CN219499401U - Radiator - Google Patents

Abstract

The utility model discloses a radiator, comprising: a shell, wherein one side of the shell is provided with a ring groove; the heat dissipation component is arranged on the shell and positioned on the other side of the shell, and is used for dissipating heat of the mobile phone; the magnet assembly is arranged in the annular groove; and the back plate is connected with one side of the shell and is used for limiting the magnet assembly in the annular groove. So set up, make radiator unit laminating on the cell-phone through the magnetism inhale the subassembly, avoid magnetism to inhale the subassembly and drop and avoid its and cell-phone direct contact simultaneously through the backplate, laminating cell-phone that can be fine dispel the heat, be difficult for droing.

Description

Radiator

Technical Field

The utility model relates to the technical field of mobile phone heat dissipation equipment, in particular to a radiator.

Background

With the rise of smart phones, the main frequency of the chip is higher and higher, especially the requirement of the game mobile phone on the running speed, so that a large amount of heat can be generated, if the heat cannot be timely radiated, the heat sense of the heat source part is strong, the heating of the mobile phone not only affects the comfort, but also affects the performance and the running speed of the mobile phone, and the hardware can be burnt.

At present, most of radiators for mobile phones adopt a buckle or stretching clamp mode, so that unstable clamping and poor attaching effect are easy to occur, and poor radiating effect is caused.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the radiator provided by the utility model can be well attached to a mobile phone to radiate heat.

A heat sink according to an embodiment of the present utility model includes:

a shell, wherein one side of the shell is provided with a ring groove;

the heat dissipation component is arranged on the shell and positioned on the other side of the shell, and is used for dissipating heat of the mobile phone;

the magnet assembly is arranged in the annular groove;

and the back plate is connected with one side of the shell and is used for limiting the magnet assembly in the annular groove.

The radiator according to the embodiment of the utility model has at least the following beneficial effects: make radiating component laminating on the cell-phone through the magnetism inhale the subassembly, avoid magnetism to inhale the subassembly to drop and avoid its and cell-phone direct contact simultaneously through the backplate, laminating cell-phone that can be fine dispel the heat, be difficult for droing.

According to some embodiments of the utility model, the magnet assembly comprises a ring iron sheet and a plurality of rectangular magnets, wherein the rectangular magnets are fixedly connected to the ring iron sheet, and the ring iron sheet is detachably arranged in the ring groove.

According to some embodiments of the utility model, the plurality of rectangular magnets are arranged on the annular iron sheet in a uniform circumferential array with the circle center of the annular iron sheet.

According to some embodiments of the utility model, the back plate is detachably connected to the housing by screws or snaps.

According to some embodiments of the utility model, the middle part of the shell is provided with a yielding hole, the heat dissipation assembly comprises a semiconductor refrigerating sheet, a heat dissipation structure and a fan, the heat dissipation structure is arranged on the shell, the semiconductor refrigerating sheet is attached to one side of the heat dissipation structure and is positioned at the yielding hole, and the fan is arranged on the shell and is positioned at the other side of the heat dissipation structure.

According to some embodiments of the utility model, a heat-dissipating silica gel is further disposed between the heat-dissipating structure and the semiconductor cooling fin.

According to some embodiments of the utility model, the housing further comprises a cover plate detachably connected to the housing, and the cover plate is provided with a plurality of heat dissipation holes allowing air flow to pass through.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic structural diagram of a radiator according to an embodiment of the utility model;

fig. 2 is an exploded view of a heat sink according to an embodiment of the present utility model.

A housing 100, a ring groove 110, and a relief hole 120;

a heat radiation assembly 200, a semiconductor refrigerating sheet 210, a heat radiation structure 220, a fan 230 and heat radiation silica gel 240;

a magnet assembly 300, a ring iron plate 310, a rectangular block magnet 320;

a back plate 400;

cover plate 500, heat sink 510.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Referring to fig. 1 and 2, a heat sink according to an embodiment of the present utility model includes: a housing 100, one side of the housing 100 being provided with a ring groove 110; the heat dissipation assembly 200 is arranged on the shell 100 and positioned on the other side of the shell 100, and the heat dissipation assembly 200 is used for dissipating heat of the mobile phone; a magnet assembly 300 disposed in the ring groove 110; a back plate 400 is coupled to one side of the housing 100, and the back plate 400 serves to restrain the magnet assembly 300 in the ring groove 110.

The radiator according to the embodiment of the utility model has at least the following beneficial effects: the heat dissipation assembly 200 is attached to the mobile phone through the magnetic attraction assembly, and meanwhile the magnetic attraction assembly is prevented from falling off and being in direct contact with the mobile phone through the back plate 400, so that the mobile phone can be attached to the mobile phone well for heat dissipation, and the mobile phone is not easy to fall off.

According to some embodiments of the present utility model, referring to fig. 1 and 2, the magnet assembly 300 includes a ring iron plate 310 and a plurality of rectangular magnets 320, the plurality of rectangular magnets 320 are fixedly connected to the ring iron plate 310, the ring iron plate 310 is detachably disposed in the ring groove 110, and the combination of the plurality of rectangular magnets 320 and the ring iron plate 310 can effectively avoid the situation that the magnetic force is too large, which results in inconvenient removal of the mobile phone and affects internal components of the mobile phone.

According to some embodiments of the present utility model, referring to fig. 1 and 2, a plurality of rectangular magnets 320 are arranged on a circular iron sheet 310 in a uniform circumferential array with the center of the circular iron sheet 310, so as to ensure uniform magnetic force everywhere and more firm lamination.

According to some embodiments of the present utility model, referring to fig. 1 and 2, the back plate 400 is detachably connected to the housing 100 by a screw or a buckle, and is convenient to disassemble and assemble, and convenient for a user to disassemble and assemble by himself.

According to some embodiments of the present utility model, referring to fig. 1 and 2, a relief hole 120 is provided in the middle of a housing 100, a heat dissipating component 200 includes a semiconductor cooling fin 210, a heat dissipating structure 220 and a fan 230, the heat dissipating structure 220 is disposed on the housing 100, the semiconductor cooling fin 210 is attached to one side of the heat dissipating structure 220 and is located at the relief hole 120, the fan 230 is disposed on the housing 100 and is located at the other side of the heat dissipating structure 220, one side of the semiconductor cooling fin 210 absorbs heat generated by a mobile phone, the other side dissipates heat, and the heat is conducted to the heat dissipating structure 220 and is dissipated through the fan 230.

According to some embodiments of the present utility model, referring to fig. 1 and 2, a heat dissipation silica gel 240 is further disposed between the heat dissipation structure 220 and the semiconductor cooling fin 210, and the heat dissipation effect can be further enhanced by the heat dissipation silica gel 240.

According to some embodiments of the present utility model, referring to fig. 1 and 2, a cover plate 500 is further included, the cover plate 500 is detachably connected to the housing 100, and a plurality of heat dissipation holes 510 allowing air flow to pass through are provided in the cover plate 500.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (7)

1. A heat sink for a mobile phone, comprising:

a shell, wherein one side of the shell is provided with a ring groove;

the heat dissipation component is arranged on the shell and positioned on the other side of the shell, and is used for dissipating heat of the mobile phone;

the magnet assembly is arranged in the annular groove;

and the back plate is connected with one side of the shell and is used for limiting the magnet assembly in the annular groove.

2. The heat sink of claim 1 wherein the magnet assembly comprises a ring iron plate and a plurality of rectangular magnets, the plurality of rectangular magnets being fixedly attached to the ring iron plate, the ring iron plate being removably disposed in the ring groove.

3. The heat sink of claim 2 wherein a plurality of said rectangular magnets are arranged in a uniform circumferential array on said annular sheet about the center of said annular sheet.

4. The heat sink of claim 1, wherein the back plate is detachably connected to the housing by screws or snaps.

5. The heat sink according to any one of claims 1 to 4, wherein a hole for giving way is provided in the middle of the housing, the heat dissipating component comprises a semiconductor cooling fin, a heat dissipating structure and a fan, the heat dissipating structure is provided on the housing, the semiconductor cooling fin is attached to one side of the heat dissipating structure and is located at the hole for giving way, and the fan is provided on the housing and is located at the other side of the heat dissipating structure.

6. The heat sink of claim 5 wherein a heat dissipating silicone is further disposed between the heat dissipating structure and the semiconductor cooling fin.

7. The heat sink of claim 5 further comprising a cover plate removably coupled to the housing, the cover plate having a plurality of heat dissipating holes disposed therein for allowing air flow therethrough.