CN218546800U - PGA chip large current Kelvin test socket - Google Patents
PGA chip large current Kelvin test socket Download PDFInfo
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- CN218546800U CN218546800U CN202222237560.1U CN202222237560U CN218546800U CN 218546800 U CN218546800 U CN 218546800U CN 202222237560 U CN202222237560 U CN 202222237560U CN 218546800 U CN218546800 U CN 218546800U
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- 238000012360 testing method Methods 0.000 title claims abstract description 126
- 239000000523 sample Substances 0.000 claims abstract description 39
- 210000004907 gland Anatomy 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009778 extrusion testing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses a PGA chip heavy current Kelvin test socket includes: the testing device comprises a main body frame, a testing mainboard, a chip positioning seat, a connecting plate and a gland assembly, wherein the upper part of the main body frame is provided with a groove for placing a chip testing element, the testing mainboard is arranged at the lower part of the main body frame, the chip positioning seat is detachably arranged in the groove, the upper part of the chip positioning seat is provided with a chip to be tested, the testing needle seat assembly is arranged on the main body frame in a sliding way and positioned at two sides of the chip positioning seat and is provided with a probe for contacting the side part of a pin of the chip, the connecting plate is detachably arranged at the upper part of the main body frame, and the gland assembly is arranged on the connecting plate and is used for driving the testing needle seat assembly to transversely move on the main body frame so as to switch testing and non-testing states; the utility model discloses simple structure can solve and introduce great internal resistance because of long and thin chip pin to lead to the big problem of test result error, can solve the very little problem of test contact simultaneously.
Description
Technical Field
The utility model relates to a semiconductor integrated circuit's chip test field, concretely relates to PGA chip heavy current Kelvin test socket.
Background
The chip test socket is mainly used for connecting and conducting a chip and a test socket point to point through a double-head probe, is commonly used for verifying the application function of an integrated circuit, and is only a connector in a certain definition so as to meet certain test requirements of a certain chip.
In the large-current Kelvin test of the PGA chip, because the pin of the PGA chip is slender, for the Kelvin test mode of pricking points in the traditional up-down direction, firstly, the test contact is very small, and the stable contact of two Kelvin pins cannot be ensured; secondly, very large internal resistance is introduced into the slender pin, and the error of the test result is large. In view of this, a socket is needed in which probes contact the chip pins through the sides for testing.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, the present invention provides a large current kelvin testing socket for PGA chips.
In order to achieve the above purpose, the utility model discloses a: the test device comprises a main body frame, a test mainboard, a chip positioning seat, a connecting plate and a gland assembly, wherein the upper part of the main body frame is provided with a groove for placing a chip test element, the test mainboard is arranged at the lower part of the main body frame, the chip positioning seat is detachably arranged in the groove, the upper part of the chip positioning seat is provided with a chip to be tested, the test needle seat assembly is arranged on the main body frame in a sliding way and is positioned at two sides of the chip positioning seat and is provided with a probe for contacting the side part of a pin of the chip, the connecting plate is detachably arranged at the upper part of the main body frame, and the gland assembly is arranged on the connecting plate and is used for driving the test needle seat assembly to transversely move on the main body frame so as to switch a test state and a non-test state.
Preferably, the capping assembly comprises: the cover plate is hinged to the connecting plate, the inner core is located in the middle of the cover plate and in threaded connection with the cover plate, the knob is mounted on the upper portion of the inner core, the pressing plate is mounted on the lower portion of the inner core, protruding portions are arranged on the periphery of the pressing plate, and the protruding portions are used for driving the test needle seat assembly to move towards the chip positioning seat so that the probes can contact the side portions of the chip pins.
Preferably, the protrusion is wedge-shaped, and the upper part of the test socket assembly has a wedge-shaped surface matched with the protrusion.
Preferably, the cover plate is provided with a reset rod, the lower end of the reset rod penetrates through the lower surface of the pressing plate, the lower part of the reset rod is provided with a first spring, and the other end of the first spring is arranged on the lower surface of the pressing plate.
Preferably, a limiting rod is installed on the test needle seat assembly, a second spring is sleeved outside the limiting rod, and a limiting hole matched with the limiting rod is formed in the chip positioning seat.
Preferably, the lateral part of the cover plate is hinged with a buckle, the upper part of the buckle is connected with the cover plate through a third spring, a clamping groove is formed in the connecting plate, and the buckle and the clamping groove are correspondingly arranged.
Preferably, a sliding groove is formed in the width direction of the main body frame, the sliding groove is communicated with the groove, and the test needle seat assembly slides in the sliding groove along the length direction.
Preferably, the bottom of the groove is provided with a positioning hole, and the bottom of the chip positioning seat is correspondingly provided with a positioning rod.
The beneficial effects of the utility model are that, extrude test needle seat subassembly through the wedge protruding portion that sets up on the gland subassembly to order about test needle seat subassembly and slide on main body frame, order about the probe contact chip pin lateral part that sets up on the test needle seat subassembly then, avoided introducing great internal resistance because of long and thin chip pin, thereby lead to the big problem of test result error, lead to both can not the problem of stable contact because of pin and probe test contact undersize through probe contact chip pin lateral part in order to solve simultaneously.
Drawings
Fig. 1 is a front view of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is a cross-sectional view of the present invention;
figure 4 is a cross-sectional view of the gland assembly of the present invention;
in the figure: the testing device comprises a main body frame 1, a testing main board 10, a groove 2, a chip positioning seat 3, a chip 4, a pin 41, a testing pin seat assembly 5, a probe 6, a probe signal probe 61, an overcurrent probe 62, a connecting plate 7, a gland assembly 8, a cover plate 81, an inner core 82, a knob 83, a pressing plate 84, a protruding part 85, a first wedge-shaped surface 851, a second wedge-shaped surface 852, a pin hole 9, a pin bolt 11, a first through groove 12, a second through groove 13, a straight hole 14, a side hole 15, a reset rod 16, a first spring 17, a limiting rod 18, a second spring 19, a limiting hole 21, a buckle 22, a clamping groove 24, a sliding groove 25 and a positioning hole 26.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly and may be, for example, fixedly connected, detachably connected or integrally connected. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The prior PGA chip large-current Kelvin test socket pointed out based on the background technology has the problems that the test contact is very small, the stable contact of two Kelvin pins cannot be ensured, the long and thin pin 41 introduces large internal resistance, and the error of the test result is large. The utility model provides a 4 heavy current kelvin test sockets of PGA chip aims at extruding test needle seat subassembly 5 through the wedge protruding portion 85 that sets up on the gland subassembly 8 to order about test needle seat subassembly 5 and slide on main body frame 1, order about the probe 6 contact chip 4 pin 41 lateral part that sets up on the test needle seat subassembly 5 then, in order to solve above-mentioned technical problem, simple structure, maneuverability is strong.
With specific reference to fig. 1 to 4, wherein fig. 1 is a front view of the present invention; FIG. 2 is an exploded view of the present invention; fig. 3 is a cross-sectional view of the present invention; figure 4 is a cross-sectional view of the gland assembly of the present invention.
A PGA chip 4 high-current kelvin test socket as shown in fig. 1 to 4 includes: the testing device comprises a main body frame 1, a testing mainboard 10, a chip positioning seat 3, a connecting plate 7, a pressing cover assembly 8 and a testing needle seat assembly, wherein the upper part of the main body frame 1 is provided with a groove 2 for placing a testing element of a chip 4, the testing mainboard 10 is arranged at the lower part of the main body frame 1, the chip positioning seat 3 is detachably arranged in the groove 2, the upper part of the testing mainboard is provided with the chip 4 to be tested, the testing needle seat assembly 5 is arranged on the main body frame 1 in a sliding mode and is positioned at two sides of the chip positioning seat 3 and is provided with a probe 6 for contacting the side part of a pin 41 of the chip 4, the connecting plate 7 is detachably arranged at the upper part of the main body frame 1, and the pressing cover assembly 8 is arranged on the connecting plate 7 and is used for driving the testing needle seat assembly 5 to transversely move on the main body frame 1 so as to switch testing and non-testing states.
The gland assembly 8 includes: a cover plate 81 hinged on the connecting plate 7, a core 82 located in the middle of the cover plate 81 and screwed to the cover plate 81, a knob 83 mounted on the upper portion of the core 82, a pressing plate 84 mounted on the lower portion of the core 82 and having a protrusion 85 on its periphery, the protrusion 85 being used to drive the testing needle holder assembly 5 to move toward the chip positioning seat 3 so that the probe 6 contacts the pin 41 side of the chip 4.
Specifically, referring to fig. 2, a groove 2 for placing a test element of the chip 4 is formed in the main body frame 1, pin holes 9 are formed in corners of the upper portion of the main body frame 1, the same number of pin holes 9 are correspondingly formed in the connecting plate 7, the connecting plate 7 is connected with the main body frame 1 through pin bolts 11, alternatively, the pin holes 9 may be threaded holes, and the pin bolts 11 may be bolts.
Referring to fig. 1, a first through groove 12 for picking and placing the chip 4 is formed through the middle of the connecting plate 7, and a second through groove 13 for moving down the protrusion 85 is formed at the side of the connecting plate 7.
Referring to fig. 2, a plurality of straight holes 14 for inserting pins 41 of the chip 4 are formed in the upper portion of the chip positioning seat 3, a plurality of side holes 15 for inserting the probes 6 are formed in the side portion of the chip positioning seat 3, and the straight holes 14 are communicated with the side holes 15, wherein the probes 6 include signal probes 61 and overcurrent probes 62, the signal probes 61 are relatively located above the overcurrent probes 62 on the testing pin seat assembly 5, so that the signal probes 61 are closer to the body of the chip 4, the internal resistance of the testing loop is small, the precision of the measured parameters is high, and the overcurrent probes 62 can be made of thicker types to carry larger currents, thereby improving the range of testing the chip 4.
Before the chip 4 is tested, the probes 6 on the test socket assembly 5 are connected to the test motherboard 10, and then the test motherboard 10 is connected to an external testing machine.
When the chip 4 needs to be detected, firstly, the cover plate 81 is separated from the connecting plate 7, the chip 4 is placed on the chip positioning seat 3 through the first through groove 12, so that the pins 41 of the chip 4 are correspondingly inserted into the straight holes 14 on the chip positioning seat 3, then, the cover plate 81 is covered on the connecting plate 7, the inner core 82 moves downwards relative to the connecting plate 7 by screwing the knob 83, the lower end of the inner core 82 extrudes the pressing plate 84, the pressing plate 84 moves downwards relative to the connecting plate 7, at this time, the protrusion 85 arranged at the lower part of the pressing plate 84 moves downwards in the second through groove 13, and the testing pin seat assembly 5 is pushed to move towards the chip positioning seat 3, the probes 6 arranged on the testing pin seat assembly 5 enter the side holes 15 formed in the side part of the chip positioning seat 3, after the knob 83 is screwed to a certain degree, the probes 6 are in contact with the side part of the pins 41 of the chip 4, at this time, the testing loop is in a testing state, after the testing is completed, the knob 83 is screwed reversely, the cover plate 81 is opened, and the test chip 4 is taken out, and the operation is convenient and fast. This application has avoided leading to great internal resistance because of elongate chip 4 pin 41 through setting up probe 6 and the contact of chip 4 pin 41 lateral part to lead to the big problem of test result error, simultaneously through probe 6 contact chip 4 pin 41 lateral part in order to solve because of pin 41 and probe 6 test contact undersize and lead to both can not the stable problem of contacting.
In a specific embodiment, the protrusion 85 has a wedge shape, and the upper portion of the test socket assembly 5 has a wedge surface matching with the protrusion 85. Specifically, referring to fig. 2 and 3, the protrusion 85 has a first wedge-shaped surface 851, a section of the first wedge-shaped surface 851 is disposed toward the chip positioning socket 3, and the test socket assembly 5 has a second wedge-shaped surface 852 matching with the first wedge-shaped surface; when clamp plate 84 drives protruding portion 85 and moves down, first wedge 851 and second wedge 852 contact each other, protruding portion 85 extrusion test needle holder subassembly 5 is to being close to 3 direction movements of chip positioning seat, rotate fixed distance through control knob 83 to this control test needle holder subassembly 5 is marching distance, make contact chip 4 base pin 41 that the probe 6 that sets up on the test needle holder subassembly 5 can be stable then, guarantee base pin 41 and probe 6's good contact, improve data test accuracy.
As a specific embodiment, a reset rod 16 is installed on the cover plate 81, the lower end of the reset rod 16 penetrates through the lower surface of the pressure plate 84, a first spring 17 is installed at the lower part of the reset rod 16, and the other end of the first spring 17 is installed on the lower surface of the pressure plate 84. Specifically, referring to fig. 4, reset lever 16 is in an inverted T-shape to restrain the ram against cover plate 81 for easy operation by the operator. Through the arrangement, after the chip 4 is tested, the knob 83 is reversely screwed and the cover plate 81 is separated from the connecting plate 7, under the action of the reset rod 16, the pressing plate 84 moves synchronously along with the cover plate 81, meanwhile, the first spring 17 is not extruded any more, the first spring 17 pushes the pressing plate 84 to move upwards so as to facilitate subsequent detection of the chip 4, operation is facilitated, practicability is high, and the detection efficiency of the chip 4 can be improved.
As a specific embodiment, the test needle holder assembly 5 is provided with a limiting rod 18, the limiting rod 18 is externally sleeved with a second spring 19, and the chip positioning seat 3 is provided with a limiting hole 21 matched with the limiting rod 18. Specifically, referring to fig. 3, the limiting hole 21 is T-shaped, after the probe 6 contacts the outer portion of the pin 41 of the chip 4, that is, after the limiting rod 18 enters the limiting hole 21, the second spring 19 is in a compressed state at this time, the test of the chip 4 is completed, the protrusion 85 unlocks the test socket assembly 5, and at this time, under the action of the second spring 19, the second spring 19 pushes the test socket assembly 5 to move in a direction away from the chip positioning seat 3, so that the test socket assembly 5 resets, the pin 41 of the chip 4 and the test probe 6 are automatically separated, the degree of automation is high, and the subsequent test on the chip 4 is facilitated.
In a specific embodiment, a buckle 22 is hinged to a side portion of the cover plate 81, an upper portion of the buckle 22 is connected to the cover plate 81 through a third spring, a locking groove 24 is provided on the connecting plate 7, and the buckle 22 is provided corresponding to the locking groove 24. Specifically, refer to fig. 1 and 2, through the above arrangement, when the cover plate 81 covers the connecting plate 7, the buckle 22 is clamped inside the clamping groove 24 through the third spring, so that the cover plate 81 and the connecting plate 7 are prevented from being separated in the testing process of the chip 4, and the pressing plate 84 is not completely pressed on the whole testing seat assembly, thereby causing the poor contact between the probe 6 and the pin 41 of the chip 4.
In a specific embodiment, a sliding groove 25 is formed in the main body frame 1 in the width direction, the sliding groove 25 is communicated with the groove 2, and the test needle holder assembly 5 slides in the sliding groove 25 in the length direction. Specifically, referring to fig. 2, the testing needle holder assembly 5 can slide smoothly on the main body frame 1 through the arrangement, and the testing needle holder assembly 5 can be replaced conveniently to meet the detection requirements of different PGA chips 4 with similar sizes, so that the testing needle holder assembly has certain practicability.
As a specific implementation manner, the bottom of the groove 2 is provided with a positioning hole 26, and the bottom of the chip positioning seat 3 is correspondingly provided with a positioning rod. Specifically, referring to fig. 2, the chip positioning seat 3 can be replaced conveniently by the arrangement, so as to meet the detection of different PGA chips 4 with similar sizes, and certain practicability is achieved.
The specific implementation process is as follows:
before the chip 4 is tested, the probes 6 on the test socket assembly 5 are connected to the test motherboard 10, and then the test motherboard 10 is connected to an external testing machine.
When the chip 4 needs to be detected, firstly, the cover plate 81 is separated from the connecting plate 7, the chip 4 is placed on the chip positioning seat 3 through the first through groove 12, so that the pins 41 of the chip 4 are correspondingly inserted into the straight holes 14 on the chip positioning seat 3, then, the cover plate 81 is covered on the connecting plate 7, the inner core 82 moves downwards relative to the connecting plate 7 through screwing the knob 83, the lower end of the inner core 82 extrudes the pressing plate 84, the pressing plate 84 moves downwards relative to the connecting plate 7, at this time, the protrusion 85 arranged at the lower part of the pressing plate 84 moves downwards in the second through groove 13 and pushes the testing pin seat assembly 5 to move towards the chip positioning seat 3, the probes 6 arranged on the testing pin seat assembly 5 enter the side holes 15 arranged at the side part of the chip positioning seat 3, after the knob 83 is screwed to a certain degree, the probes 6 are in contact with the side parts of the pins 41 of the chip 4, at this time, the testing loop is conducted, after the testing is completed, the knob 83 is screwed reversely, the cover plate 81 is opened, the testing pin seat assembly 5 is reset under the action of the third spring, and the testing chip 4 is taken out.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the above embodiments is to let the person skilled in the art understand the contents of the present invention and implement the present invention, which can not limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (8)
1. A PGA chip high current kelvin test socket comprising:
a main body frame having a recess for placing a chip test element at an upper portion thereof,
a test main board installed at a lower portion of the main body frame,
characterized in that, the socket still includes:
a chip positioning seat which is detachably arranged in the groove, the upper part of the chip positioning seat is provided with a chip to be tested,
a test needle seat assembly which is arranged on the main body frame in a sliding way, is positioned at two sides of the chip positioning seat and is provided with a probe for contacting the side part of the chip pin,
a connection plate detachably provided at an upper portion of the main body frame,
a gland assembly mounted on the connection plate for driving the test socket assembly to traverse on the body frame to switch between a test state and a non-test state.
2. The PGA chip high current Kelvin test socket according to claim 1, wherein the cover assembly comprises:
a cover plate hinged on the connecting plate,
the inner core is positioned in the middle of the cover plate and is in threaded connection with the cover plate, the upper part of the inner core is provided with a knob,
and the pressure plate is arranged at the lower part of the inner core and is provided with a protruding part at the periphery side, and the protruding part is used for driving the test needle seat assembly to move towards the chip positioning seat so that the probe contacts the side part of the chip pin.
3. A PGA chip high-current kelvin test socket according to claim 2, wherein: the protruding part is wedge-shaped, and the upper part of the test needle seat assembly is provided with a wedge-shaped surface matched with the protruding part.
4. A PGA chip high-current kelvin test socket according to claim 2, wherein: the cover plate is provided with a reset rod, the lower end of the reset rod penetrates through the lower surface of the pressing plate, a first spring is installed on the lower portion of the reset rod, and the other end of the first spring is installed on the lower surface of the pressing plate.
5. A PGA chip high-current kelvin test socket according to claim 1, wherein: the testing needle seat assembly is provided with a limiting rod, a second spring is sleeved outside the limiting rod, and a limiting hole matched with the limiting rod is formed in the chip positioning seat.
6. A PGA chip high-current kelvin test socket according to claim 2, wherein: the side part of the cover plate is hinged with a buckle, the upper part of the buckle is connected with the cover plate through a third spring, a clamping groove is formed in the connecting plate, and the buckle and the clamping groove are correspondingly arranged.
7. A PGA chip high current Kelvin test socket according to any one of claims 1 to 6, wherein: the testing needle seat assembly comprises a main body frame, a groove is formed in the main body frame, a sliding groove is formed in the width direction of the main body frame, the sliding groove is communicated with the groove, and the testing needle seat assembly slides in the sliding groove along the length direction.
8. A PGA chip high current Kelvin test socket according to any one of claims 1 to 6, wherein: the bottom of the groove is provided with a positioning hole, and the bottom of the chip positioning seat is correspondingly provided with a positioning rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222237560.1U CN218546800U (en) | 2022-08-24 | 2022-08-24 | PGA chip large current Kelvin test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222237560.1U CN218546800U (en) | 2022-08-24 | 2022-08-24 | PGA chip large current Kelvin test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218546800U true CN218546800U (en) | 2023-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222237560.1U Active CN218546800U (en) | 2022-08-24 | 2022-08-24 | PGA chip large current Kelvin test socket |
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| CN (1) | CN218546800U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092491A (en) * | 2023-10-18 | 2023-11-21 | 苏州微飞半导体有限公司 | Chip test seat applied to large-order pins and manufacturing method |
-
2022
- 2022-08-24 CN CN202222237560.1U patent/CN218546800U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092491A (en) * | 2023-10-18 | 2023-11-21 | 苏州微飞半导体有限公司 | Chip test seat applied to large-order pins and manufacturing method |
| CN117092491B (en) * | 2023-10-18 | 2024-04-05 | 苏州微飞半导体有限公司 | Chip test seat applied to large-order pins and manufacturing method |
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Address after: 215000 Suzhou Industrial Park, Suzhou City, Jiangsu Province, No. 200 Xingpu Road, 5 # 101, 102, 201, 202 Patentee after: Suzhou Fatedi Technology Co.,Ltd. Country or region after: China Address before: 215000 Suzhou Industrial Park, Suzhou City, Jiangsu Province, No. 200 Xingpu Road, 5 # 101, 102, 201, 202 Patentee before: FTDEVICE TECHNOLOGY (SUZHOU) CO.,LTD. Country or region before: China |
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