CN218482196U

CN218482196U - Even flow component and semiconductor process equipment

Info

Publication number: CN218482196U
Application number: CN202222528995.1U
Authority: CN
Inventors: 赵代红; 唐希文
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-02-14
Anticipated expiration: 2032-09-23

Abstract

The utility model discloses an even part and semiconductor process equipment that flows relates to the semiconductor technology field, and even part that flows is used for carrying out even flow to the process gas who gets into semiconductor process cavity, include: the bottom plate is provided with a plurality of through holes at intervals along the thickness direction; the plurality of air inlet plates are detachably connected with the bottom plate and correspond to the plurality of through holes one by one, and a plurality of air inlet holes are formed in the air inlet plates and are used for being communicated with the interior of the semiconductor process chamber; this even part that flows has a plurality of inlet plates that bottom plate and a plurality of detachably set up on the bottom plate, and a plurality of inlet plates form a plurality of modules that admit air, when the aperture size of the inlet port of certain position on the bottom plate needs to be adjusted, need not to dismantle whole even part that flows and revise or change, only need dismantle in the inlet plate that corresponds the position can, reduce cost raises the efficiency.

Description

Even flow component and semiconductor process equipment

Technical Field

The utility model belongs to the technical field of the semiconductor, more specifically relates to an even flow part and semiconductor process equipment.

Background

In a semiconductor process, such as an etching process or a film forming process for a wafer, a uniform flow component is disposed above a process chamber for uniform flow delivery of a process gas. The theoretical state of the uniform flow component in the working process is to completely and uniformly convey the process gas into the process chamber, but the actual state is that the process gas conveyed into the process chamber is locally uneven due to processing errors of the uniform flow component and the process chamber and the like. Taking an etching process as an example, when the etching rate of a wafer is not uniform due to local unevenness of process gas, the aperture size of an air inlet hole on a uniform flow component needs to be manually adjusted according to the process result, the aperture is generally increased at a place with a slow etching rate, and the aperture is reduced at a place with a fast etching rate. The existing uniform flow component is an integral structural part, a plurality of air inlets are arranged on the existing uniform flow component, and the size of any one or more air inlets on the existing uniform flow component needs to be adjusted, so that the whole uniform flow component needs to be disassembled for replacement or modification, and the existing uniform flow component is high in cost and low in efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an even part and semiconductor process equipment that flows that exists among the prior art, solve the even part that flows of current semiconductor process equipment and be an overall structure spare, when needs are adjusted the aperture size of inlet port above that, need dismantle whole even part and change or modify, problem with high costs and inefficiency.

In order to achieve the above object, the present invention provides a uniform flow component for uniformly flowing a process gas into a semiconductor process chamber, comprising:

the bottom plate is provided with a plurality of through holes at intervals along the thickness direction;

the plurality of air inlet plates are detachably connected with the bottom plate and correspond to the plurality of through holes one by one, and a plurality of air inlet holes are formed in the air inlet plates and are used for being communicated with the inside of the semiconductor process chamber.

Optionally, the number and/or the aperture of the air inlet holes on the plurality of air inlet plates are the same or different.

Optionally, the plurality of air inlet plates form at least one ring of annular arrangement on the bottom plate.

Optionally, the uniform flow component further comprises a cylindrical part, one end of the cylindrical part is connected to the periphery of the bottom plate, the other end of the cylindrical part extends outwards along the radial direction to form an annular installation part, and the installation part is used for being detachably connected with the semiconductor process chamber.

Optionally, be provided with a plurality of mounting grooves on the bottom plate, it is a plurality of the through-hole is seted up respectively a plurality of the tank bottom of mounting groove, every inlet plate detachably installs one in the mounting groove, just the inlet plate is installed when in the mounting groove the upper surface of inlet plate with the upper surface parallel and level of bottom plate.

Optionally, an annular protruding portion is arranged on the bottom surface of the air inlet plate, an annular groove portion matched with the protruding portion is arranged on the bottom of the mounting groove, the groove portion is located on the outer side of the through hole, an annular metal sealing gap is formed between the inner peripheral wall of the protruding portion and the groove wall of the groove portion, and the metal sealing gap is used for mounting a metal sealing element.

Optionally, be provided with annular sealing washer mounting groove on the tank bottom of mounting groove, the sealing washer mounting groove is in the outside of through-hole, the sealing washer mounting groove is used for installing the sealing washer, the sealing washer mounting groove encircle set up in the outside in metal seal clearance.

Optionally, an air inlet communicating channel is arranged inside at least one air inlet plate, and the air inlet communicating channel is communicated with at least two of the plurality of air inlet holes.

The utility model also provides a semiconductor process equipment, include semiconductor process cavity and foretell even flow part.

Optionally, the semiconductor process chamber further comprises a chamber body, a chamber cover plate and an air inlet cover plate, the chamber cover plate is arranged at the top of the chamber body, the uniform flow component is detachably and hermetically connected with the chamber cover plate, and the air inlet cover plate is arranged above the uniform flow component.

The utility model provides an even flow part and semiconductor process equipment, its beneficial effect lies in: this even part that flows has a plurality of inlet plates that bottom plate and a plurality of detachably set up on the bottom plate, and a plurality of inlet plates form a plurality of modules that admit air, when the aperture size of the inlet port of certain position on the bottom plate needs to be adjusted, need not to dismantle whole even part that flows and revise or change, only need dismantle in the inlet plate that corresponds the position can, reduce cost raises the efficiency.

Other features and advantages of the present invention will be described in detail in the detailed description which follows.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings, wherein like reference numerals generally represent like parts throughout the exemplary embodiments.

Fig. 1 shows a schematic three-dimensional structure of a flow uniforming member according to an embodiment of the present invention.

Fig. 2 shows a schematic top view of a flow homogenizing member according to an embodiment of the present invention.

Fig. 3 shows a schematic cross-sectional view of a flow distribution member according to an embodiment of the present invention.

Fig. 4 shows an overall structure diagram of the bottom plate, the cylindrical part and the mounting part of a uniform flow component according to an embodiment of the present invention.

Fig. 5 shows a schematic three-dimensional structure of an inlet plate of a uniform flow component according to an embodiment of the present invention.

Fig. 6 is a partially enlarged schematic view illustrating the matching of the air inlet plate and the bottom plate of a uniform flow component according to an embodiment of the present invention.

Fig. 7 is a partially enlarged schematic view illustrating a protrusion portion and a groove portion of a uniform flow member according to an embodiment of the present invention.

Fig. 8 shows a schematic top view of an intake plate of a uniform flow component according to an embodiment of the present invention.

Fig. 9 shows a schematic sectional structure view of the direction a of fig. 8.

Fig. 10 is a partial schematic structural view of an intake plate of a uniform flow component according to an embodiment of the present invention.

Fig. 11 shows a schematic block diagram of a semiconductor processing apparatus according to an embodiment of the present invention.

Description of the reference numerals:

1. a base plate; 2. a through hole; 3. an air intake plate; 4. an air inlet; 5. a cylindrical portion; 6. an installation part; 7. mounting grooves; 8. a boss portion; 9. a groove part; 10. a metal seal gap; 11. a sealing ring mounting groove; 12. an intake communication passage; 13. mounting holes; 14. a threaded hole; 15. a chamber body; 16. a chamber cover plate; 17. air inlet cover plate.

Detailed Description

Preferred embodiments of the present invention will be described in more detail below. While the following describes preferred embodiments of the present invention, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

As shown in fig. 1 to 3, the present invention provides a uniform flow component for uniformly flowing a process gas into a semiconductor process chamber, comprising:

the bottom plate 1 is provided with a plurality of through holes 2 at intervals along the thickness direction of the bottom plate 1;

a plurality of inlet plates 3, a plurality of inlet plates 3 can be dismantled with bottom plate 1 and be connected to with a plurality of through-holes 2 one-to-one, seted up a plurality of inlet ports 4 on the inlet plate 3, inlet port 4 is used for the inside intercommunication with semiconductor process chamber.

Specifically, the problems that in the prior art, a uniform flow component of semiconductor process equipment is an integral structural member, and when the aperture size of an air inlet 4 on the uniform flow component needs to be adjusted, the whole uniform flow component needs to be detached for replacement or modification, so that the cost is high and the efficiency is low are solved; the utility model provides an even part that flows has bottom plate 1 and a plurality of inlet plates 3 that a plurality of detachably set up on bottom plate 1, and a plurality of inlet plates 3 form a plurality of air inlet modules, when needs are adjusted the aperture size of inlet port 4 of certain position on bottom plate 1, need not to dismantle whole even part that flows and modify or change, only need dismantle be in corresponding the position inlet plate 3 can, reduce cost raises the efficiency.

Optionally, the number and/or the aperture of the air inlet holes 4 on the plurality of air inlet plates 3 are the same or different.

Specifically, the apertures of the plurality of air inlet holes 4 on each air inlet plate 3 are the same or different; according to the actual process requirements, the apertures of the air inlets 4 on the same air inlet plate 3 can be the same or different, and flexible adjustment can be realized by replacing the air inlet plate 3. The air inlet plate 3 can be various, and the number and/or the aperture of the air inlet holes 4 on various air inlet plates 3 are different; can set up multiple air inlet plate 3, every kind of air inlet plate 3 is provided with a plurality ofly, and the appearance of the air inlet plate 3 of heterogeneous is the same, and the quantity and/or the aperture of inlet port 4 on the air inlet plate 3 of heterogeneous are different, can install a plurality of the same kind or the air inlet plate 3 of heterogeneous as required on bottom plate 1, and it is more nimble to use, and the adjustment in local inlet port 4 aperture can directly change the air inlet plate 3 of heterogeneous, and is more convenient.

Alternatively, the plurality of inlet plates 3 forms an annular arrangement of at least one turn in the bottom plate 1.

In this embodiment, air inlet plate 3 is fan-shaped, and bottom plate 1 is circular, and a plurality of air inlet plate 3 are the annular along bottom plate 1's circumference and arrange.

In other embodiments, the plurality of fan-shaped air inlet plates 3 may also form a multi-turn annular arrangement along a plurality of circumferences with different diameters; alternatively, the intake plate 3 may be provided in other shapes such as a circle, a square, and a polygon, as needed.

Optionally, the flow equalizing part further comprises a cylindrical part 5, one end of the cylindrical part 5 is connected to the periphery of the bottom plate 1, the other end of the cylindrical part 5 extends outwards along the radial direction to form an annular mounting part 6, and the mounting part 6 is used for being detachably connected with the semiconductor process chamber.

Specifically, as shown in fig. 4, the bottom plate 1, the cylindrical portion 5 and the mounting portion 6 are connected to form an integrated structure, the lower end of the cylindrical portion 5 is connected to the periphery of the bottom plate 1, an air inlet cavity is formed above the bottom plate 1, and process gas firstly enters the air inlet cavity before being input into the semiconductor process cavity through the air inlet holes 4, so that the uniform flow effect is improved.

In the present embodiment, the bottom plate 1, the cylindrical portion 5, and the mounting portion 6 are integrally molded.

Optionally, a plurality of mounting grooves 7 are formed in the bottom plate 1, the bottoms of the mounting grooves 7 are respectively provided with the through holes 2, each air inlet plate 3 is detachably mounted in one mounting groove 7, and the upper surface of each air inlet plate 3 is flush with the upper surface of the bottom plate 1 when the air inlet plates 3 are mounted in the mounting grooves 7.

Specifically, as shown in fig. 5 and 10, a plurality of mounting grooves 7 on the bottom plate 1 are uniformly distributed at intervals along the circumferential direction of the bottom plate 1, and the air inlets 4 on the air inlet plate 3 can be communicated with the semiconductor process chamber by the through holes 2 at the bottoms of the mounting grooves 7, so as to convey the process gas; air inlet plate 3 detachably inlays establishes in mounting groove 7, and its upper surface is parallel and level with the upper surface of bottom plate 1 when air inlet plate 3 installs in mounting groove 7, avoids producing the vortex, improves even effect of flowing.

Optionally, the bottom surface of the air inlet plate 3 is provided with an annular protrusion portion 8, an annular groove portion 9 adapted to the protrusion portion 8 is provided on the bottom of the mounting groove 7, the groove portion 9 is located outside the through hole 2, an annular metal sealing gap 10 is formed between the inner circumferential wall of the protrusion portion 8 and the groove wall of the groove portion 9, and the metal sealing gap 10 is used for mounting a metal sealing element.

Specifically, as shown in fig. 6, a protruding portion 8 on the lower side of the air intake plate 3 is in embedded fit with a groove portion 9 on the bottom of the mounting groove 7; in the embodiment, the air inlet plate 3 is provided with a mounting hole 13, the bottom of the mounting groove 7 is provided with a threaded hole 14, and the air inlet plate 3 can be mounted in the mounting groove 7 through a bolt to realize detachable mounting; as shown in fig. 7, a metal sealing gap 10 with a wide bottom and a narrow top is formed between the outer peripheral wall of the protruding portion 8 and the groove wall of the groove portion 9, and a metal sealing element is installed in the metal sealing gap 10 to realize metal sealing; in this embodiment, the metal seal is a metal flange seal.

Optionally, an annular sealing ring mounting groove 11 is arranged on the bottom of the mounting groove 7, the sealing ring mounting groove 11 is located outside the through hole 2, the sealing ring mounting groove 11 is used for mounting a sealing ring, and the sealing ring mounting groove 11 is circumferentially arranged outside the metal sealing gap 10.

Specifically, the sealing ring in the prior art is low in cost, is generally a rubber sealing ring, but cannot be used in working conditions with strong corrosivity, high temperature and high cleanliness requirement; the metal sealing element can resist higher temperature and corrosion, does not generate particles, can be used in the working conditions with high requirements on high temperature and cleanliness, and has high cost; for the working conditions of low corrosivity, low temperature and low cleanliness requirement, if only a metal sealing element is used for sealing, the cost is increased; therefore, as shown in fig. 6, the groove bottom of the mounting groove 7 of the present invention is not only provided with the metal sealing gap 10, but also provided with the sealing ring mounting groove 11, and the sealing ring can be mounted; when the sealing device is used, one or both of the metal seal and the sealing ring can be selected optionally, the selection of the sealing means is more flexible, and the increase of the cost is avoided under the condition of ensuring the sealing effect.

Further, the seal ring mounting groove 11 is circumferentially disposed outside the metal seal gap 10, and the metal seal gap 10 is closer to the center of the through hole 2 than the seal ring mounting groove 11.

Specifically, the utility model provides an even when flowing part uses, inlet port 4 on the inlet plate 3 passes through-hole 2 and semiconductor process cavity intercommunication, use etching process as an example so, one side that inlet plate 3 is close to through-hole 2 is the plasma side, and one side that inlet plate 3 kept away from through-hole 2 is the non-plasma side, because the plasma side can produce stronger corrosivity to the sealing washer, consequently, set up metal seal clearance 10 and comparing in the position that sealing washer mounting groove 11 is more close to through-hole 2, the corrosivity operating mode that utilizes the metal seal spare in the metal seal clearance 10 to satisfy the plasma side, and utilize the sealing washer to seal in the position of keeping away from the plasma side relatively, fine prevention process gas again gets into semiconductor process cavity from the gap between inlet plate 3 and the mounting groove 7, form reliable seal.

Optionally, an intake communicating channel 12 is provided inside the at least one intake plate 3, and the intake communicating channel 12 communicates with at least two of the plurality of intake holes 4.

Specifically, as shown in fig. 8 and 9, when it is required to ensure that the air supply pressures of a plurality of local different air inlet holes 4 are consistent, an air inlet communicating channel 12 is arranged in the air inlet plate 3 as required, the air inlet communicating channel 12 communicates the air inlet holes 4, and the air supply pressures of the air inlet holes 4 can be ensured to be consistent by using the principle of pascal's law.

In the embodiment, the air inlet communicating channel 12 is a straight hole, the central line of the air inlet communicating channel 12 is perpendicular to the central lines of the air inlet holes 4, and the air supply pressure of the air inlet holes 4 which are penetrated by one air inlet communicating channel 12 is consistent, so that the uniformity of the process result is ensured; the air inlet communicating channel 12 can be punched by one side wall of the air inlet plate 3, and the punched inlet is subjected to repair welding to plug the air inlet communicating channel 12.

The utility model also provides a semiconductor process equipment, including semiconductor process cavity and foretell even flow part.

In the present embodiment, the uniform flow component is installed on the semiconductor process chamber through the installation part 6, and the process gas is uniformly delivered into the semiconductor process chamber through the plurality of gas inlet holes 4 on the plurality of gas inlet plates 3 installed on the bottom plate 1, so as to realize the uniform flow effect.

Optionally, the semiconductor process chamber further comprises a chamber body 15, a chamber cover plate 16 and an air inlet cover plate 17, wherein the chamber cover plate 16 is arranged at the top of the chamber body 15, the uniform flow component is detachably and hermetically connected with the chamber cover plate 16, and the air inlet cover plate 17 is arranged above the uniform flow component.

Specifically, as shown in fig. 11, the mounting portion 6 of the uniform flow member is detachably and sealingly connected to the chamber cover 16.

While various embodiments of the present invention have been described above, the above description is intended to be illustrative, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A flow uniforming member for uniforming flow of a process gas into a semiconductor process chamber, comprising:

the air inlet plates are detachably connected with the bottom plate and correspond to the through holes one by one, and a plurality of air inlet holes are formed in the air inlet plates and are used for being communicated with the inside of the semiconductor process chamber.

2. The flow homogenizing member of claim 1 wherein the number and/or aperture of the air inlet holes on the plurality of air inlet plates are the same or different.

3. The flow homogenizing member of claim 1 wherein a plurality of the inlet plates form an annular arrangement of at least one turn at the base plate.

4. The flow distribution member of claim 1, further comprising a cylindrical portion having one end connected to the outer periphery of the base plate and another end extending radially outward with an annular mounting portion for detachable connection to the semiconductor process chamber.

5. The flow homogenizing component according to claim 1, wherein a plurality of installation grooves are formed on the bottom plate, a plurality of through holes are respectively formed at bottoms of the installation grooves, each air inlet plate is detachably installed in one installation groove, and when the air inlet plate is installed in the installation groove, an upper surface of the air inlet plate is flush with an upper surface of the bottom plate.

6. The flow equalizing member of claim 5, wherein the bottom surface of the air inlet plate is provided with an annular protrusion, the bottom of the mounting groove is provided with an annular groove adapted to the protrusion, the groove is located outside the through hole, and an annular metal sealing gap is formed between the inner peripheral wall of the protrusion and the groove wall of the groove, and the metal sealing gap is used for mounting a metal sealing element.

7. The flow equalizing member of claim 6, wherein an annular gasket mounting groove is disposed on a bottom of the mounting groove, the gasket mounting groove being located outside the through hole, the gasket mounting groove being used for mounting a gasket, the gasket mounting groove being circumferentially disposed outside the metal seal gap.

8. The flow homogenizing member according to claim 1, wherein at least one of the air inlet plates is provided therein with an air inlet communicating passage communicating with at least two of the plurality of air inlet holes.

9. Semiconductor processing apparatus comprising the semiconductor processing chamber and the flow uniforming member according to any one of claims 1-8.

10. The semiconductor processing apparatus of claim 9, wherein the semiconductor processing chamber further comprises a chamber body, a chamber lid plate disposed at a top of the chamber body, the flow distribution member removably and sealingly coupled to the chamber lid plate, and an inlet lid plate disposed above the flow distribution member.