CN218498067U - Waterproof type multilayer ceramic packaging structure - Google Patents
Waterproof type multilayer ceramic packaging structure Download PDFInfo
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- CN218498067U CN218498067U CN202222202299.1U CN202222202299U CN218498067U CN 218498067 U CN218498067 U CN 218498067U CN 202222202299 U CN202222202299 U CN 202222202299U CN 218498067 U CN218498067 U CN 218498067U
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- multilayer ceramic
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- caulking groove
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Abstract
The utility model discloses a waterproof multilayer ceramic packaging structure, which comprises a multilayer ceramic body and a packaging cover plate; the multilayer ceramic body is provided with a packaging cavity with an upward opening; the packaging cover plate covers the opening of the packaging cavity; the edge of the opening of the packaging cavity is concavely provided with an annular caulking groove, the lower part of the packaging cover plate is embedded in the annular caulking groove, the peripheral bottom surface of the packaging cover plate and the annular caulking groove are sealed and fixed through sealant, and an annular space is formed between the outer side surface of the upper part of the packaging cover plate and the top surface of the multilayer ceramic body. Through having sealed gluey in the packing of annular caulking groove to the cooperation has been realized multiple waterproof sealing fixedly by interior toward having filled glass glue and waterproof material outward in proper order in the annular space, and product structure is more firm, and the encapsulation apron is difficult for droing, and the better ideal of water-proof effects can carry out fine protection to the wafer in the encapsulation cavity, thereby has prolonged the life of product greatly.
Description
Technical Field
The utility model belongs to the technical field of the device encapsulation technique and specifically relates to indicate a waterproof type multilayer ceramic packaging structure.
Background
The ceramic substrate means that a copper foil is directly bonded to alumina (Al) at a high temperature 2 O 3 ) Or a special process plate on the surface (single or double side) of an aluminum nitride (AlN) ceramic substrate. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soft weldability and high adhesion strength, can be etched into various patterns like a PCB (printed Circuit Board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.
Along with the continuous development of miniature electronic products, more and more electronic devices are arranged on the ceramic substrate, more and more required conductive circuits are also arranged, a multilayer ceramic substrate structure is provided at present, the conductive circuits are arranged between two adjacent ceramic plates, and the structure of a single-sided wiring circuit can be effectively simplified.
In the prior art, the packaging of the multilayer ceramic substrate is generally carried out by only adopting sealant, namely the sealant is coated on the periphery of the bottom surface of the packaging cover plate, then the packaging cover plate is attached and fixed on the top surface of the ceramic substrate to cover the packaging cavity, the waterproof sealing effect of the packaging structure is very poor, the packaging cover plate is easy to fall off and is unstable, the wafer in the packaging cavity cannot be well protected, and the service life is very short. Therefore, there is a need for an improved package structure.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a waterproof multilayer ceramic package structure, which can effectively solve the problem of poor waterproof sealing effect of the existing package structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a waterproof multilayer ceramic packaging structure comprises a multilayer ceramic body and a packaging cover plate; the multilayer ceramic body is provided with a packaging cavity with an upward opening; the packaging cover plate covers the opening of the packaging cavity; the concave annular caulking groove that is equipped with in opening edge of this encapsulation cavity, the lower part of this encapsulation apron inlays in the annular caulking groove, seals through sealed glue between the peripheral bottom surface of encapsulation apron and the annular caulking groove and fixes, is formed with annular space between the upper portion lateral surface of this encapsulation apron and multilayer ceramic body's the top surface, has glass glue and waterproof material by inside to outside packing in proper order in this annular space, and this waterproof material covers glass glue.
As a preferable scheme, the multilayer ceramic body comprises a plurality of ceramic plates, a dam and a plurality of bonding pads; the ceramic plates are overlapped and fixed together up and down, and a conducting circuit is clamped between every two adjacent ceramic plates; the dam is formed and fixed on the surface of the uppermost ceramic plate and forms the packaging cavity in a surrounding way, and the annular caulking groove and the annular space are both positioned on the dam; the plurality of bonding pads are arranged on the surface of the ceramic plate at the top and positioned in the packaging cavity, and the plurality of bonding pads are respectively connected with the corresponding conductive circuits in a conduction mode through the corresponding conducting holes.
Preferably, the box dam is a metal box dam which is formed and fixed on the surface of the uppermost ceramic plate by electroplating.
Preferably, the edge of the inner side edge of the annular caulking groove protrudes upwards to form a baffle ring.
As a preferred scheme, the bottom surface of the annular caulking groove is concavely provided with a plurality of first annular grooves which are arranged at intervals from inside to outside, the peripheral bottom surface of the packaging cover plate is concavely provided with a plurality of second annular grooves which are arranged at intervals from inside to outside, and the sealant is filled in the first annular grooves and the second annular grooves.
Preferably, the waterproof material is ultraviolet glue, and the waterproof material is coated in a range larger than that of the glass glue and completely covers the outer surface of the glass glue.
Preferably, the ultraviolet glue is acrylate.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
through having sealed gluey in the packing of annular caulking groove to the cooperation has been realized multiple waterproof sealing fixedly by interior toward having filled glass glue and waterproof material outward in proper order in the annular space, and product structure is more firm, and the encapsulation apron is difficult for droing, and the better ideal of water-proof effects can carry out fine protection to the wafer in the encapsulation cavity, thereby has prolonged the life of product greatly.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a cross-sectional view of a preferred embodiment of the present invention.
Description of the figures:
10. multilayer ceramic body 11, ceramic plate
12. Dam 13 and bonding pad
14. Conductive line 15, via hole
101. Package cavity 102, annular nest
103. Baffle ring 104, first annular groove
105. Annular space 20, encapsulation cover plate
21. Second annular groove 30, sealant
40. Glass cement 50, waterproof material.
60. A wafer.
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the present invention is shown, which includes a multi-layered ceramic body 10 and a package cover plate 20.
The multilayer ceramic body 10 has an upwardly open package cavity 101, and an annular caulking groove 102 is recessed at an opening edge of the package cavity 101. Specifically, the multilayer ceramic body 10 includes a plurality of ceramic plates 11, a dam 12, and a plurality of pads 13; the plurality of ceramic plates 11 are overlapped and fixed together up and down, and a conducting circuit 14 is arranged between every two adjacent ceramic plates 11; the dam 12 is fixed on the surface of the uppermost ceramic plate 11 and forms the packaging cavity 101, and the annular caulking groove 102 is positioned on the dam 12; the plurality of pads 13 are disposed on the surface of the uppermost ceramic board 11 and located in the package cavity 101, and the plurality of pads 13 are electrically connected to the corresponding conductive traces 14 through the corresponding via holes 15, respectively. And, the dam 12 is a metal dam, it is fixed on the surface of the upmost ceramic plate 11 by way of electroplating, in order to realize better waterproof sealing function, in addition, the inner edge of the annular caulking groove 102 is formed with the baffle ring 103 in a protruding way upwards, in order to stop the sealant 30 from flowing into the encapsulation cavity 101, and, the bottom surface of the annular caulking groove 102 is concavely provided with a plurality of first annular grooves 104, the plurality of first annular grooves 104 are arranged from inside to outside at intervals.
The package cover 20 covers the opening of the package cavity 101; the lower part of the package cover plate 20 is embedded in the annular caulking groove 102, the bottom surface of the periphery of the package cover plate 20 is fixed with the annular caulking groove 102 in a sealing manner through the sealant 30, an annular space 105 is formed between the outer side surface of the upper part of the package cover plate 20 and the top surface of the multilayer ceramic body 10, the annular space 105 is filled with the glass cement 40 and the waterproof material 50 from inside to outside in sequence, and the waterproof material 50 covers the glass cement 40. In this embodiment, the package cover plate 20 is made of a transparent material, the annular space 105 is located on the dam 12, a plurality of second annular grooves 21 are concavely formed on the bottom surface of the periphery of the package cover plate 20, the plurality of second annular grooves 21 are arranged from inside to outside at intervals, and the sealant 30 fills the plurality of first annular grooves 104 and the plurality of second annular grooves 21, so as to achieve a better waterproof sealing effect; and the waterproof material 50 is ultraviolet glue, the coating range of the waterproof material 50 is larger than that of the glass glue and completely covers the outer surface of the glass glue 40, and the ultraviolet glue is acrylate.
During packaging, firstly, the wafer 60 is placed in the packaging cavity 101 and is fixed against the bonding pad 13, and then the wafer 60 is welded and conducted with the corresponding bonding pad 13; then, the sealant 30 is injected into the annular caulking groove 102, then the packaging cover plate 20 is embedded into the annular caulking groove 102 from top to bottom, after the packaging cover plate is embedded in place, the glass cement 40 and the waterproof material 50 are sequentially filled into the annular space 105 from inside to outside, and the sealant 30, the glass cement 40 and the waterproof material 50 which are arranged in a matched mode achieve multiple waterproof sealing fixation, so that the product structure is more stable, and the waterproof effect is more ideal.
The utility model discloses a design focus lies in: through having sealed gluey in the packing of annular caulking groove to the cooperation has been realized multiple waterproof sealing fixedly by interior toward having filled glass glue and waterproof material outward in proper order in the annular space, and product structure is more firm, and the encapsulation apron is difficult for droing, and the better ideal of water-proof effects can carry out fine protection to the wafer in the encapsulation cavity, thereby has prolonged the life of product greatly.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (7)
1. A waterproof multilayer ceramic packaging structure comprises a multilayer ceramic body and a packaging cover plate; the multilayer ceramic body is provided with a packaging cavity with an upward opening; the packaging cover plate covers the opening of the packaging cavity; the method is characterized in that: the concave annular caulking groove that is equipped with in opening edge of this encapsulation cavity, the lower part of this encapsulation apron inlays in the annular caulking groove, seals through sealed glue between the peripheral bottom surface of encapsulation apron and the annular caulking groove and fixes, is formed with annular space between the upper portion lateral surface of this encapsulation apron and multilayer ceramic body's the top surface, has glass glue and waterproof material by inside to outside packing in proper order in this annular space, and this waterproof material covers glass glue.
2. The waterproof multilayer ceramic package structure according to claim 1, wherein: the multilayer ceramic body comprises a plurality of ceramic plates, a dam and a plurality of welding pads; the ceramic plates are overlapped and fixed together up and down, and a conducting circuit is clamped between every two adjacent ceramic plates; the dam is formed and fixed on the surface of the ceramic plate at the top and forms the packaging cavity in a surrounding way, and the annular caulking groove and the annular space are both positioned on the dam; the plurality of bonding pads are arranged on the surface of the ceramic plate at the top and positioned in the packaging cavity, and the plurality of bonding pads are respectively connected with the corresponding conductive circuits in a conduction mode through the corresponding conducting holes.
3. The waterproof multilayer ceramic package structure according to claim 2, wherein: the box dam is a metal box dam which is formed and fixed on the surface of the ceramic plate at the top in an electroplating mode.
4. The waterproof multilayer ceramic package structure according to claim 1, wherein: the edge of the inner side edge of the annular caulking groove protrudes upwards to form a retaining ring.
5. The waterproof multilayer ceramic package structure according to claim 1, wherein: the concave a plurality of first annular grooves that are equipped with in bottom surface of annular caulking groove, these a plurality of first annular grooves are by interior toward outer interval setting, the concave a plurality of second annular grooves that are equipped with in the periphery bottom surface of this encapsulation apron, these a plurality of second annular grooves are by interior toward outer interval setting, a plurality of first annular grooves and a plurality of second annular grooves of filling of aforementioned sealed glue.
6. The waterproof multilayer ceramic package structure according to claim 1, wherein: the waterproof material is ultraviolet glue, the coating range of the waterproof material is larger than that of the glass glue, and the waterproof material completely covers the outer surface of the glass glue.
7. The waterproof multilayer ceramic package structure according to claim 6, wherein: the ultraviolet glue is acrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222202299.1U CN218498067U (en) | 2022-08-22 | 2022-08-22 | Waterproof type multilayer ceramic packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222202299.1U CN218498067U (en) | 2022-08-22 | 2022-08-22 | Waterproof type multilayer ceramic packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218498067U true CN218498067U (en) | 2023-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222202299.1U Active CN218498067U (en) | 2022-08-22 | 2022-08-22 | Waterproof type multilayer ceramic packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218498067U (en) |
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2022
- 2022-08-22 CN CN202222202299.1U patent/CN218498067U/en active Active
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