CN209623147U - Efficient active semiconductor refrigerating radiator - Google Patents
Efficient active semiconductor refrigerating radiator Download PDFInfo
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- CN209623147U CN209623147U CN201920237741.XU CN201920237741U CN209623147U CN 209623147 U CN209623147 U CN 209623147U CN 201920237741 U CN201920237741 U CN 201920237741U CN 209623147 U CN209623147 U CN 209623147U
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- heat
- radiator
- semiconductor refrigerating
- pipe
- chilling plate
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Abstract
The utility model provides a kind of efficiently active semiconductor refrigerating radiator, is related to radiator field, and it is influenced by ambient temperature big to solve radiator, the low technical problem of radiating efficiency；The device includes heat transfer pedestal, is contacted with temperature controlling instruments is needed；Semiconductor chilling plate is connected with power supply, and an end face of semiconductor chilling plate and heat transfer base contacts；The heat pipe substrate of heat-pipe radiator, heat-pipe radiator is set to the other end top of semiconductor chilling plate；When needing to radiate, the cold end and heat transfer base contacts of semiconductor chilling plate, and its hot end is contacted with heat pipe substrate；The structure that the utility model uses heat-pipe radiator to combine with semiconductor refrigerating element, semiconductor refrigerating element is in the case where energization, active refrigeration, in the case where the good cold end of hot-side heat dissipation is unloaded, it is powered less than one minute, cooling piece can reach maximum temperature difference, and compared with traditional heat sinks rely solely on the mode of heat transfer or medium phase-state change, radiating efficiency is higher.
Description
Technical field
The utility model relates to heat sink technology fields, more particularly, to a kind of efficiently active semiconductor refrigeration radiating
Device.
Background technique
Currently on the market there are mainly three types of conventional radiators: air-cooled radiator, heat-pipe radiator, water-cooled radiator.
Wherein, air-cooled radiator is made of a radiator fan and one group of cooling fin.The heat for needing temperature controlling instruments to generate
It is transmitted on cooling fin, then is taken away heat by fan.The radiator heat transfer low efficiency needs temperature controlling instruments for powerful
Heat dissipation effect is poor.
Heat-pipe radiator by heat pipe and it is air-cooled form, utilize the phase-state change (evaporation and condensation) of cooling liquid in heat pipe
To transmit heat.It is more preferable compared to simple wind-cooling heat dissipating effect, is main application product currently on the market.
Water-cooled radiator takes away heat using coolant liquid circulation.The auxiliary device that the radiator needs mainly includes water
Pump, radiator, fan, water pipe, connector, cooled copper etc..It is complicated compared with air-cooled radiator and heat pipe radiating system, it is expensive,
And there are coolant liquid leakage, the risk for causing the elements such as mainboard to burn.
To sum up, applicants have discovered that the prior art at least has following technical problem: above-mentioned three kinds of modes are all by leading
Hot material (or medium phase-state change) to cooling fin, transfers heat to the heat transfer for needing temperature controlling instruments to generate by fan
In environment；In above process, the temperature of temperature controlling instruments is needed to be influenced by environment temperature very big, especially in summer high temperature weather
Under, above-mentioned three kinds of heat exchange modes cannot all reach good effect.
Utility model content
The purpose of this utility model is to provide a kind of efficiently active semiconductor refrigerating radiators, to solve the prior art
Present in radiator it is influenced by ambient temperature big, the low technical problem of radiating efficiency；Many technologies provided by the utility model
Many technical effects elaboration as detailed below that optimal technical scheme in scheme can be generated.
To achieve the above object, the utility model provides following technical scheme:
Efficiently active semiconductor refrigerating radiator provided by the utility model, comprising:
Conduct heat pedestal, contacts with temperature controlling instruments is needed；
Semiconductor chilling plate is connected with power supply, and an end face of the semiconductor chilling plate and the heat transfer pedestal are tight
Patch；
The heat pipe substrate of heat-pipe radiator, the heat-pipe radiator is set on the other end of the semiconductor chilling plate
Portion；Wherein, when needing to radiate, the cold end of the semiconductor chilling plate is close to the heat transfer pedestal, and its hot end with it is described
Heat pipe substrate is close to.
Preferably, the heat-pipe radiator is double tower type heat-pipe radiator comprising two groups of cooling fins radiate described in two groups
Radiator fan is provided between piece.
Preferably, it is welded with fixed plate between two groups of cooling fins, the radiator fan is fixed on the fixed plate and described
Cooling fin encloses in the space set.
Preferably, the surrounding side of the semiconductor chilling plate is provided with insulation material layer.
Preferably, each contact surface of the heat transfer pedestal, the semiconductor chilling plate and the heat pipe substrate is warp
Contact surface after crossing mirror surface polishing.
Preferably, the surface of the heat transfer pedestal is coated with silicone grease layer.
Preferably, the heat transfer pedestal is made of copper.
Preferably, the tube surface of the heat-pipe radiator is coated with nickel layer.
Preferably, the both ends of heat pipe be each passed through two groups described in cooling fin and heat pipe middle part pass through the heat pipe substrate with
Guarantee its integrality.
Preferably, temperature sensor is provided in the radiator, the temperature sensor is electrically connected with controller, described
Controller can control the connection and disconnection of power supply.
Efficiently active semiconductor refrigerating radiator provided by the utility model, compared with prior art, have has as follows
Beneficial effect: the structure that above-mentioned radiator uses heat-pipe radiator to combine with semiconductor refrigerating element can reduce making for heat pipe
With quantity, semiconductor refrigerating element is in the case where energization, active refrigeration, in the case where the good cold end of hot-side heat dissipation is unloaded,
As soon as being powered less than minute, cooling piece can reach maximum temperature difference, rely solely on heat transfer with traditional heat sinks or medium phase becomes
The mode of change is compared, and radiating efficiency is higher.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the overall structure diagram of the efficiently active semiconductor refrigerating radiator of the utility model；
Fig. 2 is the side view of efficient active semiconductor refrigerating radiator；
Fig. 3 is the top view of efficient active semiconductor refrigerating radiator；
Fig. 4 is the bottom view of efficient active semiconductor refrigerating radiator；
Fig. 5 is the structural schematic diagram of cooling fin；
Fig. 6 is the combining structure schematic diagram of fixed plate and cooling fin；
Fig. 7 is the schematic diagram that upside fixed plate is opened.
1 in figure, conduct heat pedestal；2, insulation material layer；3, semiconductor chilling plate；4, heat pipe substrate；5 heat pipes；6, it radiates
Piece；7, fixed plate；71, upside fixed plate；72, left side fixed plate；73, right side fixed plate；8, through-hole.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, below by the technology to the utility model
Scheme is described in detail.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Obtained all other embodiment is put, the range that the utility model is protected is belonged to.
In the description of the present invention, it should be understood that term " center ", " length ", " width ", " height ",
The instructions such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " side "
Orientation or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model and simplification
Description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, constructed and grasped with specific orientation
Make, therefore should not be understood as limiting the present invention.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set
Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection,
Or it is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediary can also be passed through
It is indirectly connected, can be the connection inside two elements.For the ordinary skill in the art, it can be managed with concrete condition
Solve the concrete meaning of above-mentioned term in the present invention.
The utility model provides a kind of efficiently active semiconductor refrigerating radiator, and-Fig. 4, Fig. 1 are this realities referring to Fig.1
With the overall structure diagram of new and effective active semiconductor refrigerating radiator, Fig. 2 is that efficient active semiconductor refrigerating dissipates
The side view of hot device, Fig. 3 are the top views of efficient active semiconductor refrigerating radiator, and Fig. 4 is efficient active semiconductor system
The bottom view of cold heat sink；Above-mentioned radiator includes: heat transfer pedestal 1, is contacted with temperature controlling instruments is needed, and preferably the two is in tight
Patch state；Semiconductor chilling plate 3 is connected with power supply, and an end face of semiconductor chilling plate 3 is close to heat transfer pedestal 1；Heat pipe
The heat pipe substrate 4 of radiator, heat-pipe radiator is set to the other end top of semiconductor chilling plate 3；Wherein, when needing to radiate
When, the cold end of semiconductor chilling plate 3 is close to heat transfer pedestal 1 in order to carry out heat transfer, and its hot end is close to heat pipe substrate 4
In order to carry out heat transfer.
It should be understood that the hot end of semiconductor chilling plate 3 is close to heat transfer pedestal 1, and its cold end when needing to heat
It is close to heat pipe substrate 4.Radiator heat-dissipation, heating function can be switched by current direction conversion.
Wherein, semiconductor chilling plate is a kind of heat pump as the prior art, is applied on heat exchanger, does not have sliding part
Part, the occasion of no refrigerant pollution.Its cardinal principle is the Peltier effect using semiconductor material, when one piece of N-type is partly led
Body material and one piece of p-type semiconductor material are coupled to galvanic couple clock synchronization, after connecting DC current in this circuit, can generate energy
The transfer of amount, electric current absorb heat by the connector that N-type element flows to p-type element, become cold end；N-type element is flowed to by p-type element
Connector discharge heat, become hot end.It is a kind of Refrigeration Technique for generating negative thermal resistance, its main feature is that movement-less part, reliably
Property it is also relatively high, gyroscopic action will not be generated, when work do not shake, noise, service life are long, and installation is easy.
The beneficial effects of the utility model are: above-mentioned radiator is combined using heat-pipe radiator with semiconductor refrigerating element
Structure, the usage quantity of heat pipe can be reduced, semiconductor refrigerating element is in the case where energization, active refrigeration, hot end dissipate
In the case that hot good cold end is unloaded, as soon as being powered less than minute, cooling piece can reach maximum temperature difference, only with traditional heat sinks
It is compared by the mode of heat transfer or medium phase-state change, radiating efficiency is higher.
Shown referring to Fig.1 as optional embodiment, heat-pipe radiator is double tower type heat-pipe radiator comprising two
Cooling fin 6 is organized, is provided with radiator fan between two groups of cooling fins 6.
When needing to radiate, temperature controlling instruments is needed heat to be passed to by the pedestal 1 that conducts heat the cold end of semiconductor chilling plate 3,
Cold end heat is pumped into the hot end of semiconductor chilling plate 3 by semiconductor chilling plate 3.Heat is passed to heat pipe 5 through superheater tube substrate 4.
Heat pipe 5 transfers heat to cooling fin 6 by the phase change (evaporative condenser) of liquid cooling in heat pipe, is passing through radiation air
Heat is discharged in environment by fan.
Wherein, radiator fan is set between two groups of cooling fins 6 (radiator fan is the prior art, is not shown in the figure), energy
It enough makes full use of fan to take away the heat of cooling fin 6, prevents the heat loss of cooling fin 6 uneven.
As optional embodiment, referring to Fig.1, it is welded with fixed plate 7 between two groups of cooling fins 6, radiator fan is fixed
It is enclosed in the space set in fixed plate 7 and cooling fin 6.
Specifically, above-mentioned fixed plate 7 and cooling fin 6, which enclose the space set, can refer to Fig. 6, Fig. 6 is fixed plate and cooling fin
Combining structure schematic diagram；In order to be clearly seen above-mentioned space, wherein one group of cooling fin 6 is eliminated in figure, fixed plate is welded on two
Between group cooling fin 6, radiator fan can be placed directly in above-mentioned space, or be fixed.Fig. 7 is referred again to, Fig. 7 is that upside is solid
The schematic diagram that fixed board is opened；Opening upside fixed plate 71 can be put into radiator fan or take out, more convenient to use.In order to just
In opening upside fixed plate 71, upside fixed plate 71 and the fixed plate of two avris are detachably connected, specifically, Fig. 6 is referred again to, on
71 one end of side fixed plate and right side fixed plate 73 are hinged, and the other end is provided with convex block, and the upper end of left side fixed plate 72 is provided with
Groove compatible with convex block, upside fixed plate 71 can be rotated by axis of hinged end, and are sticked in the fixed plate 72 of left side.
It is above-mentioned radiator fan to be placed in fixed plate 7 and cooling fin 6 encloses in the space set, radiator fan can be effectively prevent
Wind-force scatter and disappear, under the rotation of radiator fan, the heat of cooling fin 6 is passed through into gap between every group of backing or radiator fan
Bottom is discharged in environment.
It should be understood that radiator fan is mature technology in the art, model is unlimited, and those skilled in the art can
It is specifically chosen according to the actual situation, its structure will not be repeated herein.
As optional embodiment, the surrounding side of semiconductor chilling plate 3 is provided with insulation material layer 2.
Wherein, heat-barrier material is the material that can block hot-fluid transmitting, is the prior art.Traditional insulation materials, such as glass
Fiber, asbestos, rock wool, silicate etc., heat-insulation material, such as aerogel blanket, evacuated panel.The side of semiconductor chilling plate 3
It is filled, is guaranteed and air insulated with heat-barrier material, reduce scattering and disappearing for heat or cooling capacity.It wherein, can on the insulation material layer 2 of surrounding
Card slot is set, semiconductor chilling plate 3 is connected in insulation material layer/on piece of surrounding.
As optional embodiment, each contact surface of conduct heat pedestal 1, semiconductor chilling plate 3 and heat pipe substrate 4
For the contact surface after mirror surface is polished.
Heat transfer 1 both ends of pedestal are subjected to mirror surface polishing, the contact surface of heat pipe substrate 4 and semiconductor chilling plate 3 is carried out
Mirror surface polishing, guarantees the good contact of absolute smooth and adjacent contacting surface, is conducive to need between temperature controlling instruments and heat transfer pedestal 1
Heat transfer, heat transfer pedestal 1 and semiconductor chilling plate 3 between heat transfer and heat pipe substrate 4 and semiconductor chilling plate 3 between
Heat transfer.
Surface as optional embodiment, the pedestal 1 that conducts heat is coated with silicone grease layer.
Silicone grease layer has good thermally conductive, heatproof, insulation performance, is the ideal dielectric material of heat-resisting device, performance is steady
It is fixed, etchant gas will not be generated in use, the metal contacted will not be had an impact.Need temperature controlling instruments by silicone grease heat
Amount can be improved heat transfer efficiency by heat transfer pedestal 1.
As optional embodiment, the pedestal 1 that conducts heat is made of copper.
The moment endothermic energy of copper is better than other metal or alloys, and above structure, which is conducive to the heat transfer absorption of pedestal 1, needs temperature control
The heat of equipment surface.
As optional embodiment, 5 surface of heat pipe of heat-pipe radiator is coated with nickel layer.Above-mentioned nickel layer makes heat pipe 5
Antirust, anti-corrosive performance is excellent.
As optional embodiment, the both ends of heat pipe 5 are each passed through two groups of cooling fins 6 and the middle part of heat pipe passes through heat pipe
Substrate is to guarantee its integrality.
Heat pipe substrate 4 is fully wrapped around by the middle part of heat pipe, and above structure is capable of increasing heat exchange area while ensure that heat pipe
Integrality；Which does not need to clap heat pipe into flat cutting, ensure that the complete of wick-containing, to guarantee the normal performance of heat pipe.
Referring to Fig. 5, multiple through-holes 8 are provided on cooling fin 6, convenient for fixing with heat pipe, it is preferred that Reflow Soldering can be used, by cooling fin 6
Weld together with heat pipe 5.
As optional embodiment, temperature sensor is provided in radiator, temperature sensor is electrically connected with controller,
Controller can control the connection and disconnection of power supply.
Semiconductor chilling plate 3 is electric current transducing matrix part, can realize radiator heat-dissipation, heating by changing sense of current
The switching of function；It is detected by temperature sensor, temperature reaches setting value, and controller controling circuit disconnects, and stops heating or system
It is cold.Temperature and setting value reach certain temperature difference, and such as 2 DEG C, controller controling circuit is connected, and start to freeze or heat.Wherein temperature
Sensor and controller are the prior art, are repeated no more to its structure, as the model of temperature sensor can use Huo Niwei
You are HIH5030-001, and siemens PLC series of PLC CPU224XPCN can be selected in controller, and control circuit is switched on or switched off
The similar switch element of setting relay or thyristor etc. can be used.
The efficient active semiconductor refrigerating radiator provided in the utility model specific embodiment, main working process
It is: needs temperature controlling instruments that heat is passed through heat transfer pedestal 1 by silicone grease, pass to the cold end of semiconductor chilling plate 3.Semiconductor system
Cold end heat is pumped into the hot end of semiconductor chilling plate 3 cold 3.Heat is passed to heat pipe through superheater tube substrate 4.Heat pipe passes through heat
The phase change (evaporative condenser) of cooling liquid transfers heat to cooling fin 6 in pipe, is being discharged to heat by radiator fan
In environment.
In the description of this specification, specific features, structure or feature can in any one or more embodiments or
It can be combined in any suitable manner in example.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (10)
1. a kind of efficiently active semiconductor refrigerating radiator characterized by comprising
Conduct heat pedestal, contacts with temperature controlling instruments is needed；
Semiconductor chilling plate is connected with power supply, and an end face of the semiconductor chilling plate is close to the heat transfer pedestal；
The heat pipe substrate of heat-pipe radiator, the heat-pipe radiator is set to the other end top of the semiconductor chilling plate；
Wherein, when needing to radiate, the cold end of the semiconductor chilling plate is close to the heat transfer pedestal, and its hot end and the heat pipe
Substrate is close to.
2. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that the heat-pipe radiator
For double tower type heat-pipe radiator comprising two groups of cooling fins are provided with radiator fan between cooling fin described in two groups.
3. efficiently active semiconductor refrigerating radiator according to claim 2, which is characterized in that between two groups of cooling fins
It is welded with fixed plate, the radiator fan is fixed on the fixed plate and the cooling fin encloses in the space set.
4. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that the semiconductor refrigerating
The surrounding side of piece is provided with insulation material layer.
5. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that the heat transfer pedestal,
Each contact surface of the semiconductor chilling plate and the heat pipe substrate is the contact surface after mirror surface is polished.
6. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that the heat transfer pedestal
Surface is coated with silicone grease layer.
7. it is according to claim 6 efficiently active semiconductor refrigerating radiator, which is characterized in that the heat transfer pedestal by
Copper at.
8. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that the heat-pipe radiator
Tube surface be coated with nickel layer.
9. efficiently active semiconductor refrigerating radiator according to claim 2, which is characterized in that distinguish at the both ends of heat pipe
The heat pipe substrate is passed through across the middle part of cooling fin and heat pipe described in two groups to guarantee its integrality.
10. efficiently active semiconductor refrigerating radiator according to claim 1, which is characterized in that in the radiator
It is provided with temperature sensor, the temperature sensor is electrically connected with controller, and the controller can control company's through and off of power supply
It opens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920237741.XU CN209623147U (en) | 2019-02-25 | 2019-02-25 | Efficient active semiconductor refrigerating radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920237741.XU CN209623147U (en) | 2019-02-25 | 2019-02-25 | Efficient active semiconductor refrigerating radiator |
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| Publication Number | Publication Date |
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| CN209623147U true CN209623147U (en) | 2019-11-12 |
Family
ID=68454709
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920237741.XU Active CN209623147U (en) | 2019-02-25 | 2019-02-25 | Efficient active semiconductor refrigerating radiator |
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| Country | Link |
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| CN (1) | CN209623147U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741646A (en) * | 2020-05-26 | 2020-10-02 | 吴德坚 | Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell |
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
-
2019
- 2019-02-25 CN CN201920237741.XU patent/CN209623147U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741646A (en) * | 2020-05-26 | 2020-10-02 | 吴德坚 | Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell |
| CN115951769A (en) * | 2023-03-10 | 2023-04-11 | 山东合众智远信息技术有限公司 | Heat radiator for computer CPU |
| CN115951769B (en) * | 2023-03-10 | 2023-05-09 | 山东合众智远信息技术有限公司 | Heat abstractor for computer CPU |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221011 Address after: 201900 Room 2206, Building 2, No. 1800, Baoyang Road, Baoshan District, Shanghai Patentee after: Shanghai ShuangDi Computer Technology Co.,Ltd. Address before: 200120 Pudong New Area, Shanghai, China (Shanghai) free trade trial area, No. 3, 1 1, Fang Chun road. Patentee before: CNTHCN TECHNOLOGY (SHANGHAI) Co.,Ltd. Patentee before: HUBEI DONGDI TEXTILE TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |