CN218634600U - Mobile phone heat dissipation back splint - Google Patents

Mobile phone heat dissipation back splint Download PDF

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Publication number
CN218634600U
CN218634600U CN202222001107.0U CN202222001107U CN218634600U CN 218634600 U CN218634600 U CN 218634600U CN 202222001107 U CN202222001107 U CN 202222001107U CN 218634600 U CN218634600 U CN 218634600U
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China
Prior art keywords
heat
heat dissipation
hole
circuit board
mobile phone
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Active
Application number
CN202222001107.0U
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Chinese (zh)
Inventor
刘君
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Dongguan Ouwei Intelligent Hardware Technology Co ltd
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Dongguan Ouwei Intelligent Hardware Technology Co ltd
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Priority to CN202222001107.0U priority Critical patent/CN218634600U/en
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Abstract

The utility model relates to a cell-phone accessory technical field, concretely relates to cell-phone heat dissipation back splint, it includes dorsal scale, bottom plate and radiating part, the dorsal scale includes the casing and installs two jack catchs on the casing, the floor mounting is in the casing, radiating part installs the casing and between the bottom plate, first heat dissipation through-hole has been seted up on the casing, first heat dissipation through-hole with radiating part intercommunication, second heat dissipation through-hole has been seted up to the side of casing, second heat dissipation through-hole with radiating part intercommunication. When the radiating back clamp is used, the radiating back clamp is arranged on the back of the mobile phone through the clamping jaws, the radiating back clamp is electrified, and the radiating part radiates the back of the mobile phone, so that the temperature of the mobile phone is effectively reduced, the cooling effect is achieved, and the problem of insufficient radiating of the mobile phone in the related technology is solved.

Description

Mobile phone heat dissipation back splint
Technical Field
The utility model relates to a cell-phone accessory technical field, concretely relates to cell-phone heat dissipation back splint.
Background
The smart phone has very wide application in life, has an excellent operating system, and can be freely provided with various software to realize different functions, such as video and audio playing, game entertainment, online live broadcasting and the like.
When a program is operated, especially when the program is operated under a high-load state for a long time, the heat productivity of the smart phone is increased, so that the temperature of the smart phone is continuously increased, the use of a user is influenced, and even parts in the smart phone are damaged when the temperature is serious. At present, a mobile phone heat dissipation back clamp can be used in a matched manner to perform auxiliary heat dissipation on a mobile phone, namely, a heat dissipation fan is arranged on the mobile phone heat dissipation back clamp, and the heat dissipation fan can accelerate air flow at the back of the mobile phone to drive heat. However, the conventional mobile phone heat dissipation back clip is usually provided with only one through hole opposite to the heat dissipation fan, and the flowing air can only flow out of the through hole, or only equipped with an axial flow type heat dissipation fan, so that the heat dissipation effect is not good.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in improving the not good problem of cell-phone back splint radiating effect among the correlation technique to a cell-phone heat dissipation back splint is provided.
The utility model provides a cell-phone heat dissipation back splint, includes dorsal scale, bottom plate and radiating part, the dorsal scale includes the casing and installs two jack catchs on the casing, the bottom plate is installed the casing, radiating part installs the casing and between the bottom plate, first heat dissipation through-hole has been seted up on the casing, first heat dissipation through-hole with radiating part intercommunication, second heat dissipation through-hole has been seted up to the side of casing, second heat dissipation through-hole with radiating part intercommunication.
Furthermore, the heat dissipation part comprises a base arranged between the shell and the bottom plate, a heat dissipation fan and a plurality of heat conduction parts are arranged on one side, close to the first heat dissipation through hole, of the base, a control circuit board is arranged on one side, far away from the first heat dissipation through hole, of the base, and the heat dissipation fan is electrically connected with the control circuit board.
Furthermore, the plurality of heat conduction pieces are divided into a plurality of first heat conduction blocks and a plurality of second heat conduction blocks, the plurality of first heat conduction blocks are located on two sides of the base in the width direction, the plurality of second heat conduction blocks are located on two sides of the base in the length direction, and the first heat conduction blocks are longer than the second heat conduction blocks.
Further, be provided with the instruction subassembly in the first heat dissipation through-hole of casing, the instruction subassembly is including fixed the setting a plurality of bracing pieces on the casing and fixed the setting are in supporting disk on the bracing piece, install indicating circuit board on the supporting disk, be provided with the pilot lamp on the indicating circuit board, the pilot lamp is located indicating circuit board keeps away from one side of supporting disk, the last welding of indicating circuit board have with the wire that control circuit board switched on.
Furthermore, a plurality of positioning columns are fixedly arranged on the supporting plate, and positioning holes matched with the positioning columns are formed in the indicating circuit board.
Furthermore, one of the supporting rods is provided with a wire slot, the shell is also provided with a wire slot, and the wire sequentially penetrates through the wire slot of the shell and the wire slot of the supporting rod and then is connected with the indicating circuit board.
Furthermore, two all fixed elastic convex blocks that are used for increasing frictional force that are provided with on the jack catch, two elastic convex blocks set up relatively, two elastic convex blocks have the radian.
The utility model discloses technical scheme has following advantage:
1. according to the mobile phone heat dissipation back clamp, the back shell, the bottom plate and the heat dissipation part are arranged, the clamping jaws, the first heat dissipation through holes and the second heat dissipation through holes are formed in the back shell, when the mobile phone heat dissipation back clamp is used, the heat dissipation back clamp is installed on the back of a mobile phone through the clamping jaws, the heat dissipation back clamp is electrified, and the heat dissipation part dissipates heat of the back of the mobile phone, so that the temperature of the mobile phone is effectively reduced, the cooling effect is achieved, and the problem of insufficient heat dissipation of the mobile phone in the related technology is solved;
2. according to the mobile phone heat dissipation back clamp, the heat dissipation part is provided with the plurality of heat conduction parts on the base, so that when the heat dissipation fan rotates to bring out hot air, the heat conduction parts can enlarge the heat dissipation area, and the heat dissipation effect is better;
3. the utility model provides a cell-phone heat dissipation back splint still is provided with elastic convex block in jack catch department, can increase the frictional force between back splint and the cell-phone through elastic convex block for the heat dissipation back splint can be installed at the cell-phone back steadily and dispel the heat, increases the job stabilization nature of heat dissipation back splint.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a heat dissipation back clip of a mobile phone according to the present application;
fig. 2 is a schematic structural view of a heat dissipation component in a heat dissipation back clip of a mobile phone according to the present application;
fig. 3 is a schematic structural view of a housing in a heat dissipation back clip of a mobile phone according to the present application;
fig. 4 is a schematic structural view of a back shell in a heat dissipation back clip of the present application;
fig. 5 is a partially enlarged view of a portion a of fig. 4.
Description of reference numerals:
1. a back shell; 11. a housing; 111. a first heat dissipating through hole; 112. a second heat dissipating through hole; 12. an indicating component; 121. a support bar; 122. a support disc; 1221. a positioning column; 123. an indicating circuit board; 124. a wire; 13. a claw; 131. an elastic bump; 2. a base plate; 3. a heat dissipating member; 31. a base; 32. a heat dissipation fan; 33. a heat conductive member; 331. a first heat-conducting block; 332. A second heat-conducting block; 4. and (4) an outer cover.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 2, a mobile phone heat dissipation back clip comprises a back shell 1, a bottom plate 2 and a heat dissipation part 3, wherein the back shell 1 comprises a shell 11 and two claws 13 arranged on the shell 11, the bottom plate 2 is buckled and arranged on the shell 11 for fixing, and the heat dissipation part 3 is arranged between the shell 11 and the bottom plate 2. In order to increase the heat dissipation effect, the housing 11 is provided with a first heat dissipation through hole 111, and meanwhile, the side surface of the housing 11 is provided with a second heat dissipation through hole 112. The heat sink 3 includes a base 31 attached between the housing 11 and the base plate 2, and the base 31 may be attached to the base plate 2 or the base 31 may be attached to the back case 1. A heat dissipating fan 32 and a plurality of heat conducting members 33 are installed on one side of the base 31 close to the first heat dissipating through hole 111, a control circuit board is installed on one side of the base 31 far away from the first heat dissipating through hole 111, the heat dissipating fan 32 is electrically connected with the control circuit board, and an interface used for being communicated with an external power supply is arranged on the control circuit board.
Referring to fig. 2 and 3, more specifically, the first heat dissipating through hole 111 is located above the heat dissipating fan 32, that is, the first heat dissipating through hole 111 is opposite to the heat dissipating fan 32, when the heat dissipating fan 32 operates, the heat dissipating fan 32 accelerates the air flow at the back of the mobile phone, and the flowing air flows out from the first heat dissipating through hole 111 to take heat out. The second heat dissipating through holes 112 are located at the side of the housing 11, in this embodiment, six second heat dissipating through holes 112 are located at two sides of the housing 11 in the width direction, and two second heat dissipating through holes 112 are located at two sides of the housing 11 in the length direction. By forming the second heat dissipating through hole 112 on the basis of forming the first heat dissipating through hole 111 in the housing 11, when the heat dissipating fan 32 is in operation, the flowing air can flow not only from the first heat dissipating through hole 111 but also from the second heat dissipating through hole 112, thereby increasing the heat dissipating effect of the heat dissipating back clip.
The purpose of setting up a plurality of heat-conducting pieces 33 on base 31 is in order to further increase the radiating effect, in addition, this application still divides a plurality of heat-conducting pieces 33 into a plurality of first heat conduction pieces 331 and a plurality of second heat conduction pieces 332, a plurality of first heat conduction pieces 331 are located base 31 width direction's both sides, a plurality of second heat conduction pieces 332 are located base 31 length direction's both sides, and first heat conduction pieces 331 are longer than second heat conduction pieces 332, the fast length direction of first heat conduction and the air flow direction looks adaptation. By providing the heat conducting member 33 in this way, when the heat dissipating fan 32 operates, the heat conducting member 33 can better conduct air to dissipate heat, and the heat conducting member 33 may be specifically copper or aluminum as long as heat conduction can be performed.
Two jack catchs 13 are used for installing the back splint that dispels the heat on the cell-phone, all fixedly on two jack catchs 13 being provided with the elastic convex block 131 that is used for increasing frictional force, and two elastic convex block 131 set up relatively, and two elastic convex block 131 have the radian with the adaptation cell-phone, can effectively increase the frictional force of heat dissipation back splint and cell-phone through setting up elastic convex block 131 for the back splint is installed on the cell-phone steadily, increases the job stabilization nature of heat dissipation back splint promptly.
Referring to fig. 4 and 5, an indication member 12 is further provided in the first heat dissipation through-hole 111 of the case 11. Specifically, the indication assembly 12 includes a plurality of support rods 121 fixedly disposed on the housing 11 and a support plate 122 fixedly disposed on the support rods 121, the support rods 121 and the support plate 122 may be integrally formed, an indication circuit board 123 is mounted on the support plate 122, an indication lamp is disposed on the indication circuit board 123, the indication lamp is located on one side of the indication circuit board 123 far away from the support plate 122, and a wire 124 connected to the control circuit board is welded on the indication circuit board 123. When the heat dissipation fan 32 is operated, the indicator light on the indicator circuit board 123 is turned on, so that the user can observe and know the working state of the heat dissipation back clip conveniently. Meanwhile, in order to facilitate installation of the indication circuit board 123, a plurality of positioning columns 1221 are fixedly arranged on the supporting plate 122, positioning holes used for being matched with the positioning columns 1221 are formed in the indication circuit board 123, and the indication circuit board 123 can be conveniently positioned and installed by arranging the positioning columns 1221 and the positioning holes. One of the supporting rods 121 is provided with a wire slot, the housing 11 is also provided with a wire slot, and the wire 124 sequentially passes through the wire slot of the housing 11 and the wire slot of the supporting rod 121 and then is connected with the indicating circuit board 123. The outer cover 4 is installed on one side of the back shell 1 far away from the bottom plate 2, the outer cover 4 comprises a cover body installed on the back shell 1 and a dome installed on the support plate 122, the dome is used for protecting the indicating assembly 12 on the support plate 122,
the working principle of the mobile phone heat dissipation back splint is that, the mobile phone heat dissipation back splint is installed on the back of the mobile phone, heat on the back of the mobile phone can be conducted to the heat dissipation back splint, the mobile phone heat dissipation back splint is powered on, the heat dissipation fan 32 is operated at the moment, the air flow in the back splint is accelerated, the heat conduction piece 33 accelerates the heat dissipation speed, and therefore the temperature of the mobile phone is effectively reduced to achieve the heat dissipation effect.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (7)

1. The utility model provides a cell-phone heat dissipation back splint, its characterized in that, includes dorsal scale (1), bottom plate (2) and heat dissipation part (3), dorsal scale (1) includes casing (11) and installs two jack catchs (13) on casing (11), bottom plate (2) are installed casing (11), heat dissipation part (3) are installed casing (11) and between bottom plate (2), first heat dissipation through-hole (111) have been seted up on casing (11), first heat dissipation through-hole (111) with heat dissipation part (3) intercommunication, second heat dissipation through-hole (112) have been seted up to the side of casing (11), second heat dissipation through-hole (112) with heat dissipation part (3) intercommunication.
2. The heat-dissipating back clip of a mobile phone as claimed in claim 1, wherein the heat-dissipating member (3) comprises a base (31) installed between the housing (11) and the bottom plate (2), a heat-dissipating fan (32) and a plurality of heat-conducting members (33) are installed on a side of the base (31) close to the first heat-dissipating through hole (111), a control circuit board is installed on a side of the base (31) far from the first heat-dissipating through hole (111), and the heat-dissipating fan (32) is electrically connected to the control circuit board.
3. The heat-dissipating back clip of claim 2, wherein the plurality of heat-conducting members (33) are divided into a plurality of first heat-conducting blocks (331) and a plurality of second heat-conducting blocks (332), the plurality of first heat-conducting blocks (331) are located on both sides of the width direction of the base (31), the plurality of second heat-conducting blocks (332) are located on both sides of the length direction of the base (31), and the first heat-conducting blocks (331) are longer than the second heat-conducting blocks (332).
4. The heat dissipation back clamp for the mobile phone according to claim 3, wherein an indication component (12) is disposed in the first heat dissipation through hole (111) of the housing (11), the indication component (12) includes a plurality of support rods (121) fixedly disposed on the housing (11) and a support plate (122) fixedly disposed on the support rods (121), an indication circuit board (123) is mounted on the support plate (122), an indication lamp is disposed on the indication circuit board (123), the indication lamp is disposed on one side of the indication circuit board (123) far away from the support plate (122), and a wire (124) conducted with the control circuit board is welded on the indication circuit board (123).
5. The heat-dissipation back clamp for the mobile phone according to claim 4, wherein a plurality of positioning columns (1221) are fixedly arranged on the supporting plate (122), and positioning holes for matching with the positioning columns (1221) are formed in the indicating circuit board (123).
6. The heat-dissipating back clip for the mobile phone according to claim 4, wherein one of the support rods (121) is provided with a slot, the housing (11) is also provided with a slot, and the wire (124) sequentially passes through the slot of the housing (11) and the slot of the support rod (121) and then is connected to the indicating circuit board (123).
7. The heat-dissipating back clip for the mobile phone as claimed in claim 1, wherein the two claws (13) are each fixedly provided with an elastic protrusion (131) for increasing friction force, the two elastic protrusions (131) are oppositely arranged, and the two elastic protrusions (131) have a curvature.
CN202222001107.0U 2022-08-01 2022-08-01 Mobile phone heat dissipation back splint Active CN218634600U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222001107.0U CN218634600U (en) 2022-08-01 2022-08-01 Mobile phone heat dissipation back splint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222001107.0U CN218634600U (en) 2022-08-01 2022-08-01 Mobile phone heat dissipation back splint

Publications (1)

Publication Number Publication Date
CN218634600U true CN218634600U (en) 2023-03-14

Family

ID=85458247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222001107.0U Active CN218634600U (en) 2022-08-01 2022-08-01 Mobile phone heat dissipation back splint

Country Status (1)

Country Link
CN (1) CN218634600U (en)

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