CN115621404A - LED conductive structure without electric polarity separation, LED packaging body and light-emitting device - Google Patents

LED conductive structure without electric polarity separation, LED packaging body and light-emitting device Download PDF

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Publication number
CN115621404A
CN115621404A CN202211358677.3A CN202211358677A CN115621404A CN 115621404 A CN115621404 A CN 115621404A CN 202211358677 A CN202211358677 A CN 202211358677A CN 115621404 A CN115621404 A CN 115621404A
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China
Prior art keywords
chip
led
electrode
conductive
conducting
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CN202211358677.3A
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Chinese (zh)
Inventor
江道利
程朋朋
黄泳智
彭云飞
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Dongguan Guanqing Intelligent Lighting Technology Co ltd
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Dongguan Guanqing Intelligent Lighting Technology Co ltd
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Priority to CN202211358677.3A priority Critical patent/CN115621404A/en
Publication of CN115621404A publication Critical patent/CN115621404A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The application discloses electrically conductive structure of LED chip: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips. An LED package and a light emitting apparatus employing the conductive structure of the LED chip are also provided. This application is through changing the mode of connection of chip and electrode for a pair of chip is alternately parallelly connected, makes the LED chip not receive the restriction of electric polarity direction when carrying out single equipment, series connection equipment or parallelly connected equipment, in the follow-up production and the use that carry out the LED packaging body, also does not receive the restriction of electric polarity direction, has greatly promoted LED light-emitting equipment's production efficiency.

Description

LED conductive structure without electric polarity separation, LED packaging body and light-emitting device
Technical Field
The present disclosure relates to LED packaging technologies, and particularly to an LED conductive structure with no electric polarity difference, an LED package and a light emitting device.
Background
The main purpose of an LED package is to package a light emitting chip, which is a pn junction die composed of p-type and n-type semiconductors, in its core part, and when minority carriers and majority carriers injected into the pn junction are combined, visible light, ultraviolet light or near infrared light is emitted. The pn junction die is polar, i.e., has a positive and a negative polarity, so to successfully excite the pn junction die to emit light, the electrode assembly direction of the light emitting chip must be correctly distinguished. However, the application scenes of the LED lighting device are more and more abundant, the application range is wider and wider, and more producers are needed, if the LED package body is used or manufactured, the LED package body requires a user to have certain electrical knowledge, the positive electrode and the negative electrode of the light emitting chip or the LED package body can be correctly distinguished, on one hand, the mounting failure of the LED lighting device can be caused, the process of detecting faults is increased, the yield and the production efficiency are not favorably improved, on the other hand, the market competitiveness is possibly influenced due to insufficient foolproof design, and the market share of the product is not favorably improved.
In the prior art, when the technical problem of realizing the non-polarized installation of the LED is considered, the polarity conversion circuit is mainly realized by adding a polarity conversion circuit module outside an LED package body, and the polarity conversion circuit can be formed by connecting a plurality of secondary tubes in series and in parallel, and can also be realized by a bridge rectifier. However, the circuit improvement outside the LED package does not fundamentally solve the problem that the light emitting chip needs to be mounted in a predetermined electrode assembly direction.
Disclosure of Invention
The purpose of the present application is to at least partially overcome the defects in the prior art, and provide a conductive structure of an LED chip with a simpler structure and good fool-proof performance, and an LED package and a light emitting device using the conductive structure of the LED chip.
In order to achieve the technical purpose, the technical scheme adopted by the application is as follows:
in a first aspect, a conductive structure of an LED chip is provided, including:
the bracket is used as a mounting base of the chip;
a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support;
the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode;
and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips.
Preferably, the chip is a two-electrode chip.
In one possible embodiment, when the first and second electrodes are of a monolithic structure, each conductive sheet provides two connection points for connecting the first and second chips simultaneously.
Optionally, when a plurality of the conductive structures are laterally arranged side by side, each conductive sheet provides four connection points for connecting a pair of chips in the laterally adjacent conductive structures, so as to realize series connection of the plurality of conductive structures; and the same side of each conducting strip is connected with different chip electrodes.
Another alternative is that when a plurality of the conductive structures are arranged side by side longitudinally, a connection point is provided on the same side of each conductive sheet for connecting a pair of chips in the longitudinally adjacent conductive structures, so as to implement parallel connection of the plurality of conductive structures; the number of the connection points of each conducting strip is the same as that of the chips.
Another possible embodiment is that when the first electrode and the second electrode are in a two-piece structure, each conductive piece provides a connection point for connecting to the first chip or the second chip.
Optionally, when a plurality of the conductive structures are laterally arranged side by side, each conductive sheet provides two connection points for connecting a first chip or a second chip in the laterally adjacent conductive structures, so as to realize series connection of the plurality of conductive structures; each conducting strip is connected with different chip electrodes.
Further optionally, when the plurality of conductive structures are arranged side by side longitudinally, the first electrodes and the second electrodes of the plurality of pairs of biplate structures are arranged longitudinally, so as to realize parallel connection of the plurality of conductive structures.
In a second aspect, an LED package is provided, which employs the conductive structure of the LED chip as described above.
Further, the conductive structure of the LED chip is not limited in the electrode assembly direction within the LED package.
Optionally, the LED package is implemented in any one of the following forms: pin type LED packaging, surface mount type LED packaging, chip-on-board direct-mount type LED packaging and system package type LED packaging.
Further, an electrode assembling direction of the LED package is not limited.
In a third aspect, a light emitting device is provided, comprising an LED light emitting assembly comprising the conductive structure of an LED chip as described above, or an LED package as described above.
Compared with the prior art, the method has the following advantages:
(1) According to the LED packaging structure, the conductive structure of the LED chip is changed, the problem of the LED electrode assembling directivity is solved from a basic production link, the LED packaging structure is greatly different from other improved technical schemes based on an external circuit of an LED packaging body, and the follow-up improvement of the LED packaging technology is facilitated.
(2) The conductive structure of the LED chip only changes the wiring mode of the chip and the electrode, so that the pair of chips are connected in parallel in a crossed mode, the change of the original LED production line is small, and the quality of the LED is improved greatly.
(3) The utility model provides a conductive structure of LED chip makes the LED chip not receive the restriction of electric polarity direction when carrying out single equipment, series connection equipment or parallelly connected equipment, in the production and the use that follow-up carry out the LED packaging body, also does not receive the restriction of electric polarity direction, has greatly promoted LED lighting apparatus's production efficiency, is favorable to promoting the market competition advantage of relevant product.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a conductive structure of an LED chip according to the present application.
Fig. 2 is a schematic structural diagram of a first embodiment of the present application in series.
Fig. 3 is a schematic structural diagram of the first embodiment of the present application in parallel.
Fig. 4 is a schematic structural diagram of a second embodiment of a conductive structure of an LED chip according to the present application.
Fig. 5 is a schematic diagram of a tandem structure according to a second embodiment of the present application.
Fig. 6 is a schematic diagram of a parallel structure according to a second embodiment of the present application.
Fig. 7 is a schematic structural diagram of an embodiment of an LED package of the present application.
Fig. 8 is another schematic diagram of the parallel connection structure of the second embodiment of the present application.
Detailed Description
The present application is described in further detail below with reference to the attached drawings and the detailed description.
The LED (Light Emitting Diode) package refers to a package of a Light Emitting chip, and a general package is not only required to protect the Light Emitting chip, but also required to be transparent, so as to adjust color temperature and chromaticity of emitted visible Light, and ensure Light Emitting efficiency and heat dissipation. The LED package generally includes a substrate, an LED support, glue between the LED support and the chip, a conductive electrode or pin LED out from the support, a wire connecting the chip and the conductive electrode (or pin), and a cover layer for optically modifying the chip, and an additional physical protective layer is added if necessary.
The present application provides a conductive structure of an LED chip, as shown with reference to an embodiment of fig. 1, the conductive structure of the LED chip includes: support 1, a pair of conductive electrode, a pair of chip and the wire 4 of connecting a pair of conductive electrode and a pair of chip, specifically:
the support 1, which is used as a supporting structure and a heat dissipation structure of the chip, defines a volume of a minimum component unit of the LED package, and in this embodiment, the support 1 should be configured as a metal support or a non-metal support according to an application scenario of the LED. Further, the two ends of the bracket 1 are used for providing fixing positions of the pair of conductive electrodes.
The pair of conductive electrodes comprises a first electrode 21 and a second electrode 22 which are arranged at two ends of the bracket 1; the pair of chips, i.e., the light emitting chip in the LED package, includes a first chip 31 and a second chip 32 disposed side by side between the pair of conductive electrodes. The chips are double-electrode chips, the chips and the support 1 are fixed with conductive silver adhesive for crystal bonding, when the conducting wire 4 is further used for realizing conductive connection, the positive electrode and the negative electrode of the first chip 31 are respectively and electrically connected with the first electrode 21 and the second electrode 22, the positive electrode and the negative electrode of the second chip 32 are respectively and electrically connected with the second electrode 22 and the first electrode 21, namely, the chips and the conductive electrodes are connected in parallel in a crossing manner. Whether the power supply is direct current or alternating current, or whether the feeding current is fed from any direction of the first electrode 21 or the second electrode 22, any one of the pair of chips can be excited to emit light, so that the conductive structure of the LED chip of the present application is not limited by the electrode assembly direction.
When the aforementioned conductive structure of the single LED chip is packaged into a single LED package, assembling such an LED package into a light emitting apparatus does not need to consider an electrode assembling direction. When the conductive structures of the LED chips are mounted side by side, whether the conductive structures of the LED chips are in series or parallel, a plurality of adjacent pairs of conductive electrodes may be further optimally disposed:
referring to fig. 1, in one possible embodiment, the first electrode 21 and the second electrode 22 are monolithic structures, i.e. the first electrode 21 and the second electrode 22 are respectively formed by one conductive sheet a, each of which provides two connection points for simultaneously connecting the first chip 31 and the second chip 32. As shown in fig. 1, the first chip 31 and the second chip 32 are arranged at the center of the bracket 1 up and down, the conductive sheets a of the first electrode 21 and the second electrode 22 are arranged at the left end and the right end of the bracket 1, the right end of the conductive sheet a of the first electrode 21 provides two connection points respectively opposite to the first chip 31 and the second chip 32, the two connection points are connected with different chip electrodes, the upper connection point is connected with the anode of the first chip 31, and the lower connection point is connected with the cathode of the second chip 32; the left end of the conducting sheet a of the second electrode 22 provides two connection points opposite to the first chip 31 and the second chip 32, the two connection points are connected with different chip electrodes, the upper connection point is connected with the negative electrode of the first chip 31, and the lower connection point is connected with the positive electrode of the second chip 32.
When the LED lamp is used, current is fed from the first electrode 21 and then injected into the anode of the first chip 31 to excite the first chip 31 to emit light, at the moment, the current fed from the first electrode 21 is injected into the cathode of the second chip 32 to be incapable of breaking the state of internal electric field balance of the second chip 32, and the second chip 32 does not emit light; if the current is fed from the second electrode 22, the anode injected into the second chip 32 can excite the second chip 32 to emit light, the cathode injected into the first chip 31 cannot break the state of the internal electric field balance of the first chip 31, and the first chip 31 does not emit light. From this, the conducting structure of the LED chip of this application, no matter assemble with any kind of electrode direction, can both arouse that one of them chip is luminous. In another usage scenario, when one of the chips fails and does not emit light, the electrode assembly direction of the conductive structure of the LED chip is exchanged, so as to excite the other chip to emit light, and maintain the working state of the LED device.
When a plurality of the conductive structures of the first embodiment are arranged side by side, two conductive sheets a belonging to different conductive structures may be combined, as shown in fig. 2, the conductive sheet a between two sets of chips respectively performs the functions of the second electrode of the left conductive structure and the first electrode of the right conductive structure, at this time, the conductive sheet a provides four connection points for connecting a pair of chips in the adjacent conductive structures, the upper left connection point is connected with the negative electrode of the first chip 31 of the left conductive structure, the lower left connection point is connected with the positive electrode of the second chip 32 of the left conductive structure, the lower right connection point is connected with the negative electrode of the second chip 32 of the right conductive structure, and the upper right connection point is connected with the positive electrode of the first chip 31 of the right conductive structure, so that the same-side connection points of the conductive sheets a are connected with different chip electrodes. The plurality of conductive structures arranged side by side transversely in the above manner realize the series connection of the plurality of conductive structures.
When a plurality of the aforementioned conductive structures of the first embodiment are longitudinally side by side, two conductive sheets a belonging to different conductive structures are combined in another way: as shown in fig. 3, the first electrodes 21 belonging to different conductive structures are combined into a conductive sheet a, and the right side of the first electrode 21 is provided with a plurality of connection points respectively facing the chips, so that the number of the connection points on the first electrode 21 is the same as that of the chips; the chip electrode connected with each connecting point is different from other connecting points which are adjacent up and down. On the other hand, the second electrodes 22 belonging to different conductive structures are combined into one conductive sheet a, and the left side of the second electrode 22 provides a connection point, which is disposed in the same manner as the first electrode 21. Through the mode, the parallel connection of the plurality of conductive structures is realized.
Referring to fig. 4, another possible embodiment is that the first electrode 21 and the second electrode 22 are of a double-sheet structure, i.e. the first electrode 21 and the second electrode 22 are respectively formed by two separate conductive sheets b, and each conductive sheet b provides a connection point for connecting the first chip 31 or the second chip 32. The first chip 31 and the second chip 32 are vertically arranged in the center of the bracket 1, a pair of conducting strips b of the first electrode 21 are vertically arranged on the left side of the bracket 1, each conducting strip b is opposite to one chip, the right end of each conducting strip b is provided with a connection point, the conducting strip b above the first electrode 21 is connected with the anode of the first chip 31, the conducting strip b below the first electrode 21 is connected with the cathode of the second chip 32, and therefore, the two connection points provided by the first electrode 21 are connected with different chip electrodes; a pair of conducting strips b of the second electrode 22 are vertically arranged on the right side of the bracket 1, each conducting strip b is opposite to one chip, the left end of each conducting strip b provides a connection point, the conducting strip b above the second electrode 22 is connected with the negative electrode of the first chip 31, and the conducting strip b below the second electrode 22 is connected with the positive electrode of the second chip 32, so that two connection points provided by the second electrode 22 are connected with different chip electrodes. The double-piece type electrode can be connected in parallel by using a lead or welded in the same bonding pad to realize parallel connection outside the conductive structure.
When a plurality of the aforementioned conductive structures of the second embodiment are laterally juxtaposed, the conductive sheets b subordinate to the different conductive structures may also be combined. The conducting strips b between the two groups of chips respectively perform the functions of the second electrode 22 of the left conducting structure and the first electrode of the right conducting structure, at this time, in the upper and lower separated conducting strips b, the upper conducting strip b provides two connection points for connecting the first chip 31 in the adjacent conducting structure, specifically, the left connection point is connected with the negative electrode of the first chip 31 of the left conducting structure, and the right connection point is connected with the positive electrode of the first chip 31 of the right conducting structure; the lower conductive sheet b provides two connection points for connecting the second chips 32 in the adjacent conductive structures, specifically, the connection point on the left side is connected with the anode of the second chip 32 in the left conductive structure, and the connection point on the right side is connected with the cathode of the second chip 32 in the right conductive structure. Therefore, the same side connection points of the separated double-sheet conducting strips b are connected with different chip electrodes, and when the double-sheet conducting strips b are fixed in the same bonding pad, the two conducting strips b are connected in series. The plurality of conductive structures arranged side by side in the above manner realize the series connection of the plurality of conductive structures.
When a plurality of conductive structures of the foregoing second embodiment are longitudinally arranged side by side, it is only necessary to longitudinally arrange the first electrodes 21 and the second electrodes 22 of the plurality of conductive structures, and solder the conductive sheets b on the same side on the same pad, so as to connect the plurality of conductive structures in parallel, as shown in fig. 6.
The two embodiments have the same effect of realizing the non-polarized LED assembly.
The conductive structure of any of the above embodiments can be directly applied to an LED package. The LED package may include a pin type LED package, a Chip On Board (COB) LED package, and a system package type LED package according to a package structure. The LED packaging body containing a single conductive structure can be a pin type LED packaging body or a patch type LED packaging body, and the LED packaging body containing two or more conductive structures can be a patch type LED packaging body, a chip-on-board direct-mounted type LED packaging body or a system packaging type LED packaging body. As shown in fig. 7, the present application is a schematic structural diagram of a chip-on-board direct-mount LED package, in the COB package, a support of a conductive structure of each LED chip is integrally processed, the conductive structures of each LED chip are connected in series along an extending direction of the substrate 5 in the manner as described above, in this embodiment, the first electrode 21 and the second electrode 22 use a single-chip conductive sheet a, and those skilled in the art can replace the single-chip conductive sheet b with a double-chip conductive sheet b as needed.
The conductive structure of the LED chip of the second embodiment can also be connected in series or in parallel by using an external wire. Specifically, as shown in fig. 8, on a substrate of an LED package, a plurality of conductive structures of LED chips using a two-piece conductive sheet b are placed according to product requirements, two independent copper foils 6 are disposed along a longitudinal direction of the substrate, and if the conductive structures of the LED chips are required to be connected in parallel, a plurality of branches extend from one copper foil 6 for connecting with a first electrode 21 of each conductive structure, and a plurality of branches extend from the other copper foil 6 for connecting with a second electrode 22 of each conductive structure. Further, the structure shown in fig. 8 can also be understood as that the conductive structure of the LED chip using the two-piece conductive sheet b has been packaged into a single LED package, and when the LED package is assembled into an LED module, the parallel connection relationship between the LED packages is established on the module substrate by using the copper foil 6 on the substrate in the manner described above. The above strategy is applicable to parallel connection between conductive structures of LED chips employing the single-sheet conductive sheet a, and also applicable to parallel connection between single LED packages of conductive structures of LED chips employing the single-sheet conductive sheet a. According to the common knowledge of the skilled person, the series connection between the conductive structures of the LED chips using the single conductive sheet a or the series connection between the individual LED packages of the conductive structures of the LED chips using the single conductive sheet a can be realized by changing the branch connection position of the copper foil 6. The electrode assembly direction of the conductive structure of the LED chip using the monolithic conductive sheet a or the single LED package of the conductive structure of the LED chip using the monolithic conductive sheet a is not limited.
When the LED package bodies are assembled by using the LED chip conductive structure of the present application, the electrode assembly direction of the LED chip conductive structure in the LED package bodies is not limited, and further, when the assembled LED package bodies are further assembled into LED light emitting assemblies, the electrode assembly method of the LED package body in the LED light emitting assemblies of the present application is also not limited. The aforementioned LED light emitting assembly is generally applied to light emitting devices such as various indicator lights, backlights, illuminating lamps, and display screens, and the LED light emitting assembly capable of emitting ultraviolet light can also be applied to ultraviolet disinfection products.
To sum up, the present application provides a conductive structure of an LED chip, comprising: the bracket is used as a mounting base of the chip; a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support; the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode; and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips. Also provided are an LED package and a light emitting apparatus employing the conductive structure of the LED chip. This application is through the conducting structure who changes the LED chip, has changed the mode of connection of chip and electrode, makes a pair of chip alternately parallelly connected, makes the LED chip not receive the restriction of electric polarity direction when carrying out single equipment, series connection equipment or parallelly connected equipment, in the follow-up production and the use that carry out the LED packaging body, also does not receive the restriction of electric polarity direction, has greatly promoted LED light emitting equipment's production efficiency, is favorable to promoting the market competition advantage of relevant product.
The above embodiments are only preferred embodiments of the present application, but not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present application should be construed as equivalents and are included in the scope of the present application.

Claims (13)

1. An electrically conductive structure of an LED chip, comprising:
the bracket is used as a mounting base of the chip;
a pair of conductive electrodes including a first electrode and a second electrode, disposed at both ends of the support;
the pair of chips comprises a first chip and a second chip, wherein the anode and the cathode of the first chip are respectively and electrically connected with the first electrode and the second electrode, and the anode and the cathode of the second chip are respectively and electrically connected with the second electrode and the first electrode;
and the conducting wire is used for realizing the electrical connection between the pair of conducting electrodes and the pair of chips.
2. The conductive structure of an LED chip of claim 1, wherein said chip is a two-electrode chip.
3. The conductive structure of an LED chip of claim 1, wherein when said first and second electrodes are of a monolithic construction, each conductive sheet provides two connection points for simultaneously connecting said first and second chips.
4. The conductive structure of an LED chip according to claim 3, wherein when a plurality of said conductive structures are laterally side by side, each of said conductive sheets provides four connection points for connecting a pair of chips in laterally adjacent said conductive structures for enabling a series connection of a plurality of said conductive structures; and the same side of each conducting strip is connected with different chip electrodes.
5. The conducting structure of an LED chip according to claim 3, wherein when a plurality of the conducting structures are arranged side by side longitudinally, the same side of each conducting strip provides a connection point for connecting a pair of chips in the longitudinally adjacent conducting structures, so as to implement parallel connection of the plurality of conducting structures; the number of the connection points of each conducting strip is the same as that of the chips.
6. The conductive structure of an LED chip according to claim 1, wherein when the first and second electrodes are in a dual-sheet structure, each conductive sheet provides a connection point for connecting to the first or second chip.
7. The conductive structure of an LED chip according to claim 6, wherein when a plurality of said conductive structures are laterally arranged side by side, each of said conductive sheets provides two connection points for connecting a first chip or a second chip in laterally adjacent said conductive structures, for enabling a series connection of a plurality of said conductive structures; each conducting strip is connected with different chip electrodes.
8. The conducting structure of an LED chip according to claim 6, wherein when a plurality of the conducting structures are arranged side by side in the longitudinal direction, a plurality of pairs of the first electrodes and the second electrodes of the two-piece structure are arranged in the longitudinal direction for realizing parallel connection of the plurality of the conducting structures.
9. An LED package, characterized in that it employs the conductive structure of the LED chip according to any one of claims 1 to 8.
10. The LED package of claim 9, wherein the conductive structure of the LED chip has no defined electrode assembly direction within the LED package.
11. The LED package of claim 9, wherein the LED package is implemented in any one of the following forms: pin type LED package, surface mount type LED package, chip-on-board direct-mount type LED package, and system package type LED package.
12. The LED package of claim 9, wherein an electrode assembly direction of the LED package is not defined.
13. A light emitting device comprising an LED light emitting assembly, wherein the LED light emitting assembly comprises the conductive structure of the LED chip according to any one of claims 1 to 8, or the LED package according to any one of claims 9 to 12.
CN202211358677.3A 2022-11-01 2022-11-01 LED conductive structure without electric polarity separation, LED packaging body and light-emitting device Pending CN115621404A (en)

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