CN113488415B - Wafer post-processing equipment and ventilation system with uniform flow function and applied to same - Google Patents
Wafer post-processing equipment and ventilation system with uniform flow function and applied to same Download PDFInfo
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- CN113488415B CN113488415B CN202110761658.4A CN202110761658A CN113488415B CN 113488415 B CN113488415 B CN 113488415B CN 202110761658 A CN202110761658 A CN 202110761658A CN 113488415 B CN113488415 B CN 113488415B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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Abstract
The invention discloses a wafer post-processing device and a ventilation system with a uniform flow function applied by the same, wherein the wafer post-processing device comprises: a clamping mechanism for vertically rotating the wafer, a supply arm for delivering a fluid, a vent system for creating a dynamic gas flow within the wafer processing chamber; the ventilation system comprises an air inlet assembly and an air outlet assembly, the air outlet assembly comprises an air exhaust back plate, an annular flow homogenizing plate and an annular exhaust hood, the annular flow homogenizing plate is arranged on one side of the air exhaust back plate close to the annular exhaust hood, and gas in the wafer processing chamber sequentially enters the annular exhaust hood through an air outlet of the air exhaust back plate and a flow homogenizing port of the annular flow homogenizing plate to be collected and is led out to an exhaust pipeline below through a bottom leading-out structure of the annular exhaust hood; a plurality of air outlets of the air exhaust back plate are arranged into a ring shape corresponding to the position of the annular air exhaust cover, and the uniform flow ports of the annular uniform flow plate are arranged at the position right facing the air outlets so as to adjust the air output of the air outlets.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing post-treatment, in particular to wafer post-treatment equipment and a ventilation system with a uniform flow function applied to the wafer post-treatment equipment.
Background
Chemical Mechanical Polishing (CMP) is a globally planarizing ultra-precise surface processing technique. Since the chemical agents and abrasives used in the chemical mechanical polishing process are in large quantities, a large amount of contaminants such as abrasive particles and abrasive byproducts remain on the wafer surface after the polishing process is completed, and the contaminants adversely affect the subsequent process and may cause the wafer yield loss. It is necessary to introduce a post-treatment process after the chemical mechanical polishing, which typically consists of cleaning and drying, to provide a smooth and clean wafer surface.
In the wafer post-processing process, the process chamber needs to be ventilated continuously, a flow field generated by gas flowing in the process chamber affects wafer drying, and particularly, the wafer post-processing is adversely affected when the gas updating efficiency in the process chamber is low. Therefore, how to set a ventilation system with better effect is a problem to be solved urgently at present.
Disclosure of Invention
The embodiment of the invention provides wafer post-processing equipment and a ventilation system with a uniform flow function applied to the same, and aims to at least solve one of the technical problems in the prior art.
The first aspect of the embodiment of the invention provides a ventilation system with a uniform flow function, which is applied to wafer post-processing equipment, wherein the ventilation system is used for forming dynamic airflow in a wafer processing chamber and comprises an air inlet assembly positioned on one surface of the wafer processing chamber and an air outlet assembly positioned on the other opposite surface of the wafer processing chamber, the air outlet assembly comprises an air exhaust back plate, an annular uniform flow plate and an annular exhaust hood, the annular uniform flow plate is arranged on one side of the air exhaust back plate close to the annular exhaust hood, and air in the wafer processing chamber sequentially enters the annular exhaust hood through an air outlet of the air exhaust back plate and a uniform flow port of the annular uniform flow plate to be collected and is led out to an exhaust pipeline of a lower exhaust pipe through a bottom leading-out structure of the annular exhaust hood;
a plurality of air outlets of the air exhaust back plate are arranged into a ring shape corresponding to the position of the annular air exhaust cover, and the uniform flow ports of the annular uniform flow plate are arranged at the position right facing the air outlets so as to adjust the air output of the air outlets.
In one embodiment, the area of the uniform flow opening at the first position is smaller than that of the uniform flow opening at the second position so as to adjust the air output of different uniform flow openings to be consistent, wherein the distance from the first position to the bottom leading-out structure is smaller than that from the second position to the bottom leading-out structure.
In one embodiment, the area of the flow equalizing port is gradually reduced from top to bottom.
In one embodiment, the area of the uniform flow opening is smaller than or equal to the area of the corresponding air outlet, so that the overhigh air output is reduced.
In one embodiment, the annular exhaust hood is fixedly connected with the exhaust back plate, the annular flow homogenizing plate is fixedly attached to the exhaust back plate in an attaching mode, the annular exhaust hood covers the outer sides of the exhaust outlet and the flow homogenizing port, and an air guide channel is formed between the annular exhaust hood and the annular flow homogenizing plate.
In one embodiment, the annular exhaust hood comprises an outer annular plate, an inner annular plate and a cover plate hermetically connected between the outer annular plate and the inner annular plate, the outer annular plate, the inner annular plate and the cover plate enclose an air guide channel, the outer annular plate, the inner annular plate and the cover plate can be integrally formed, the bottom of the outer annular plate is provided with a bottom opening used for being hermetically connected with the bottom leading-out structure in a matched mode, and the outer annular plate and the inner annular plate are connected with the exhaust back plate through bolts.
In one embodiment, the material of the annular exhaust hood is aluminum alloy, stainless steel or engineering plastic.
In one embodiment, the width of the air outlet ranges from 1 mm to 100mm, the included angle of two sides of the air outlet ranges from 2 degrees to 88 degrees, and the interval angle of the air outlet ranges from 2 degrees to 28 degrees.
In one embodiment, the air intake assembly includes an air intake panel and an air intake cover.
A second aspect of an embodiment of the present invention provides a wafer post-processing apparatus, including: a clamping mechanism for vertically rotating the wafer and a supply arm for delivering fluid; the supply arm is vertically swingable and supplies fluid onto the wafer via a spray mechanism provided at a free end thereof; also included is a ventilation system as described above.
The embodiment of the invention has the beneficial effects that: by arranging the annular flow equalizing plate, the problem of overlarge air output difference of each air outlet on the air exhaust back plate is solved, the uniformity of air flow distribution in the wafer processing cavity is obviously improved, and further, the process result is favorably influenced.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
fig. 1 is a perspective view of a wafer post-processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure of a wafer processing chamber of a wafer post-processing apparatus according to an embodiment of the present invention;
fig. 3 is a perspective view of the wafer post-processing apparatus according to an embodiment of the present invention after the air inlet cover is removed;
FIG. 4 is a perspective view of a wafer post-processing apparatus according to an embodiment of the present invention;
FIG. 5 is a front view of the wafer post-processing apparatus with the annular exhaust hood removed, in accordance with one embodiment of the present invention;
FIG. 6 is a front view of the wafer post-processing apparatus with the annular exhaust hood and the annular flow homogenizing plate removed according to one embodiment of the present invention;
FIG. 7 is a front view of an annular exhaust hood according to one embodiment of the present invention;
fig. 8 is a perspective view of an annular exhaust hood according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. It should be understood that, unless otherwise specified, the following description of the embodiments of the present invention is made for the convenience of understanding, and the description is made in a natural state where relevant devices, apparatuses, components, etc. are originally at rest and no external control signals and driving forces are given.
Further, it is also noted that terms used herein such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, and the like, to denote orientation, are used merely for convenience of description to facilitate understanding of relative positions or orientations, and are not intended to limit the orientation of any device or structure.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
In the present application, Chemical Mechanical Polishing (Chemical Mechanical Planarization) is also called Chemical Mechanical Planarization (Chemical Mechanical Planarization), and wafer (wafer) is also called substrate (substrate), which means and actually functions equally.
As shown in fig. 1 and 2, a wafer post-processing apparatus 1 according to the present application includes: the case 10, and the chucking mechanism 20, the supply arm 30, the rotation shaft member 40, etc. provided in the case 10, further include a motor assembly (not shown) provided at the bottom of the case 10. The interior of the chamber 10 is a wafer processing chamber. The chucking mechanism 20 has a plurality of chucking pins (not shown) to hold the wafer W and to rotate the wafer W vertically in the chamber 10 about a wafer rotation axis passing through the center of the wafer W and perpendicular to the surface of the wafer W. The supply arm 30 has two ends, one end connected to the rotating shaft member 40 and the other end being a free end that is rotatable about the rotating shaft member 40. The feed arm 30 is also connected to a motor assembly such that the feed arm 30 is rotatable about the spindle member 40 under the drive of the motor assembly to effect oscillation of the feed arm 30 in a vertical plane parallel to the plane of the wafer W. Also, the feed arm 30 is provided with a spray mechanism (not shown) at its free end, so that fluid can be supplied to the global surface of the rotating wafer W via the spray mechanism moving with the feed arm 30. The spindle member 40 is disposed perpendicular to the wafer W.
As shown in fig. 3-6, the wafer post-processing apparatus 1 further includes a ventilation system 50 for forming dynamic airflow in the wafer processing chamber, the ventilation system 50 includes an air intake assembly 60 located on one side of the wafer processing chamber and an air exhaust assembly 70 located on the opposite side of the wafer processing chamber, the air intake assembly 60 includes an air intake panel 61 and an air intake cover 63, the air intake panel 61 is provided with a plurality of through air intakes 62, the air exhaust assembly 70 includes an air exhaust back panel 71 and an annular air exhaust cover 76, external air is introduced from an air intake pipeline located below the air intake cover 63 and is introduced into the wafer processing chamber through the air intake 62 of the air intake panel 61, air in the wafer processing chamber enters the annular air exhaust cover 76 from an air exhaust port 72 of the air exhaust back panel 71 for collection, and is led out to an air exhaust pipeline of a bottom leading-out structure 77 of the annular air exhaust cover 76. In addition, the intake assembly 60 includes an intake panel 61 and an intake cover 63.
As shown in fig. 1, the box 10 of the wafer post-processing apparatus 1 is composed of an air intake panel 61, an air exhaust back plate 71 and a chamber wall. The enclosure 10 encloses a wafer processing chamber.
The ventilation system 50 in this embodiment is provided with the air intake assembly 60 and the air exhaust assembly 70 to ensure the continuous update of the air in the wafer processing chamber, the filtered clean air enters the wafer processing chamber through the air inlet 62 of the air intake panel 61, so as to accelerate the drying of the wafer, the air in the chamber enters the annular exhaust hood 76 from the air outlet 72 of the air exhaust back plate 71, and the air collected by the annular exhaust hood 76 is directly led out through the exhaust pipeline below the bottom leading-out structure 77 arranged at the bottom of the annular exhaust hood 76.
As shown in FIG. 5, in one embodiment of the present invention, the exhaust assembly 70 further includes an annular flow equalizer 74. The annular flow equalizing plate 74 is arranged on one side of the exhaust back plate 71 close to the annular exhaust hood 76, and the gas in the wafer processing chamber enters the annular exhaust hood 76 through the exhaust outlet 72 of the exhaust back plate 71 and the flow equalizing port 75 of the annular flow equalizing plate 74 in sequence. The plurality of air outlets 72 of the air outlet back plate 71 are arranged in a ring shape corresponding to the position of the ring-shaped air outlet cover 76, and the uniform flow ports 75 of the ring-shaped uniform flow plate 74 are arranged at the position opposite to the air outlets 72 to adjust the air output of the air outlets 72.
In the embodiment, the annular uniform flow plate 74 is arranged, so that the problem of overlarge air output difference of each air outlet 72 on the air exhaust back plate 71 is solved, the uniformity of air flow distribution in the wafer processing chamber is obviously improved, and further, the process result is favorably influenced.
As shown in fig. 5 and 6, in one embodiment, the area of the uniform flow opening 75 is smaller than or equal to the area of the corresponding air outlet 72, so as to reduce the excessive air output. In particular, the area of the uniform flow opening 75 near the bottom is smaller than the area of the corresponding air outlet 72, thereby reducing the air output.
In one embodiment, the area of the uniform flow openings 75 at the first position is smaller than the area of the uniform flow openings 75 at the second position to adjust the air output of different uniform flow openings 75 to be consistent, wherein the distance from the bottom leading-out structure 77 at the first position is smaller than the distance from the bottom leading-out structure 77 at the second position.
Specifically, the area of the uniform flow port 75 near the bottom lead-out structure 77 is smaller than the area of the uniform flow port 75 far from the bottom lead-out structure 77.
As shown in FIG. 5, in one embodiment, the area of the uniform flow port 75 is gradually reduced from top to bottom.
The air outlet 72 of the air outlet back plate 71 is a long hole with equal size. The length of the uniform flow port 75 corresponding to each air outlet 72 can be substantially the same as that of the air outlet 72, but the width of the uniform flow port 75 is smaller than or equal to that of the air outlet 72, so as to reduce the air output of the air outlet 72 by a certain proportion. The width of the flow equalizing port 75 differs depending on the position, and the width decreases as the distance from the bottom discharge end decreases, and the width increases as the distance from the bottom discharge end increases.
Because the actual air output of different air outlets 72 on the air exhaust back plate 71 is greatly influenced by the positions of the air outlets 72, the air output of the air outlets 72 closer to the bottom air exhaust end is larger, the air output of the different air outlets 72 is uneven, which causes the flow field in the process cavity to be extremely uneven, and further causes the process effect to be influenced. Therefore, in the embodiment of the present invention, an annular flow equalizing plate 74 is disposed on one side of the air exhaust back plate 71 close to the annular air exhaust cover 76, the annular flow equalizing plate 74 is provided with flow equalizing ports 75 at each position facing the air exhaust ports 72 of the air exhaust back plate 71, the areas of the flow equalizing ports 75 at different positions are different, the area of the flow equalizing port 75 closer to the bottom air exhaust end is smaller, and the area of the flow equalizing port 75 farther from the bottom air exhaust end is larger, so that the air output of each air exhaust port 72 on the air exhaust back plate 71 is adjusted in such a way as to be consistent, thereby achieving uniform distribution of the flow field in the wafer processing chamber, and improving the wafer cleaning and drying effect.
As shown in fig. 4, in one embodiment, the annular exhaust hood 76 is fixedly connected to the exhaust back plate 71, the annular flow equalizing plate 74 is fixedly attached to the exhaust back plate 71, the annular exhaust hood 76 covers the outer sides of the exhaust opening 72 and the flow equalizing opening 75, and an air guiding channel is formed between the annular exhaust hood 76 and the annular flow equalizing plate 74.
As shown in fig. 4, 7, 8, in one embodiment of the invention, the bottom lead-out structure 77 has a smoothly transitioning guide face 771 to reduce the fluid resistance to gas venting.
Specifically, the bottom lead-out structure 77 is a horn-shaped structure, and the area of the upper end opening 772 of the bottom lead-out structure 77 is larger than that of the lower end opening 773 thereof. The upper opening 772 of the bottom extraction structure 77 is a prolate ellipse and the lower opening 773 is circular.
As shown in fig. 7, the width of the upper end opening 772 of the bottom lead-out structure 77 and the outer diameter of the annular exhaust hood 76 satisfy: 1/4D is not less than W not more than D, wherein W is the width of the upper end opening 772 of the bottom extraction structure 77, and D is the outer diameter of the annular exhaust hood 76.
The guide surface 771 of the bottom leading-out structure 77 is arc-shaped, one end of the guide surface 771 is basically tangent to the outline of the annular exhaust hood 76, and the other end of the guide surface 771 is basically tangent to the flow direction of the gas after leading-out.
In this embodiment, the exhaust assembly 70 has a wider effective passing width when the airflow enters the bottom leading-out structure 77 through the bottom leading-out structure 77 with the smooth transition guide surface 771, so as to effectively weaken the resistance caused by the airflow collision on both sides of the annular exhaust hood and weaken the resistance caused by the sudden turning of the airflow direction, and after the exhaust resistance is reduced, the gas update efficiency in the wafer processing chamber is significantly improved.
As shown in fig. 4 and 8, the annular exhaust hood 76 includes an outer annular plate 761, an inner annular plate 762, and a cover plate 763 hermetically connected between the outer annular plate 761 and the inner annular plate 762, the outer annular plate 761, the inner annular plate 762, and the cover plate 763 enclose a wind guide channel, the outer annular plate 761, the inner annular plate 762, and the cover plate 763 can be integrally formed, a bottom opening for mating and hermetically connecting with the bottom leading-out structure 77 is provided at the bottom of the outer annular plate 761, and the outer annular plate 761 and the inner annular plate 762 are connected with the exhaust back plate 71 through bolts.
Specifically, the outer end of the outer annular plate 761 and the inner end of the inner annular plate 762 are provided with mounting holes in the circumferential direction at positions close to the exhaust back plate 71, and are connected to the mounting holes at corresponding positions on the exhaust back plate 71 by screws. The annular exhaust hood 76 and the bottom lead-out structure 77 are fixed by welding or screws.
The central axis of the annular exhaust hood 76 coincides with the wafer rotation axis, and the exhaust end of the annular exhaust hood 76 faces vertically downward.
Preferably, the material of the annular exhaust hood 76 is aluminum alloy, stainless steel or engineering plastic.
As shown in fig. 6, the plurality of exhaust ports 72 of the exhaust back plate 71 are arranged in a ring shape corresponding to the position of the ring-shaped exhaust hood 76. The shape of air exit 72 is formed by the intercepting of annular equidistance, and the quantity of air exit 72 is 4 ~ 90, and the annular ring width is air exit 72's width a, and air exit 72's width a scope is 1~100mm, and air exit 72's both sides contained angle theta 1 is 2 ~88, and air exit 72's interval angle theta 2 is 2 ~ 28.
The inner ring width b of the ring-shaped exhaust hood 76 satisfies: a < b < a +100(mm), where a is the width of the exhaust vent 72 and b is the inner annular width of the annular exhaust hood 76. In addition, the inner depth of the annular exhaust hood 76 is 5 to 200 mm.
As shown in FIG. 1, in one embodiment of the present invention, the air intake assembly 60 includes an air intake panel 61 and an air intake cover 63.
As shown in fig. 1, the intake panel 61 is embedded in the front panel of the chamber, and the intake cover 63 covers the intake panel 61 and is fixed to the front panel of the chamber by screws. The air inlet end of the air inlet cover 63 faces the vertical downward direction. The central axes of the main body annular structures of the air inlet cover 63 and the air inlet panel 61 are respectively superposed with the wafer rotating shaft.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A ventilation system with a uniform flow function applied to wafer post-processing equipment is characterized in that the ventilation system is used for forming dynamic airflow in a wafer processing chamber and comprises an air inlet assembly positioned on one surface of the wafer processing chamber and an air outlet assembly positioned on the other opposite surface of the wafer processing chamber, the air outlet assembly comprises an air exhaust back plate, an annular uniform flow plate and an annular exhaust hood, the annular uniform flow plate is arranged on one side, close to the annular exhaust hood, of the air exhaust back plate, and gas in the wafer processing chamber sequentially enters the annular exhaust hood through an air outlet of the air exhaust back plate and a uniform flow port of the annular uniform flow plate to be collected and is led out through an exhaust pipeline below a leading-out structure at the bottom of the annular exhaust hood;
the air outlets of the air exhaust back plate are arranged in an annular shape corresponding to the position of the annular air exhaust cover, and the uniform flow port of the annular uniform flow plate is arranged at the position opposite to the air outlets so as to adjust the air output of the air outlets;
the area of the uniform flow port at the first position is smaller than that of the uniform flow port at the second position so as to adjust the air output of different uniform flow ports to be consistent, wherein the distance from the first position to the bottom leading-out structure is smaller than that from the second position to the bottom leading-out structure.
2. The ventilation system of claim 1, wherein the plurality of flow homogenizing ports of the vertically arranged annular flow homogenizing plate are gradually reduced in area from top to bottom.
3. The ventilation system of claim 1, wherein the area of the uniform flow port is smaller than or equal to the area of the corresponding air outlet so as to reduce the excessive air output.
4. The ventilation system of claim 1, wherein the annular exhaust hood is fixedly connected to the exhaust back plate, the annular flow homogenizing plate is fixedly attached to the exhaust back plate, the annular exhaust hood covers the outer sides of the exhaust opening and the flow homogenizing opening, and the air guiding channel is formed between the annular exhaust hood and the annular flow homogenizing plate.
5. The ventilation system of claim 1, wherein the annular exhaust hood comprises an outer annular plate, an inner annular plate and a cover plate hermetically connected between the outer annular plate and the inner annular plate, the outer annular plate, the inner annular plate and the cover plate define an air guide channel, the bottom of the outer annular plate is provided with a bottom opening for matching with the bottom leading-out structure in an airtight connection, and the outer annular plate and the inner annular plate are connected with the exhaust back plate through bolts.
6. The ventilation system of claim 1, wherein the material of the annular exhaust hood is aluminum alloy, stainless steel or engineering plastic.
7. The ventilation system according to claim 1, wherein the width of the air outlet is 1-100 mm, the included angle between two sides of the air outlet is 2-88 degrees, and the interval angle between the air outlets is 2-28 degrees.
8. The ventilation system of claim 1, wherein the air intake assembly comprises an air intake panel and an air intake shroud.
9. A wafer post-processing apparatus, comprising: a clamping mechanism for vertically rotating the wafer and a supply arm for delivering fluid; the supply arm is vertically swingable and supplies fluid onto the wafer via a spray mechanism provided at a free end thereof; further comprising a ventilation system as claimed in any one of claims 1 to 8.
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