCB)s, it is characterized in that 7, when holding wire changed layer cabling, the described layer place that change was placed with filter capacitor, connects a holding wire that changes layer place.
8, as claim 5 or 6 described printed circuit board (PCB)s, it is characterized in that, be placed with filter capacitor between the power supply of described printed circuit board (PCB), the zone network wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610063428 CN1949953A (en) | 2006-11-01 | 2006-11-01 | Wiring method for printed circuitboard and printed circuitboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610063428 CN1949953A (en) | 2006-11-01 | 2006-11-01 | Wiring method for printed circuitboard and printed circuitboard |
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| CN1949953A true CN1949953A (en) | 2007-04-18 |
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| CN 200610063428 Pending CN1949953A (en) | 2006-11-01 | 2006-11-01 | Wiring method for printed circuitboard and printed circuitboard |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146399B (en) * | 2007-10-09 | 2010-06-09 | 福建星网锐捷网络有限公司 | Circuit board |
| CN102196656A (en) * | 2010-03-04 | 2011-09-21 | 纬创资通股份有限公司 | Circuit layout method and layout circuit using same |
| CN102122767B (en) * | 2010-01-08 | 2013-05-01 | 研祥智能科技股份有限公司 | Expanding interconnecting component |
| CN103857169A (en) * | 2012-12-03 | 2014-06-11 | 北汽福田汽车股份有限公司 | Printed circuit board and electric car |
| CN104469617A (en) * | 2014-12-22 | 2015-03-25 | 青岛歌尔声学科技有限公司 | Circuit and method capable of lowering loop noise of active earphone |
| CN106934083A (en) * | 2015-12-30 | 2017-07-07 | 小米科技有限责任公司 | Circuit design method and device |
| CN107911941A (en) * | 2017-12-07 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of circuit board |
| CN108566724A (en) * | 2018-06-13 | 2018-09-21 | 晶晨半导体（深圳）有限公司 | Wiring plate, printed circuit board and the electronic device of DDR memory |
| CN111123065A (en) * | 2018-10-30 | 2020-05-08 | 浙江宇视科技有限公司 | Method and device for inspecting printed circuit board wiring |
| CN112004323A (en) * | 2020-08-20 | 2020-11-27 | 之江实验室 | Isometric wiring design method for MCU (microprogrammed control Unit) and SDRAM (synchronous dynamic random access memory) of BGA (ball grid array) package |
| CN112312644A (en) * | 2019-07-31 | 2021-02-02 | 谷歌有限责任公司 | Printed circuit board connection of integrated circuits using two wiring layers |
| WO2022095867A1 (en) * | 2020-11-04 | 2022-05-12 | 蓬托森思股份有限公司 | Filter circuit |
-
2006
- 2006-11-01 CN CN 200610063428 patent/CN1949953A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146399B (en) * | 2007-10-09 | 2010-06-09 | 福建星网锐捷网络有限公司 | Circuit board |
| CN102122767B (en) * | 2010-01-08 | 2013-05-01 | 研祥智能科技股份有限公司 | Expanding interconnecting component |
| CN102196656A (en) * | 2010-03-04 | 2011-09-21 | 纬创资通股份有限公司 | Circuit layout method and layout circuit using same |
| CN102196656B (en) * | 2010-03-04 | 2013-01-30 | 纬创资通股份有限公司 | Circuit layout method and layout circuit using same |
| CN103857169A (en) * | 2012-12-03 | 2014-06-11 | 北汽福田汽车股份有限公司 | Printed circuit board and electric car |
| CN103857169B (en) * | 2012-12-03 | 2017-06-06 | 北汽福田汽车股份有限公司 | A kind of printed circuit board (PCB) and electric automobile |
| CN104469617B (en) * | 2014-12-22 | 2018-05-22 | 青岛歌尔声学科技有限公司 | A kind of circuit and method for reducing active earphone loop noise |
| CN104469617A (en) * | 2014-12-22 | 2015-03-25 | 青岛歌尔声学科技有限公司 | Circuit and method capable of lowering loop noise of active earphone |
| CN106934083A (en) * | 2015-12-30 | 2017-07-07 | 小米科技有限责任公司 | Circuit design method and device |
| CN107911941A (en) * | 2017-12-07 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of circuit board |
| CN107911941B (en) * | 2017-12-07 | 2019-12-31 | 晶晨半导体(上海)股份有限公司 | Circuit board |
| CN108566724A (en) * | 2018-06-13 | 2018-09-21 | 晶晨半导体（深圳）有限公司 | Wiring plate, printed circuit board and the electronic device of DDR memory |
| CN111123065A (en) * | 2018-10-30 | 2020-05-08 | 浙江宇视科技有限公司 | Method and device for inspecting printed circuit board wiring |
| CN112312644A (en) * | 2019-07-31 | 2021-02-02 | 谷歌有限责任公司 | Printed circuit board connection of integrated circuits using two wiring layers |
| CN112004323A (en) * | 2020-08-20 | 2020-11-27 | 之江实验室 | Isometric wiring design method for MCU (microprogrammed control Unit) and SDRAM (synchronous dynamic random access memory) of BGA (ball grid array) package |
| WO2022095867A1 (en) * | 2020-11-04 | 2022-05-12 | 蓬托森思股份有限公司 | Filter circuit |
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