CN218567514U

CN218567514U - Wafer position measuring device

Info

Publication number: CN218567514U
Application number: CN202222056955.1U
Authority: CN
Inventors: 张锋; 张鑫; 张鹏程; 蒋昌朋; 马睿
Original assignee: Weike Saile Microelectronics Co Ltd
Current assignee: Weike Saile Microelectronics Co Ltd
Priority date: 2022-08-05
Filing date: 2022-08-05
Publication date: 2023-03-03
Anticipated expiration: 2032-08-05

Abstract

The utility model relates to a semiconductor device is used for the location field, discloses a wafer position finding device, include: circular slide rail and linear slide rail, linear slide rail both ends are connected with circular slide rail block, and linear slide rail can rotate on the plane at circular slide rail place, and the centre of a circle of circular slide rail is crossed to linear slide rail, is provided with the scale mark on the linear slide rail, is provided with the mark number of degrees on the circular slide rail, and circular slide rail inner wall is provided with the connection face that is used for fixing a position the big limit of wafer or unfilled corner. After the big limit or the unfilled corner position on the face of connecting through setting up the circular slide rail inner wall in wafer top are fixed a position, use the rotation of linear slide rail to measure defect point for the concrete position and the angle of big limit or unfilled corner, can accurately derive the position that wants the region of expression under the condition of contactless wafer, avoid testing process to cause the pollution to the wafer.

Description

Wafer position measuring device

Technical Field

The utility model relates to a semiconductor device is used for the location field, especially relates to a sweep wafer measurement station position device.

Background

With the rapid development of large-scale integrated circuit technology, semiconductor devices have been widely used in aerospace military fields, industries, communications, and civilian products. Therefore, the reliability of the semiconductor device is very important to be researched. Failure analysis is a common reliability analysis mode, and is to obtain a failure mechanism and accurately judge failure reasons through anatomical analysis of a failure sample used on site, a failure sample for a reliability test, a failure sample screened and the like, so that a scientific basis is provided for improving the reliability of a product.

The defect point positioning is an extremely important link in failure analysis, and after the defect point is found and positioned on the wafer, the defect point can be accurately found in the subsequent physical analysis process. The simplest method is to mark the defect spot on the wafer with a marker, but this can cause contamination of the wafer surface. In the prior art, high-precision equipment such as an ultrasonic device, a laser marker and the like is generally adopted to detect and position defect points on the surface of a wafer, for example, a positioning device and a method for detecting hard defect fault points of a semiconductor device are provided with the publication number of CN113466650B, the device comprises a light source module, an optical module, an objective lens, a signal extraction system, a three-dimensional mobile platform, a mobile platform control box and a control computer; the method comprises the steps of collecting an infrared microscopic image of a tested device at the focal point of an objective lens, and recording the focal point coordinate of the objective lens corresponding to the image and the frequency signal intensity of a coordinate point to obtain a frequency intensity distribution diagram; superposing the infrared microscopic image and the frequency intensity distribution map to obtain a signal intensity distribution map; and positioning the position of the hard defect fault point on the tested device by analyzing the signal intensity distribution diagram. However, the cost of the detection equipment is extremely high, the cost of failure analysis is increased, the installation and debugging are very complex, and the efficiency of the failure analysis is reduced.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a wafer position measuring device, which can solve the problem that the wafer is easily contaminated by the existing contact-type wafer position measuring process.

The utility model discloses an above-mentioned technical problem is solved to following technical means: the method comprises the following steps: circular slide rail and linear slide rail, linear slide rail both ends are connected with circular slide rail block, and linear slide rail can rotate on the plane at circular slide rail place, and linear slide rail crosses the centre of a circle of circular slide rail, is provided with the scale mark on the linear slide rail, is provided with the mark number of degrees on the circular slide rail, and circular slide rail inner wall is provided with the connection face that is used for fixing a position the big limit of wafer or unfilled corner. The degree line can be used for expressing the distance between a defect point and a wafer center, the marking degree can assist in expressing the angle of the defect point relative to a defect angle or a large side, the polar axis length and the polar axis angle of the defect point relative to the large side or the defect angle can be accurately obtained by matching with the scale line, after the large side or the defect angle position on the wafer is positioned by the connecting surface arranged on the inner wall of the circular slide rail above the wafer, the specific position and the specific angle of the defect point relative to the large side or the defect angle can be measured by using the rotation of the linear slide rail, the point position of an area to be expressed can be accurately obtained under the condition of not contacting the wafer, and the pollution to the wafer caused by the detection process is avoided.

Furthermore, a second laser and a fourth laser which are used for positioning the large side of the wafer are arranged on the connecting surface, and a third laser which is used for positioning the unfilled corner is also arranged on the connecting surface. Whether the laser point is positioned on the large side or the unfilled corner or not can be accurately judged by using the laser emitter and observing the light, and the laser point is smaller, so that the measured result is more accurate.

Furthermore, first sliding blocks are arranged at two ends of the linear sliding rail, and the first sliding blocks are provided with grooves matched with the circular sliding rail. The linear slide rail is arranged to rotate on the plane where the circular slide rail is located, so that the linear slide rail can move to a connecting line which passes through the defect point and the center of the wafer, and the description of the angle is further assisted.

Furthermore, a second sliding block is sleeved on the linear sliding rail, and a first laser is arranged on the second sliding block. The rotation of the linear slide rail is matched with the sliding of the second slide block, so that the first laser can be transported to a designated position in the circular slide rail, and the point position of a defect point is expressed.

The utility model has the advantages that:

1. after the large side or the unfilled corner position on the wafer is positioned by the connecting surface arranged on the inner wall of the circular slide rail above the wafer, the first laser on the linear slide rail is used for measuring the specific position and angle of the defective point compared with the large side or the unfilled corner, the point position of the region to be expressed can be accurately obtained under the condition of not contacting the wafer, and the wafer is prevented from being polluted in the detection process.

2. Compare large-scale electronic detection equipment, this device simple structure, detection and reading process are swift, only need swivelling joint face to use second laser instrument, third laser instrument and third laser instrument to carry out rotatory linear slide rail and utilize the first laser instrument on the linear slide rail to carry out the defect point location after the reference point location, can draw the point location data of defect point directly perceivedly through the scale mark on the linear slide rail and the mark number of degrees on the circular slide rail.

3. The device uses the laser to position, reduces the error in the point location detection process and improves the accuracy of the measurement result.

Drawings

FIG. 1 is a general assembly diagram of the wafer measuring station device of the present invention;

FIG. 2 is a top view of the circular slide rail of the wafer measuring station device of the present invention;

FIG. 3 is a front view of a linear slide rail of the wafer position measuring device of the present invention;

FIG. 4 is a schematic view of a wafer during measurement of the wafer measuring station apparatus of the present invention.

Wherein, the first and the second end of the pipe are connected with each other,

100: a measurement structure; 200: a support portion; 1: a base; 2: a circular slide rail; 21: a connecting surface; 3: a linear slide rail; 31: a first slider; 32: a groove; 33: scale marks; 34: a second slider; 4: a first laser; 5: a second laser; 6: a third laser; 7: a fourth laser; 8: and (4) a bracket.

Detailed Description

The following description is given for illustrative embodiments of the invention and to enable those skilled in the art to understand the advantages and effects of the invention from the disclosure of the present invention. It should be noted that the drawings provided in the following embodiments are only for illustrative purposes, and are only schematic drawings rather than actual drawings, which should not be construed as limiting the invention, and in order to better illustrate the embodiments of the invention, some components in the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and their descriptions may be omitted.

In the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", "front", "back", etc. indicating the orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for convenience of description and simplification of description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, therefore, the terms describing the position relationship in the drawings are used only for exemplary illustration, and should not be construed as limiting the present invention, and those skilled in the art can understand the specific meaning of the terms according to the specific situation.

The wafer site-finding device shown in fig. 1 includes: a measurement structure 100 and a support 200. The measurement structure 100 is used to locate a defect or designated point on the wafer and output positional information. The support 200 serves to support the measurement structure 100 so that it can be set onto a measurement wafer.

Optionally, the measurement structure 100 comprises a circular slide rail 2 and a linear slide rail 3. Two ends of the linear slide rail 3 are respectively connected to the circular slide rail 2 through the first sliding block 31. The first sliding block 31 is connected with the circular slide rail 2 in a clamping manner, and a groove 32 matched with the circular slide rail 2 is arranged at the joint of the first sliding block 31 and the circular slide rail 2. The linear slide rail 3 can slide on the circular slide rail 2. The linear slide rail 3 passes through the center of the circular slide rail 2, that is, the linear slide rail 3 always rotates around the center of the circular slide rail 2. The middle point of the linear slide rail 3 is always at the center of the circle of the circular slide rail 2. The linear slide rail 3 is provided with a scale mark 22 with a corresponding length, wherein the zero point of the scale mark 33 is located at the midpoint of the linear slide rail 3 and is also located at the center of the circular slide rail 2. The scale values on the scale marks 33 increase sequentially from the zero point to the two ends of the linear slide rail 3 with increasing distance from the zero point. The linear slide rail 3 is sleeved with a second slide block 34 capable of sliding on the linear slide rail 3. The second slider 34 is mounted with the first laser 4.

Optionally, the circular slide rail 2 is provided with a marking degree. The marking degree increases in the counterclockwise direction. The marking degree can be specifically referred to a rectangular coordinate system. The circular slide rail 2 is provided with a connecting surface 21. The connecting surface 21 is parallel to the plane of the circular slide rail 2. The second laser 5, the third laser 6 and the fourth laser 7 are arranged on the connection surface 21. The second laser 5 and the fourth laser 7 are arranged on two sides of the third laser 6. Preferably, the second laser 5, the third laser 6 and the fourth laser 7 are collinear. Preferably, the connecting surface 21 is set to be 0 degree with the midpoint of the connecting line of the inner wall of the circular slide rail 2. The straight line on which the second laser 5, the third laser 6, and the fourth laser 7 are located coincides with the large side on the wafer as viewed in plan. The distance between the second laser 5 and the fourth laser 7 is set in accordance with the length of the large side on the wafer. The shape enclosed by the second laser 5, the third laser 6, the fourth laser 7 and the circular slide rail 2 is matched with the shape of the large edge. It is worth noting that when the wafer has large sides, all of the large sides are the same shape and size. The wafers in this application are all uniform circular wafers.

Alternatively, the laser irradiation directions of the first laser 4, the second laser 5, the third laser 6, and the fourth laser 7 in the present application are all vertically downward.

Optionally, the support portion 200 comprises a bracket 8 and a base 1. One end of the bracket 8 is connected with the base 1, and the other end is connected with the circular slide rail 2. The inner diameters of the base 1 and the circular slide rail 2 are matched with the outer diameter of the wafer.

The utility model discloses a use method as follows: sleeving a base 1 on a wafer with the same size, when the wafer has a large side (as shown in fig. 4, the whole device is rotated to stop the light of a second laser 5 and a fourth laser 7 when the light does not irradiate the wafer right, rotating a linear slide rail 3 and moving a second sliding block 34 to the light of a first laser 4 to hit a defect point, and reading the polar axis angle and the polar axis length of the corresponding defect point relative to the large side through a scale mark 33 on the linear slide rail 1 and the intersection point of the linear slide rail 3 and a circular slide rail 2; when the wafer has a defect angle (as shown in fig. 4, right), the whole device is rotated to make the light of the third laser 6 stop when the light just passes through the defect angle, the linear slide rail 3 is rotated and the second slider 34 is moved until the light of the first laser 4 hits a defect point, and the polar axis angle and the polar axis length of the corresponding defect point relative to the defect angle are read through the scale mark 33 on the linear slide rail 1 and the intersection point of the linear slide rail 3 and the circular slide rail 2;

although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art will understand that the present invention can be modified or replaced with other embodiments without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims. The technology, shape and construction parts which are not described in detail in the present invention are known technology.

Claims

1. A wafer site locating device, comprising:

circular slide rail (2) and linear slide rail (3), linear slide rail (3) both ends with circular slide rail (2) block is connected, linear slide rail (3) can rotate on the plane at circular slide rail (2) place, linear slide rail (3) are crossed the centre of a circle of circular slide rail (2), be provided with scale mark (33) on linear slide rail (3), be provided with the mark number of degrees on circular slide rail (2), circular slide rail (2) inner wall is provided with and is used for fixing a position the big limit of wafer or connecting face (21) of unfilled corner.

2. The wafer position-finding device according to claim 1, characterized in that the connection surface (21) is provided with a second laser (5) and a fourth laser (7) for positioning the wafer large side.

3. The wafer position-finding device according to claim 1, characterized in that a third laser (6) for positioning a chip corner is arranged on the connection surface (21).

4. The wafer position-measuring device of claim 1, wherein two ends of the linear slide rail (3) are provided with first sliding blocks (31), and the first sliding blocks (31) are provided with grooves (32) matched with the circular slide rail (2).

5. The wafer point detecting device according to claim 1, wherein a second slider (34) is sleeved on the linear slide rail (3), and a first laser (4) is arranged on the second slider (34).

6. The wafer position finding device according to claim 1, further comprising a support for supporting the circular slide (2) and the linear slide (3).