CN218679733U - Electronic equipment - Google Patents

Abstract

The application provides an electronic device. The electronic device includes: a housing; a heat source disposed inside the housing; the heat insulation structure is arranged on one side of the heat source close to the shell; wherein the heat insulation structure comprises: a first cover plate; the second cover plate is arranged opposite to the first cover plate; and a heat insulation cavity arranged between the first cover plate and the second cover plate. The scheme of this application has reduced the heat that the heat source transmitted the electronic equipment surface through the heat-conducting mode of heat radiation and air based on thermal-insulated structure, has effectively reduced electronic equipment surface temperature to solve electronic equipment surface temperature too high and the limited problem of heat dissipation, and then promote user's body and feel the comfort level.

Description

Electronic equipment

Technical Field

The present application relates to the field of electronic technology, and in particular, to an electronic device.

Background

With the progress of science and technology, the integration level of electronic equipment is higher and higher, the performance is continuously broken through and improved, and the problems of increased power consumption of components and parts and increased heating capacity are brought. However, the electronic device has been developed to be high performance and light and thin, and the internal space of the device is greatly limited, so that the gap between the surface of the electronic device and the internal element is smaller and smaller, and the problem of local surface temperature scalding is more and more serious.

For the solution of the over-high surface temperature of the electronic device in the related art, for example, the soaking treatment in the heat conduction mode is performed by attaching copper foil and graphite or using a copper plate, a temperature equalizing plate and the like, and the improvement of the heat conduction efficiency and the radiant heat is limited due to the limitation of space, area and the like, and the surface temperature of the electronic device is always high.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application is directed to an electronic device to solve or partially solve the above problems.

The application provides an electronic equipment, includes:

a housing;

a heat source disposed inside the housing; and

the heat insulation structure is arranged on one side of the heat source close to the shell;

wherein the heat insulation structure comprises:

a first cover plate;

the second cover plate is arranged opposite to the first cover plate; and

a thermal insulation chamber disposed between the first cover plate and the second cover plate.

From the above, can see out, the electronic equipment that this application provided has reduced the heat that the heat source transmitted the electronic equipment surface through the heat-conduction mode of heat radiation and air based on thermal-insulated structure, has effectively reduced electronic equipment surface temperature to solve the too high and heat dissipation limited problem of electronic equipment surface temperature, and then promote user's body and feel the comfort level.

Drawings

In order to more clearly illustrate the technical solutions in the present application or the related art, the drawings needed to be used in the description of the embodiments or the related art will be briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 shows a schematic diagram of an exemplary electronic device of an embodiment of the application;

FIG. 2 shows a schematic view of an insulation structure of an embodiment of the present application;

FIG. 3A shows a schematic view of an exemplary support post;

FIG. 3B shows a schematic view of an exemplary support post of an embodiment of the present application;

FIG. 4A shows a schematic view of a pressure distribution and support columns of an exemplary insulation structure;

FIG. 4B shows a schematic view of a pressure distribution and support columns of an exemplary insulation structure of an embodiment of the present application;

FIG. 5A illustrates a schematic view of an exemplary position of a housing and a heat insulation structure of a notebook computer;

FIG. 5B is a schematic diagram illustrating an exemplary positional relationship of a housing of a cell phone and a heat shield structure;

FIG. 6 illustrates a schematic view of an exemplary insulation structure secured in a housing by a breaching lock in accordance with embodiments of the present application;

FIG. 7 illustrates another exemplary connection relationship between a housing and a thermal insulation structure of a notebook computer.

Detailed Description

To make the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application are described in detail below with reference to the accompanying drawings.

It should be noted that technical terms or scientific terms used in the embodiments of the present application should have a general meaning as understood by those having ordinary skill in the art to which the present application belongs, unless otherwise defined. The use of "first," "second," and similar terms in the embodiments of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

Along with scientific and technological progress, electronic equipment integration level is higher and higher, the performance breaks through the promotion constantly, bring the components and parts consumption increase calorific capacity grow, but electronic equipment to the high performance, the inner space of equipment has been restricted greatly in the time of frivolous development, make the clearance of electronic equipment surface and internal element originally littleer and smaller, and because heat source areas such as electronic equipment inside mainboard high heating element and heat pipe are great, lead to electronic equipment's local surface temperature too high, it is more and more serious to send out the boiling hot problem, and then lead to the performance, life-span decline scheduling problem, and influence user experience.

For the solution of the over-high surface temperature of the electronic device in the related art, for example, the soaking treatment in the heat conduction mode is performed by attaching copper foil and graphite or using a copper plate, a temperature equalizing plate and the like, and the improvement of the heat conduction efficiency and the radiant heat is limited due to the limitation of space, area and the like, and the surface temperature of the electronic device is always high.

In view of this, the embodiment of the application provides an electronic equipment, including casing, heat source and thermal-insulated structure, has reduced the heat that the heat source transmitted to the electronic equipment surface through the heat-conduction mode of heat radiation and air based on thermal-insulated structure, has effectively reduced electronic equipment surface temperature to solve electronic equipment surface temperature too high and the limited problem of heat dissipation, and then promote user's body and feel comfort level. And under the condition of reasonable design, the scheme of the application does not influence the original performance of the electronic equipment.

Fig. 1 shows a schematic diagram of an exemplary electronic device 100 provided by an embodiment of the present application. Referring to fig. 1, an electronic device 100 provided by the embodiment of the present application may include a housing 101, a heat source 102 (e.g., a CPU) disposed inside the housing 101, and a heat insulation structure 103 disposed on a side of the heat source 102 close to the housing 101.

Referring to fig. 2, a schematic view of the insulation structure 103 is shown. As shown in fig. 2, the insulation structure 103 may further include a first cover plate 1031, a second cover plate 1032 disposed opposite to the first cover plate 1031, and an insulation chamber 1033 disposed between the first cover plate 1031 and the second cover plate 1032. Specifically, the first cover plate 1031 and the second cover plate 1032 may be made of a composite material (e.g., stainless steel) having low thermal conductivity and high strength; the second cover plate 1032 is close to the heat source 102 with respect to the first cover plate 1031; the edges of the first cover plate 1031 and the second cover plate 1032 may be connected and encapsulated by laser welding to ensure that the welding edge seam is a narrow edge, thereby reducing the amount of heat conducted through the edges of the thermal insulation structure 103. As an alternative embodiment, the interior of the insulating chamber 1033 may be a vacuum environment, thereby better insulating the thermal conduction. It will be appreciated that the higher the vacuum level of the insulating chamber 1033, the better the heat transfer from the heat convection can be avoided and the better the insulating effect of the insulating structure 103.

In some embodiments, the thickness of the thermal insulation structure 103 may be less than 1.0mm, wherein the thickness of the first cover plate 1031 and the second cover plate 1032 may be 0.1 to 0.2mm, and the thickness of the thermal insulation chamber 1033 may be 0.6 to 0.8mm. Like this, thermal-insulated structure 103 can satisfy ultra-thin space demand when guaranteeing thermal-insulated effect to satisfy ultra-thin electronic equipment's design demand, with the comfort level is felt to further promote user's body under the prerequisite that does not influence electronic equipment original performance.

It is understood that the overall size and shape of the insulation structure 103 may be designed according to the actual application requirements, or may be customized. For example, the overall shape of the heat insulation structure 103 may be a regular shape, or may be an irregular shape designed according to the actual application requirement (for example, the shape may be designed to have a different local thickness, or may be bent, etc.), and the present embodiment is not limited thereto.

As shown in fig. 2, in some alternative embodiments, the insulation structure 103 may further include a plurality of support posts 1034 disposed between the first cover plate 1031 and the second cover plate, the plurality of support posts 1034 being configured to support the insulation structure 103, thereby enhancing the structural strength of the insulation structure 103 to prevent atmospheric pressure from collapsing the insulation structure 103 due to the insulation structure 103 including the insulation cavity 1033. Specifically, the supporting pillars 1034 may be integrally formed on the second cover plate 1032 by etching; the support posts 1034 may be made of a low thermal conductivity, high strength composite material (e.g., stainless steel).

Fig. 3A shows a schematic view of an exemplary support post 1034. As shown in fig. 3A, the plurality of support pillars 1034 have the same size (for example, the support pillars 1034 are cylindrical support pillars 1034, the bottom surfaces of the support pillars 1034 have the same diameter, for example, 1.5 mm), and are uniformly, regularly and densely arranged. Due to the close arrangement and the large number of the supporting pillars 1034, the heat generated by the heat source 102 may be conducted from the second cover plate 1032 to the first cover plate 1031 through the supporting pillars 1034 and reach the surface of the electronic device, so that the heat insulation effect of the heat insulation structure 103 is limited.

In some embodiments, the plurality of support posts 1034 have at least two different sizes. Referring to fig. 3B, a schematic view of an exemplary support post 1034 is provided in accordance with an embodiment of the present application. As shown in fig. 3B, support posts 1034 have two different sizes, and in the case where support posts 1034 are cylindrical support posts 1034, two types of support posts 1034 having bottom diameters of 1.5mm and 3mm, respectively, may be included.

It should be noted that the shape of the support post 1034 is not further limited herein, and may include a cylindrical support post 1034, an elliptical support post 1034 (the cross section of the support post 1034 is elliptical), and the like, and different shapes of designs may be adopted according to the application requirements. It should be understood that the difference between the bottom areas of the support pillars 1034 with different shapes should be considered, and the bottom areas of the support pillars 1034 should be kept as small as possible, so that the smaller the contact area between the support pillars 1034 and the second cover plate 1032, the smaller the amount of heat transferred to the first cover plate 1031, and the thermal insulation effect of the thermal insulation structure 103 is not affected and reduced. Moreover, the support pillar 1034 provided by the embodiment of the application has a simple structure, is convenient to produce and has a low cost.

In some embodiments, the plurality of support posts 1034 may be arranged according to a pre-obtained pressure profile of the insulation structure 103. Specifically, referring to FIG. 4A, a schematic illustration of a pressure distribution and support columns 1034 of an exemplary insulation structure 103; referring to fig. 4B, a schematic diagram of a pressure distribution and support columns 1034 of the exemplary insulation structure 103 provided in the embodiments of the present application is shown. As shown in fig. 4B, the central position of the thermal insulation structure 103 is under a higher pressure, the structural strength is weaker, and the support pillars 1034 are arranged in a larger size and in a larger number; the edge of the insulation structure 103 is under less stress and has better structural strength, and the support columns 1034 are smaller and fewer in size. In this way, a certain number, size, shape and arrangement position of the support pillars 1034 are obtained by accurate calculation according to the pressure distribution of the thermal insulation structure 103, and the contact area between the support pillars 1034 and the second cover plate 1032 in this embodiment can be reduced to at least 1/2 of the contact area in fig. 4B. Thereby reducing the amount of heat conducted through the support posts 1034 and enhancing the thermal insulation effect of the thermal insulation structure 103.

In some alternative embodiments, the insulating structure 103 may be disposed in the housing 101, i.e., the insulating structure 103 and the housing 101 may be a unitary structure. Thus, the housing 101 can directly serve as the heat insulation structure 103 to have a heat insulation effect, and design requirements of ultrathin electronic equipment are further met. However, it should be considered that, when the housing 101 is directly used as the heat insulation structure 103, the first cover plate 1031 and the second cover plate 1032 should have larger sizes, and accordingly, the support columns 1034 should have larger sizes and larger numbers, so as to ensure the structural strength of the housing 101 (the heat insulation structure 103). Taking support post 1034 as a cylindrical support post 1034 as an example, the plurality of support posts 1034 may have three different sizes, with at least one of the three support posts 1034 having a larger diameter (e.g., 5 mm) at the bottom surface.

Further, as shown in fig. 2, in some optional embodiments, an insulating material 1035 may be disposed between the first cover plate 1031 and the support posts 1034. Specifically, the insulating material 1035 may be a high thermal resistance coating; insulation material 1035 may be provided at positions corresponding to the plurality of support columns 1034, and the shape of insulation material 1035 matches the shape of the bottom surface of support columns 1034 (in the case where support columns 1034 are cylindrical support columns 1034 are taken as an example, insulation material 1035 is also cylindrical); the orthographic projection of the support posts 1034 on the first cover plate 1031 is located within the insulating material 1035, for example, the size of the insulating material 1035 is 1mm larger than a single side of the support posts 1034. In this way, the heat of the second cover plate 1032 can be restricted from being transferred to the first cover plate 1031 through the support posts 1034 based on the heat insulating material 1035.

In some optional embodiments, a side of the second cover plate 1032 remote from the first cover plate 1031 may be further provided with a heat conductive material. Specifically, the heat conductive material may be sprayed or adhered on the side of the second cover plate 1032 away from the first cover plate 1031, and the heat conductive material may be graphene. Like this, carry out the soaking through the heat conduction material to the surface of second apron 1032 to increase heat radiating area so that second apron 1032 strengthens the heat dissipation, thereby reduce the heat and the surface temperature of second apron 1032, and then reduce the heat that conducts to the first apron 1031 of thermal-insulated structure 103, reach better thermal-insulated effect.

In some alternative embodiments, a side of the first cover plate 1031 facing the second cover plate 1032 and a side of the second cover plate 1032 facing the first cover plate 1031 are both provided with a metal layer for reducing heat radiation. Specifically, the metal thin material used for the metal layer may be gold, silver or copper (the operating environment of the electronic device is the infrared region), and the metal layer is mostly copper-plated layer in consideration of the production cost of the heat insulating structure 103. Thus, a thermal insulation net can be formed in the thermal insulation structure 103 based on the metal layer provided, thereby reducing the amount of heat transferred by thermal radiation and enhancing the thermal insulation effect of the thermal insulation structure 103.

In the above, the heat insulation structure 103 of the electronic device has a heat insulation effect and a heat soaking effect based on the heat insulation cavity 1033, the heat insulation material 1035, the heat conduction material, and the metal layer, so that the surface temperature of the electronic device is significantly reduced, and the use satisfaction of the user on the electronic device is improved. The heat insulation cavity 1033 and the heat insulation material 1035 of the heat insulation structure 103 can increase thermal conduction resistance in the heat conduction direction, the heat conduction material can perform heat soaking and heat dissipation on the surface of the second cover plate 1032 to reduce heat of the second cover plate 1032, and the metal layer can reduce radiation heat in the heat conduction direction to reduce heat transfer to the surface of the first cover plate 1031 of the heat insulation structure 103, so that heat transfer to the surface of the electronic device is reduced, and the surface temperature of the electronic device is effectively reduced. Moreover, the heat insulation structure 103 of the embodiment of the present application is an ultra-thin structure, and meets the design of an electronic device with a limited inner space size but a low surface temperature.

In addition, it can be understood that the electronic device 100 provided in the embodiments of the present application may be a display device. In this way, the heat transferred from the heat source 102 to the surface of the display device can be limited by the thermal insulation structure 103, so as to reduce the surface temperature of the display device and improve the safety and service life thereof. Specifically, the display device may be a product having an image display function, and may be, for example: display, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal Digital Assistant (PDA), digital camera, camcorder, viewfinder, navigator, vehicle, large-area wall, household appliance, information inquiry device (such as business inquiry device and monitor in the departments of e-government affairs, bank, hospital, electric power, etc.).

In some embodiments, referring to fig. 5A, for example, the electronic device is a notebook computer, the heat insulation structure 103 may be disposed in the casing 101 of the notebook computer; referring to fig. 5B, taking an electronic device as an example of a mobile phone, the heat insulation structure 103 may be disposed in the casing 101 of the mobile phone. Specifically, the heat insulation structure 103 may be disposed in the housing 101 by screw locking, structure column fastening, magnet attraction, welding, adhesive tape, or the like.

Fig. 6 shows a schematic view of the thermal insulation structure 103 arranged in the housing 101 by hole-breaking locking. As shown in fig. 6, in some alternative embodiments, the heat insulation structure 103 may be formed by breaking screw locking holes 105, locking the second cover plate 1032 directly in contact with the heat source 102 to directly contact the heat conductive material with the heat source 102, so as to conduct heat directly to the second cover plate 1032 through the heat conductive material for heat soaking and dissipation.

In some alternative embodiments, the second cover plate 1032 of the thermal insulation structure 103 may be made of copper with high thermal conductivity, and the first cover plate 1031 may be made of stainless steel with low thermal conductivity; the thermal insulation structure 103 may be fastened to the hole sites 105 by breaking holes and opening screws, and the second cover plate 1032 may be provided with a thermal paste or a heat sink to directly contact the heat source 102, thereby achieving uniform heating and heat dissipation using the second cover plate 1032 as a high thermal conductor.

In some alternative embodiments, the second cover plate 1032 of the thermal insulation structure 103 may be welded with a copper block and locking screw elastic pieces, and the copper block may be provided with a thermal grease or a heat sink to directly contact the heat source 102, the thermal insulation structure 103 may be formed by breaking the holes and opening the screw locking holes 105, and the copper block conducts heat of the heat source 102 to the second cover plate 1032 to achieve heat soaking and heat dissipation.

In other embodiments, taking the electronic device as a notebook computer as an example, as shown in fig. 7, the notebook computer may include a housing 101 (which may include an upper housing 101A and a lower housing 101B), a heat source 102, a heat insulation structure 103, a keyboard 104, and a display panel 106, wherein the keyboard 104 is disposed on the housing 101 (e.g., specifically on the lower housing 101B), and the heat insulation structure 103 is disposed between the keyboard 104 and the heat source 102. In this way, the heat transfer from the heat source 102 (high heat generating components and motherboard) to the keyboard 104 is reduced by the thermal isolation structure 103, thereby improving the user experience.

Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the context of the present application, also features in the above embodiments or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of brevity.

While the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description.

The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present application are intended to be included within the scope of the present application.

Claims (13)

1. An electronic device, comprising:

a housing;

a heat source disposed inside the housing; and

the heat insulation structure is arranged on one side of the heat source close to the shell;

wherein the heat insulation structure comprises:

a first cover plate;

the second cover plate is arranged opposite to the first cover plate; and

a thermally insulating chamber disposed between the first cover plate and the second cover plate.

2. The electronic device of claim 1, wherein the thermal isolation structure is disposed in the housing.

3. The electronic device of claim 1, wherein the electronic device is a notebook computer including a keyboard disposed on the housing, the thermal isolation structure being disposed between the keyboard and the heat source.

4. The electronic device of claim 1, wherein the thermal isolation structure further comprises:

a plurality of support posts disposed between the first cover plate and the second cover plate.

5. The electronic device of claim 4, wherein the second cover plate is proximate to the heat source relative to the first cover plate, and wherein a thermally insulating material is disposed between the first cover plate and the support posts.

6. The electronic device of claim 5, wherein the shape of the insulating material matches the shape of the bottom surface of the support post.

7. The electronic device of claim 5, wherein an orthographic projection of the support posts on the first cover plate is located within the thermally insulating material.

8. The electronic device of claim 4, wherein the plurality of support posts have at least two different sizes.

9. The electronic device of claim 4, wherein the plurality of support posts are arranged according to a pre-derived pressure profile of the insulating structure.

10. The electronic device of claim 1, wherein a side of the second cover plate remote from the first cover plate is provided with a thermally conductive material.

11. The electronic device of claim 10, wherein the thermally conductive material is graphene.

12. The electronic apparatus according to claim 1, wherein a side of the first cover plate facing the second cover plate and a side of the second cover plate facing the first cover plate are each provided with a metal layer for reducing heat radiation.

13. The electronic device according to any of claims 1-12, wherein the electronic device is a display device.

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