CN218475631U - Silicon wafer sorting equipment - Google Patents
Silicon wafer sorting equipment Download PDFInfo
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- CN218475631U CN218475631U CN202222402754.2U CN202222402754U CN218475631U CN 218475631 U CN218475631 U CN 218475631U CN 202222402754 U CN202222402754 U CN 202222402754U CN 218475631 U CN218475631 U CN 218475631U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a silicon wafer sorting device, which comprises a frame, a conveying line, a plurality of material receiving assemblies and a sorting assembly, wherein the conveying line is used for conveying silicon wafers; the plurality of material receiving assemblies are annularly arranged on the rack; each material receiving assembly comprises a material receiving frame, and the material receiving frame is provided with a receiving groove; the sorting assembly comprises a rotating disc and a plurality of adsorption assemblies; the rotating disc is rotatably arranged on the frame; the rotating disc is provided with a plurality of rotating arms which are arranged at intervals along the annular direction of the rotating disc; a plurality of adsorption modules for adsorbing the silicon wafers conveyed by the conveying line; a plurality of adsorption component connect in the swinging boom that corresponds to will carry the silicon wafer that carries through the transfer chain to the groove of accomodating that corresponds in proper order under the drive of rotary disk, at this moment, when the rotary disk is rotatory for the frame, connect in the adsorption component of swinging boom and rotatory along with the rotation of rotary disk, and receive the material subassembly through transfer chain and a plurality of in proper order, so that will be in each silicon wafer of transfer chain and accomodate in the groove of accomodating of each receipts material subassembly in proper order.
Description
Technical Field
The application belongs to the technical field of silicon wafer sorting equipment, and particularly relates to silicon wafer sorting equipment.
Background
The silicon wafers are also called wafers, are processed from silicon ingots and are applied to the photovoltaic industry, the silicon wafers are used as a part of solar panels, the usage amount of the silicon wafers is gradually increased along with the development of the photovoltaic industry, and a large number of silicon wafers are conveyed and sorted in silicon wafer sorting equipment.
In the prior art, the existing silicon wafer sorting equipment comprises a conveying line, a material receiving frame and a Z-direction moving module. The silicon wafer of placing the top in through the multistage transfer chain is thrown into and is accomodate the inslot, after a box is full of material, moves the module through the Z axle and removes, switches other magazine for current silicon wafer sorting facilities efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides silicon wafer sorting equipment to solve the problem that the sorting efficiency of the existing silicon wafer sorting equipment is low.
In a first aspect, an embodiment of the present application provides a silicon wafer sorting apparatus, which includes:
a frame;
a transfer line mounted to the frame, the transfer line for transferring a silicon wafer;
the receiving assemblies are annularly arranged on the rack; each material receiving assembly comprises a material receiving frame, and the material receiving frame is provided with a receiving groove;
the sorting assembly comprises a rotating disc and a plurality of adsorption assemblies; the rotating disc is rotatably arranged on the rack; the rotating disc is provided with a plurality of rotating arms which are arranged at intervals along the annular direction of the rotating disc; the plurality of adsorption assemblies are used for adsorbing the silicon wafers conveyed by the conveying line; and the adsorption components are connected with the corresponding rotating arms and are used for sequentially conveying the silicon wafers conveyed by the conveying lines to the corresponding accommodating grooves under the driving of the rotating disc.
Optionally, the conveying line comprises two conveying belts which rotate in a circulating manner, and the two conveying belts are arranged oppositely and jointly convey the silicon wafers to the loading station of the rack.
Optionally, the material receiving frame is connected with a plurality of vertical plates, and the vertical plates are annularly arranged and surround to form the receiving groove; the accommodating groove is used for accommodating a plurality of silicon wafers; a plurality of the silicon wafers are stacked in a vertical direction in the receiving groove.
Optionally, the material receiving frame is connected with a first moving module, and a moving seat of the first moving module is connected to the bottom of the material receiving frame and drives the material receiving frame to be away from the rotating disc;
the silicon wafer sorting equipment further comprises a taking and placing assembly, and the taking and placing assembly is used for moving the silicon wafers in the accommodating grooves to an automatic butt joint station of the rack.
Optionally, the taking and placing assembly comprises two taking and placing claws and a multidirectional moving module, and the multidirectional moving module is connected with the two taking and placing claws and drives the two taking and placing claws to move from the accommodating groove to the automatic docking station; the two picking and placing claws move relatively and clamp or release the silicon wafers in the accommodating grooves.
Optionally, each of the adsorption assemblies includes a connecting arm and a suction cup; the connecting arm is connected to the rotating arm; the sucker is connected to the end part of the connecting arm and adsorbs the silicon wafer conveyed by the conveying line in a working state.
Optionally, a first guiding element is connected to the frame, and the first guiding element is arranged relative to the material collecting frame;
the connecting arm is movably connected to the rotating arm; the connecting arm is connected with a roller;
when the rotating arm is in a rotating state, the roller contacts the first guide piece, and the swinging of the connecting arm is adjusted under the guidance of the first guide piece, so that the connecting arm is in a vertical state relative to the material receiving frame.
Optionally, the connecting arm is hinged to the rotating arm through a rotating shaft, and swings relative to the rotating arm along the axial direction of the rotating shaft.
Optionally, the outer contour of the suction cup is annular; and a plurality of adsorption ports are arranged at the bottom of the sucker, and the silicon wafer is adsorbed by the adsorption ports in a working state.
According to the silicon wafer sorting device provided by one embodiment of the application, the conveying line is mounted on the rack and used for conveying silicon wafers; the plurality of material receiving assemblies are annularly arranged on the rack; each material receiving assembly comprises a material receiving frame, and the material receiving frame is provided with a receiving groove; the sorting assembly comprises a rotating disc and a plurality of adsorption assemblies; the rotating disc is rotatably arranged on the frame; the rotating disc is provided with a plurality of rotating arms which are arranged at intervals along the annular direction of the rotating disc; a plurality of adsorption modules for adsorbing the silicon wafers conveyed by the conveying line; a plurality of adsorption component connect in the swinging boom that corresponds, and will carry the silicon wafer through the transfer chain transport to the groove of accomodating that corresponds in proper order under the drive of rotary disk, at this moment, when the rotary disk is rotatory for the frame, the adsorption component who connects in the swinging boom is rotatory along with the rotation of rotary disk, and receive the material subassembly through transfer chain and a plurality of in proper order, adsorption component adsorbs the silicon wafer when the transfer chain, adsorption component receives material subassembly release silicon wafer at each, so that to accomodate each silicon wafer that is in the transfer chain in proper order in the groove of accomodating of each receipts material subassembly, the ability of accomodating of silicon wafer sorting facilities to the silicon wafer has been improved, and realize that silicon wafer sorting facilities sorts the annular form of a plurality of silicon wafers and handle, so that improve the sorting efficiency of silicon wafer sorting facilities to the silicon wafer.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can also be derived from them without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic view of a silicon wafer sorting apparatus provided in an embodiment of the present application.
Fig. 2 is a partially enlarged view taken along the direction a in fig. 1.
Fig. 3 is a schematic view of a sorting assembly of the silicon wafer sorting apparatus provided in an embodiment of the present application.
Fig. 4 is a schematic connection diagram of rollers of a silicon wafer sorting apparatus according to an embodiment of the present application.
Fig. 5 is a partial schematic view of a silicon wafer sorting apparatus provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a silicon wafer sorting device 100 to solve the problem that the sorting efficiency of the existing silicon wafer sorting device is low.
Referring to fig. 1 to 5, the silicon wafer sorting apparatus 100 according to the embodiment of the present application includes a rack 10, a conveying line, a plurality of receiving assemblies 30, and a sorting assembly 40, where the conveying line, the plurality of receiving assemblies 30, and the sorting assembly 40 are all mounted on the rack 10.
The rack 10 serves as a support body of the silicon wafer sorting apparatus 100, and supports the transfer line, the plurality of receiving members 30, and the sorting member 40.
The conveying line is installed in frame 10, and the conveying line is used for carrying the silicon wafer, and wherein, the conveying line includes two conveyer belts of rotation in circulation, and two conveyer belts are arranged relatively to carry the silicon wafer to the material loading station of frame 10 jointly, and at this moment, two conveyer belts carry out rotation in circulation under corresponding actuating mechanism's drive respectively, and drive the silicon wafer and carry out position shift, so that realize the automatic of silicon wafer and carry.
The receiving assemblies 30 are annularly arranged on the rack 10, the receiving assemblies 30 are respectively used for receiving the corresponding silicon wafers, and each receiving assembly 30 is used as a separate receiving station.
Each material receiving assembly 30 comprises a material receiving frame 31, the material receiving frame 31 is provided with a receiving groove 312, at this time, the material receiving frame 31 is connected with a plurality of vertical plates 311, and the plurality of vertical plates 311 are annularly arranged and enclose to form the receiving groove 312; a storage groove 312 for storing a plurality of silicon wafers; a plurality of silicon wafers are stacked in the vertical direction in the receiving groove 312.
The design through a plurality of receipts material subassembly 30 has improved silicon wafer sorting facilities 100's the space of accomodating to a plurality of receipts material subassembly 30 rings are arranged in frame 10, are convenient for select separately the silicon wafer that subassembly 40 will be in the transfer chain and carry to a plurality of receipts material subassembly 30 in proper order, thereby realize that each silicon wafer deposits in proper order in a plurality of receipts material subassembly 30, realize the silicon wafer to a plurality of receipts material subassembly 30 accomodate, in time shift is in the silicon wafer on the conveyer belt.
The material receiving frame 31 is connected with a first moving module 32, a moving seat of the first moving module 32 is connected with the bottom of the material receiving frame 31 and drives the material receiving frame 31 to be away from the rotating disc 41, at the moment, the material receiving frame 31 is in a first state that the silicon wafer is conveyed to the receiving groove 312 when being close to the rotating disc 41, the material receiving frame 31 is in a second state that the silicon wafer is separated from the receiving groove 312 when being away from the rotating disc 41, and optionally, the first moving module 32 is a synchronous belt moving module, a screw rod type moving module or an air cylinder.
The sorting assembly 40 includes a rotating disk 41, a plurality of adsorption assemblies 42; the rotating disc 41 is rotatably mounted to the frame 10; the rotating disk 41 is provided with a plurality of rotating arms 411, the plurality of rotating arms 411 being arranged at intervals along the annular direction of the rotating disk 41; a plurality of adsorption modules 42 for adsorbing the silicon wafers transferred through the transfer line; the plurality of adsorption units 42 are connected to the corresponding rotating arms 411, and are driven by the rotating disc 41 to sequentially transfer the silicon wafers transferred by the transfer lines to the corresponding receiving grooves 312.
At this time, when the rotating disk 41 rotates with respect to the rack 10, the adsorption unit 42 connected to the rotating arm 411 rotates with the rotation of the rotating disk 41 and sequentially passes through the transfer line and the plurality of material receiving units 30, the adsorption unit 42 adsorbs the silicon wafers at the transfer line, and the adsorption unit 42 releases the silicon wafers at the material receiving units 30 so as to sequentially store the silicon wafers at the transfer line in the storage grooves 312 of the material receiving units 30, thereby improving the silicon wafer storage capability of the silicon wafer sorting apparatus 100, and realizing the ring type sorting process of the silicon wafer sorting apparatus 100 for the plurality of silicon wafers so as to improve the sorting efficiency of the silicon wafer sorting apparatus 100 for the silicon wafers.
Wherein, be connected with rotary mechanism between rotary disk 41 and the frame 10, rotary mechanism can be the DD motor, connects in rotary disk 41 to drive rotary disk 41 for the rotation of frame 10, at this moment, the swinging boom 411 of rotary disk 41 passes through transfer chain and a plurality of receipts material subassembly 30 in proper order along the circumferencial direction of rotary disk 41.
Each adsorption assembly 42 comprises a connecting arm 421 and a suction cup 422; the connecting arm 421 is connected to the rotating arm 411; the suction cup 422 is connected to the end part of the connecting arm 421, and sucks the silicon wafer conveyed by the conveying line in a working state, and the suction positioning of the silicon wafer is realized through the suction cup 422, so that the station transfer of the silicon wafer is realized. Optionally, the outer profile of the suction cup 422 is annular; the bottom of the suction cup 422 is provided with a plurality of suction ports, which suck the silicon wafer in a working state.
Where the chuck 422 is a bernoulli chuck, the bernoulli chuck adsorbs the silicon wafer under positive pressure. When the chuck 422 is another type of chuck, the chuck adsorbs the silicon wafer in a negative pressure state.
In addition, a first guide 11 is connected to the frame 10, and the first guide 11 is disposed with respect to the material receiving frame 31, and at this time, the first guide 11 extends along an arc direction.
The connecting arm 421 is movably connected to the rotating arm 411; the connecting arm 421 is connected with a roller 423; when the rotating arm 411 is in a rotating state, the roller 423 contacts the first guide member 11, and the swinging of the connecting arm 421 is adjusted under the guidance of the first guide member 11, so that the connecting arm 421 is in a vertical state relative to the material receiving frame 31, so that the swinging of the connecting arm 421 relative to the rotating arm 411 is realized through the guidance of the roller 423 by the first guide member 11, thereby realizing the position transfer of the connecting arm 421, so as to realize the position transfer of the suction cup 422 and the silicon wafer located at the suction cup 422.
Alternatively, the connecting arm 421 is hinged to the rotating arm 411 through a rotating shaft, and swings relative to the rotating arm 411 along the axial direction of the rotating shaft.
In addition, the silicon wafer sorting apparatus 100 further comprises a pick-and-place assembly 20, and the pick-and-place assembly 20 is used for moving the plurality of silicon wafers in the receiving grooves 312 to the automatic docking station of the rack 10. The taking and placing assembly 20 comprises two taking and placing claws 21 and a multidirectional moving module 22, and the multidirectional moving module 22 is connected with the two taking and placing claws 21 and drives the two taking and placing claws 21 to move to the automatic docking station from the accommodating groove 312; the pick-and-place claws 21 move relatively to each other and clamp or release the silicon wafers in the storage grooves 312. Alternatively, the multi-directional moving module 22 is composed of a plurality of moving modules, and the plurality of moving modules are perpendicular to each other.
In the silicon wafer sorting apparatus 100 according to an embodiment of the present application, a transport line for transporting a silicon wafer is installed in the frame 10; a plurality of receiving assemblies 30 are annularly arranged on the frame 10; each material receiving assembly 30 comprises a material receiving frame 31, and the material receiving frame 31 is provided with a receiving groove 312; the sorting assembly 40 includes a rotating disk 41, a plurality of adsorption assemblies 42; the rotating disc 41 is rotatably mounted to the frame 10; the rotating disk 41 is provided with a plurality of rotating arms 411, the plurality of rotating arms 411 being arranged at intervals along the annular direction of the rotating disk 41; a plurality of adsorption modules 42 for adsorbing the silicon wafers transferred through the transfer lines; the plurality of adsorption assemblies 42 are connected to the corresponding rotating arms 411, and are driven by the rotating disc 41 to sequentially convey the silicon wafers conveyed by the conveying lines to the corresponding accommodating grooves 312, at the moment, when the rotating disc 41 rotates relative to the rack 10, the adsorption assemblies 42 connected to the rotating arms 411 rotate along with the rotation of the rotating disc 41 and sequentially pass through the conveying lines and the plurality of receiving assemblies 30, the adsorption assemblies 42 adsorb the silicon wafers during the conveying lines, the adsorption assemblies 42 release the silicon wafers at the receiving assemblies 30, so that the silicon wafers in the conveying lines are sequentially accommodated in the accommodating grooves 312 of the receiving assemblies 30, the accommodating capacity of the silicon wafer sorting equipment 100 for the silicon wafers is improved, the circular sorting treatment of the silicon wafer sorting equipment 100 for the silicon wafers is realized, and the sorting efficiency of the silicon wafer sorting equipment 100 for the silicon wafers is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and these embodiments are still within the scope of the invention.
Claims (9)
1. A silicon wafer sorting apparatus, characterized in that the silicon wafer sorting apparatus comprises:
a frame;
a transfer line mounted to the frame, the transfer line for transferring a silicon wafer;
the receiving assemblies are annularly arranged on the rack; each material receiving assembly comprises a material receiving frame, and the material receiving frame is provided with a receiving groove;
the sorting assembly comprises a rotating disc and a plurality of adsorption assemblies; the rotating disc is rotatably arranged on the rack; the rotating disc is provided with a plurality of rotating arms which are arranged at intervals along the annular direction of the rotating disc; the plurality of adsorption assemblies are used for adsorbing the silicon wafers conveyed by the conveying line; and the adsorption components are connected with the corresponding rotating arms and are used for sequentially conveying the silicon wafers conveyed by the conveying lines to the corresponding accommodating grooves under the driving of the rotating disc.
2. The silicon wafer sorting apparatus according to claim 1, wherein the transfer line includes two endless rotary transfer belts which are disposed opposite to each other and transfer the silicon wafers together to the loading station of the rack.
3. The silicon wafer sorting equipment according to claim 2, wherein the material receiving frame is connected with a plurality of vertical plates which are annularly arranged and enclose to form the receiving groove; the accommodating groove is used for accommodating a plurality of silicon wafers; a plurality of the silicon wafers are stacked in a vertical direction in the receiving groove.
4. The silicon wafer sorting equipment according to claim 3, wherein the collecting frame is connected with a first moving module, and a moving seat of the first moving module is connected with the bottom of the collecting frame and drives the collecting frame to be far away from the rotating disc;
the silicon wafer sorting equipment further comprises a picking and placing assembly, and the picking and placing assembly is used for moving the silicon wafers in the accommodating grooves to an automatic docking station of the rack.
5. The silicon wafer sorting equipment according to claim 4, wherein the pick-and-place assembly comprises two pick-and-place claws and a multidirectional moving module, and the multidirectional moving module is connected with the two pick-and-place claws and drives the two pick-and-place claws to move from the accommodating grooves to the automatic docking station; the two picking and placing claws move relatively and clamp or release the silicon wafers in the accommodating grooves.
6. The silicon wafer sorting apparatus according to any one of claims 1 to 5, wherein each of the suction members comprises a connecting arm and a suction cup; the connecting arm is connected to the rotating arm; the sucker is connected to the end part of the connecting arm and adsorbs the silicon wafer conveyed by the conveying line in a working state.
7. The silicon wafer sorting apparatus according to claim 6, wherein a first guide is attached to the frame, the first guide being arranged with respect to the receiving rack;
the connecting arm is movably connected to the rotating arm; the connecting arm is connected with a roller;
when the rotating arm is in a rotating state, the roller contacts the first guide piece, and the swinging of the connecting arm is adjusted under the guiding of the first guide piece, so that the connecting arm is in a vertical state relative to the material receiving frame.
8. The silicon wafer sorting apparatus according to claim 7, wherein the connecting arm is hinged to the rotating arm through a rotating shaft and swings relative to the rotating arm in an axial direction of the rotating shaft.
9. The silicon wafer sorting apparatus according to claim 7, wherein the outer contour of the suction cup is annular; and a plurality of adsorption ports are arranged at the bottom of the sucker, and the silicon wafer is adsorbed by the adsorption ports in a working state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222402754.2U CN218475631U (en) | 2022-09-09 | 2022-09-09 | Silicon wafer sorting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222402754.2U CN218475631U (en) | 2022-09-09 | 2022-09-09 | Silicon wafer sorting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218475631U true CN218475631U (en) | 2023-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222402754.2U Active CN218475631U (en) | 2022-09-09 | 2022-09-09 | Silicon wafer sorting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218475631U (en) |
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2022
- 2022-09-09 CN CN202222402754.2U patent/CN218475631U/en active Active
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