CN117457638A - Color LED lamp bead bracket capable of being internally provided with control chip - Google Patents
Color LED lamp bead bracket capable of being internally provided with control chip Download PDFInfo
- Publication number
- CN117457638A CN117457638A CN202311459900.8A CN202311459900A CN117457638A CN 117457638 A CN117457638 A CN 117457638A CN 202311459900 A CN202311459900 A CN 202311459900A CN 117457638 A CN117457638 A CN 117457638A
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- Prior art keywords
- bonding pad
- base
- pins
- color led
- pin
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- 239000011324 bead Substances 0.000 title claims abstract description 55
- 238000002955 isolation Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a color LED lamp bead bracket capable of being internally provided with a control chip, which comprises a base, a light reflecting cup arranged on the front surface of the base and a bonding pad arranged in the light reflecting cup, wherein the bonding pad comprises a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and two positive electrode pins, two negative electrode pins, a signal input pin and a signal output pin are arranged on two sides of the base. The invention has the advantages of reasonable pin arrangement, strong current carrying capacity, high product yield, more reliable electric connection and the like.
Description
Technical Field
The invention relates to a light-emitting device, and particularly discloses a color LED lamp bead bracket capable of being internally provided with a control chip.
Background
The color LED lamp beads with the control chips are arranged inside, namely, the control chips are packaged in the color LED lamp beads, the control chips are electrically connected with the three light-emitting chips of red, green and blue in the color LED lamp beads, and the control chips can control the brightness combination of the light-emitting chips. Therefore, the peripheral circuit structure and the manufacturing process of the external controller and the LED lamp beads can be simplified. The prior color LED lamp bead structure with the built-in control chip can refer to patent documents with patent number 2021222782073 and patent name of 'a conventional general bracket design built-in IC magical color LED lamp bead'. The LED lamp bead disclosed in the patent document comprises a support, a control chip and three light-emitting chips of red, green and blue are arranged on the support, six pins are uniformly distributed on two sides of the support, two pins are a positive power supply electrode and a negative power supply electrode respectively, two pins are a signal input pin and a signal output pin respectively, and the other two pins are a signal standby pin and a suspension pin respectively. The problems with this technique are: redundant signal spare pins and suspended pins waste the space of the bracket, and meanwhile, the signal pins and the anode pins are set to be the same size, so that the layout is unreasonable, and the current carrying capacity of the LED lamp beads is weakened.
Disclosure of Invention
Based on the above, it is necessary to provide a color LED lamp bead bracket with more reasonable pin arrangement, strong current carrying capability and more reliable electrical connection, in which a control chip can be built in, aiming at the problems of the prior art.
In order to solve the problems in the prior art, the invention discloses a color LED lamp bead bracket with a built-in control chip, which comprises a base, a light reflecting cup arranged on the front surface of the base and a bonding pad arranged in the light reflecting cup, wherein the bonding pad comprises a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and two positive electrode pins, two negative electrode pins, a signal input pin and a signal output pin are arranged on two sides of the base.
The beneficial effects of the invention are as follows: according to the invention, as the two positive electrode pins and the two negative electrode pins are arranged on the bracket, the positive electrode and the negative electrode of the color LED lamp bead can be connected with the circuit through the two positive electrode pins and the two negative electrode pins respectively, so that the current carrying capacity of the color LED lamp bead is improved, the product failure caused by the breakage or the cold welding of one pin can be prevented, the electric connection of the product is more reliable, and the yield is higher; because positive pin and negative pole pin mainly used transmission drive LED lamp pearl's electric current, its electric current is great, and signal pin mainly used transmission control signal, and its electric current is less, respectively sets up positive pin and negative pole pin as two, and signal input pin respectively set up to one, can more effectively utilize the space, and the overall arrangement is more reasonable.
As a further improvement of the invention: the two positive pins are respectively located on two sides of the base, the two negative pins are respectively located on two sides of the base, and the signal input pins and the signal output pins are respectively located on two sides of the base. Two positive electrode pins are positioned at one end of two sides of the base, two negative electrode pins are positioned at the other end of two sides of the base, and the signal input pin and the signal output pin are positioned at the centers of two sides of the base. The negative electrode pin, the signal input pin, the signal output pin and the positive electrode pin are bent from the front surface of the base to the back surface of the base through the side surfaces, and isolation ribs are arranged between every two adjacent pins on the back surface of the base. The two negative electrode pins and the first bonding pad are in an integrated structure, the two positive electrode pins and the fourth bonding pad are in an integrated structure, the signal input pin and the second bonding pad are in an integrated structure, and the signal input pin and the third bonding pad are in an integrated structure. The first bonding pad is used for installing a control chip, and the fourth bonding pad is used for installing a red light chip, a green light chip and a blue light chip.
Drawings
Fig. 1 is a schematic diagram of an assembly structure of a bracket base and a cup bowl.
Fig. 2 is a schematic view of the structure of the back of the bracket.
Fig. 3 is a schematic structural view of a color LED lamp bead.
Fig. 4 is a circuit configuration diagram of a color LED lamp bead.
Fig. 5 is a schematic view of a lamp strip structure with color LED beads connected in parallel.
Fig. 6 is a schematic circuit diagram of a color LED lamp bead using parallel-connected lamp strips.
Fig. 7 is a schematic view of a color LED light bead with a series connection of light strips.
Fig. 8 is a schematic circuit diagram of a color LED light bead using a series connected light strip.
Detailed Description
The invention will be further described with reference to the drawings and the detailed description below, in order to further understand the features, technical means, specific objects and functions of the invention. For convenience of description, one surface of the mounting pad on the support is a front surface, the other surface opposite to the front surface is a back surface, two sides of the mounting pin are side surfaces, and two ends of the non-mounting pin are end surfaces.
Reference is made to fig. 1 and 2. The color LED lamp bead bracket capable of internally arranging a control chip comprises an insulated base 10, wherein a first bonding pad 11, a second bonding pad 12, a third bonding pad 13 and a fourth bonding pad 14 are arranged on the front surface of the base 10. Two positive pins 140, two negative pins 110, one signal input pin 120 and one signal output pin 130 are provided on both sides of the base 10. The two positive electrode pins 140 are respectively located at two sides of the base 10 and near one end of the base 10, the two negative electrode pins 110 are respectively located at two sides of the base 10 and near the other end of the base 10, and the signal input pin 120 and the signal output pin 130 are respectively located at the central positions of two sides of the base 10, so that welding of the positive electrode pins and expansion of welding spots are more convenient. The two negative electrode pins 110, the two positive electrode pins 140, the signal input pin 120 and the signal output pin 130 are respectively in an integrated structure formed by cutting and punching the same plate with the first bonding pad 11, the fourth bonding pad 14, the second bonding pad 12 and the third bonding pad 13, so that the manufacturing is simpler, and the internal electric connection of the lamp beads is easier. The cathode pin 110, the signal input pin 120, the signal output pin 130 and the anode pin 140 are all bent from the front surface of the base 10 to the back surface of the base 1 through the side surfaces, so that the welding of the pins is more convenient. The spacer ribs 15 are disposed between the adjacent pins on the back of the base 10, so that it is possible to prevent the short circuit caused by the bonding of solder paste between the adjacent pins during soldering. The front surface of the base 10 is also provided with a reflective cup 16, and the first bonding pad 11, the second bonding pad 12, the third bonding pad 13 and the fourth bonding pad 14 are positioned in the reflective cup 16.
Reference is made to fig. 3 and 4. The color LED lamp bead with the built-in control chip comprises the bracket, the control chip 2 arranged on the first bonding pad 11, the red light chip R, the green light chip G, the blue light chip B arranged on the fourth bonding pad 14 and the transparent packaging colloid 3 filled in the reflecting cup 16. The control chip 2 is adhered to the first bonding pad 11 through insulating glue, the green light chip G and the blue light chip B are adhered to the fourth bonding pad 14 through insulating glue, and the positive electrode of the red light chip R is directly welded to the fourth bonding pad 14. Since the positive and negative electrodes of the green light chip G and the blue light chip B are on the same side of the chip, and the positive and negative electrodes of the red light chip R are respectively on two sides of the chip, the mounting mode of the latter is different from that of the former two. The control chip 2 includes a chip positive electrode VDD, a chip negative electrode GND, a signal input terminal DI, a signal output terminal DO, a red light output terminal OR, a green light output terminal OG, and a blue light output terminal OB. The chip positive electrode VDD and the chip negative electrode GND are electrically connected to the fourth pad 14 and the first pad 11, respectively, through wires, so as to be electrically connected to the positive electrode pin 140 and the negative electrode pin 110, respectively. The signal input terminal DI and the signal output terminal DO are electrically connected to the second pad 12 and the third pad 13, respectively, through wires, thereby being electrically connected to the signal input pin 120 and the signal output pin 130, respectively. The red light output end OR, the green light output end OG and the blue light output end OB of the control chip are respectively and electrically connected to the cathodes of the red light chip R, the green light chip G and the blue light chip B through leads, so that the luminous intensity of the three chips is controlled. The anodes of the green light chip G and the blue light chip B are electrically connected to the fourth pad 14 through wires, thereby being electrically connected to the anode pin 140. The invention mounts three light emitting chips by using one bonding pad of the fourth bonding pad 14, and has the advantages of easy installation and convenient bonding wire.
According to the invention, as the two positive electrode pins and the two negative electrode pins are arranged on the bracket, the positive electrode and the negative electrode of the color LED lamp bead can be connected with the circuit through the two positive electrode pins and the two negative electrode pins respectively, so that the current carrying capacity of the color LED lamp bead is improved, the product failure caused by the breakage or the cold welding of one pin can be prevented, the electric connection of the product is more reliable, and the yield is higher; because positive pin and negative pole pin mainly used transmission drive LED lamp pearl's electric current, its electric current is great, and signal pin mainly used transmission control signal, and its electric current is less, respectively sets up positive pin and negative pole pin as two, and signal input pin respectively set up to one, can more effectively utilize the space, and the overall arrangement is more reasonable.
Referring to fig. 5 to 8, a color LED strip employing the above color LED beads includes a circuit board 4 and a plurality of the above color LED beads. The circuit board 4 is provided with a power circuit and a signal circuit Vd, the power circuit is used for transmitting main current for driving the color LED lamp beads, and the signal circuit Vd is used for transmitting signal current. The two positive pins 140 and the two negative pins 110 of the color LED lamp beads are welded in the power circuit, and the signal input pins 120 and the signal output pins 130 thereof are welded in the signal circuit Vd. The colored LED lamp beads can be connected in series or in parallel on the circuit board 4.
When the colored LED lamp beads are connected in parallel, the circuit structure of the circuit board 4 can refer to fig. 5 and 6. The power supply circuit comprises a positive electrode circuit V+ and a negative electrode circuit V-. Two positive pins 140 of the color LED lamp beads are welded on the positive circuit V+, two negative pins 110 of the color LED lamp beads are welded on the negative circuit V-, and the signal circuit Vd is connected with the signal input pins 12 and the signal output pins 13 of two adjacent color LED lamp beads in series. Current flows from the positive electrode circuit v+ into the color LED lamp bead through the two positive electrode pins 140 and then flows from the two negative electrode pins 110 to the negative electrode circuit V-. The control signal is input from the signal input pin 120 of the first color LED lamp bead, then is transmitted to the signal input pin 120 of the second color LED lamp bead through the signal output pin 130 of the first color LED lamp bead, and the like to transmit the tail color LED lamp bead. In this scheme, the working voltage of the color LED lamp beads is generally about 3V, and the commercial power is 220V, so that a step-down transformer (i.e. a driving power supply) is generally required to be configured for use.
When the colored LED lamp beads are connected in series, the circuit board 4 may include one or more series units in parallel connection, and the circuit structure of one series unit may refer to fig. 7 and 8. The power supply circuit comprises two series circuits Vs, two positive pins 140 of the color LED lamp beads are respectively welded on the two series circuits Vs, two negative pins 110 are also respectively welded on the two series circuits Vs, and adjacent color LED lamp beads are respectively connected in series through the two positive pins 140 and the two negative pins 110. The signal circuit Vd connects in series the signal input pins 120 and the signal output pins 130 of two adjacent color LED lamp beads. Because the number of the series circuits Vs is two, the two groups of positive and negative pins of the color LED lamp beads are respectively connected in series, and the current carrying capacity of the circuit board is further increased. In this embodiment, the total series voltage of one series unit is generally set to be equal to the mains supply, so that the zero line of the mains supply can be directly electrically connected to the positive and negative poles of the series unit without a driving power supply. When the circuit board comprises a plurality of series units, an anode circuit V+ and a cathode circuit V-are also arranged on the circuit board, and the series units are connected to the anode circuit V+ and the cathode circuit V-in parallel, so that the zero line of the mains supply is directly electrically connected to the anode and the cathode of the series units for use.
As a further improvement of the present invention, the width of the positive electrode circuit v+ and the negative electrode circuit V-is larger than the signal circuit Vd. Because the positive electrode circuit V+ and the negative electrode circuit V-are used for transmitting the current for driving the LED lamp beads, the current is larger; the signal circuit Vd is used for transmitting control signal current, and the current is smaller, so that the space of the circuit board can be more effectively utilized, the current carrying capacity of the circuit board is further improved, the circuit voltage drop is reduced, and especially, the brightness of the LED lamp beads at the tail end of the lamp strip can be improved in the ultra-long lamp strip, and the overall brightness of the lamp strip is more uniform. As a further improvement of the solution, the welding points 40 on the positive electrode pins 140 and the negative electrode pins 110 extend from the side surface of the support to the end surface along the corner, and form an L-shaped wrapping structure for the pins. The welding spot strength is higher, and the electric connection is more reliable; meanwhile, the contact surface of the welding spot and the circuit is larger, and the current carrying capacity of the LED lamp bead is higher. As another form of the electrical connection structure of the present invention, the circuit board may be omitted, and a wire may be used instead of the power supply circuit and the signal circuit.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (6)
1. The utility model provides a color LED lamp pearl support that can embed control chip, includes the base, installs at the positive reflector cup of base and the pad of setting in the reflector cup, its characterized in that: the bonding pads comprise a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and two positive electrode pins, two negative electrode pins, a signal input pin and a signal output pin are arranged on two sides of the base.
2. The color LED lamp bead bracket with the built-in control chip according to claim 1, wherein the two positive pins are respectively located at two sides of the base, the two negative pins are respectively located at two sides of the base, and the signal input pin and the signal output pin are respectively located at two sides of the base.
3. The color LED lamp bead bracket with a built-in control chip according to claim 2, wherein: two positive electrode pins are positioned at one end of two sides of the base, two negative electrode pins are positioned at the other end of two sides of the base, and the signal input pin and the signal output pin are positioned at the centers of two sides of the base.
4. The color LED bead holder with a built-in control chip according to claim 3, wherein: the negative electrode pin, the signal input pin, the signal output pin and the positive electrode pin are bent from the front surface of the base to the back surface of the base through the side surfaces, and isolation ribs are arranged between every two adjacent pins on the back surface of the base.
5. The color LED light bead bracket with a built-in control chip according to claim 1, wherein: the two negative electrode pins and the first bonding pad are in an integrated structure, the two positive electrode pins and the fourth bonding pad are in an integrated structure, the signal input pin and the second bonding pad are in an integrated structure, and the signal input pin and the third bonding pad are in an integrated structure.
6. The color LED light bead bracket with a built-in control chip according to claim 1, wherein: the first bonding pad is used for installing a control chip, and the fourth bonding pad is used for installing a red light chip, a green light chip and a blue light chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311459900.8A CN117457638A (en) | 2023-11-03 | 2023-11-03 | Color LED lamp bead bracket capable of being internally provided with control chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311459900.8A CN117457638A (en) | 2023-11-03 | 2023-11-03 | Color LED lamp bead bracket capable of being internally provided with control chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117457638A true CN117457638A (en) | 2024-01-26 |
Family
ID=89594504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311459900.8A Pending CN117457638A (en) | 2023-11-03 | 2023-11-03 | Color LED lamp bead bracket capable of being internally provided with control chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117457638A (en) |
-
2023
- 2023-11-03 CN CN202311459900.8A patent/CN117457638A/en active Pending
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