CN218350555U

CN218350555U - Optical module

Info

Publication number: CN218350555U
Application number: CN202222412337.6U
Authority: CN
Inventors: 刘凯; 申世超; 李传斌; 李丹; 崔峰
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2023-01-20
Anticipated expiration: 2032-09-09

Abstract

The application discloses optical module includes: the circuit board is provided with an emission through hole and an emission shell arranged in the emission through hole. The emission shell comprises an emission base used for bearing the light emission chip and the lens; the upper surface of adaptation loading board is sunken formation adaptation recess downwards. The fiber optic adapter, embedding adaptation recess includes: the optical fiber ferrule, the flange, the outside of locating the optical fiber ferrule of cover, including first connecting portion and the second connecting portion that have different diameters. And the sleeve is sleeved outside the optical fiber ferrule and is internally provided with an optical isolator. One side of the first connecting part is abutted against the side wall of the adapting groove, and the second connecting part is embedded into the adapting groove; the flange is not contacted with the sleeve, the part of the optical fiber ferrule is exposed between the flange and the sleeve, the phenomenon that redundant glue is adhered to the outer wall of the optical fiber ferrule can be avoided, the machining precision of the optical fiber ferrule is larger than that of the sleeve, the cylindrical surface of the optical fiber ferrule can be conveniently identified to determine the position of the central axis of the optical fiber ferrule, and the coupling efficiency of the optical module can be improved.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

Among them, the light emitting device is an important component that converts an electric signal into an optical signal. In order to make the connection between the light emitting device and the external optical fiber, a fiber optic adapter is typically provided for connecting the light emitting assembly with the external optical fiber. And the position precision between the optical fiber adapter and the optical component directly influences the coupling efficiency of light.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve optical coupling efficiency of the optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

a circuit board provided with an emission through hole;

the transmission casing, set up in the transmission through-hole includes:

the emission base is used for bearing the light emission chip and the lens;

the adaptive bearing plate is arranged on one side of the emission base, and the upper surface of the adaptive bearing plate is sunken downwards to form an adaptive groove;

a fiber optic adapter embedded in the adapter groove, comprising:

an optical fiber ferrule;

the flange is sleeved outside the optical fiber ferrule and comprises a first connecting part and a second connecting part which have different diameters;

the sleeve is sleeved outside the optical fiber inserting core, and an optical isolator is arranged in the sleeve;

one side of the first connecting part abuts against the side wall of the adapting groove, and the second connecting part is embedded into the adapting groove;

the flange is not in contact with the sleeve, and part of the optical fiber ferrule is exposed between the flange and the sleeve;

the processing precision of the optical fiber insertion core is greater than that of the sleeve.

The beneficial effect of this application:

the application discloses optical module includes: the circuit board is provided with an emission through hole and an emission shell arranged in the emission through hole. The emission shell comprises an emission base used for bearing the light emission chip and the lens; and the adaptation bearing plate is arranged on one side of the emission base, and the upper surface of the adaptation bearing plate is sunken downwards to form an adaptation groove. The optical fiber adapter is embedded into the adapting groove and comprises an optical fiber inserting core; and the flange is sleeved outside the optical fiber ferrule and comprises a first connecting part and a second connecting part with different diameters. And the sleeve is sleeved outside the optical fiber inserting core and is internally provided with an optical isolator. One side of the first connecting part abuts against the side wall of the adapting groove, and the second connecting part is embedded into the adapting groove; the flange is not in contact with the sleeve, and the part of the optical fiber ferrule is exposed between the flange and the sleeve, so that the cylindrical surface of the optical fiber ferrule can be identified conveniently, the position of the central axis of the optical fiber ferrule can be determined, and the identification precision can be improved. Meanwhile, a gap exists between the outer wall of the optical fiber ferrule and the mounting groove, so that the situation that redundant glue is adhered to the outer wall of the optical fiber ferrule can be avoided, the identification accuracy of the optical fiber ferrule is improved, and the coupling efficiency of an optical module is improved.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be considered as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic view of a connection structure between a light emitting device and a circuit board provided in the present application;

fig. 6 is a schematic structural view of a light emitting device provided in the present application, detached from a circuit board;

FIG. 7 is a schematic diagram of an exemplary fiber optic adapter and light emitting device according to the present application;

FIG. 8 is an exploded view of an exemplary fiber optic adapter of the present application;

FIG. 9 is a cross-sectional view of a fiber optic adapter according to an example of the present application;

fig. 10 is a schematic cross-sectional view of a light emitting device provided herein;

fig. 11 is a schematic diagram of a split partial structure of a light emitting device provided in the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, theoretically, infinite distance transmission can be realized. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 may be any one or several of the following devices: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is made by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101, and an electrical port, such that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be plugged into the optical network terminal 100 so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the interconversion between the optical signal and the electrical signal, and has no function of processing data, information is not changed in the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the onu 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200, so that the onu 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a configuration diagram of the optical network terminal, and fig. 2 only shows a configuration of the optical module 200 of the optical network terminal 100 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed within the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 is connected to the optical network terminal 100 by a bidirectional electrical signal. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional optical signal connection with the optical fiber 101.

FIG. 3 is a block diagram of a light module according to some embodiments. Fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical transceiver module.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper case 201 includes a cover 2011, and the cover 2011 covers the two lower side plates 2022 of the lower case 202 to form the above case.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates located on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with the two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end portion (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end portion (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. The opening 204 is an electrical port, and a gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101, so that the external optical fiber 101 is connected to an optical transceiver module inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that the circuit board 300, the optical transceiver module and other devices can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form encapsulation protection for the devices. In addition, when the circuit board 300, the optical transceiver module and other devices are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, and the unlocking component is configured to realize a fixed connection between the optical module 200 and the upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a latching member that mates with a host cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member; when the unlocking member is pulled, the engaging member of the unlocking member moves along with the unlocking member, and further the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. Examples of the electronic components include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip includes, for example, a Micro Controller Unit (MCU), a laser driving chip, a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide smooth bearing; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300 (e.g., the upper surface shown in fig. 4), or may be disposed on both upper and lower sides of the circuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer so as to realize power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement the rigid circuit boards. For example, a flexible circuit board may be used to connect the rigid circuit board and the optical transceiver module.

The optical transceiver component includes an optical transmitter 400 configured to transmit an optical signal and an optical receiver configured to receive an optical signal. Illustratively, the light emitting device and the light receiving device are combined together to form an integrated light transceiving component.

For convenience, in the present application, according to the direction shown in fig. 4, the direction from the optical port of the optical module to the electrical port is the length direction, the direction from the upper casing to the lower casing is the height direction, and the other direction perpendicular to the length direction is the width direction.

In order to realize the connection between the light emitting device and the external optical fiber, a fiber adapter 500 is provided at one end of the light emitting device for connecting the light emitting device and the external optical fiber.

Fig. 5 is a schematic view of a connection structure of a light emitting device and a circuit board provided in the present application, and fig. 6 is a schematic view of a structure of a light emitting device and a circuit board provided in the present application in a detached state. As shown in fig. 5 and 6, in some embodiments of the present application, the circuit board 300 is provided with an emission through hole 310, the emission housing 410 is embedded inside the emission through hole 310, and a side of the circuit board adjacent to the emission through hole is provided with a driving pin connected with the light emission chip 430 and the semiconductor cooler by wire bonding. The optical fiber adapter 500 is disposed at one end of the emission housing 410, and the signal light emitted from the light emission chip 430 is coupled into the optical fiber adapter 500 through the lens 420 and transmitted to the outside through the optical fiber adapter 500.

FIG. 7 is a schematic diagram of a fiber optic adapter and light emitting device according to an example of the present application, and FIG. 8 is an exploded view of a fiber optic adapter according to an example of the present application; FIG. 9 is a cross-sectional schematic view of an exemplary fiber optic adapter of the present application. As shown in fig. 7, 8 and 9, the light emitting device includes: an emission case 410, and a light emission chip 430, a semiconductor cooler, and a lens 420 disposed inside the emission case.

The emission case 410 is provided with an emission base 413, and a first emission side plate 414 and a second emission side plate 412 which are disposed at both sides of the emission base 413, and an adaptation carrier plate 411 is further disposed between the first emission side plate 414 and the second emission side plate 412. The light emitting chip, the semiconductor cooler, and the lens are disposed on the emission base 413 and located at the opposite side of the adaptive carrier plate.

The launching base extends to the outside of the first launching side plate 414 and the second launching side plate 412, forming a load-bearing platform 4131. The upper surface of the supporting platform 4131 is connected to the lower surface of the circuit board 300 for supporting the circuit board.

The adapter carrier plate 411 is provided with an adapter groove 4111 for fixing the fiber adapter 500. The adapting groove 4111 is recessed downward compared to the upper surface of the transmitting housing 410, and has an arc-shaped structure.

The fiber optic adapter 500 includes: flange 520, fiber ferrule 510, and optical isolator 540. Wherein, one end of the optical fiber ferrule 510 is provided with a flange 520, and the other end is provided with a sleeve 530. An optical isolator 540 is disposed within the sleeve 530. And the flange 520 is located outside the fiber stub 510 for defining the positioning of the fiber stub 510 in the left-right position. A gap exists between the flange 520 and the sleeve 530, and a part of the optical fiber ferrule 510 is exposed between the flange and the sleeve.

The inner wall of the flange 520 is connected with the fiber stub 510, the flange 520 is sleeved outside the fiber stub 510, the flange 520 is provided with a first connecting portion 521 and a second connecting portion 522 which have different diameters, and the diameter of the first connecting portion 521 is greater than that of the second connecting portion 522. The second connecting portion 522 is embedded into the adapting groove, the first connecting portion 521 is disposed outside the light emitting casing 410, and one end of the first connecting portion 521 abuts against the side wall of the light emitting casing 410, so that the optical fiber adapter 500 is limited in the left-right direction of the light path propagation direction, that is, the end of the first connecting portion 521 abuts against the side wall of the light emitting casing 410, the optical fiber adapter 500 is positioned in the length direction, and the positioning of the optical fiber adapter 500 is facilitated.

The outer wall of the flange 520 is connected with the adapting groove 4111 by connection glue, specifically, the end of the first connecting part 521 abuts against the side wall of the adapted launch housing 410, and the lower outer wall of the second connecting part 522 is connected with the adapting groove 4111 by connection glue.

In this application, the diameter of optic fibre lock pin 510 is less than the diameter of flange, the part of optic fibre lock pin 510 exposes between flange and sleeve, there is the gap between outer wall and the mounting groove of optic fibre lock pin 510, if the local connection glue is more during the installation, unnecessary glue extends along adaptation recess 5111, it is on the exposed position of optic fibre lock pin 510 not, when carrying out the position determination of optic fibre adapter, only need to detect the outer wall of optic fibre lock pin 510 that exposes between flange and sleeve through using detecting instrument, can obtain the three-dimensional position coordinate of the center pin of optic fibre lock pin 510, make things convenient for the unification of optic axis of optic fibre lock pin 510 and light emission chip in the installation.

The optical fiber ferrule is made of ceramic materials and has high machining precision. The sleeve and the flange are made of metal materials, and the processing precision of the sleeve and the flange is smaller than that of the optical fiber insertion core. The outer wall of the optical fiber ferrule 510 exposed between the flange and the sleeve is detected by using a detecting instrument, the position of the central axis of the optical fiber ferrule is identified, the position accuracy is higher than that of the central axis of the optical fiber ferrule determined by identifying the outer wall of the sleeve or the flange, and the coupling efficiency of the optical module is favorably improved. The machining precision of the optical fiber inserting core is larger than that of the sleeve, the machining precision of the optical fiber inserting core is larger than that of the flange, the outer wall of the optical fiber inserting core is used for identification, the accuracy of identifying the position of the optical central axis is improved, and the improvement of the coupling efficiency of the optical module is facilitated.

The outer wall of the sleeve 530 is connected with the fitting groove 5111, and in order to increase the connection firmness, the sleeve is connected with the fitting groove 5111 through liquid glue. To facilitate the installation of the fiber optic adapter, the diameter of the sleeve is the same as the diameter of the first connection portion of the flange. The length of the opening on the upper surface of the adapting groove 5111 is not greater than the distance from the left end of the first connecting part of the flange to the right end of the sleeve, the width of the opening on the upper surface of the adapting groove 5111 is greater than the diameter of the optical fiber ferrule 510, and the optical fiber ferrule 510 is exposed in the opening direction of the adapting groove 5111, so that a detecting instrument can be used for detecting the outer wall of the optical fiber ferrule 510 exposed between the flange and the sleeve conveniently, the three-dimensional position coordinate of the central shaft of the optical fiber ferrule 510 can be obtained, and the optical axes of the optical fiber ferrule 510 and the light emitting chip can be unified conveniently in the installation process.

Fig. 10 is a schematic cross-sectional structure of a light emitting device provided herein, and fig. 11 is a schematic partial structure of a light emitting device provided herein. In order to improve the coupling efficiency of light in the light emitting device, the optical axis of the light emitting chip is kept uniform with the central axis of the fiber stub 510. During the installation process, three-dimensional coordinates can be established, and the optical axis of the light emitting chip and the central axis of the fiber stub 510 can be unified by using the left sides of a plurality of points.

A first cermet substrate 441 is disposed above the emission base 413, and a semiconductor refrigerator 440 is disposed above the first cermet substrate. The first metal ceramic substrate 441 is provided with a refrigeration driving circuit, which is connected with the circuit board in a routing manner and is used for driving the semiconductor refrigerator 440 to regulate the temperature of the light emitting device.

The second ceramic substrate 442 is disposed above the semiconductor cooler 440, the lens 420 and the third metal ceramic substrate 443 are disposed above the second ceramic substrate, the lens 420 is disposed between the third metal ceramic substrate 443 and the fiber stub 510, and the light emitting chip 430 is disposed above the third metal ceramic substrate 443. The light emitting chip 430 emits signal light toward the fiber adapter 500, the signal light is divergent light at this time, convergent light is formed after the divergent light passes through a lens, light spots of the convergent light are located on the end face of the fiber ferrule 510 after the convergent light passes through an optical isolator in the fiber adapter, and the convergent light is transmitted to an external fiber through the fiber adapter.

In this application, in order to ensure the coupling efficiency of light, if the optical axes of the light emitting chip and the optical fiber ferrule 510 are to be ensured to be uniform, it is required to ensure that the height of the optical axis of the light emitting chip is consistent with the height of the central axis of the optical fiber ferrule 510. The diameter of the optical fiber ferrule 510 is smaller than the diameter of the flange, a part of the optical fiber ferrule 510 is exposed between the flange and the sleeve, a gap exists between the outer wall of the optical fiber ferrule 510 and the installation groove, and the position of the central axis of the optical fiber ferrule 510 can be determined by directly measuring the outer wall of the optical fiber ferrule 510 at the opening of the installation groove during installation. The deviation caused by the concentricity deviation of the flange 520 and the optical fiber ferrule 510 when the central axis of the optical fiber ferrule 510 is measured by using the outer diameter of the flange is avoided.

The metal ceramic substrate has higher flatness, and after the height of the central axis of the optical fiber ferrule 510 from the upper surface of the light emission base 413 is determined, the thickness of the third metal ceramic substrate can be screened, so that the light-emitting optical axis of the light emission chip and the central axis of the optical fiber ferrule 510 are on the same straight line. Thus, the positioning of the optical fiber ferrule 510 and the optical transmitting chip in the width and thickness directions of the optical module is determined.

In order to ensure the coupling efficiency of light, it is also required to ensure that the signal light emitted from the light emitting chip falls to the end face of the optical fiber ferrule 510 via the light spot converged by the lens. In order to ensure that the signal light emitted from the light emitting chip falls to the end surface of the optical fiber ferrule 510 through the light spot converged by the lens, the distance between the end surface of the optical fiber ferrule 510 and the light emitting chip needs to be ensured. For convenient installation, the optical fiber ferrule 510 and the light emitting chip are respectively positioned in the length direction of the optical module.

The fiber optic adapter comprises: flange 520, fiber ferrule 510, and an optical isolator. Wherein, flange 520 is arranged at one end of the optical fiber ferrule 510, and a sleeve is arranged at the other end. The optical isolator is arranged in the sleeve. The flange 520 is provided with a first connection portion and a second connection portion having different diameters, and the diameter of the first connection portion is greater than that of the second connection portion. The second connecting portion are embedded into the fitting groove 5111, the first connecting portion is disposed outside the light emitting housing, and one end of the first connecting portion abuts against the side wall of the fitting light emitting housing, i.e., the side wall of the first connecting portion abuts against the side wall of the fitting groove 5111, so that the optical fiber ferrule 510 is positioned in the length direction of the optical module. The light emitting chip is disposed on the upper surface of the third metal ceramic substrate, and is located above the light emitting base 413, and the positioning of the light emitting chip in the length direction of the optical module can be determined by taking a certain vertex of the light emitting base 413 as a reference.

In the present application, the flange 520 is provided with a first connection portion and a second connection portion of different diameters, the diameter of the first connection portion being greater than the diameter of the second connection portion. The inside of second connecting portion embedding adaptation recess 5111, and first connecting portion set up in the outside of transmitting the casing, and the one end of first connecting portion supports and leans on the lateral wall that is in suitable transmitting the casing, can be used to spacingly, guarantees the location of optic fibre lock pin 510 terminal surface at the length direction of optical module. The diameter of the optical fiber ferrule 510 is smaller than that of the flange 520, part of the optical fiber ferrule 510 is exposed between the flange 520 and the sleeve, a gap exists between the outer wall of the optical fiber ferrule 510 and the mounting groove, and the distance of the upper surface opening of the adapting groove 5111 in the width direction of the optical module is greater than the diameter of the optical fiber ferrule 510. When the position of the optical fiber adapter is determined, the outer wall of the optical fiber ferrule 510 exposed between the flange 520 and the sleeve is detected only by using a detecting instrument, and the identification of the optical fiber ferrule 510 in the width and height directions of the optical module can be realized by identifying the outer wall cylindrical surface of the optical fiber ferrule 510. Then, the thickness of the third metal ceramic substrate used for bearing the light emitting chip is selected, so that the optical axes of the optical fiber ferrule 510 and the light emitting chip are unified, and the positioning of the optical fiber ferrule 510 and the light emitting chip in the width direction and the height direction of the optical module is ensured.

In some embodiments of the present application, the fitting groove 5111 has a circular arc structure, which matches with the flange 520 and the outer wall of the sleeve. For convenience of installation, the diameter of the second connecting portion of the flange 520 is the same as that of the sleeve, and during installation, the end of the optical fiber adapter, to which the optical fiber is not connected, can be inserted from one side of the fitting groove 5111 until the side wall of the first connecting portion of the flange 520 abuts against the end of the fitting groove 5111. To achieve the installation positioning of the fiber optic adapter, the width of the opening of the fitting groove 5111 at the upper surface is smaller than the diameter of the second connecting portion of the flange 520, and the width of the opening of the fitting groove 5111 at the upper surface is larger than the diameter of the fiber stub 510. Part of the optical fiber ferrule 510 is exposed between the flange 520 and the sleeve, a gap exists between the outer wall of the optical fiber ferrule 510 and the mounting groove, if more local connection glue exists during mounting, redundant glue extends along the adapting groove 5111 and is not adhered to the exposed part of the optical fiber ferrule 510, when the position of the optical fiber adapter is determined, the outer wall of the optical fiber ferrule 510 exposed between the flange 520 and the sleeve is detected only by using a detecting instrument, the three-dimensional position coordinate of the central shaft of the optical fiber ferrule 510 can be obtained, and the unification of the optical axes of the optical fiber ferrule 510 and the optical transmission chip in the mounting process is facilitated.

For convenient installation and timely observation of the installation position of the optical fiber adapter, an installation avoiding part is arranged on one side of the adaptation groove 5111 close to the light emitting chip, and the installation avoiding part is positioned at the bottom of the adaptation groove 5111, so that part of the optical fiber adapter is exposed in the emission shell. The terminal surface of optic fibre adapter is parallel with a side end face that adaptation recess 5111 closes on the light emission chip, makes things convenient for the installation of optic fibre adapter fixed, and avoids optic fibre adapter protrusion and adaptation recess 5111, is favorable to avoiding the optic fibre adapter to receive external force in installation, transportation and touches and lead to the damage.

In some embodiments of the present application, the fiber stub 510 is disposed coaxially with the flange 520; the optical fiber ferrule 510 and the sleeve are coaxially arranged, so that the optical fiber ferrule 510 is convenient to limit in the installation process. Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises a" \8230; "8230;" defines an element and does not exclude the presence of additional like elements in circuit structures, articles, or devices comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising: a circuit board provided with an emission through hole;

the transmission casing, set up in the transmission through-hole includes:

the emission base is used for bearing the light emission chip and the lens;

a fiber optic adapter embedded within the adapter recess, comprising:

an optical fiber ferrule;

2. The optical module according to claim 1, wherein the first connecting portion and the second connecting portion are cylindrical structures, and a diameter of the first connecting portion is larger than a diameter of the second connecting portion.

3. The optical module of claim 1, wherein the diameter of the fiber stub is smaller than the diameter of the second connection portion, and the diameter of the fiber stub is smaller than the diameter of the sleeve.

4. The optical module of claim 1, wherein the fiber stub is disposed coaxially with the flange;

the optical fiber insertion core and the sleeve are coaxially arranged.

5. The optical module of claim 1, wherein the width of the opening of the fitting groove on the upper surface is larger than the diameter of the fiber stub.

6. The optical module according to claim 1, wherein the width of the opening of the fitting groove on the upper surface is smaller than the diameter of the second connecting portion, and the width of the opening of the fitting groove on the upper surface is smaller than the diameter of the sleeve.

7. The light module of claim 1, wherein the launch housing further comprises: the first emission side plate is arranged on the adjacent side of the adaptive bearing plate;

a second emission side plate disposed at an opposite side of the first emission side plate;

and a semiconductor refrigerator, a lens and a light emitting chip are arranged in the emission shell, and the lens is arranged between the optical fiber adapter and the light emitting chip.

8. The optical module according to claim 7, wherein the circuit board is provided with a driving circuit electrically connected with the light emitting chip and the semiconductor cooler; the drive circuit is arranged on the opposite side of the optical fiber adapter.

9. The optical module of claim 7, wherein a first metal ceramic substrate is disposed above the transmitting base, the semiconductor refrigerator is disposed above the first metal ceramic substrate, the first metal ceramic substrate is electrically connected to the circuit board, and the first metal ceramic substrate is electrically connected to the semiconductor refrigerator;

the semiconductor refrigerator is characterized in that a second ceramic substrate is arranged above the semiconductor refrigerator, a lens and a third metal ceramic substrate are arranged above the second ceramic substrate, and the light emitting chip is arranged above the third metal ceramic substrate.

10. The optical module of claim 1, further comprising: an upper shell is arranged on the upper side of the shell,

the lower shell is covered with the upper shell to form a wrapping cavity, and the circuit board is arranged inside the wrapping cavity.