CN218514579U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN218514579U CN218514579U CN202222211973.2U CN202222211973U CN218514579U CN 218514579 U CN218514579 U CN 218514579U CN 202222211973 U CN202222211973 U CN 202222211973U CN 218514579 U CN218514579 U CN 218514579U
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- China
- Prior art keywords
- pad
- circuit board
- component
- plane
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
The application relates to the technical field of electronics, and provides a circuit board and electronic equipment, and solves the problem that molten solder easily flows into a via hole. The circuit board provided by the embodiment of the application comprises a substrate, wherein the substrate comprises a first plane and a second plane which are oppositely arranged, a first bonding pad part is formed on the first plane, a second bonding pad part is formed on the second plane, and at least one through hole penetrating through the substrate is formed on the substrate at the position of the first bonding pad part; the second pad portion includes the outside pad at least, the outside pad is located the outside of at least one via hole, just the outside pad with be equipped with between the at least one via hole and hinder the solder mask structure, hinder the solder mask structure and be used for separating the outside pad with at least one via hole. Because the solder resist structure separates the outer bonding pad and the via hole, solder of the outer bonding pad is prevented from flowing into the via hole, the influence on components of the first bonding pad part is avoided, and the quality of the circuit board is improved.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a circuit board and electronic equipment.
Background
Under the condition that components are required to be arranged on different surfaces of the circuit board, the welding of the components on one surface is usually completed first, and then the welding of the components on the other surface is carried out. However, when a component on one surface is soldered, molten solder is likely to flow into a via hole on the surface of the circuit board, which affects the soldering and operation of another surface component.
SUMMERY OF THE UTILITY MODEL
The application provides a circuit board and electronic equipment, which are used for solving the problem that molten solder easily flows into a through hole.
The present application provides a circuit board, which includes a substrate, the substrate includes a first plane and a second plane that are oppositely disposed, a first pad portion is formed on the first plane, a second pad portion is formed on the second plane, and at least one via hole that penetrates through the substrate is formed on the substrate at the position of the first pad portion;
the second pad portion includes the outside pad at least, the outside pad is located the outside of at least one via hole, just the outside pad with be equipped with between the at least one via hole and hinder the solder mask structure, hinder the solder mask structure and be used for separating the outside pad with at least one via hole.
In some embodiments, the first pad part includes at least a first pad positioned outside the at least one via, the first pad being used to mount a first component.
In some embodiments, the first pad part further includes a first via area pad, the first pad being located at an outer side of the first via area pad.
In some embodiments, the second pad part further includes a second via area pad, and the outer pad is positioned at an outer side of the second via area pad.
In some embodiments, the solder resist structure comprises a solder resist ink.
In some embodiments, the solder resist structure includes at least one solder resist region, the solder resist region being adjacent to the at least one via.
In some embodiments, a projection of the center of the first pad portion on the second plane is less than a first preset distance from the center of the second pad portion.
In some embodiments, a distance between a center of the via area pad and a center of the second pad part is less than a second preset distance.
In some embodiments, the circuit board further includes a first component mounted to the first pad portion and/or a second component mounted to the second pad portion; the first component comprises at least one of a heat dissipation component, a structural component and a chip, and the second component comprises at least one of a heat dissipation component, a structural component and a chip.
In some embodiments, the first component is a chip and the second component is a heat sink component.
A second aspect of the application provides an electronic device comprising a circuit board according to the first aspect of the application.
The circuit board comprises a substrate, the substrate comprises a first plane and a second plane which are oppositely arranged, a first bonding pad part is formed on the first plane, a second bonding pad part is formed on the second plane, and at least one through hole penetrating through the substrate is formed on the substrate at the position of the first bonding pad part; the second pad portion includes the outside pad at least, the outside pad is located the outside of at least one via hole, just the outside pad with be equipped with between the at least one via hole and hinder the solder mask structure, hinder the solder mask structure and be used for separating the outside pad with at least one via hole. Because the solder resist structure separates the outer bonding pad and the via hole, solder of the outer bonding pad is prevented from flowing into the via hole, the influence on components of the first bonding pad part is avoided, and the quality of the circuit board is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a second plane of a circuit board according to an embodiment of the present application;
fig. 3 is a partially enlarged schematic view of a second pad portion of fig. 2;
fig. 4 is a schematic structural diagram of a first plane of a circuit board according to an embodiment of the present application;
fig. 5 is a partially enlarged schematic view of the first pad portion in fig. 4;
fig. 6 is a schematic structural diagram of a second plane of a circuit board according to an embodiment of the present application.
10. A circuit board; 100. a substrate; 101. an outer bonding pad; 102. a via hole; 103. a solder resist structure; 104. a second via area pad; 105. a first bonding pad; 106. a first via area pad.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The flow diagrams depicted in the figures are merely illustrative and do not necessarily include all of the elements and operations/steps, nor do they necessarily have to be performed in the order depicted. For example, some operations/steps may be decomposed, combined or partially combined, so that the actual execution sequence may be changed according to the actual situation.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure.
As shown in fig. 1, components are mounted on both the first plane and the second plane of the circuit board substrate 100, for example, a chip is mounted on the first plane above the substrate in fig. 1, a heat sink is mounted on the second plane below the substrate, and a via hole 102 penetrating through the substrate 100 is formed so that heat generated by the chip can be conducted to the heat sink through the via hole 102 for heat dissipation.
However, when a circuit board of the prior art is used for mounting a component of a first plane or a second plane, molten solder generally flows into the via hole 102, so that the via hole 102 is blocked, and the mounting or operation of the component of the other plane is affected. For example, when the heat sink of the second plane is soldered first, the excess molten solder flows into the first plane through the via hole 102, which may result in the chip of the first plane being unable to be soldered or the heat dissipation after the chip is soldered being poor, which may result in the quality of the circuit board being poor.
Referring to fig. 2 to 5, fig. 2 is a schematic structural diagram of a second plane of a circuit board according to an embodiment of the present disclosure, fig. 3 is a schematic partial enlarged view of a second pad portion in fig. 2, fig. 4 is a schematic structural diagram of a first plane of a circuit board according to an embodiment of the present disclosure, and fig. 5 is a schematic partial enlarged view of a first pad portion in fig. 4.
In some embodiments, the circuit board includes a substrate, the substrate includes a first plane and a second plane that are oppositely disposed, the first plane has a first pad portion formed thereon, the second plane has a second pad portion formed thereon, and the substrate has at least one via hole penetrating through the substrate at a position of the first pad portion; the second pad portion includes the outside pad at least, the outside pad is located the outside of at least one via hole, just the outside pad with be equipped with between at least one via hole and hinder the solder mask structure, hinder the solder mask structure and be used for separating the outside pad with at least one via hole.
It can be understood that, as shown in fig. 2, since the solder resist structure 103 separates the outer pad 101 and the at least one via 102, the inner side of the solder resist structure 103 is the at least one via 102, and the outer side of the solder resist structure 103, i.e. the outer side of the at least one via 102, is the outer pad 103, so that the component mounted on the second pad portion can cover the at least one via 102, for example, the heat sink mounted on the second pad portion can cover the via, so that the heat sink conducts heat generated by the component on the first plane.
Illustratively, a first pad portion and a second pad portion for mounting components are respectively formed on the first plane and the second plane of the substrate 100, and the substrate 100 is further formed with at least one via hole 102 penetrating through the substrate 100.
For example, the at least one via 102 can guide heat generated by the component on the first plane to the second plane, but is not limited thereto.
Illustratively, the solder of the outer pad 101 can be prevented from flowing into the at least one via 102 in a molten state by the solder resist structure 103, so that the solder is prevented from blocking the via and even being condensed on another plane, and the quality of the circuit board is improved.
In some embodiments, the second pad part further includes a second via area pad, and the outer pad is located at an outer side of the second via area pad.
As shown in fig. 2 and 3, the outer pad 101 is located outside the second via area pad 104, and the solder resist structure 103 separates the at least one via 102 from the outer pad 101 and also separates the outer pad 101 from the second via area pad 104, so as to prevent the solder of the outer pad 101 from adhering to the solder of the second via area pad 104, and prevent excessive solder from entering the at least one via 102, which may affect the quality of the circuit board.
In some embodiments, the solder resist structure comprises solder resist ink.
For example, the solder resist structure 103 may be other materials that can prevent solder from adhering, and is not limited herein.
Illustratively, since the solder resist structure 103 is unable to attach solder, the solder of the outer pad 101 can be separated from the solder of the via area pad 104, thereby avoiding excessive solder from adhering to the outer pad and entering the via 102.
In some embodiments, the first pad part includes at least a first pad positioned outside the at least one via, the first pad being used to mount a first component.
As shown in fig. 4 and 5, the first pad portion of the first plane of the circuit board 10 further includes a first pad 105, and components of the first pad portion are mounted through the first pad 105.
Illustratively, the projection of the first pad 105 on the second plane is located in the outer pad 101, so that the components of the first pad portion can cooperate with the components of the second pad portion, for example, the heat generated by the components of the first pad portion is dissipated by the heat sink of the second pad portion, which is not limited herein.
In some embodiments, the first pad part further includes a first via area pad, the first pad being located at an outer side of the first via area pad.
Illustratively, the at least one via 102 is provided with a first via area pad 106 in a region of the first plane, so as to mount a component of the first plane, so that the component of the first pad portion can be sufficiently contacted with the component of the second pad portion through the via 102, for example, a chip of the first pad portion conducts heat to a heat sink of the second pad portion through the via 102, but is not limited thereto.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a second plane of a circuit board according to an embodiment of the present application.
In some embodiments, the solder resist structure includes at least one solder resist area adjacent to the at least one via.
For example, the solder resist structure 103 may be a connected structure shown in fig. 2, a structure including a plurality of solder resist regions shown in fig. 6, or another structure, which is not limited herein.
Illustratively, the solder resist structure 103 may be selected according to actual requirements, for example, according to a manufacturing process of the solder resist structure 103, specifically, the manufacturing process of the solder resist structure 103 includes, but is not limited to, at least one of screen printing, electrostatic spraying, and printing; the solder adding mode can be selected according to the solder adding mode, and specifically, the solder adding mode comprises at least one of but not limited to printing, manual coating, injection and printing.
In some embodiments, the circuit board further includes a first component mounted to the first pad portion and/or a second component mounted to the second pad portion; the first component comprises at least one of a heat dissipation component, a structural component and a chip, and the second component comprises at least one of a heat dissipation component, a structural component and a chip.
Illustratively, the mounting manner of the first component and/or the second component includes, but is not limited to, at least one of reflow soldering, wave soldering, and laser soldering.
In some embodiments, the first component is a chip and the second component is a heat sink component.
Illustratively, the first component is a chip, the second component is a heat dissipation component, and heat generated by the chip on the first plane is guided to the heat dissipation component on the second plane through at least one via hole 102, so as to ensure stable operation of the chip.
By way of example, the packaging form of the chip includes, but is not limited to, at least one of a Quad Flat No-lead Package (QFN), a Small Outline Package (SOP), a Quad Flat Package (QFP), a Ball Grid Array Package (BGA).
In some embodiments, a projection of the center of the first pad portion on the second plane is less than a first preset distance from the center of the second pad portion.
Exemplarily, the first pad part and the second pad part are located at corresponding positions of different planes of the substrate, so that the first component mounted on the first pad part and the second component mounted on the second pad part cooperate better, for example, the heat dissipation component of the second pad part can guide heat generated by the chip of the first pad part to the periphery more uniformly, thereby improving heat dissipation efficiency.
Illustratively, the projection of the center of the first pad portion on the second plane is located at the same position as the center of the second pad portion.
In some embodiments, a center of the via area pad is less than a second predetermined distance from a center of the second pad portion.
For example, the center of the via area pad is located at a corresponding position in the second pad portion, so that the first component mounted on the first pad portion and the second component mounted on the second pad portion cooperate better, for example, a heat dissipation component mounted on the second pad portion can uniformly guide heat conducted through the via to the periphery, thereby improving heat dissipation efficiency.
Illustratively, the center of the via area pad and the center of the second pad part are located at the same position.
In some embodiments, the present application further provides an electronic device comprising: a circuit board as described above.
For example, the electronic device may include one or more circuit boards as described above, but is not limited thereto.
For example, the electronic device may be a supercomputing device, and is certainly not limited thereto, and is not limited thereto.
It should be noted that the descriptions in this application referring to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It should also be understood that the term "and/or" as used in this application and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (11)
1. The circuit board is characterized by comprising a substrate, wherein the substrate comprises a first plane and a second plane which are oppositely arranged, a first pad part is formed on the first plane, a second pad part is formed on the second plane, and at least one through hole which penetrates through the substrate is formed on the substrate at the position of the first pad part;
the second pad portion includes the outside pad at least, the outside pad is located the outside of at least one via hole, just the outside pad with be equipped with between the at least one via hole and hinder the solder mask structure, hinder the solder mask structure and be used for separating the outside pad with at least one via hole.
2. The circuit board of claim 1, wherein the first pad portion comprises at least a first pad located outside the at least one via, the first pad being configured to mount a first component.
3. The circuit board of claim 2, wherein the first pad portion further comprises a first via area pad, the first pad being located outside the first via area pad.
4. The circuit board of claim 1, wherein the second pad portion further comprises a second via area pad, the outer pad being located outside the second via area pad.
5. Circuit board according to any of claims 1-4, characterized in that the solder resist structure comprises solder resist ink.
6. The circuit board of any of claims 1-4, wherein the solder resist structure includes at least one solder resist area, the solder resist area being adjacent to the at least one via.
7. The circuit board according to any one of claims 1 to 4, wherein a projection of the center of the first pad portion on the second plane is less than a first predetermined distance from the center of the second pad portion.
8. The circuit board of claim 4, wherein a distance between a center of the via area pad and a center of the second pad portion is less than a second preset distance.
9. The circuit board of claim 1, further comprising a first component mounted to the first pad portion and/or a second component mounted to the second pad portion; the first component comprises at least one of a heat dissipation component, a structural component and a chip, and the second component comprises at least one of a heat dissipation component, a structural component and a chip.
10. The circuit board of claim 9, wherein the first component is a chip and the second component is a heat sink component.
11. An electronic device, characterized in that the electronic device comprises a circuit board according to any of claims 1-10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222211973.2U CN218514579U (en) | 2022-08-22 | 2022-08-22 | Circuit board and electronic equipment |
| PCT/CN2023/109643 WO2024041303A1 (en) | 2022-08-22 | 2023-07-27 | Circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222211973.2U CN218514579U (en) | 2022-08-22 | 2022-08-22 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218514579U true CN218514579U (en) | 2023-02-21 |
Family
ID=85209726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222211973.2U Active CN218514579U (en) | 2022-08-22 | 2022-08-22 | Circuit board and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218514579U (en) |
| WO (1) | WO2024041303A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041303A1 (en) * | 2022-08-22 | 2024-02-29 | 北京比特大陆科技有限公司 | Circuit board and electronic device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3639505B2 (en) * | 2000-06-30 | 2005-04-20 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Printed wiring board and semiconductor device |
| JP5142119B2 (en) * | 2006-09-20 | 2013-02-13 | 住友電装株式会社 | Method of manufacturing printed circuit board having heat dissipation structure and heat dissipation structure of printed circuit board manufactured by the method |
| CN210444551U (en) * | 2019-03-28 | 2020-05-01 | 观致汽车有限公司 | Heat dissipation bonding pad and printed circuit board with same |
| CN211481596U (en) * | 2020-02-13 | 2020-09-11 | 东莞市金锐显数码科技有限公司 | Grounding bonding pad and chip |
| CN212628599U (en) * | 2020-08-26 | 2021-02-26 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
| CN215581857U (en) * | 2021-05-24 | 2022-01-18 | 深圳市一博科技股份有限公司 | PCB structure for improving heat dissipation efficiency of electronic component |
| CN218514579U (en) * | 2022-08-22 | 2023-02-21 | 北京比特大陆科技有限公司 | Circuit board and electronic equipment |
-
2022
- 2022-08-22 CN CN202222211973.2U patent/CN218514579U/en active Active
-
2023
- 2023-07-27 WO PCT/CN2023/109643 patent/WO2024041303A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024041303A1 (en) * | 2022-08-22 | 2024-02-29 | 北京比特大陆科技有限公司 | Circuit board and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024041303A1 (en) | 2024-02-29 |
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