CN218552551U - Forehead cooler - Google Patents

Abstract

The utility model discloses a forehead cooler relates to human cooler field, which comprises a housin, the casing divide into epitheca and inferior valve, epitheca and inferior valve intermediate junction have the fin shell, install the semiconductor refrigeration piece between inferior valve and the fin shell, be provided with the opening that makes the semiconductor refrigeration piece expose on the inferior valve. The utility model discloses utilize the refrigeration face of semiconductor refrigeration piece to refrigerate, carry out the temperature exchange to the cold volume that the semiconductor refrigeration piece produced and the heat that the forehead produced for the forehead temperature drops, and the forehead is hugged closely to this kind of mode, and cold volume runs off for a short time, can not receive ambient temperature's influence moreover, still can switch the positive negative pole of semiconductor refrigeration piece, and the cold face and the hot face of messenger are to trading, realize the hot compress function.

Description

Forehead cooler

Technical Field

The utility model relates to a human cooler field specifically is a forehead cooler.

Background

The normal body temperature of a human body is between 36 and 37.2 degrees, and the fever belongs to the fever when the temperature exceeds 37.3 degrees, and the body can be cooled by a physical method in the low fever, so that the physical cooling can take away redundant heat in the body, the body temperature can be favorably promoted to be reduced, and the fever symptom can be relieved.

The traditional method is to use cold water to apply the forehead, the cold water is low in temperature and volatile, a large amount of heat can be absorbed and taken away when the forehead is applied, a clean towel can be soaked in the cold water and is placed at the forehead after being taken out and wrung, and an ice block can be wrapped by the towel to apply the forehead.

A forehead cooler has appeared on the market at present, and it is tied up a fan at the head through the band, and the fan is bloied to the forehead position to this realization is to the cooling of forehead, but only leans on the heat of blowing to take away limited, but bloies moreover and still can receive ambient temperature's influence, if ambient temperature is high, then the cooling effect of blowing can be worse.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a forehead cooler to it is troublesome to solve traditional cooling mode and use, and current forehead cooler passes through the poor technical problem of fan cooling effect.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a forehead cooler, includes the casing, the casing divide into epitheca and inferior valve, epitheca and inferior valve intermediate junction have the fin shell, install semiconductor refrigeration piece between inferior valve and the fin shell, be provided with the opening that makes semiconductor refrigeration piece expose on the inferior valve.

Through adopting above-mentioned technical scheme, utilize the refrigeration face of semiconductor refrigeration piece to refrigerate, carry out the temperature exchange to the cold volume that semiconductor refrigeration piece produced and the heat that the forehead produced for the forehead temperature drops, the forehead is hugged closely to this kind of mode, and cold volume runs off fewly, carries out the temperature exchange with forehead direct contact.

The utility model discloses further set up to, the internally mounted of fin shell has a fan.

By adopting the technical scheme, the heat loss of the hot surface of the semiconductor chilling plate can be accelerated, and the normal operation of the semiconductor chilling plate is ensured.

The utility model discloses further set up to, the top intermediate position department of epitheca is provided with first wind gap, and the both sides at epitheca top are provided with the second wind gap.

By adopting the technical scheme, the heat generated by the hot surface of the semiconductor refrigerating sheet can be dissipated.

The utility model discloses further set up to, the bottom joint of inferior valve has heat conduction silica gel pad.

By adopting the technical scheme, the cold generated by the semiconductor refrigeration piece is transmitted to the forehead with the maximum efficiency.

The utility model discloses further set up to, through the screw connection between epitheca, fin shell and the inferior valve.

Through adopting above-mentioned technical scheme, the maintenance is dismantled to the forehead cooler to the convenience.

The utility model discloses further set up to, the both sides of epitheca all are provided with the hangers, connect a band through the hangers.

Through adopting above-mentioned technical scheme, utilize the band to fix the forehead cooler at the head.

The utility model discloses further set up to, vacancy department between epitheca and the inferior valve installs removable button cell, be provided with the switch of control fan and semiconductor refrigeration piece circuit state on the epitheca.

Through adopting above-mentioned technical scheme, button cell provides the electric energy for the forehead cooler, through on-off control operating condition.

The utility model discloses further set up to, vacancy department installation between epitheca and the inferior valve is fixed with chargeable battery, be provided with the switch of control fan and semiconductor refrigeration piece circuit state on the epitheca, the outside of epitheca is provided with the mouth that charges for battery charging.

Through adopting above-mentioned technical scheme, convenient to use need not to change the battery.

The utility model discloses further set up to, the fin shell is made by the aluminium material, there is the neutral gear between the lamellar body of fin shell.

Through adopting above-mentioned technical scheme, make fin casing and hot-air abundant contact, improve the radiating effect.

To sum up, the utility model discloses mainly have following beneficial effect:

1. the utility model discloses utilize the refrigeration face of semiconductor refrigeration piece to refrigerate, carry out the temperature exchange to the cold volume that the semiconductor refrigeration piece produced and the heat that the forehead produced for the forehead temperature drops, and the forehead is hugged closely to this kind of mode, and cold volume runs off fewly, carries out the temperature exchange with forehead direct contact, can not receive ambient temperature's influence moreover.

2. The utility model discloses still can switch the positive negative pole of semiconductor refrigeration piece, the cold side and the hot side of messenger are traded, realize the hot compress function.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is an assembly structure view of the present invention;

fig. 4 is a top view of the present invention.

In the figure: 1. an upper shell; 2. a lower case; 3. a fin case; 4. a fan; 5. a semiconductor refrigeration sheet; 6. a heat-conducting silica gel pad; 7. hanging a lug; 8. a first tuyere; 9. and a second tuyere.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

Next, an embodiment of the present invention will be described with reference to the overall structure thereof.

Example 1

A forehead cooler is disclosed, as shown in fig. 1-4, comprising an upper shell 1 and a lower shell 2, wherein an aluminum heat-dissipating sheet shell 3 is connected between the upper shell 1 and the lower shell 2, the upper shell 1 and the lower shell are assembled in a screw connection mode, a gap is arranged between sheet bodies of the heat-dissipating sheet shell 3, a semiconductor refrigerating sheet 5 is installed between the lower shell 2 and the heat-dissipating sheet shell 3, an opening matched with the semiconductor refrigerating sheet 5 is formed in the lower shell 2, a limiting groove for fixing the semiconductor refrigerating sheet 5 is formed in the bottom of the heat-dissipating sheet shell 3, the semiconductor refrigerating sheet 5 is provided with a hot surface and a cold surface, during cold compress, the lower portion is the cold surface, the upper portion is the hot surface, a first air port 8 and a second air port 9 are formed in the top of the upper shell 1, heat generated by the hot surface can be dissipated, a heat-conducting silica gel pad 6 is connected to the bottom of the lower shell 2, the heat-conducting silica gel pad 6 is contacted with the forehead, cold energy generated by the semiconductor refrigerating sheet 5 is subjected to temperature exchange with heat generated by the forehead, so that the forehead is lowered, lugs 7 are connected to the forehead cooler through a strap.

On the basis of the structure, removable button cell is installed to vacancy department between the inferior valve 2, be provided with the switch of control fan 4 and the 5 circuit state of semiconductor refrigeration piece on the epitheca 1, button cell can provide the electric energy for the work of fan 4 and semiconductor refrigeration piece 5, through on-off control operating condition, when having no electricity, can change button cell, for making the use more convenient, can be with button cell replacement for the battery that can charge, set up the mouth that charges again in the casing outside, just so need not change the battery, direct charging can.

During the use, connect a band on hangers 7 of 1 both sides of epitheca, wear the forehead desuperheater at the head through the band, make heat conduction silica gel pad 6 hug closely the forehead, semiconductor refrigeration piece 5's refrigeration face and heat conduction silica gel pad 6 contact, turn on switch, semiconductor refrigeration piece 5's inside has a thermocouple that P type and N type semiconductor are linked into, after its both ends are through going up the electricity, inside has the current to flow, thermal transfer will take place in this time, it can give the hot face to be exactly that semiconductor refrigeration piece 5's cold face endotherm is with heat conduction, the cold face can become cold in this time, the hot face becomes hot, and reach a balanced state, carry out the temperature exchange with the heat that the forehead produced the cold volume that semiconductor refrigeration piece 5 produced, make forehead temperature drop.

The cold surface and the hot surface can be exchanged by switching the anode and the cathode of the semiconductor refrigeration sheet 5, so that the hot surface faces to the forehead, and the hot compress function can be realized.

Example 2

The major structure is the same with embodiment 1, the difference lies in that there is a fan 4 inside the fin shell 3 through the screw mounting, the heat accessible fan 4 that the hot side of semiconductor refrigeration piece 5 produced takes away, fan 4 induced drafts through one of them wind gap at 1 top of epitheca, blow 5 hot backs of semiconductor refrigeration piece back through another wind gap blowback come out with wind, take away the heat of 5 hot sides of semiconductor refrigeration piece with this, accelerate the heat loss of 5 hot sides of semiconductor refrigeration piece, guarantee 5 normal operating of semiconductor refrigeration piece.

Although embodiments of the present invention have been shown and described, it is intended that the present embodiments be illustrative only and not limiting to the invention, and that the particular features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples, and that modifications, substitutions, variations, and the like, which are not inventive in light of the above teachings, may be made to the embodiments by those skilled in the art without departing from the principles and spirit of the present invention, but are to be construed as broadly as the following claims.

Claims (9)

1. The utility model provides a forehead cooler, includes the casing, its characterized in that: the casing divide into epitheca (1) and inferior valve (2), epitheca (1) and inferior valve (2) intermediate junction have fin shell (3), install semiconductor refrigeration piece (5) between inferior valve (2) and fin shell (3), be provided with the opening that makes semiconductor refrigeration piece (5) expose on inferior valve (2).

2. A forehead cooler according to claim 1, wherein: a fan (4) is arranged in the radiating fin shell (3).

3. A forehead cooler according to claim 1 or 2, wherein: a first air port (8) is formed in the middle of the top of the upper shell (1), and second air ports (9) are formed in the two sides of the top of the upper shell (1).

4. A forehead cooler according to claim 1, wherein: and the bottom of the lower shell (2) is clamped with a heat-conducting silica gel pad (6).

5. A forehead cooler according to claim 1, wherein: the upper shell (1), the radiating fin shell (3) and the lower shell (2) are connected through screws.

6. A forehead cooler according to claim 1, wherein: both sides of the upper shell (1) are provided with hangers (7), and a binding band is connected through the hangers (7).

7. A forehead cooler according to claim 1, wherein: the replaceable button cell is installed at a vacant position between the upper shell (1) and the lower shell (2), and a switch for controlling the circuit state of the fan (4) and the semiconductor refrigerating sheet (5) is arranged on the upper shell (1).

8. A forehead cooler according to claim 1, wherein: a rechargeable battery is fixedly installed in a vacancy position between the upper shell (1) and the lower shell (2), a switch for controlling the circuit state of the fan (4) and the semiconductor refrigerating sheet (5) is arranged on the upper shell (1), and a charging port for charging the battery is arranged on the outer side of the upper shell (1).

9. A forehead cooler according to claim 1, wherein: the radiating fin shell (3) is made of aluminum materials, and a gap is arranged between the radiating fin shell (3) bodies.

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