CN218675388U

CN218675388U - Optical module

Info

Publication number: CN218675388U
Application number: CN202222568024.XU
Authority: CN
Inventors: 郑龙; 杨思更; 刘璐
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-03-21
Anticipated expiration: 2032-09-27

Abstract

The application discloses optical module includes: a circuit board and a light emitting device, wherein the light emitting device includes: and one end of the third ceramic substrate is connected with the circuit board in a routing way. And the light emitting chip is arranged above the third ceramic substrate and used for emitting signal light. And the first lens is arranged on the light emitting path of the light emitting chip and used for converting the signal light into convergent light. The lower surface of one side of the first lens facing the light emitting chip is provided with a reflecting film. And the photoelectric detector is positioned between the first lens and the light emitting chip, receives the signal light reflected by the reflecting film and converts part of the signal light into an electric signal. The upper surface of the photoelectric detector is lower than the light-emitting central axis of the light-emitting chip, and the photoelectric detector receives the signal light reflected by the reflecting film, so that the optical power of the light-emitting chip is directly monitored, and the accuracy of optical power monitoring is improved.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

The optical module is mainly used for photoelectric and electro-optical conversion, and an emission end of the optical module converts an electric signal into an optical signal and transmits the optical signal through an optical fiber. Usually, in order to avoid signal abnormality caused by too low or too high optical power, the optical power of the transmitting end is monitored, and the optical power of the outgoing light is adjusted in time.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve the monitoring accuracy of the optical power of an optical emission chip.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

a circuit board;

a light emitting device electrically connected to the circuit board, comprising:

one end of the third ceramic substrate is connected with the circuit board in a routing way;

the light emitting chip is arranged above the third ceramic substrate and used for emitting signal light;

the first lens is arranged on a light emitting path of the light emitting chip and used for converting the signal light into convergent light;

the reflecting film is arranged on one side of the first lens facing the light emitting chip and reflects part of the signal light;

the reflecting film is positioned on the lower surface of the center of the first lens;

the photoelectric detector is arranged between the first lens and the light emitting chip and used for receiving the reflected signal light;

the upper surface of the photoelectric detector is lower than the light-emitting central axis of the light-emitting chip.

The beneficial effect of this application:

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is a schematic view of a connection structure of a light emitting device and a circuit board provided in the present application;

fig. 6 is a schematic structural diagram of a light emitting device provided in the present application, detached from a circuit board;

fig. 7 is a schematic cross-sectional view of a light emitting device provided in the present application;

FIG. 8 is a schematic diagram of a split-partial structure of a light emitting device provided herein;

FIG. 9 is a schematic illustration of a partial cross-sectional structure of a light emitting device according to an example of the present application;

fig. 10 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present disclosure;

FIG. 11 is a second partial cross-sectional view of a light emitting device in accordance with an example of the present application;

fig. 12 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present application;

FIG. 13 is a schematic illustration of a partial cross-sectional structure of a light emitting device in accordance with an example of the present application;

fig. 14 is a schematic partial optical path diagram three of a light emitting device according to an embodiment of the present application;

FIG. 15 is a partial cross-sectional view of a light emitting device illustrating a fourth embodiment of the present application;

fig. 16 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present application;

FIG. 17 is a schematic illustration of a partial cross-sectional structure of a light emitting device in accordance with an example of the present application;

fig. 18 is a partial optical path schematic diagram five of a light emitting device according to an embodiment of the present application;

FIG. 19 is a schematic diagram showing a partial cross-sectional structure of a light emitting device according to an example of the present application;

fig. 20 is a schematic partial optical path diagram six of a light emitting device according to an embodiment of the present application;

fig. 21 is a schematic diagram seven of a partial cross-sectional structure of a light emitting device of an example of the present application;

fig. 22 is a schematic partial optical path diagram seven of a light emitting device according to an embodiment of the present application;

fig. 23 is a partial sectional view schematically illustrating an eighth light emitting device according to an example of the present application;

fig. 24 is a schematic partial optical path diagram eight of a light emitting device according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of thousands of meters (6 km to 8 km), on the basis of which if a repeater is used, theoretically infinite distance transmission can be realized. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is made by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 and an electrical port, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the interconversion between the optical signal and the electrical signal, and has no function of processing data, information is not changed in the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the ont 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a configuration diagram of the optical network terminal, and fig. 2 only shows a configuration of the optical module 200 of the optical network terminal 100 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed within the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the onu 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, so that the optical module 200 is connected to the optical network terminal 100 by a bidirectional electrical signal. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional optical signal connection with the optical fiber 101.

FIG. 3 is a block diagram of a light module according to some embodiments. As shown in fig. 3, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical transceiver module 400.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper case 201 includes a cover 2011, and the cover 2011 covers the two lower side plates 2022 of the lower case 202 to form the above case.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates located on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with the two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end portion (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end portion (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. The opening 204 is an electrical port, and a gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101, so that the external optical fiber 101 is connected to the optical transceiver module 400 inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form encapsulation protection for the devices. In addition, when the components such as the circuit board 300 and the optical transceiver module 400 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the components are convenient to arrange, and the automatic production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, and the unlocking component is configured to realize a fixed connection between the optical module 200 and the upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a latching member that mates with a host cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member; when the unlocking member is pulled, the engaging member of the unlocking member moves along with the unlocking member, and further the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. Examples of the electronic components include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip includes, for example, a Micro Controller Unit (MCU), a laser driver chip, a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide smooth bearing; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300 (e.g., the upper surface shown in fig. 4), or may be disposed on both upper and lower sides of the circuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer to realize power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards. For example, a flexible circuit board may be used to connect the rigid circuit board and the optical transceiver module.

The optical transceiver component 400 includes a light emitting device configured to enable emission of an optical signal and a light receiving device configured to enable reception of the optical signal. Illustratively, the light emitting device and the light receiving device are combined together to form an integrated light transceiving component.

In order to realize the connection between the light emitting device and the external optical fiber, a fiber adapter 500 is provided at one end of the light emitting device for connecting the light emitting device and the external optical fiber.

Fig. 5 is a schematic view of a connection structure between a light emitting device and a circuit board provided in the present application, and fig. 6 is a schematic view of a structure between a light emitting device and a circuit board provided in the present application. As shown in fig. 5 and 6, in some embodiments of the present application, the circuit board 300 is provided with an emission through hole 310, the emission housing 410 is embedded inside the emission through hole 310, and a side of the circuit board adjacent to the emission through hole is provided with a driving pin connected with the light emission chip 430 and the semiconductor cooler by wire bonding. The optical fiber adapter 500 is disposed at one end of the emission housing 410, and the signal light emitted from the light emission chip 430 is coupled into the optical fiber adapter 500 through the lens 430 and transmitted to the outside through the optical fiber adapter 500.

Fig. 7 is a schematic cross-sectional structure of a light emitting device provided herein, and fig. 8 is a schematic partial structure of a light emitting device provided herein. A first cermet substrate 441 is disposed over the emission base 413, and a semiconductor cooler 440 is disposed over the first cermet substrate. The first metal ceramic substrate 441 is provided with a refrigeration driving circuit, which is connected with the circuit board in a routing manner and is used for driving the semiconductor refrigerator 440 to regulate the temperature of the light emitting device.

The second ceramic substrate 442 is disposed above the semiconductor cooler 440, the lens 420 and the third metal ceramic substrate 443 are disposed above the second ceramic substrate 442, the lens 420 is disposed between the third metal ceramic substrate 443 and the fiber stub 510, and the light emitting chip 430 is disposed above the third metal ceramic substrate 443. The light emitting chip 430 emits signal light towards the fiber adapter direction 500, the signal light at this time is divergent light, convergent light is formed after the divergent light passes through a lens, light spots of the convergent light are located on the end face of the fiber ferrule 510 after the convergent light passes through an optical isolator in the fiber adapter, and the convergent light is transmitted to an external fiber through the fiber adapter.

In the optical module, a photodetector 450 is generally provided for detecting the intensity of the signal light emitted from the light-emitting chip 430. The photodetector 450 is electrically connected to the MCU, and the MCU adjusts power supply to the light emitting chip 430 by receiving intensity of the signal light, so as to ensure signal transmission efficiency.

Example one

Fig. 9 is a partial cross-sectional structure diagram of a light emitting device according to an example of the present application. Fig. 10 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present application. As shown in fig. 9 and 10, in order to achieve detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, wherein the first lens is disposed on the light emitting path of the light emitting chip 430. A reflecting film is arranged on the lower surface of the first convex surface of the first lens facing the light emitting chip to reflect part of the signal light.

In order to monitor the optical power of the signal light emitted by the light emitting chip, the photoelectric detector 450 is arranged between the first lens and the light emitting chip, so that the optical signal is converted into an electrical signal, and the electrical signal is sent to the MCU. And after receiving the electric signal, the MCU chip calculates the current optical power according to the electric signal, compares the current optical power with a preset optical power threshold value according to the current optical power, and adjusts the power supply voltage of the light emitting chip so as to realize the adjustment of the light emitting power.

In order to accurately monitor the output optical power of the light emitting chip, the photodetector 450 is disposed between the first lens and the light emitting chip and located on the sidewall of the third metal ceramic substrate. The photosensitive surface of the photodetector 450 is disposed toward the first lens, and is configured to receive the signal light reflected by the first lens and detect the signal light.

The reflective film is positioned below the center of the first lens, namely the upper edge of the reflective film is lower than the center of the first lens, and the reflected signal light faces the lower part of the optical module.

The first lens is a convergent lens, receives the signal light emitted by the light emitting chip and then converges the signal light into a light spot, and the emitting optical fiber is positioned on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is reflected by the reflecting film and then received by the photosensitive surface of the photoelectric detector 450, and other signal light is converged to the emitting optical fiber through the first lens and is transmitted out through the emitting optical fiber.

In the present example, a fourth cermet substrate 444 is disposed between the third cermet substrate 443 and the light emitting chip 430 to adjust a height difference between the light emitting chip and the photodetector 450.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 200-450 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.5-1.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

The upper surface of the photoelectric detector is arranged at a position lower than the optical axis of the light emitting chip and used for receiving a part of optical signals reflected by the reflecting film of the first lens and performing photoelectric conversion.

In the present embodiment, in order to realize the converging effect of the first lens on the signal light, the horizontal distance L2 between the center of the first lens and the light outlet of the light emitting chip is 2.5 to 5.5mm. The horizontal distance between the center of the first lens and the light outlet of the light emitting chip is too large or too small, which affects the coupling efficiency of the signal light.

In the embodiment of the present application, the light emitting chip and the circuit of the photo detector 450 are disposed on the surfaces of the third ceramic metal substrate and the fourth ceramic metal substrate, and connected to the circuit board by wire bonding.

In order to realize the positioning of the emitting optical fiber and to improve the coupling efficiency of light, an optical fiber adapter 500 is provided at the light emitting side of the first lens.

In order to improve the coupling efficiency of light, in the present example, the central axes of the optical fiber adapter, the light emitting chip, and the first lens are aligned. An embodiment of the present application provides a light emitting device, including: the third metal ceramic substrate 443, and the light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, the first lens is disposed on the light emitting path of the light emitting chip 430, and a reflective film is disposed on the lower surface of the convex mirror facing the light emitting chip to reflect a portion of the signal light to the photodetector. The photo detector 450 is disposed on the sidewall of the third metal ceramic substrate, and the photosensitive surface of the photo detector faces the first lens, and is used for reflecting the signal light reflected by the film to detect the signal light. The first lens is a convergent lens, receives the signal light emitted by the light emitting chip and then converges the signal light into a light spot, and the emitting optical fiber is positioned on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is converged to the emitting optical fiber through the first lens and is transmitted out through the emitting optical fiber.

Example two

Fig. 11 is a partial cross-sectional structure diagram of a light emitting device according to an example of the present application. Fig. 12 is a schematic partial optical path diagram of a light emitting device according to an embodiment of the present application. As shown in fig. 11 and 12, in order to realize detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, and a second lens 421 is disposed on the light-emitting path of the light emitting chip 430. The third lens 422 is disposed between the second lens 421 and the fiber adapter 500.

In order to monitor the optical power of the signal light emitted by the light emitting chip, the photodetector 450 is disposed between the second lens and the light emitting chip, so that the optical signal is converted into an electrical signal, and the electrical signal is transmitted to the MCU. And after receiving the electric signal, the MCU chip calculates the current optical power according to the electric signal, compares the current optical power with a preset optical power threshold value according to the current optical power, and adjusts the power supply voltage of the light emitting chip so as to realize the adjustment of the light emitting power.

The second lens 421 is provided with a reflective film on a lower surface of the convex mirror facing the light emitting chip for reflecting a part of the signal light to the photodetector 450.

In order to accurately monitor the output optical power of the light emitting chip, the photodetector 450 is disposed between the second lens and the light emitting chip and located on the sidewall of the third metal ceramic substrate. The photosensitive surface of the photodetector 450 is disposed toward the first lens, and is configured to receive the signal light reflected by the first lens and detect the signal light.

The reflective film is positioned below the center of the second lens, namely the upper edge of the reflective film is lower than the center of the second lens, and the reflected signal light faces the lower part of the optical module and is received by the photoelectric detector.

The second lens is a collimating lens, and converts the signal light into collimated signal light after receiving the signal light emitted by the light emitting chip. The third lens 422 is disposed between the second lens 421 and the fiber adapter 500, and the third lens 422 converts the collimated signal light into a converging signal light.

The optical fiber adapter 500 is located on the light-emitting side of the third lens, and is used for receiving the signal light converged by the third lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is collimated by the second lens, then converged to the optical fiber adapter 500 through the third lens, and transmitted out through the emitting optical fiber of the optical fiber adapter 500.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is 200-450 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.5-1.5 mm.

The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is 200 to 450 μm, and if the vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, the light received by the photo detector 450 is less, which affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, so that the light received by the photodetector 450 is less, and the detection accuracy of the photodetector 450 is affected.

The horizontal distance L1 between the right end of the photodetector 450 and the light exit of the light emitting chip is 0.5 to 1.5mm, and the horizontal distance between the right end of the photodetector 450 and the light exit of the light emitting chip is too large, which results in less light received by the photodetector 450 and affects the detection accuracy of the photodetector 450. The horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of light received by the photodetector 450 and the light efficiency monitoring effect.

The horizontal distance L2 between the center of the second lens and the light outlet of the light emitting chip is 2.5-5.5 mm. The horizontal distance between the center of the second lens and the light outlet of the light emitting chip is too large or too small, which affects the coupling efficiency of the signal light. The horizontal distance between the center of the second lens and the light outlet of the light emitting chip is the focal length of the second lens.

In the embodiment of the present application, the light emitting chip and the circuit of the photodetector are disposed on the surfaces of the third ceramic metal substrate and the fourth ceramic metal substrate, and are connected to the circuit board by wire bonding.

In order to improve the coupling efficiency of light, in the present example, the central axes of the fiber adapter, the light emitting chip, the second lens, and the third lens are aligned.

An embodiment of the present application provides a light emitting device, including: the second lens is arranged on the light emitting path of the light emitting chip 430, and a reflective film is arranged on the lower side of one side of the second lens facing the light emitting chip. The photodetector 450 is disposed on a sidewall of the third metal ceramic substrate. The photosensitive surface of the photodetector 450 is disposed toward the second lens, and is used for receiving the signal light reflected by the reflective film and detecting the signal light. The second lens is a collimating lens, and converts the signal light into parallel signal light after receiving the signal light emitted by the light emitting chip. The parallel signal light forms convergent signal light after passing through the third lens, and the transmitting optical fiber is positioned on the light emitting side of the third lens and used for receiving the signal light converged by the third lens. The signal light emitted by the light emitting chip is divergent light, part of the signal light is reflected by the reflecting film of the second lens and then received by the photosensitive surface of the photoelectric detector 450, and other signal light passes through the second lens and the third lens and then is transmitted out through the transmitting optical fiber.

EXAMPLE III

Fig. 13 is a schematic diagram of a partial cross-sectional structure of a light emitting device according to an example of the present application. Fig. 14 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present application. As shown in fig. 13 and 14, in order to achieve detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light-emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, and a first lens is disposed on the light-emitting path of the light-emitting chip 430. A reflecting film is arranged on the lower surface of the first convex surface of the first lens facing the light emitting chip to reflect part of the signal light.

In order to accurately monitor the output optical power of the optical transmitting chip, the photodetector 450 is disposed between the first lens and the optical transmitting chip, and the photosensitive surface of the photodetector 450 faces upward to receive the signal light reflected by the first lens and detect the signal light. In this example, the upper surface of the photodetector 450 is lower than the central axis of the light emitting chip.

The photodetector 450 is disposed on the upper surface of the carrier substrate, and the height of the upper surface of the carrier substrate is lower than that of the upper surface of the third metal ceramic substrate, so as to facilitate installation and debugging of the photodetector. The carrier substrate 446 may be an integral structure with the third cermet substrate or a split structure.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 300-650 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.7-2.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

The upper surface of the photoelectric detector is arranged lower than the optical axis of the light emitting chip and used for receiving a part of optical signals reflected by the reflecting film of the first lens and performing photoelectric conversion.

In the present embodiment, in order to realize the converging effect of the first lens on the signal light, the horizontal distance L2 between the center of the first lens and the light outlet of the light emitting chip is 2.5 to 6.5mm. The horizontal distance between the center of the first lens and the light outlet of the light emitting chip is too large or too small, which affects the coupling efficiency of the signal light.

In order to improve the coupling efficiency of light, in the present example, the central axes of the optical fiber adapter, the light emitting chip, and the first lens are aligned. An embodiment of the present application provides a light emitting device, including: the third metal ceramic substrate 443, and the light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, the first lens is disposed on the light emitting path of the light emitting chip 430, and a reflective film is disposed on the lower surface of the convex mirror facing the light emitting chip to reflect a portion of the signal light to the photodetector. The photo detector 450 is disposed on a sidewall of the third metal ceramic substrate, and a photosensitive surface of the photo detector faces upward to reflect the signal light reflected by the film for detecting the signal light. The first lens is a convergent lens, receives the signal light emitted by the light emitting chip and then converges the signal light into a light spot, and the emitting optical fiber is positioned on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is converged to the emitting optical fiber through the first lens and transmitted out through the emitting optical fiber.

Example four

Fig. 15 is a partial cross-sectional structure diagram of a light emitting device according to an example of the present application. Fig. 16 is a partial optical path schematic diagram of a light emitting device according to an embodiment of the present application. As shown in fig. 15 and 16, in order to realize detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, and a second lens is disposed on the light emitting path of the light emitting chip 430. And a reflecting film is arranged on the lower surface of the convex surface of the second lens facing the light emitting chip and used for reflecting part of the signal light. Other signal light is converted into parallel light by the second lens, and then is converged to the optical fiber adapter 500 by the third lens.

In order to accurately monitor the output optical power of the optical transmitting chip, the photodetector 450 is disposed between the second lens and the optical transmitting chip, and the photosensitive surface of the photodetector 450 faces upward to receive the signal light reflected by the second lens and detect the signal light. In this example, the upper surface of the photodetector 450 is lower than the central axis of the light emitting chip.

The reflective film is positioned below the center of the second lens, namely the upper edge of the reflective film is lower than the center of the second lens, and the reflected signal light faces the lower part of the optical module.

The second lens is a collimating lens, receives the signal light emitted by the light emitting chip, converts the signal light into parallel light beams, converges the parallel light beams into a light spot through the convergence of the third lens, and the emitting optical fiber is positioned on the light emitting side of the third lens and is used for receiving the signal light converged by the third lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is reflected by the reflecting film and then received by the photosensitive surface of the photoelectric detector 450, and other signal light is converged to the emitting optical fiber through the second lens and the third lens and is transmitted out through the emitting optical fiber.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 300-650 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.7-2.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the accuracy of the photoelectric detection.

In the present embodiment, in order to realize the converging effect of the second lens on the signal light, the horizontal distance L2 between the center of the second lens and the light outlet of the light emitting chip is 2.5 to 6.5mm. The horizontal distance between the center of the second lens and the light outlet of the light emitting chip is too large or too small, which affects the coupling efficiency of the signal light.

In order to improve the coupling efficiency of light, in the present example, the central axes of the optical fiber adapter, the light emitting chip, and the first lens are aligned. An embodiment of the present application provides a light emitting device, including: the third metal ceramic substrate 443, and the light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, the first lens is disposed on the light emitting path of the light emitting chip 430, and a reflective film is disposed on the lower surface of the convex mirror facing the light emitting chip to reflect a portion of the signal light to the photodetector. The photo detector 450 is disposed on the sidewall of the third metal ceramic substrate, and the photosensitive surface of the photo detector faces the second lens, and is used for reflecting the signal light reflected by the film to detect the signal light. The second lens is a collimating lens, receives the signal light emitted by the light emitting chip, converts the signal light into parallel light beams, and the emitting optical fiber is located on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is converged to the emitting optical fiber through the first lens and transmitted out through the emitting optical fiber.

EXAMPLE five

Fig. 17 is a partial cross-sectional structure diagram of a light emitting device according to an example of the present application. Fig. 18 is a partial optical path schematic diagram five of a light emitting device according to an embodiment of the present application. As shown in fig. 17 and 18, in order to realize the detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, wherein the first lens is disposed on the light emitting path of the light emitting chip 430. A reflecting film is arranged on the upper surface of the first convex surface of the first lens facing the light emitting chip to reflect part of the signal light.

In order to accurately monitor the output optical power of the light emitting chip, the photodetector 450 is disposed between the first lens and the light emitting chip. A fifth cermet substrate 445 is disposed above the first lens for carrying the photodetector 450. The photo detector 450 is disposed on a sidewall of the fifth metal ceramic substrate 445, and a photosensitive surface of the photo detector 450 faces the first lens, and is configured to receive the signal light reflected by the first lens and detect the signal light.

Fifth metal ceramic substrate 445 is equipped with the bearing part, and the protrusion sets up in fifth metal ceramic substrate's lower surface, and the photosensitive surface sets up towards first lens for receive the signal light through first lens reflection, survey this signal light.

The reflecting film is positioned above the center of the first lens, namely the lower edge of the reflecting film is higher than the center of the first lens, and the reflected signal light faces to the obliquely upper part of the optical module.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 150-450 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.2-1.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

In order to improve the coupling efficiency of light, in the present example, the central axes of the optical fiber adapter, the light emitting chip, and the first lens are aligned. An embodiment of the present application provides a light emitting device, including: the first lens is disposed on the light-emitting path of the light-emitting chip 430, and a reflective film is disposed on the upper surface of the convex mirror facing the light-emitting chip to reflect a portion of the signal light to the photodetector. The photo detector 450 is disposed on the sidewall of the fifth metal ceramic substrate above the first lens, and the photosensitive surface of the photo detector faces the first lens for reflecting the signal light reflected by the film to detect the signal light. The first lens is a convergent lens, receives the signal light emitted by the light emitting chip and then converges the signal light into a light spot, and the emitting optical fiber is positioned on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is converged to the emitting optical fiber through the first lens and transmitted out through the emitting optical fiber.

On the basis of the embodiment of the present application, the first lens may be replaced by a second lens and a third lens, where the second lens is a collimating lens and the third lens is a converging lens. The reflective film 4201 is disposed on a side of the second lens facing the photodetector and above the optical axis. The signal light is reflected by the reflecting film and then transmitted to the oblique upper part of the optical module, and is projected to the photosensitive surface of the photoelectric detector. As shown in fig. 19 and 20. Fig. 19 is a partial sectional structure diagram six of a light emitting device according to an example of the present application. Fig. 20 is a schematic partial optical path diagram six of a light emitting device according to an embodiment of the present application. Wherein: in order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 150-450 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.2-1.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

In this embodiment, the horizontal distance L2 between the center of the second lens and the light exit of the light emitting chip is 2.5 to 5.5mm. The horizontal distance between the center of the second lens and the light outlet of the light emitting chip is too large or too small, which affects the coupling efficiency of the signal light.

Example six

Fig. 21 is a partial cross-sectional view of a light emitting device according to an example of the present application. Fig. 22 is a schematic partial optical path diagram seven of a light emitting device according to an embodiment of the present application. As shown in fig. 21 and 22, in order to achieve detection of the intensity of the signal light emitted from the light emitting chip 430 by the photodetector 450, the light emitting device provided by the present application includes: a third metal ceramic substrate 443 and a light emitting chip 430 disposed on the upper surface of the third metal ceramic substrate 443, wherein the first lens is disposed on the light emitting path of the light emitting chip 430. A reflecting film is arranged on the upper surface of the first convex surface of the first lens facing the light emitting chip to reflect part of the signal light.

In order to accurately monitor the output optical power of the light emitting chip, the photodetector 450 is disposed between the first lens and the light emitting chip. A fifth cermet substrate 445 is disposed above the first lens for carrying the photodetector 450. The photodetector 450 is disposed on the lower surface of the fifth metal ceramic substrate 445, and the photosensitive surface of the photodetector 450 faces downward, and is configured to receive the signal light reflected by the reflective film of the first lens and detect the signal light.

The fifth metal ceramic substrate 445 is provided with a bearing portion protruding from the lower surface of the fifth metal ceramic substrate, and the photosensitive surface is disposed toward the lower housing for receiving the signal light reflected by the first lens and detecting the signal light.

In order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 300-650 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.7-2.5 mm. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photodetector 450 and the light exit of the light emitting chip is too large, which results in less light received by the photodetector 450 and affects the detection accuracy of the photodetector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

In order to improve the coupling efficiency of light, in the present example, the central axes of the optical fiber adapter, the light emitting chip, and the first lens are aligned. An embodiment of the present application provides a light emitting device, including: the first lens is disposed on the light-emitting path of the light-emitting chip 430, and a reflective film is disposed on the upper surface of the convex mirror facing the light-emitting chip to reflect a portion of the signal light to the photodetector. The photodetector 450 is disposed on the lower surface of the fifth metal ceramic substrate above the first lens, and the photosensitive surface of the photodetector faces the lower side of the optical module, and is configured to reflect the signal light reflected by the film to detect the signal light. The first lens is a convergent lens, receives the signal light emitted by the light emitting chip and then converges the signal light into a light spot, and the emitting optical fiber is positioned on the light emitting side of the first lens and used for receiving the signal light converged by the first lens. The signal light emitted by the light emitting chip is divergent light, part of the divergent light is received by the photosensitive surface of the photodetector 450, and other signal light is converged to the emitting optical fiber through the first lens and transmitted out through the emitting optical fiber.

On the basis of this embodiment, the first lens may be replaced by a second lens and a third lens, where the second lens 421 is a collimating lens, and the third lens 422 is a converging lens. The reflective film 4201 is disposed on a side of the second lens 421 facing the photodetector and above the optical axis. The signal light is reflected by the reflecting film and then transmitted to the oblique upper part of the optical module, and is projected to the photosensitive surface of the photoelectric detector. As shown in fig. 23 and 24. Fig. 23 is a partial sectional view schematically illustrating an eighth light emitting device according to an example of the present application. Fig. 24 is a schematic partial optical path diagram eight of a light emitting device according to an embodiment of the present application. Wherein: in order to ensure that the photodetector 450 can receive 5% -8% of the optical power of the light emitted from the light emitting chip, the vertical distance H between the upper surface of the photodetector 450 and the optical axis of the light emitting chip is 300-650 μm, and the horizontal distance L1 between the right end of the photodetector 450 and the light outlet of the light emitting chip is 0.7-2.5 mm. The vertical distance between the photosensitive surface of the photo detector 450 and the optical axis of the light emitting chip is too large, or the horizontal distance between the right end of the photo detector 450 and the light outlet of the light emitting chip is too large, which results in less light received by the photo detector 450 and affects the detection accuracy of the photo detector 450. The vertical distance between the photosensitive surface of the photodetector 450 and the optical axis of the light emitting chip is too small, or the horizontal distance between the right end of the photodetector 450 and the light outlet of the light emitting chip is too small, which affects the size of the light received by the photodetector 450 and affects the optical efficiency monitoring effect.

In some embodiments of the present application, the light emitting chip, the lens, and the projection of the photodetector on the lower case may be disposed on the same line. The projection of the photoelectric detector on the lower shell can also be positioned on one side of a connecting line of the projection of the light emitting chip and the projection of the lens on the lower shell, the distance between the projection of the photoelectric detector on the lower shell and the first lower side plate is greater than the distance between the light emitting chip and the first lower side plate, the distance between the projection of the photoelectric detector on the lower shell and the first lower side plate can also be greater than the distance between the light emitting chip and the first lower side plate, and the specific distance between the photoelectric detector and the first lower side plate is determined by the reflection direction of the reflection film on the lens.

In this application, for the accuracy of realizing the monitoring of light power, 5% -8% of light power is sent out before the light emission chip to photoelectric detector 450 can receive the light emission chip, and the perpendicular distance of the photosensitive surface of photoelectric detector 450 and the optical axis of the light emission chip, the right-hand member of photoelectric detector 450 and the horizontal distance of the light-emitting port of the light emission chip, the center of lens and the horizontal distance of the light-emitting port of the light emission chip can set up according to the light-emitting parameter of the light emission chip. The light emitting parameters include light intensity, focal length and the like.

In order to improve the coupling efficiency of light, in the example of the present application, the central axes of the fiber adapter, the light emitting chip, the second lens, and the third lens are on a straight line. Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the phrases "comprising a" \8230; "defining an element do not exclude the presence of additional like elements in a circuit structure, article, or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising: a circuit board;

2. The optical module of claim 1, wherein the photodetector is located on the third ceramic substrate sidewall with its photosensitive surface disposed toward the first lens.

3. The optical module according to claim 2, wherein a vertical distance between an upper surface of the photodetector and a light-emitting central axis of the light-emitting chip is greater than or equal to 200 μm and less than or equal to 450 μm;

the horizontal distance between the photosensitive surface of the photoelectric detector and the light outlet of the light emitting chip is 0.5 mm-1.5 mm.

4. The optical module of claim 2, wherein the photodetector is located at a horizontal distance of 2.5mm to 5.5mm from the center of the first lens on a side adjacent to the light emitting chip.

5. The optical module of claim 1, further comprising: the bearing substrate is positioned on one side of the third ceramic substrate, and the upper surface of the bearing substrate is lower than that of the third ceramic substrate;

the photoelectric detector is positioned on the upper surface of the bearing substrate, and the photosensitive surface of the photoelectric detector faces the upper part of the optical module.

6. The light module of claim 5, further comprising: the vertical distance between the upper surface of the photoelectric detector and the light-emitting central axis of the light-emitting chip is greater than or equal to 300 mu m and less than or equal to 650 mu m;

and the horizontal distance between one side of the photoelectric detector, which is close to the light emitting chip, and the light outlet of the light emitting chip is 0.7-2.5 mm.

7. The optical module of claim 6, wherein the photodetector is located at a horizontal distance of 2.5mm to 6.5mm from the center of the first lens on a side adjacent to the light emitting chip.

8. A light module, comprising: a circuit board;

the second lens is arranged on a light emitting path of the light emitting chip and used for converting the signal light into parallel light;

the third lens is arranged on a light-emitting path of the second lens and used for converting the signal light from parallel light into convergent light;

the reflecting film is arranged on one side of the second lens facing the light emitting chip and reflects part of the signal light;

the reflecting film is positioned on the lower surface of the center of the second lens;

the photoelectric detector is arranged between the second lens and the light emitting chip and used for receiving the reflected signal light;

9. The optical module of claim 8, wherein the photodetector is located on the third ceramic substrate sidewall with its photosensitive surface disposed toward the second lens.

10. The light module of claim 8,

the vertical distance between the upper surface of the photoelectric detector and the light-emitting central axis of the light-emitting chip is greater than or equal to 200 μm and less than or equal to 450 μm;

and the horizontal distance between one side of the photoelectric detector, which is close to the light emitting chip, and the light outlet of the light emitting chip is 0.5-1.5 mm.