CN218513479U - LED package body without electric polarity separation and light-emitting device - Google Patents

Abstract

The application discloses an LED packaging body, which comprises a substrate, at least two conductive structures of LED chips fixed on the substrate, and a lead connected with the conductive structures of the LED chips; the conductive structure of the LED chip comprises: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips. This application is through the mode of connection that changes chip and electrode, and in the production and the use of carrying out the LED packaging body, does not receive the restriction of electric polarity direction, has greatly promoted LED light-emitting equipment's production efficiency.

Description

LED package body without electric polarity separation and light-emitting device

Technical Field

The present disclosure relates to LED packaging technologies, and particularly to an LED package and a light emitting device with no electric polarity.

Background

The main purpose of an LED package is to package a light emitting chip, which is a pn junction die composed of p-type and n-type semiconductors, in its core part, and when minority carriers and majority carriers injected into the pn junction are combined, visible light, ultraviolet light or near infrared light is emitted. The pn junction die is polar, i.e., has a positive and a negative polarity, so to successfully excite the pn junction die to emit light, the electrode assembly direction of the light emitting chip must be correctly distinguished. However, as the application scenes of the LED light emitting device are more and more abundant, the application range is more and more wide, and more producers are needed, if the LED package body is used or manufactured, the user is required to have certain electrical knowledge, and the positive electrode and the negative electrode of the light emitting chip or the LED package body can be correctly distinguished, on one hand, the installation failure of the LED light emitting device can be caused, the process of detecting faults is increased, the yield and the production efficiency are not favorably improved, on the other hand, the market competitiveness can be influenced due to insufficient foolproof design, and the market share of the product is not favorably improved.

In the prior art, when the technical problem of realizing the non-polarized installation of the LED is considered, the polarity conversion circuit is mainly realized by adding a polarity conversion circuit module outside an LED package body, and the polarity conversion circuit can be formed by connecting a plurality of secondary tubes in series and in parallel, and can also be realized by a bridge rectifier. However, the circuit improvement outside the LED package does not fundamentally solve the problem that the light emitting chip needs to be mounted in a predetermined electrode assembly direction.

SUMMERY OF THE UTILITY MODEL

The purpose of the present application is to overcome at least part of the deficiencies of the prior art, and to provide a conductive structure of an LED chip with a simpler structure and good fool-proof performance, and an LED package and a light emitting device using the conductive structure of the LED chip.

In order to achieve the technical purpose, the technical scheme adopted by the application is as follows:

in a first aspect, an LED package is provided, which includes a substrate, at least two conductive structures of LED chips fixed on the substrate, and a wire connecting the conductive structures of the LED chips; the conductive structure of the LED chip comprises: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips.

Preferably, the conductive structure of the LED chip is not limited in an electrode assembling direction within the LED package.

Optionally, the LED package is implemented in any one of the following forms: pin type LED packaging, surface mount type LED packaging, chip-on-board direct-mount type LED packaging and system package type LED packaging.

Further, an electrode assembly direction of the LED package is not limited.

Preferably, the chip is a two-electrode chip.

Alternatively, the first electrode and the second electrode are respectively of a monolithic structure or a biplate structure.

Furthermore, the LED chip comprises two independent copper foils arranged along the longitudinal direction of the substrate, and each copper foil extends out of a branch for connecting the conductive structures of the LED chips in series or in parallel.

Optionally, one branch of the copper foil is connected with each first electrode, and the other branch of the copper foil is connected with each second electrode, so that the parallel connection between the conductive structures of the LED chips is realized.

In a second aspect, there is provided a light emitting device comprising an LED lighting assembly comprising an LED package as described above.

Compared with the prior art, the method has the following advantages:

(1) According to the LED packaging structure, the conductive structure of the LED chip is changed, the problem of the LED electrode assembling directivity is solved from a basic production link, the LED packaging structure is greatly different from other improved technical schemes based on an external circuit of an LED packaging body, and the follow-up improvement of the LED packaging technology is facilitated.

(2) The conductive structure of the LED chip only changes the wiring mode of the chip and the electrode, so that the pair of chips are connected in parallel in a crossed mode, the change of the original LED production line is small, and the quality of the LED is improved greatly.

(3) The conductive structure of the LED chip enables the LED chip not to be limited by the polarity direction when being singly assembled, serially assembled or parallelly assembled, and is not limited by the polarity direction in the subsequent production and use of the LED packaging body, so that the production efficiency of the LED light-emitting equipment is greatly improved, and the market competitive advantage of related products is favorably improved.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of a conductive structure of an LED chip according to the present application.

Fig. 2 is a schematic structural diagram of a first embodiment of the present application in series.

Fig. 3 is a schematic diagram of a parallel structure according to a first embodiment of the present application.

Fig. 4 is a schematic structural diagram of a second embodiment of a conductive structure of an LED chip according to the present application.

Fig. 5 is a schematic diagram of a tandem structure according to a second embodiment of the present application.

Fig. 6 is a schematic diagram of a parallel structure according to a second embodiment of the present application.

Fig. 7 is a schematic structural diagram of an embodiment of an LED package according to the present application.

Fig. 8 is another schematic diagram of the second embodiment of the present application.

Detailed Description

The present application is described in further detail below with reference to the attached drawings and the detailed description.

An LED (Light Emitting Diode) package refers to a package of a Light Emitting chip, and a general package is required to protect the Light Emitting chip, transmit Light, adjust color temperature and chromaticity of emitted visible Light, and ensure Light Emitting efficiency and heat dissipation. The LED package generally includes a substrate, an LED support, glue between the LED support and the chip, a conductive electrode or pin LED out from the support, a wire connecting the chip and the conductive electrode (or pin), and a cover layer for optically modifying the chip, and an additional physical protective layer is added if necessary.

The present application provides a conductive structure of an LED chip, as shown with reference to an embodiment of fig. 1, the conductive structure of the LED chip includes: support 1, a pair of conductive electrode, a pair of chip and the wire 4 of connecting the pair of conductive electrode and a pair of chip, specifically:

the support 1, which is used as a supporting structure and a heat dissipation structure of the chip, defines a volume of a minimum component unit of the LED package, and in this embodiment, the support 1 should be configured as a metal support or a non-metal support according to an application scenario of the LED. Further, the two ends of the bracket 1 are used for providing fixing positions of the pair of conductive electrodes.

The pair of conductive electrodes comprises a first electrode 21 and a second electrode 22 which are arranged at two ends of the bracket 1; the pair of chips, i.e., the light emitting chip in the LED package, includes a first chip 31 and a second chip 32 disposed side by side between the pair of conductive electrodes. The chip adopts a double-electrode chip, the pair of chips and the bracket 1 adopt conductive silver adhesive for die bonding, when the conducting wire 4 is further utilized for realizing conductive connection, the anode and the cathode of the first chip 31 are respectively electrically connected with the first electrode 21 and the second electrode 22, the anode and the cathode of the second chip 32 are respectively electrically connected with the second electrode 22 and the first electrode 21, namely, the pair of chips and the pair of conductive electrodes realize cross parallel connection. Whether the power supply is direct current or alternating current, or whether the feeding current is fed from any direction of the first electrode 21 or the second electrode 22, any one of the pair of chips can be excited to emit light, so that the conductive structure of the LED chip of the present application is not limited by the electrode assembly direction.

When the aforementioned conductive structure of the single LED chip is packaged into a single LED package, assembling such an LED package into a light emitting apparatus does not need to consider an electrode assembling direction. When the conductive structures of the plurality of LED chips are mounted side by side, whether the conductive structures of the plurality of LED chips are in a series relationship or a parallel relationship, a plurality of adjacent pairs of conductive electrodes may be further optimally arranged:

referring to fig. 1, in one possible embodiment, the first electrode 21 and the second electrode 22 are monolithic structures, i.e. the first electrode 21 and the second electrode 22 are respectively formed by one conductive sheet a, each of which provides two connection points for simultaneously connecting the first chip 31 and the second chip 32. As shown in fig. 1, the first chip 31 and the second chip 32 are arranged at the center of the bracket 1 up and down, the conductive sheets a of the first electrode 21 and the second electrode 22 are arranged at the left end and the right end of the bracket 1, the right end of the conductive sheet a of the first electrode 21 provides two connection points respectively opposite to the first chip 31 and the second chip 32, the two connection points are connected with different chip electrodes, the upper connection point is connected with the anode of the first chip 31, and the lower connection point is connected with the cathode of the second chip 32; the left end of the conducting sheet a of the second electrode 22 provides two connection points opposite to the first chip 31 and the second chip 32, the two connection points are connected with different chip electrodes, the upper connection point is connected with the negative electrode of the first chip 31, and the lower connection point is connected with the positive electrode of the second chip 32.

When the LED lamp is used, current is fed from the first electrode 21 and then injected into the anode of the first chip 31 to excite the first chip 31 to emit light, at the moment, the current fed from the first electrode 21 is injected into the cathode of the second chip 32 to be incapable of breaking the state of internal electric field balance of the second chip 32, and the second chip 32 does not emit light; if the current is fed from the second electrode 22, the anode injected into the second chip 32 can excite the second chip 32 to emit light, the cathode injected into the first chip 31 cannot break the state of the internal electric field balance of the first chip 31, and the first chip 31 does not emit light. From this, the conducting structure of the LED chip of this application, no matter assemble with any kind of electrode direction, can both arouse that one of them chip is luminous. In another usage scenario, when one of the chips fails and does not emit light, the electrode assembly direction of the conductive structure of the LED chip is exchanged, so as to excite the other chip to emit light, thereby maintaining the operating state of the LED device.

When a plurality of the conductive structures of the first embodiment are arranged side by side, two conductive sheets a belonging to different conductive structures may be combined, as shown in fig. 2, the conductive sheet a between two sets of chips respectively performs the functions of the second electrode of the left conductive structure and the first electrode of the right conductive structure, at this time, the conductive sheet a provides four connection points for connecting a pair of chips in the adjacent conductive structures, the upper left connection point is connected with the negative electrode of the first chip 31 of the left conductive structure, the lower left connection point is connected with the positive electrode of the second chip 32 of the left conductive structure, the lower right connection point is connected with the negative electrode of the second chip 32 of the right conductive structure, and the upper right connection point is connected with the positive electrode of the first chip 31 of the right conductive structure, so that the same-side connection points of the conductive sheets a are connected with different chip electrodes. The plurality of conductive structures arranged laterally side by side in the above manner enables series connection of the plurality of conductive structures.

When a plurality of the aforementioned conductive structures of the first embodiment are longitudinally side by side, two conductive sheets a belonging to different conductive structures are combined in another way: as shown in fig. 3, the first electrodes 21 belonging to different conductive structures are combined into a conductive sheet a, and the right side of the first electrode 21 is provided with a plurality of connection points respectively facing the chips, so that the number of the connection points on the first electrode 21 is the same as that of the chips; the chip electrode connected with each connecting point is different from other connecting points which are adjacent up and down. On the other hand, the second electrodes 22 belonging to different conductive structures are combined into one conductive sheet a, and the left side of the second electrode 22 provides a connection point, which is disposed in the same manner as the first electrode 21. Through the mode, the parallel connection of the plurality of conductive structures is realized.

Referring to fig. 4, another possible embodiment is that the first electrode 21 and the second electrode 22 are of a double-sheet structure, i.e. the first electrode 21 and the second electrode 22 are respectively formed by two separate conductive sheets b, and each conductive sheet b provides a connection point for connecting the first chip 31 or the second chip 32. The first chip 31 and the second chip 32 are vertically arranged in the center of the bracket 1, a pair of conducting strips b of the first electrode 21 are vertically arranged on the left side of the bracket 1, each conducting strip b is opposite to one chip, the right end of each conducting strip b provides a connection point, the conducting strip b above the first electrode 21 is connected with the anode of the first chip 31, the conducting strip b below the first electrode 21 is connected with the cathode of the second chip 32, and therefore, two connection points provided by the first electrode 21 are connected with different chip electrodes; a pair of conducting strips b of the second electrode 22 are vertically arranged on the right side of the bracket 1, each conducting strip b is opposite to one chip, the left end of each conducting strip b provides a connection point, the conducting strip b above the second electrode 22 is connected with the negative electrode of the first chip 31, and the conducting strip b below the second electrode 22 is connected with the positive electrode of the second chip 32, so that two connection points provided by the second electrode 22 are connected with different chip electrodes. The double-piece type electrode can be connected in parallel by using a lead or welded in the same bonding pad to realize parallel connection outside the conductive structure.

When a plurality of the aforementioned conductive structures of the second embodiment are laterally side by side, the conductive sheets b subordinate to different conductive structures may also be combined. The conducting strips b between the two groups of chips respectively perform the functions of the second electrode 22 of the left conducting structure and the first electrode of the right conducting structure, at this time, in the upper and lower separated conducting strips b, the upper conducting strip b provides two connection points for connecting the first chip 31 in the adjacent conducting structure, specifically, the left connection point is connected with the negative electrode of the first chip 31 of the left conducting structure, and the right connection point is connected with the positive electrode of the first chip 31 of the right conducting structure; the lower conductive sheet b provides two connection points for connecting the second chips 32 in the adjacent conductive structures, specifically, the connection point on the left side is connected with the anode of the second chip 32 in the left conductive structure, and the connection point on the right side is connected with the cathode of the second chip 32 in the right conductive structure. Therefore, the same side connection points of the separated double-sheet conducting strips b are connected with different chip electrodes, and when the double-sheet conducting strips b are fixed in the same bonding pad, the two conducting strips b are connected in series. The plurality of conductive structures arranged side by side in the above manner realizes the series connection of the plurality of conductive structures.

When a plurality of conductive structures of the second embodiment are arranged side by side in the longitudinal direction, it is only necessary to arrange the first electrodes 21 and the second electrodes 22 of the plurality of conductive structures in the longitudinal direction, and solder the conductive sheets b on the same side to the same bonding pad, so as to connect the plurality of conductive structures in parallel, as shown in fig. 6.

The two embodiments have the same effect of realizing the non-polarized LED assembly.

The conductive structure of any of the above embodiments can be directly applied to an LED package. The LED package may include a pin type LED package, a Chip On Board (COB) LED package, and a system package type LED package according to a package structure. The LED packaging body containing a single conductive structure can be a pin type LED packaging body or a patch type LED packaging body, and the LED packaging body containing two or more conductive structures can be a patch type LED packaging body, a chip-on-board direct-mounted type LED packaging body or a system packaging type LED packaging body. As shown in fig. 7, the present application is a schematic structural diagram of a chip-on-board direct-mount LED package, in the COB package, a support of a conductive structure of each LED chip is integrally processed, the conductive structures of each LED chip are connected in series along an extending direction of the substrate 5 in the manner as described above, in this embodiment, the first electrode 21 and the second electrode 22 use a single-chip conductive sheet a, and those skilled in the art can replace the single-chip conductive sheet b with a double-chip conductive sheet b as needed.

The conductive structure of the LED chip of the second embodiment can also be connected in series or in parallel by using an external wire. Specifically, as shown in fig. 8, on a substrate of an LED package, a plurality of conductive structures of LED chips using a two-piece conductive sheet b are placed according to product requirements, two independent copper foils 6 are disposed along a longitudinal direction of the substrate, and if the conductive structures of the LED chips are required to be connected in parallel, a plurality of branches extend from one copper foil 6 for connecting with a first electrode 21 of each conductive structure, and a plurality of branches extend from the other copper foil 6 for connecting with a second electrode 22 of each conductive structure. Further, the structure shown in fig. 8 can also be understood as that the conductive structure of the LED chip using the two-piece conductive sheet b has been packaged into a single LED package, and when the LED package is assembled into an LED module, the parallel connection relationship between the LED packages is established on the module substrate by using the copper foil 6 on the substrate in the manner described above. The above strategy is applicable to parallel connection between conductive structures of LED chips employing the single-sheet conductive sheet a, and also applicable to parallel connection between single LED packages of conductive structures of LED chips employing the single-sheet conductive sheet a. According to the common knowledge of those skilled in the art, changing the branch connection position of the copper foil 6 can realize the series connection between the conductive structures of the LED chips adopting the monolithic conductive sheet a, or realize the series connection between the single LED packages of the conductive structures of the LED chips adopting the monolithic conductive sheet a. The electrode assembly direction of the conductive structure of the LED chip using the single conductive sheet a or the single LED package of the conductive structure of the LED chip using the single conductive sheet a is not limited.

When the LED package bodies are assembled by using the LED chip conductive structure of the present application, the electrode assembly direction of the LED chip conductive structure in the LED package bodies is not limited, and further, when the assembled LED package bodies are further assembled into LED light emitting assemblies, the electrode assembly method of the LED package body in the LED light emitting assemblies of the present application is also not limited. The aforementioned LED light emitting assembly is generally applied to light emitting devices such as various indicator lights, backlights, illuminating lamps, and display screens, and the LED light emitting assembly capable of emitting ultraviolet light can also be applied to ultraviolet disinfection products.

To sum up, the present application provides a conductive structure of an LED chip, including: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips. An LED package and a light emitting apparatus employing the conductive structure of the LED chip are also provided. This application is through the conducting structure who changes the LED chip, has changed the mode of connection of chip and electrode, makes a pair of chip alternately parallelly connected, makes the LED chip not receive the restriction of electric polarity direction when carrying out single equipment, series connection equipment or parallelly connected equipment, in the follow-up production and the use that carry out the LED packaging body, also does not receive the restriction of electric polarity direction, has greatly promoted LED light emitting equipment's production efficiency, is favorable to promoting the market competition advantage of relevant product.

The above embodiments are only preferred embodiments of the present application, but not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present application should be construed as equivalents and are included in the scope of the present application.

Claims (9)

1. The LED packaging body is characterized by comprising a substrate, at least two conductive structures of LED chips fixed on the substrate, and a lead connected with the conductive structures of the LED chips; the conductive structure of the LED chip comprises: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips.

2. The LED package of claim 1, wherein the conductive structure of the LED chip has no defined electrode assembly direction within the LED package.

3. The LED package of claim 1, wherein the LED package is implemented in any one of the following forms: pin type LED packaging, surface mount type LED packaging, chip-on-board direct-mount type LED packaging and system package type LED packaging.

4. The LED package of claim 1, wherein an electrode assembly direction of the LED package is not defined.

5. The LED package of claim 1, wherein said chip is a two-electrode chip.

6. The LED package of claim 1, wherein the first electrode and the second electrode are each a monolithic structure or a bi-monolithic structure.

7. The LED package of claim 1, further comprising two separate copper foils disposed along the longitudinal direction of the substrate, each copper foil extending out of a branch for connecting the conductive structures of the LED chips in series or in parallel.

8. The LED package of claim 7, wherein one branch of said copper foil is connected to each of said first electrodes and another branch of said copper foil is connected to each of said second electrodes, thereby enabling parallel connection between conductive structures of said LED chips.

9. A light emitting device comprising an LED light emitting assembly, wherein the LED light emitting assembly comprises the LED package according to any one of claims 1 to 8.

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