CN218470565U - Silicon chip terminal surface defect detection equipment - Google Patents
Silicon chip terminal surface defect detection equipment Download PDFInfo
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- CN218470565U CN218470565U CN202222394052.4U CN202222394052U CN218470565U CN 218470565 U CN218470565 U CN 218470565U CN 202222394052 U CN202222394052 U CN 202222394052U CN 218470565 U CN218470565 U CN 218470565U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model relates to a silicon chip terminal surface detection area, concretely relates to silicon chip terminal surface defect check out test set, including protection box assembly, turn-over mechanism, drive mechanism, two conveying mechanism and two detection mechanism, the inside fixed brace table that is provided with of protection box assembly, the fixed eight support columns and the eight support columns that are provided with in upper end of brace table are the symmetrical type and distribute in turn-over mechanism both sides, two conveying mechanism fixed mounting is respectively on the support column of distributing in turn-over mechanism both sides, turn-over mechanism fixed mounting is in the brace table upper end and is located between two conveying mechanism, drive mechanism fixed mounting just is located between two conveying mechanism in the brace table upper end, through turn-over mechanism with silicon chip upset 180 degrees, can carry out the detection and the analysis of shooing at the silicon chip back, has guaranteed that the roughness of silicon chip positive and negative meets the requirements, adopts the mode of conveyer belt to carry the silicon chip that detects simultaneously, has improved detection efficiency.
Description
Technical Field
The utility model relates to a silicon chip terminal surface detection area, concretely relates to silicon chip terminal surface defect check out test set.
Background
The current trend of new energy industry is obvious, the photovoltaic industry develops rapidly, silicon wafers are used as main raw materials of solar cells, the demand of the silicon wafers is increased day by day, the flatness of the surfaces of the silicon wafers directly influences the quality of the solar cells, the solar cells are manufactured by using unqualified silicon wafers, the solar cells can be directly scrapped, the cost and resources are wasted, the flatness of a single surface is mostly detected by a camera in the conventional defect detection of the surfaces of the silicon wafers, and the flatness condition of the back surface cannot be guaranteed, so that detection equipment capable of detecting double surfaces is needed, and based on the background, the silicon wafer end surface defect detection equipment is provided to solve the problem that the double surfaces cannot be detected simultaneously in the silicon wafer detection.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon chip terminal surface defect check out test set, its aim at solve can not detect two-sided problem simultaneously when current silicon chip check out test set detects the defect on silicon chip surface.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a silicon chip terminal surface defect check out test set, including protection box assembly, turn-over mechanism, drive mechanism, two conveying mechanism and two detection mechanism, the inside fixed brace table that is provided with of protection box assembly, the fixed eight support columns and the eight support columns that are provided with in upper end of brace table are the symmetrical type and distribute in turn-over mechanism both sides, two conveying mechanism fixed mounting respectively is on the support column of distributing in turn-over mechanism both sides, turn-over mechanism fixed mounting just is located between two conveying mechanism in a brace table upper end, drive mechanism fixed mounting just is located between two conveying mechanism in a brace table upper end, two detection mechanism fixed mounting respectively is on every conveying mechanism.
Further, the protection box assembly includes feed inlet, discharge gate and two dustproof doors, the fixed one side of seting up in the protection box assembly of feed inlet is used for conveniently carrying the silicon chip and gets into check out test set, the fixed opposite side of seting up in the protection box assembly of discharge gate is used for conveniently seeing off the silicon chip that has detected the completion, two the dustproof door articulates respectively and sets up all fixedly on both sides and every dustproof door of protection box assembly and is provided with the operating condition that the glass observation window is used for observation device and prevents that the dust from getting into.
Further, every conveying mechanism includes workstation, transmission band and two pivots, workstation fixed mounting is on four support columns of turn-over mechanism lateral part, and the both sides of workstation are all fixed and are provided with two pivot supports, two the pivot is rotated respectively and is installed in the pivot support of workstation both sides, and is located the fixed belt pulley that is provided with of one end of the pivot of turn-over mechanism one side, the transmission band rotary type cup joints in two pivots.
Further, turn-over mechanism includes motor mount pad, step motor, connector, turn-over axle, two support axle beds and six blades, motor mount pad fixed mounting has seted up the motor hole in the upper end of brace table and the upper end of motor mount pad, step motor fixed mounting passes the motor hole in the upper end of motor mount pad and step motor's output shaft, connector fixed mounting is used for connecting the turn-over axle at the top of step motor output shaft, two it is symmetry type fixed mounting and lies in between two conveying mechanism to support the axle bed and be the upper end of symmetry type fixed mounting at the brace table and lie in, every the axle hole is all seted up to the upper end of supporting the axle bed and is used for pegging graft the turn-over axle, turn-over axle rotates to peg graft between two support axle beds and the one end of turn-over axle passes the axle hole and fixes pegging graft in the connector, six the blade is the fixed setting of annular array form on the turn-over axle, and every the standing groove has all been seted up to the blade and is used for placing male silicon chip, every the both sides of standing groove all establish fixed stopper and be provided with the removal that is used for preventing the silicon chip.
Further, drive mechanism includes driving motor, first driving belt, second driving belt, driving motor fixed mounting just is located step motor's below in the upper end of brace table, fixed inner belt pulley and the outer belt pulley of being provided with on driving motor's the output shaft, the one end of first driving belt cup joints on inner belt pulley, the other end of first driving belt cup joints the outside at one of them belt pulley, the one end of second driving belt cup joints on outer belt pulley, the other end of second driving belt cup joints the inboard at another belt pulley.
Further, every detection mechanism includes servo motor, camera pillar, threaded rod, slip swivel nut, slip support arm and detection camera, servo motor fixed mounting is on the top of camera pillar, and servo motor's output shaft fixed grafting is used for driving the rotation of threaded rod on the top of threaded rod, camera pillar fixed mounting is in the upper end of workstation, the removal that the support arm spout is used for limiting the slip support arm is seted up to the both sides of camera pillar, the threaded rod rotates the inside of pegging graft at the camera pillar, slip swivel nut is established on the threaded rod and the both sides of slip swivel nut all fixed be provided with the slide bar and one of them slide bar fixed mounting is at the lower extreme of slip support arm, the one end of slip support arm slides and sets up and be used for driving the slip support arm and detect the camera motion on the camera pillar, the other end fixed mounting of slip support arm is provided with the camera mount pad, it is used for detecting the level condition of silicon chip terminal surface to detect the camera fixed mounting on the camera mount pad.
The utility model has the advantages that:
the utility model discloses a set up turn-over mechanism, can make the silicon chip that needs detect carry out positive shooting and detect and the analysis, through turn-over mechanism with silicon chip upset 180 degrees, carry out the shooting at the silicon chip back again and detect and the analysis, guaranteed that the roughness of silicon chip positive and negative meets the requirements, can not be because of the quality that the terminal surface roughness of silicon chip is not up to standard makes the product not pass, adopt the mode of conveyer belt to carry the silicon chip that detects simultaneously, improved detection efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a partial structure of the protective box assembly of the present invention;
fig. 3 is a schematic view of a partial structure of the turn-over mechanism of the present invention;
fig. 4 is a schematic view of a partial structure of the transmission mechanism of the present invention;
fig. 5 is a schematic view of a partial structure of the conveying mechanism of the present invention;
fig. 6 is a schematic view of a partial structure of the detection mechanism of the present invention;
fig. 7 is a schematic view of the detection mechanism according to the present invention;
fig. 8 is a partially enlarged view of "a" in fig. 5.
In the figure:
1. a protective case assembly; 11. a support table; 12. a support column; 13. a feed inlet; 14. a discharge port; 15. a dust-proof door; 151. a glass viewing window;
2. a turn-over mechanism; 21. a motor mounting seat; 22. a stepping motor; 23. a connector; 24. a turnover shaft; 25. a support shaft seat; 26. a blade; 261. a placement groove; 262. a limiting block;
3. a transmission mechanism; 31. a drive motor; 32. a first drive belt; 33. a second drive belt;
4. a conveying mechanism; 41. a work table; 411. a rotating shaft support; 42. a conveyor belt; 43. a rotating shaft; 431. a belt pulley;
5. a detection mechanism; 51. a servo motor; 52. a camera post; 53. a threaded rod; 54. a sliding threaded sleeve; 55. sliding the support arm; 56. a camera is detected.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
Referring to fig. 1, a silicon wafer end surface defect detection device includes a protection box assembly 1, a turnover mechanism 2, a transmission mechanism 3, two conveying mechanisms 4 and two detection mechanisms 5, a support table 11 is fixedly arranged inside the protection box assembly 1, the upper end of the support table 11 is fixedly provided with eight support columns 12, and the eight support columns 12 are symmetrically distributed on two sides of the turnover mechanism 2, the two conveying mechanisms 4 are respectively and fixedly installed on the support columns 12 distributed on two sides of the turnover mechanism 2, the turnover mechanism 2 is fixedly installed on the support table 11 and located between the two conveying mechanisms 4, the transmission mechanism 3 is fixedly installed on the support table 11 and located between the two conveying mechanisms 4, and the two detection mechanisms 5 are respectively and fixedly installed on each conveying mechanism 4.
Referring to fig. 2, the protective box assembly 1 includes a feed port 13, a discharge port 14 and two dustproof doors 15, the feed port 13 is fixedly disposed on one side of the protective box assembly 1 and used for facilitating feeding of a silicon wafer into a detection device, the discharge port 14 is fixedly disposed on the other side of the protective box assembly 1 and used for facilitating feeding of the detected silicon wafer, the two dustproof doors 15 are respectively and hingedly disposed on two sides of the protective box assembly 1, and a glass observation window 151 is fixedly disposed on each dustproof door 15 and used for observing the working state of the device and preventing dust from entering the device, when the silicon wafer is fed into the feed port 13 through an external feeding mechanism, the silicon wafer is fed out through the discharge port 14 by the internal conveying mechanism 4, and when the detection device works normally, the dustproof doors 15 are in a closed state and can prevent certain dust from entering the device.
Referring to fig. 3, the flipping mechanism 2 includes a motor mounting base 21, a stepping motor 22, a connector 23, a flipping shaft 24, two supporting shaft bases 25 and six blades 26, the motor mounting base 21 is fixedly mounted at the upper end of the supporting table 11, and a motor hole is formed in the upper end of the motor mounting base 21, the stepping motor 22 is fixedly mounted at the upper end of the motor mounting base 21, and an output shaft of the stepping motor 22 passes through the motor hole, the connector 23 is fixedly mounted at the top end of the output shaft of the stepping motor 22 for connecting the flipping shaft 24, the two supporting shaft bases 25 are symmetrically and fixedly mounted at the upper end of the supporting table 11 and located between the two conveying mechanisms 4, a shaft hole is formed in the upper end of each supporting shaft base 25 for inserting the flipping shaft 24, the flipping shaft 24 is rotatably inserted between the two supporting shaft bases 25, and one end of the flipping shaft 24 passes through the shaft hole to be fixedly inserted in the connector 23, the six blades 26 are fixedly disposed on the flipping shaft 24 in an annular shape, and each blade 26 is disposed with a placement groove for placing a silicon wafer inserted, two sides of each placement groove 261 are disposed on the placement groove for preventing the silicon wafer 261 from moving forward, when the transmission belt 261 drives the stepping motor 22 to move one step of the stepping motor 22, and the stepping motor 22 to move one step down, and the stepping motor 42, and the blade 261 can drive the stepping motor 26 to move down the silicon wafer to move.
Referring to fig. 4, the transmission mechanism 3 includes a transmission motor 31, a first transmission belt 32, and a second transmission belt 33, the transmission motor 31 is fixedly installed at the upper end of the support platform 11 and located below the step motor 22, an inner belt pulley 431 and an outer belt pulley 431 are fixedly installed on an output shaft of the transmission motor 31, one end of the first transmission belt 32 is sleeved on the inner belt pulley 431, the other end of the first transmission belt 32 is sleeved on the outer side of one of the belt pulleys 431, one end of the second transmission belt 33 is sleeved on the outer belt pulley 431, and the other end of the second transmission belt 33 is sleeved on the inner side of the other belt pulley 431.
Referring to fig. 5 and 8, each conveying mechanism 4 includes a workbench 41, a conveying belt 42 and two rotating shafts 43, the workbench 41 is fixedly installed on four supporting columns 12 at the side of the turn-over mechanism 2, two rotating shaft supports 411 are fixedly installed at both sides of the workbench 41, the two rotating shafts 43 are respectively rotatably installed in the rotating shaft supports 411 at both sides of the workbench 41, a belt pulley 431 is fixedly installed at one end of the rotating shaft 43 at one side of the turn-over mechanism 2, the conveying belt 42 is rotatably sleeved on the two rotating shafts 43, the rotating shafts 43 are driven by the transmission mechanism 3 to drive the conveying belt 42 to operate, when a silicon wafer fed in from the outside reaches the surface of the conveying belt 42, the conveying belt 42 drives the silicon wafer to pass through a first detection mechanism 5 forward, then the silicon wafer is turned over by the turn-over mechanism 2, and then the silicon wafer is fed to a next detection mechanism 5 by another conveying belt 42, and then the silicon wafer is fed out through the discharge port 14.
Referring to fig. 6 and 7, each detection mechanism 5 includes a servo motor 51, a camera support 52, a threaded rod 53, a sliding screw 54, a sliding support arm 55 and a detection camera 56, the servo motor 51 is fixedly mounted at the top end of the camera support 52, an output shaft of the servo motor 51 is fixedly inserted into the top end of the threaded rod 53 for driving the threaded rod 53 to rotate, the camera support 52 is fixedly mounted at the upper end of the worktable 41, arm chutes are formed at two sides of the camera support 52 for limiting the movement of the sliding support arm 55, the threaded rod 53 is rotatably inserted into the camera support 52, the sliding screw 54 is slidably inserted into the threaded rod 53, sliding rods are fixedly arranged at two sides of the sliding screw 54, one sliding rod is fixedly mounted at the lower end of the sliding support arm 55, one end of the sliding support arm 55 is slidably arranged on the camera support 52 for driving the sliding support arm 55 and the detection camera 56 to move, the other end of the sliding support arm 55 is fixedly provided with a camera mounting seat, the detection camera 56 is fixedly mounted on the camera mounting seat and used for photographing and detecting the flatness of the end face of the silicon wafer, when the height of the detection camera 56 needs to be adjusted, the threaded rod 53 is driven to rotate through the operation of the servo motor 51, the sliding threaded sleeve 54 is enabled to move up and down on the threaded rod 53, as the sliding threaded sleeve 54 and the sliding support arm 55 are fixedly connected through the sliding rod, the sliding support arm 55 can move along with the sliding threaded sleeve 54 and can be determined after being adjusted to a specified position, when the silicon wafer is conveyed to the position under the detection camera 56, the detection camera 56 can photograph and detect, the detection result is analyzed through a computer, the detection of the front face of the silicon wafer is completed at the moment, and after the silicon wafer is turned over by the turning mechanism 2, the photographing and the detection is performed, so that the detection of the front face and the back face of the silicon wafer is completed.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a silicon chip terminal surface defect detection equipment, its characterized in that, is including protection box assembly (1), turn-over mechanism (2), drive mechanism (3), two conveying mechanism (4) and two detection mechanism (5), protection box assembly (1) inside fixed brace table (11) that is provided with, the upper end of brace table (11) is fixed to be provided with eight support columns (12) and is the symmetry type and distributes in turn-over mechanism (2) both sides, two conveying mechanism (4) fixed mounting respectively is on the support column (12) of distributing in turn-over mechanism (2) both sides, turn-over mechanism (2) fixed mounting is in brace table (11) upper end and is located between two conveying mechanism (4), drive mechanism (3) fixed mounting just is located between two conveying mechanism (4) in brace table (11) upper end, two detection mechanism (5) is fixed mounting respectively on every conveying mechanism (4).
2. The silicon wafer end surface defect detection equipment according to claim 1, wherein the protective box assembly (1) comprises a feeding hole (13), a discharging hole (14) and two dustproof doors (15), the feeding hole (13) is fixedly arranged on one side of the protective box assembly (1) and used for facilitating conveying of a silicon wafer into the detection equipment, the discharging hole (14) is fixedly arranged on the other side of the protective box assembly (1) and used for facilitating sending out of a detected silicon wafer, and the two dustproof doors (15) are respectively hinged to two sides of the protective box assembly (1) and are respectively fixedly provided with a glass observation window (151) for observing the working state of the equipment and preventing dust from entering the dustproof doors (15).
3. The silicon wafer end surface defect detection equipment of claim 2, characterized in that, every conveying mechanism (4) includes workstation (41), transmission band (42) and two pivot (43), workstation (41) fixed mounting is on four support columns (12) of turn-over mechanism (2) lateral part, and the both sides of workstation (41) are all fixed and are provided with two pivot supports (411), two pivot (43) rotate respectively and install in pivot support (411) of workstation (41) both sides, and the one end that is located pivot (43) of turn-over mechanism (2) one side is fixed and is provided with belt pulley (431), transmission band (42) rotary type cup joints on two pivot (43).
4. The silicon wafer end surface defect detection equipment as claimed in claim 3, wherein the turnover mechanism (2) comprises a motor mounting seat (21), a stepping motor (22), a connector (23), a turnover shaft (24), two supporting shaft seats (25) and six blades (26), the motor mounting seat (21) is fixedly mounted at the upper end of the support platform (11), a motor hole is formed at the upper end of the motor mounting seat (21), the stepping motor (22) is fixedly mounted at the upper end of the motor mounting seat (21), an output shaft of the stepping motor (22) penetrates through the motor hole, the connector (23) is fixedly mounted at the top end of an output shaft of the stepping motor (22) and is used for connecting the turnover shaft (24), the two supporting shaft seats (25) are symmetrically and fixedly mounted at the upper end of the support platform (11) and are located between the two conveying mechanisms (4), a shaft hole is formed at the upper end of each supporting shaft seat (25) and is used for inserting the turnover shaft (24), the turnover shaft (24) rotates between the two supporting shaft seats (25), one end of the turnover shaft (24) penetrates through the fixed shaft (24) and is inserted into the six blades (26) and is placed in the annular groove (261), and both sides of each placing groove (261) are respectively and fixedly provided with a limiting block (262) for preventing the silicon wafers from moving.
5. The silicon wafer end surface defect detection device according to claim 4, wherein the transmission mechanism (3) comprises a transmission motor (31), a first transmission belt (32) and a second transmission belt (33), the transmission motor (31) is fixedly installed at the upper end of the support table (11) and is located below the stepping motor (22), an inner belt pulley (431) and an outer belt pulley (431) are fixedly arranged on an output shaft of the transmission motor (31), one end of the first transmission belt (32) is sleeved on the inner belt pulley (431), the other end of the first transmission belt (32) is sleeved on the outer side of one of the belt pulleys (431), one end of the second transmission belt (33) is sleeved on the outer belt pulley (431), and the other end of the second transmission belt (33) is sleeved on the inner side of the other belt pulley (431).
6. The silicon wafer end surface defect detection equipment according to claim 5, wherein each detection mechanism (5) comprises a servo motor (51), a camera support (52), a threaded rod (53), a sliding screw sleeve (54), a sliding support arm (55) and a detection camera (56), the servo motor (51) is fixedly arranged at the top end of the camera support post (52), and the output shaft of the servo motor (51) is fixedly inserted at the top end of the threaded rod (53) for driving the threaded rod (53) to rotate, the camera support column (52) is fixedly arranged at the upper end of the workbench (41), two sides of the camera support post (52) are provided with support arm sliding grooves for limiting the movement of the sliding support arm (55), the threaded rod (53) is rotatably inserted into the camera post (52), the sliding threaded sleeve (54) is sleeved on the threaded rod (53) in a sliding manner, sliding rods are fixedly arranged on two sides of the sliding threaded sleeve (54), one sliding rod is fixedly arranged at the lower end of the sliding support arm (55), one end of the sliding support arm (55) is arranged on the camera support column (52) in a sliding way and is used for driving the sliding support arm (55) and the detection camera (56) to move, the other end of the sliding support arm (55) is fixedly provided with a camera mounting seat, and the detection camera (56) is fixedly mounted on the camera mounting seat and used for photographing and detecting the smoothness of the end face of the silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222394052.4U CN218470565U (en) | 2022-09-08 | 2022-09-08 | Silicon chip terminal surface defect detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222394052.4U CN218470565U (en) | 2022-09-08 | 2022-09-08 | Silicon chip terminal surface defect detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218470565U true CN218470565U (en) | 2023-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222394052.4U Active CN218470565U (en) | 2022-09-08 | 2022-09-08 | Silicon chip terminal surface defect detection equipment |
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| Country | Link |
|---|---|
| CN (1) | CN218470565U (en) |
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2022
- 2022-09-08 CN CN202222394052.4U patent/CN218470565U/en active Active
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