CN218631985U - Clamping and conveying device for wafer carrier - Google Patents

Abstract

The utility model relates to a clamping and conveying device of a wafer carrier, which comprises a chuck, wherein the chuck comprises a clamping body, at least two clamping jaws and a driving piece, and the driving piece drives the two or more clamping jaws to synchronously open or tighten; the clamping and conveying device further comprises an auxiliary component, wherein the auxiliary component comprises an auxiliary seat, an adjuster and an airflow isolating piece, an isolating cavity is formed between the airflow isolating piece and the auxiliary seat, an auxiliary track is formed on the auxiliary seat, the auxiliary track is located in the isolating cavity, the clamping body is arranged on the auxiliary track in a sliding mode, and the adjuster drives the clamping body to move along the length direction of the auxiliary track. The utility model realizes fast clamping and releasing of the wafer carrier, has simple structure and effectively improves the production efficiency; meanwhile, the wafer carrier enters or breaks away from the isolation cavity by driving the chuck to move in the isolation cavity, so that the problem of shaking caused by the influence of external air flow during the transmission of the wafer carrier is effectively avoided, the clamping stability of the wafer carrier is ensured, and the production safety is improved.

Description

Clamping and conveying device for wafer carrier

Technical Field

The utility model belongs to the transmission equipment field, concretely relates to clamping and conveying device of wafer carrier.

Background

As is well known, wafers refer to silicon wafers used in the fabrication of silicon semiconductor circuits, which are silicon wafers formed from silicon ingots after grinding, polishing, and slicing, wherein the wafers are subjected to surface treatment by holding them on an element commonly referred to as a wafer carrier so that the top surface of each wafer is exposed on the top surface of the wafer carrier, and then placing the wafer carrier into a reaction chamber for a series of surface treatment processes.

The patent that the publication is CN214937946U, it discloses a negative pole hanger mobile device is electroplated to wafer, and it includes linear movement mechanism, clamping jaw, centre gripping fixed plate, card strip, setting element and wafer tool, the cylinder body of clamping jaw is fixed on linear movement mechanism's lift portion, is fixed with two centre gripping fixed plates on two fingers of clamping jaw respectively, and card strip and setting element are fixed on the centre gripping fixed plate, are equipped with the draw-in groove that is used for imbedding the card strip on the wafer tool, are equipped with the perforation that is used for passing the setting element on the wafer tool.

However, in the actual production process, the following defects are easily existed when the wafer carrier is transported between the processes by adopting the prior art scheme:

1. according to the general knowledge of the technicians in the field, a fan system is usually arranged in the production environment where the wafer is located to filter impurities and polluted gases generated in the air during the processing of the wafer, so that air flow exists in the production environment of the wafer, which is doubtless, and according to the technical scheme content of the prior art, in the clamping and conveying process of the prior art, a wafer fixture is always in an exposed state, and the wafer is thin and large in area, so that the wafer fixture is easily affected by the air flow to generate shaking in the conveying process, the clamping and conveying device is difficult to keep stable for clamping a wafer carrier, and the risk of production accidents caused by falling off exists;

2. the existing clamping and conveying device has a complex structure, and the clamping and releasing actions are slow, so that the production efficiency is influenced.

Disclosure of Invention

The utility model aims to solve the technical problem that a modified clamping and conveying device of wafer carrier is provided.

For solving the technical problem, the utility model discloses take following technical scheme:

a clamping and conveying device for a wafer carrier comprises a chuck, wherein the chuck comprises a clamping body, clamping jaws and a driving part, at least two clamping jaws are arranged, and the driving part drives two or more clamping jaws to synchronously open or tighten; the clamping and conveying device further comprises an auxiliary component, wherein the auxiliary component comprises an auxiliary seat, a regulator and an airflow isolating piece, an isolating cavity with an open end and a closed circumferential direction is formed between the airflow isolating piece and the auxiliary seat, an auxiliary track is formed on the auxiliary seat and located in the isolating cavity, the clamping body is arranged on the auxiliary track in a sliding mode, and the regulator drives the clamping body to move along the length direction of the auxiliary track.

Preferably, the airflow isolating piece comprises a first isolating piece and a second isolating piece which are fixedly connected to two opposite sides of the auxiliary track, wherein an isolating cavity is formed among the first isolating piece, the second isolating piece and the auxiliary track. Set up like this, keep apart the cavity in chamber and can laminate the centre gripping body, compact structure, small.

Specifically, keep apart the chamber and extend and open the setting from the bottom along vertical direction, the centre gripping body extends along the horizontal direction, regulator drive centre gripping body is at the intracavity elevating movement of keeping apart. The arrangement is convenient for clamping and releasing the wafer carrier.

Preferably, the auxiliary rail includes a first rail body and a second rail body which are arranged side by side at an interval, wherein the inner sides of the first rail body and the second rail body are respectively outwardly recessed and form sliding grooves extending in the vertical direction, and the clamping bodies are respectively slidably arranged in the corresponding sliding grooves from both end portions. Set up like this, the spout plays the guide effect to the motion of chuck, so, guarantees that the chuck keeps steadily at the lift in-process, avoids producing and rocks.

Preferably, the clamping jaws are two and are arranged at the bottom of the clamping body side by side at intervals along the extension direction of the clamping body, wherein each clamping jaw is bent upwards from the bottom end and forms a hook part, and when clamping is carried out, the wafer carrier is vertically suspended on the two hook parts from the top.

Furthermore, each clamping jaw is pivotally connected to the clamping body, wherein the driving member drives the two clamping jaws to synchronously rotate, and the two hook parts synchronously and relatively close to each other or open away from each other. By the arrangement, the clamping jaws are simple in action, and the wafer carrier is convenient to grab and release.

Preferably, the clamping body comprises a top plate and a bottom plate which are arranged side by side from top to bottom in a spaced mode, and a side plate which is arranged between the top plate and the bottom plate in a surrounding mode, wherein two through holes which are correspondingly matched with the two clamping jaws respectively are formed in the bottom plate, and the two clamping jaws respectively penetrate through the corresponding through holes from the bottom ends upwards and are connected with the side plate in a pivot mode. The driving part of the clamping jaw is arranged in the clamping body, so that the size of the chuck is effectively reduced, and the chuck can conveniently lift and move in the isolation cavity.

Furthermore, the chuck also comprises two fixing modules which are fixedly arranged on the inner side of the side plate and are matched with the two clamping jaws in a one-to-one correspondence manner, wherein an elastic part is arranged between each fixing module and the corresponding clamping jaw, the driving part drives the clamping jaws to rotate, and the corresponding elastic parts are compressed or stretched. Set up like this, when the clamping jaw rotary motion, the elastic component that corresponds can form the buffering, avoids the damage that the violent striking leads to, effective lifting means's life.

In addition, the chuck further comprises two positioning columns arranged between the two clamping jaws at intervals side by side, wherein each positioning column extends in the vertical direction, and positioning grooves matched with the positioning columns are formed in the wafer carrier. The arrangement ensures that the wafer carrier and the clamping jaws are oppositely matched for clamping.

Preferably, the adjuster comprises a boom fixedly connected to the clamping body, and a lifting power member for driving the boom to move up and down.

Due to the implementation of the above technical scheme, compared with the prior art, the utility model have the following advantage:

the utility model realizes fast clamping and releasing of the wafer carrier through synchronous tightening and opening movements between the clamping jaws, has simple structure and effectively improves the production efficiency; meanwhile, the wafer carrier enters or breaks away from the isolation cavity by driving the chuck to move in the isolation cavity, so that the problem of shaking caused by the influence of external air flow during the transmission of the wafer carrier is effectively avoided, the clamping stability of the wafer carrier is ensured, and the production safety is improved.

Drawings

The present invention will be described in further detail with reference to the following drawings and specific embodiments:

fig. 1 is a schematic structural view of a clamping and conveying device for a wafer carrier according to the present invention;

fig. 2 is a schematic structural view of the clamping and conveying device of the wafer carrier according to the present invention (from another view angle, the first spacer is not shown);

FIG. 3 is an enlarged view of the chuck shown in FIG. 2 (one side plate not shown);

in the drawings: 1. a chuck; 10. a clamping body; 100. a top plate; 101. a base plate; k. a through hole; 102. a side plate; 11. a clamping jaw; 110. a hook portion; s, a pivot; 12. a drive member; 13. a positioning column; 14. a fixed module; t, an elastic member;

2. an auxiliary component; 20. an auxiliary seat; 200. an auxiliary track; a1, a first track body; a2, a second track body; c. a chute; q, isolating the cavity; 21. a gas flow separator; 211. a first separator; 212. a second separator; 22. a regulator; 220. a boom.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1 and 2, the gripping device for a wafer carrier of the present embodiment includes a chuck 1 and an auxiliary member 2.

Referring to fig. 3, the chuck 1 includes a clamping body 10, a clamping jaw 11, a driving member 12, and a positioning post 13.

The holding body 10 is a rectangular parallelepiped shape extending in the horizontal direction, and includes a top plate 100 and a bottom plate 101 spaced apart from each other in the vertical direction, and a side plate 102 enclosed between the top plate 100 and the bottom plate 101.

For convenience of implementation, two through holes k are formed in the bottom plate 101 and are arranged side by side at intervals along the length direction of the bottom plate, two clamping jaws 11 are arranged and are matched with the two through holes k in a one-to-one correspondence manner, and each clamping jaw 11 penetrates through the corresponding through hole k from the bottom end to the top and is rotatably connected with the inner side of the side plate 102 through a pivot s.

Specifically, a hook 110 bent upward is formed at the bottom end of each clamping jaw 11, and a groove matched with the hook 110 is formed on the wafer carrier.

Specifically, the driving element 12 employs two air cylinders fixed on the inner side of the side plate 102 and in one-to-one corresponding fit with the two clamping jaws 11, wherein the pushing end of each air cylinder correspondingly pushes the portion of each clamping jaw 11 located above the pivot s, the two air cylinders push the two clamping jaws 11 to synchronously rotate around the pivot s, and the hook portions 110 at the bottom ends of the two clamping jaws 11 are relatively tightened to clamp the wafer carrier or opened to release the wafer carrier. Set up like this, the clamping jaw action is simple, conveniently snatchs and releases the wafer carrier, places the inside of centre gripping body in the driving piece of clamping jaw simultaneously, so, effectively reduces the volume of chuck.

Meanwhile, the chuck 1 further comprises two fixing modules 14 which are fixedly arranged on the inner side of the side plate 102 and are matched with the two clamping jaws 11 in a one-to-one correspondence manner, each fixing module 14 is positioned on one side, far away from the corresponding cylinder, of the corresponding clamping jaw 11, an elastic part t is further arranged between each fixing module 14 and the corresponding clamping jaw 11, the driving part 12 drives each clamping jaw 11 to rotate, and the corresponding elastic part t is compressed or stretched. Set up like this, when the clamping jaw rotary motion, the elastic component that corresponds can form the buffering, avoids the damage that the violent striking leads to, effective lifting means's life.

Specifically, two positioning columns 13 are arranged between two clamping jaws 11 side by side at intervals and are fixedly connected with a bottom plate 101, wherein each positioning column 13 extends downwards vertically from the bottom plate 101 and is gradually narrowed, and positioning grooves matched with the positioning columns 13 are formed on the wafer carrier. The arrangement ensures that the wafer carrier and the clamping jaws are oppositely matched for clamping.

In this example, the auxiliary member 2 includes an auxiliary seat 20, an airflow isolating member 21, and an adjuster 22, wherein an isolating cavity q with an open end and a closed circumference is formed between the airflow isolating member 21 and the auxiliary seat 20, an auxiliary rail 200 is formed on the auxiliary seat 20, the auxiliary rail 200 is located in the isolating cavity q, the clamping body 10 is slidably disposed on the auxiliary rail 200, and the adjuster 22 drives the clamping body 10 to move along the length direction of the auxiliary rail 200.

Specifically, the auxiliary rail 200 includes a first rail body a1 and a second rail body a2 extending vertically downward from two opposite sides of the auxiliary seat 20, wherein inner sides of the first rail body a1 and the second rail body a2 are respectively recessed outward and form sliding grooves c extending in a vertical direction, and the clamping bodies 10 are respectively slidably disposed in the corresponding sliding grooves c from two end portions. Set up like this, the spout plays the guide effect to the motion of chuck, so, guarantees that the chuck keeps steadily at the lift in-process, avoids producing and rocks.

Specifically, the airflow isolating member 21 includes a first isolating plate 211 and a second isolating plate 212 fixedly connected to opposite sides of the auxiliary rail 200, wherein an isolating cavity q is formed between the first isolating plate 211, the second isolating plate 212, and the auxiliary rail 200. Set up like this, keep apart the cavity in chamber and can laminate the centre gripping body, compact structure, small.

That is, the isolation chamber q of the present embodiment extends in a vertical direction and is open from the bottom, and the adjuster 22 drives the grip body 10 to move up and down in the isolation chamber q. The arrangement is convenient for clamping and releasing the wafer carrier.

In addition, the adjuster 22 includes a suspension rod 220 and a lifting power member (not shown, but not shown) wherein the suspension rod 220 extends in a vertical direction and is fixedly connected to a middle portion of the top surface of the clamping body 10 from a bottom end thereof, and the lifting power member drives the suspension rod 220 to move up and down.

In summary, the present embodiment has the following advantages:

1. the wafer carrier is clamped and released quickly by synchronous tightening and opening motions between the clamping jaws, the structure is simple, and the production efficiency is effectively improved;

2. the wafer carrier enters or breaks away from the isolation cavity by driving the chuck to move in the isolation cavity, so that the problem of shaking caused by the influence of external air flow during the transmission of the wafer carrier is effectively avoided, the clamping stability of the wafer carrier is ensured, and the production safety is improved;

3. the clamping jaws are simple in action, and a wafer carrier is convenient to grab and release;

4. the driving piece is arranged in the clamping body, so that the volume of the chuck can be effectively reduced;

5. the spout plays the guide effect to the motion of chuck, guarantees that the chuck keeps steady at the lift in-process, avoids producing and rocks.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (10)

1. The utility model provides a device is sent in clamp of wafer carrier, its includes the chuck, the chuck includes centre gripping body, clamping jaw and driving piece, its characterized in that: the driving part drives two or more clamping jaws to synchronously open or tighten; the clamping and conveying device further comprises an auxiliary component, wherein the auxiliary component comprises an auxiliary seat, an adjuster and an airflow isolating piece, an isolating cavity with an open end and a circumferentially closed end is formed between the airflow isolating piece and the auxiliary seat, an auxiliary track is formed on the auxiliary seat and located in the isolating cavity, the clamping body is arranged on the auxiliary track in a sliding mode, and the adjuster drives the clamping body to move along the length direction of the auxiliary track.

2. The wafer carrier pinch device of claim 1, wherein: the airflow isolating piece comprises a first isolating piece and a second isolating piece which are fixedly connected to the two opposite sides of the auxiliary track, wherein an isolating cavity is formed among the first isolating piece, the second isolating piece and the auxiliary track.

3. The wafer carrier clamping and conveying apparatus as claimed in claim 2, wherein: keep apart the chamber and extend and open the setting from the bottom along vertical direction, the centre gripping body extends along the horizontal direction, the regulator drive the centre gripping body is in keep apart intracavity elevating movement.

4. The wafer carrier pinch device of claim 3, wherein: the auxiliary track comprises a first track body and a second track body which are arranged side by side at intervals, wherein the inner sides of the first track body and the second track body are respectively outwards sunken and form sliding grooves extending along the vertical direction, and the clamping bodies are respectively arranged in the corresponding sliding grooves in a sliding mode from two end portions.

5. The wafer carrier pinch device of claim 3, wherein: the clamping jaws are arranged at the bottom of the clamping body side by side in a spaced mode along the extending direction of the clamping body, each clamping jaw is bent upwards from the bottom end and forms a hook portion, and during clamping, the wafer carrier is vertically suspended on the two hook portions from the top.

6. The wafer carrier clamping and conveying apparatus as claimed in claim 5, wherein: each clamping jaw is connected to the clamping body in a pivot mode, the driving piece drives the two clamping jaws to rotate synchronously, and the two hook portions are close to each other synchronously or are far away from each other synchronously to be opened.

7. The wafer carrier pinch device of claim 6, wherein: the clamping body comprises a top plate, a bottom plate and a side plate, wherein the top plate and the bottom plate are arranged side by side in a spaced mode from top to bottom, the side plate is arranged between the top plate and the bottom plate in a surrounding mode, two through holes which are correspondingly matched with the two clamping jaws respectively are formed in the bottom plate, and the two clamping jaws respectively penetrate through the corresponding through holes from the bottom ends upwards and are connected with the side plate in a pivoted mode.

8. The wafer carrier clamping and conveying apparatus as claimed in claim 7, wherein: the chuck is characterized by further comprising two fixing modules which are fixedly arranged on the inner sides of the side plates and are matched with the clamping jaws in a one-to-one correspondence mode, wherein each fixing module corresponds to one clamping jaw, an elastic piece is arranged between the corresponding clamping jaws, and the driving piece drives the clamping jaws to rotate and compress or stretch the corresponding elastic pieces.

9. The wafer carrier pinch device of claim 5, wherein: the chuck further comprises two positioning columns arranged between the two clamping jaws at intervals side by side, wherein each positioning column extends in the vertical direction, and positioning grooves matched with the positioning columns are formed in the wafer carrier.

10. The wafer carrier pinch device of claim 3, wherein: the adjuster comprises a suspender fixedly connected to the clamping body and a lifting power part for driving the suspender to move up and down.

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