CN218633940U - Bluetooth passes structure thoroughly - Google Patents
Bluetooth passes structure thoroughly Download PDFInfo
- Publication number
- CN218633940U CN218633940U CN202223301508.4U CN202223301508U CN218633940U CN 218633940 U CN218633940 U CN 218633940U CN 202223301508 U CN202223301508 U CN 202223301508U CN 218633940 U CN218633940 U CN 218633940U
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- CN
- China
- Prior art keywords
- circuit board
- heat absorption
- absorption shell
- bluetooth
- chuck
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010521 absorption reaction Methods 0.000 claims abstract description 53
- 238000005057 refrigeration Methods 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000004891 communication Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a bluetooth passes structure thoroughly, relate to bluetooth communication technology field, which comprises a circuit board, the top surface of circuit board is equipped with passes chip module thoroughly, the surface of circuit board is equipped with the heat absorption shell, install the refrigeration piece in the mounting groove on heat absorption shell two sides, the louvre has been seted up to the two sides array of heat absorption shell, the one end of heat absorption shell is equipped with the gas permeable plate, the array has the through-hole on the gas permeable plate, the inside of heat absorption shell is equipped with chuck and spring respectively, the heat that the heat absorption shell can distribute the circuit board at the circuit board during operation, thereby it is quick to pass the module to cool down to the bluetooth thoroughly through the refrigeration piece to cool down the shell, some heat that the circuit board produced also can discharge through louvre and gas permeable plate, accelerate the cooling to the bluetooth pass the module thoroughly once more through the cooperation of louvre and refrigeration piece.
Description
Technical Field
The utility model relates to a bluetooth communication technology field especially relates to a bluetooth passes structure thoroughly.
Background
Bluetooth is a radio technology supporting short-distance communication (generally within 10 m) of devices, and can perform wireless information exchange among a plurality of devices including mobile phones, PDAs, wireless headsets, notebook computers, related peripherals, etc., and by using the bluetooth technology, the communication between mobile communication terminal devices can be effectively simplified, and the communication between the devices and the Internet can be successfully simplified, so that data transmission becomes more rapid and efficient, and the way is widened for wireless communication, transparent transmission means that the transmission is only responsible for transmitting the transmitted content from a source address to a destination address without any change to the content of service data regardless of the transmitted service content in the communication.
The above description introduces bluetooth transparent transmission, and the existing bluetooth transparent transmission structure has the following problems when in use:
1. the circuit board can give off a large amount of heats when using for current bluetooth pass structure thoroughly, can cause different influences to the bluetooth structure along with thermal rising, and the in-process bluetooth structure that uses can't be fast effectual handles the heat that gives off.
2. The inconvenient and shell machine of passing circuit board of current bluetooth installs spacingly, and current circuit board adopts the mode installation of screw usually, and the operation is comparatively troublesome.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a Bluetooth transparent transmission structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a bluetooth passes structure thoroughly, includes the circuit board, the top surface of circuit board is equipped with passes chip module thoroughly, the surface of circuit board is equipped with the heat absorption shell, install the refrigeration piece in the mounting groove on heat absorption shell two sides, the louvre has been seted up to the two side array of heat absorption shell, the one end of heat absorption shell is equipped with the gas permeable plate, and the array has the through-hole on the gas permeable plate, the inside of heat absorption shell is equipped with chuck and spring respectively.
Preferably, the circuit board is embedded in the inner wall of the heat absorption shell, and one end of the circuit board is abutted against the inlet end of the heat absorption shell.
Preferably, the two sides of the circuit board are respectively provided with a connecting hole, the connecting holes are positioned at the corners of the circuit board, and the two ends of the spring are respectively connected with the chuck and the heat absorption shell.
Preferably, the connecting hole and the chuck are circular, the connecting hole is matched with the chuck, and the chuck is clamped on two sides of the circuit board.
Preferably, the top surface of the circuit board is provided with a sleeve, the sleeve is bonded with the top surface of the circuit board, and the sleeve is superposed with the through hole on the top surface of the heat absorption shell.
Preferably, the sleeve is internally provided with the clamping head, and the surface of the clamping head clamping end is buckled with the inner wall of the sleeve.
Advantageous effects
The utility model discloses in, the heat absorption shell can absorb the heat that the circuit board gived off at the circuit board during operation to thereby cool down the heat absorption shell fast through the refrigeration piece and pass the module through to the bluetooth and cool down the processing, some heat that the circuit board produced also can discharge through louvre and air permeable plate, accelerates the cooling of passing through the module through the bluetooth once more through the cooperation of louvre and refrigeration piece.
The utility model discloses in, utilize the resilience force of spring to make the chuck with the circuit board centre gripping, make things convenient for personnel to install circuit board and heat absorption shell, can have the space between circuit board and the heat absorption shell when chuck and circuit board centre gripping simultaneously, can accelerate the thermal diffusion of circuit board, avoid the heat to concentrate on the bluetooth passes through the module to increase sleeve and dop with the circuit board block in the heat absorption shell, be convenient for install, need not to use screwed connection fixed.
Drawings
FIG. 1 is an exploded view of the present invention;
fig. 2 is an isometric view of the present invention;
fig. 3 is a cross-sectional view of the present invention;
fig. 4 is a top view of the present invention.
Illustration of the drawings:
1. a circuit board; 2. a transparent transmission chip module; 3. a heat-absorbing housing; 4. heat dissipation holes; 5. a refrigeration plate; 6. a gas permeable plate; 7. connecting holes; 8. a spring; 9. a chuck; 10. a sleeve; 11. a chuck.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the embodiment, those skilled in the art can obtain other embodiments without making creative efforts, and all of them belong to the protection scope of the present invention.
Specific embodiments of the present invention will be described below with reference to the accompanying drawings.
The specific embodiment is as follows:
the first embodiment is as follows:
as shown in fig. 1-4, a bluetooth transparent transmission structure comprises a circuit board 1, a transparent transmission chip module 2 is disposed on the top surface of the circuit board 1, a heat absorption casing 3 is disposed on the surface of the circuit board 1, the circuit board 1 is embedded in the inner wall of the heat absorption casing 3, one end of the circuit board 1 abuts against the inlet end of the heat absorption casing 3, refrigerating sheets 5 are disposed in the mounting grooves on both sides of the heat absorption casing 3, the transparent transmission chip module 2 is disposed on the circuit board 1, the circuit board 1 is mounted in the heat absorption casing 3, the refrigerating sheets 5 are respectively disposed in the mounting grooves on both sides of the heat absorption casing 3, the refrigerating sheets 5 are semiconductor refrigerating sheets 5, the heat absorption casing 3 is made of heat absorption material, can absorb the heat that circuit board 1 gived off at 1 during operation of circuit board, thereby through 5 refrigeration pieces cool down to heat absorption shell 3 quick pass through the bluetooth and pass the module and cool down the processing, louvre 4 has been seted up to the two sides array of heat absorption shell 3, the one end of heat absorption shell 3 is equipped with ventilative board 6, the array has the through-hole on ventilative board 6, louvre 4 has been seted up to the top surface and the back array of heat absorption shell 3, the one end of heat absorption shell 3 is equipped with ventilative board 6, partly heat that circuit board 1 produced also can be discharged through louvre 4 and ventilative board 6, the cooperation through louvre 4 and refrigeration piece 5 accelerates once more to pass through the cooling of module to the bluetooth.
Example two:
as shown in fig. 1-4, a chuck 9 and a spring 8 are respectively arranged inside the heat absorption housing 3, two sides of the circuit board 1 are respectively provided with a connecting hole 7, the connecting hole 7 is located at a corner of the circuit board 1, two ends of the spring 8 are respectively connected with the chuck 9 and the heat absorption housing 3, the connecting hole 7 and the chuck 9 are both circular, the connecting hole 7 and the chuck 9 are mutually matched, the chuck 9 is clamped on two sides of the circuit board 1, since the chuck 9 in the heat absorption housing 3 is mutually matched with the connecting hole 7 at the corner of two sides of the circuit board 1, both are circular, the circuit board 1 can be plugged into the heat absorption housing 3 when being installed, the chuck 9 can clamp the circuit board 1 by using the resilience of the spring 8, the circuit board 1 and the heat absorption housing 3 can be conveniently installed by a person, a gap can exist between the circuit board 1 and the heat absorption housing 3 when the chuck 9 is clamped with the circuit board 1, the heat diffusion of the circuit board 1 can be accelerated, and the heat is prevented from being concentrated on the bluetooth transparent transmission module.
The top surface of circuit board 1 is equipped with sleeve 10, sleeve 10 and the top surface bonding of circuit board 1, the through-hole position coincidence of sleeve 10 and the 3 top surfaces of heat absorption shell, sleeve 10 internally mounted has dop 11, the surface of the 11 block ends of dop and the mutual lock of sleeve 10 inner wall, treat that the through-hole of the 3 top surfaces of heat absorption shell aligns with sleeve 10 position on the circuit board 1 after circuit board 1 and the 3 installation of heat absorption shell, because dop 11 is plastics dop 11, consequently, can fill in dop 11 in sleeve 10, thereby make the protruding ring on dop 11 surface and the 10 inner wall block of sleeve consolidate circuit board 1, prevent the activity of circuit board 1, sleeve 10 can be located the top surface and the bottom surface of circuit board 1 respectively.
In summary, the following steps:
1. the heat generated by the circuit board 1 can be absorbed by the heat absorption shell 3 and cooled by the refrigerating sheet 5;
2. the heat dissipation holes 4 and the ventilation plate 6 are added to be matched with the heat absorption shell 3 for use, so that the cooling of the circuit board 1 is accelerated;
3. carry out spacing installation with circuit board 1 that the mode through the centre gripping can be quick to through the mode of buckle with circuit board 1 fixed prevention circuit board 1 removal.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a bluetooth passes structure thoroughly, includes circuit board (1), its characterized in that: the top surface of circuit board (1) is equipped with passes chip module (2) thoroughly, the surface of circuit board (1) is equipped with heat absorption shell (3), install refrigeration piece (5) in the mounting groove on heat absorption shell (3) two sides, louvre (4) have been seted up to the two sides array of heat absorption shell (3), the one end of heat absorption shell (3) is equipped with ventilative board (6), and the array has the through-hole on ventilative board (6), the inside of heat absorption shell (3) is equipped with chuck (9) and spring (8) respectively.
2. The bluetooth transparent transmission structure according to claim 1, characterized in that: the circuit board (1) is embedded in the inner wall of the heat absorption shell (3), and one end of the circuit board (1) is abutted to the inlet end of the heat absorption shell (3).
3. The bluetooth transparent transmission structure according to claim 1, characterized in that: connecting holes (7) are respectively formed in two sides of the circuit board (1), the connecting holes (7) are located at corners of the circuit board (1), and two ends of the spring (8) are respectively connected with the chuck (9) and the heat absorption shell (3).
4. The bluetooth transparent transmission structure according to claim 3, characterized in that: the connecting hole (7) and the chuck (9) are both circular, the connecting hole (7) and the chuck (9) are matched with each other, and the chuck (9) is clamped on two sides of the circuit board (1).
5. The bluetooth transparent transmission structure according to claim 1, characterized in that: the top surface of the circuit board (1) is provided with a sleeve (10), the sleeve (10) is bonded with the top surface of the circuit board (1), and the positions of the sleeve (10) and the through hole on the top surface of the heat absorption shell (3) are superposed.
6. The bluetooth transparent transmission structure according to claim 5, wherein: the sleeve (10) is internally provided with a clamping head (11), and the surface of the clamping end of the clamping head (11) is buckled with the inner wall of the sleeve (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223301508.4U CN218633940U (en) | 2022-12-06 | 2022-12-06 | Bluetooth passes structure thoroughly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223301508.4U CN218633940U (en) | 2022-12-06 | 2022-12-06 | Bluetooth passes structure thoroughly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218633940U true CN218633940U (en) | 2023-03-14 |
Family
ID=85453368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223301508.4U Active CN218633940U (en) | 2022-12-06 | 2022-12-06 | Bluetooth passes structure thoroughly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218633940U (en) |
-
2022
- 2022-12-06 CN CN202223301508.4U patent/CN218633940U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231011 Address after: 518000 Zhongxing Hotel (Qianhai HOP International) 3203, No. 19 Xinghua 1st Road (Extension), Haiwang Community, Xin'an Street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Hixixi Technology Co.,Ltd. Address before: 3601, Zhongxing Hotel (Qianhai HOP International), No. 19, Xinghua 1st Road (extension section), Haiwang Community, Xin'an Street, Bao'an District, Shenzhen, Guangdong Province, 518101 Patentee before: Qianxun Everything (Shenzhen) Technology Co.,Ltd. |