CN218460293U

CN218460293U - Silicon wafer boiling tool and system

Info

Publication number: CN218460293U
Application number: CN202222210669.6U
Authority: CN
Inventors: 王彦娟; 李玲玲; 马建仁; 丁亚国; 马全森
Original assignee: Ningxia Dunyuan Poly Core Semiconductor Technology Co ltd
Current assignee: Ningxia Dunyuan Poly Core Semiconductor Technology Co ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2023-02-10
Anticipated expiration: 2032-08-22

Abstract

The utility model provides a silicon chip boils frock, includes apron, bottom plate, one side of apron is rotated with one side of bottom plate and is connected, the bottom plate includes first arch, second arch, first liquid circulation hole, first arch is "ten" font, and is a plurality of first arch is along transversely arranging into the several rows on the bottom plate, along vertically arranging into several rows, one section distance at interval between two adjacent first archs, and four adjacent first archs enclose into a square region and be used for placing the silicon chip, and are equipped with first liquid circulation hole on the bottom plate at every square region middle part, first liquid circulation hole link up the bottom plate, the second arch is established at four corners in square region, the bellied upper surface of second is less than first bellied upper surface to with the silicon chip frame in square region, the boiling water of being convenient for fully contacts with the silicon chip surface, washs the upper and lower surface of each silicon chip, makes more thorough that impurity got rid of, promotes the cleaning efficiency of silicon chip.

Description

Silicon wafer boiling tool and system

Technical Field

The utility model belongs to the technical field of the semiconductor cleaning, especially, relate to a silicon chip boils frock and system.

Background

Silicon wafers are the principal substrate material for modern very large scale integrated circuits, and integrated circuit grade semiconductor wafers are typically made by processes such as crystal pulling, slicing, chamfering, lapping, etching, back sealing, polishing, cleaning, and the like. The step of cleaning is mainly to use boiling water to soak and wash away impurities such as glue residue and the like attached to the surface of the silicon wafer.

Staff usually puts into a container with a plurality of silicon chips among the prior art and adds boiling water and soaks to detach impurity, be difficult to comprehensive washing when a plurality of silicon chips overlap each other, need relapse a lot of washing and just can reach the edulcoration standard, work efficiency is lower, extravagant manpower.

Disclosure of Invention

In view of the above, it is necessary to provide a wafer boiling tool for improving the cleaning efficiency.

It is also necessary to provide a wafer boiling system.

A silicon wafer boiling tool comprises a cover plate and a base plate, wherein one side of the cover plate is rotatably connected with one side of the base plate, the base plate comprises first bulges, second bulges and first liquid circulation holes, the first bulges are in a cross shape, the first bulges are transversely arranged on the base plate in a plurality of rows and are longitudinally arranged in a plurality of rows, a distance is reserved between every two adjacent first bulges, every four adjacent first bulges surround a square area for placing a silicon wafer, the size of each square area is the same, the base plate in the middle of each square area is provided with the first liquid circulation holes, the first liquid circulation holes penetrate through the base plate, the second bulges are arranged at four corners of the square area, the upper surfaces of the second bulges are lower than the upper surfaces of the first bulges, the second bulges can support the silicon wafer so that liquid can flow in from the first liquid circulation holes, the cover plate is provided with the second liquid circulation holes, and the second liquid circulation holes are arranged at positions opposite to the first liquid circulation holes.

Preferably, the second protrusion is "L" shaped.

Preferably, still include the support, the support has two, sets up the both sides at the bottom plate respectively, the support includes first support montant, second support montant, support horizontal pole, portable pole, first slider, the top of first support montant is connected with the one end of portable pole, the top that the second supported the montant is connected with the other end of portable pole, the middle part of first support montant is connected with the one end of supporting the horizontal pole, the middle part that the second supported the montant is connected with the other end of supporting the horizontal pole, first slider is rectangular shape, first slider is connected with the bottom that first support montant, second support the montant, first support montant, second support the montant and be connected with the side of bottom plate.

The utility model provides a silicon chip boils system, includes that foretell silicon chip boils the frock and boils the washing basin, it includes cell body, heating device, baffle, inlet tube, outlet pipe to boil the washing basin, heating device establishes the bottom at the cell body, the baffle is established on the cell body of heating device's top, be equipped with the hole on the baffle, be equipped with two first spouts on the baffle, the outlet pipe is established in the below of cell body, the inlet tube is established in the top of cell body, and the silicon chip boils the frock and can put into and boil the washing basin, and the silicon chip boils the first slider of frock and boils the first spout sliding fit of washing basin.

Preferably, boil and wash the basin and still include the swing subassembly, the swing subassembly includes motor, sealing member, carousel, rocker, connecting rod, second spout, second slider, the output shaft of motor passes the lateral wall of basin through the sealing member, the tip and the carousel of the output shaft of motor are connected, the outward flange of carousel is connected, the other end of rocker is connected with one side of second slider, is equipped with the second spout on the lateral wall of cell body, second slider and second spout sliding fit, the opposite side of second slider is connected with the one end of connecting rod, the other end of connecting rod passes through strong magnet fixed connection with the support that the silicon chip boiled the frock.

Preferably, the cross-section of sealing member is the annular, and annular cavity position is used for passing the output shaft of motor, is equipped with the seal groove on the inner ring wall of sealing member, and the seal groove is cyclic annular, the cross-section of seal groove is the arc, fill soft medium in the seal groove.

Compared with the prior art, the invention has the beneficial effects that:

use above-mentioned silicon chip to boil frock and load silicon chip, can separate the silicon chip, and because the silicon chip boils one section distance in interval between two adjacent first archs on the frock bottom plate, so four liquid circulation passageways are formed around the square region, first liquid circulation hole and second liquid circulation hole on bottom plate and the apron of deuterogamying, can boil when the silicon chip that will load the silicon chip boils the frock and immerses boiling water, boiling water flows in and flows from liquid circulation hole and liquid circulation passageway, fully contact with the silicon chip surface, wash the upper and lower surface of each silicon chip, make more thorough that impurity was got rid of, promote the cleaning efficiency of silicon chip.

Drawings

FIG. 1 is a schematic structural diagram of a silicon wafer boiling tool of the present application.

FIG. 2 is a partially enlarged schematic view of the wafer boiling tool of the present application.

Fig. 3 is a schematic structural view of the boiling and cleaning water tank of the present application.

Fig. 4 is a schematic structural view of the seal of the present application.

In the figure: the silicon wafer boiling tool comprises a silicon wafer boiling tool 10, a cover plate 11, a second liquid circulation hole 111, a bottom plate 12, a first protrusion 121, a second protrusion 122, a first liquid circulation hole 123, a support 13, a first supporting vertical rod 131, a second supporting vertical rod 132, a supporting cross rod 133, a hand-held rod 134, a first sliding block 135, a boiling and cleaning water tank 20, a tank body 21, a heating device 22, a baffle plate 23, a water inlet pipe 24, a water outlet pipe 25, a swing assembly 26, a sealing element 261, a sealing groove 2611, a rotating disc 262, a rocker 263, a connecting rod 264, a second sliding groove 265, a second sliding block 266 and a motor 267.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Referring to fig. 1 to 2, the embodiment of the present invention provides a silicon wafer boiling tool 10, including a cover plate 11 and a bottom plate 12, one side of the cover plate 11 is rotatably connected to one side of the bottom plate 12, the bottom plate 12 includes a first protrusion 121, a second protrusion 122, a first liquid circulation hole 123, the first protrusion 121 is "cross", a plurality of first protrusions 121 are arranged in a plurality of rows on the bottom plate 12 along the transverse direction, the rows are arranged along the longitudinal direction, a distance is arranged between two adjacent first protrusions 121, four adjacent first protrusions 121 enclose a square area for placing a silicon wafer, each square area has the same size, and a first liquid circulation hole 123 is arranged on the bottom plate 12 in the middle of each square area, the first liquid circulation hole 123 penetrates through the bottom plate 12, the second protrusion 122 is arranged at four corners of the square area, the upper surface of the second protrusion 122 is lower than the upper surface of the first protrusion 121, a second liquid circulation hole 111 is arranged on the cover plate 11, and the second liquid circulation hole 111 is arranged at a position opposite to the first liquid circulation hole 123. The second protrusion 122 can be used for erecting a silicon wafer placed in a square area so as to enable a gap to be reserved between the silicon wafer and the bottom plate 12, so that liquid can flow conveniently, the turnover cover plate 11 can be used for buckling the bottom plate 12 to prevent the silicon wafer from falling out, the lower surface of the cover plate 11 can abut against the upper surface of the first protrusion 121, and a gap is reserved between the cover plate 11 and the silicon wafer.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the silicon wafer boiling tool 10 is used for loading silicon wafers, the silicon wafers can be separated, and because a distance is reserved between every two adjacent first protrusions 121 on the bottom plate 12 of the silicon wafer boiling tool 10, four liquid circulation channels are formed around the square area, and then the first liquid circulation holes 123 and the second liquid circulation holes 111 on the bottom plate 12 and the cover plate 11 are matched with each other, when the silicon wafer boiling tool 10 loaded with the silicon wafers is immersed in boiling water, the boiling water flows in and flows out from the liquid circulation holes and the liquid circulation channels, fully contacts the surfaces of the silicon wafers, and cleans the upper surface and the lower surface of each silicon wafer, so that impurities are removed more thoroughly, and the cleaning efficiency of the silicon wafers is improved.

Referring to fig. 1-2, further, the second protrusion 122 is "L" shaped.

Referring to fig. 1 to 2, further, still include support 13, support 13 has two, set up the both sides at bottom plate 12 respectively, support 13 includes first support montant 131, second support montant 132, support horizontal pole 133, portable pole 134, first slider 135, the top of first support montant 131 is connected with the one end of portable pole 134, the top of second support montant 132 is connected with the other end of portable pole 134, the middle part of first support montant 131 is connected with the one end of supporting horizontal pole 133, the middle part of second support montant 132 is connected with the other end of supporting horizontal pole 133, first slider 135 is rectangular shape, first slider 135 and first support montant 131, the bottom of second support montant 132 is connected, first support montant 131, second support montant 132 is connected with the side of bottom plate 12.

Referring to fig. 3, the utility model also provides a silicon chip system of boiling, boil frock 10 and boil washing basin 20 including foretell silicon chip, it includes cell body 21 to boil washing basin 20, heating device 22, baffle 23, inlet tube 24, outlet pipe 25, heating device 22 establishes the bottom at cell body 21, baffle 23 is established on the cell body 21 of heating device 22's top, be equipped with the hole on the baffle 23, baffle 23 is equipped with two first spouts on the surface, outlet pipe 25 establishes the below at cell body 21, inlet tube 24 establishes the top at cell body 21, inlet tube 24, be equipped with the valve on the outlet pipe 25. The silicon wafer boiling tool 10 can be placed in the boiling and cleaning water tank 20, and the first sliding block 135 of the silicon wafer boiling tool 10 is in sliding fit with the first sliding groove of the boiling and cleaning water tank 20. The baffle 23 is used for dividing the tank body 21 into two areas, the heating device 22 is arranged below the baffle 23, the heating device 22 can be an electric heating pipe, water placed in the tank body 21 is heated, high water temperature is kept in the silicon wafer cleaning process, the silicon wafer boiling tool 10 is arranged above the baffle 23, and liquid above and below the baffle 23 can be exchanged through holes.

In a specific embodiment, the top end of the first vertical support rod 131 is hinged to one end of the portable rod 134, the top end of the second vertical support rod 132 is hinged to the other end of the portable rod 134, the middle of the first vertical support rod 131 is hinged to one end of the support cross rod 133, the middle of the second vertical support rod 132 is hinged to the other end of the support cross rod 133, the first slider 135 is hinged to the first vertical support rod 131, the bottom end of the second vertical support rod 132 is hinged to the bottom end of the first vertical support rod 131, the second vertical support rod 132 is hinged to the side of the bottom plate 12, the support 13 further includes a first torsion spring, a second torsion spring, one end of the first torsion spring is connected to one end of the support cross rod 133, the other end of the first torsion spring is connected to the middle of the first vertical support rod 131, one end of the second torsion spring is connected to the other end of the support cross rod 133, and the other end of the second torsion spring is connected to the middle of the second vertical support rod 132. When support 13 receives the external force first support montant 131, the slope of second support montant 132, first support montant 131, second support montant 132 resume vertical state when not receiving the external force, can drive bottom plate 12 swing through unstable support 13 structure, when the silicon chip boils frock 10 and immerses the boiling water of boiling washing basin 20, bottom plate 12 can be automatic swing under the rivers thrust of boiling, the impurity on the efficient except the silicon chip more.

Referring to fig. 3, further, the boiling and cleaning water tank 20 further includes a swing assembly 26, the swing assembly 26 includes a motor 267, a sealing member 261, a rotary plate 262, a rocker 263, a connecting rod 264, a second sliding groove 265, and a second sliding block 266, an output shaft of the motor 267 passes through a side wall of the water tank through the sealing member 261, an end portion of the output shaft of the motor 267 is connected with the rotary plate 262, an outer edge of the rotary plate 262 is connected, the other end of the rocker 263 is connected with one side of the second sliding block 266, the side wall of the tank body 21 is provided with the second sliding groove 265, the second sliding block 266 is in sliding fit with the second sliding groove 265, the other side of the second sliding block 266 is connected with one end of the connecting rod 264, and the other end of the connecting rod 264 is fixedly connected with the bracket 13 of the silicon wafer boiling tool 10 through a strong magnet. The rocking bar 263 of the swinging assembly 26 converts the rotation of the motor 267 into the linear motion of the second sliding block 266, so as to drive the silicon wafer boiling tool 10 to swing back and forth in the boiling and cleaning water tank 20, so that the liquid can flow on the surface of the silicon wafer more fully, and impurities on the silicon wafer can be removed more efficiently.

Referring to fig. 4, further, the cross section of the sealing member 261 is annular, the annular hollow portion is used for passing through the output shaft of the motor 267, a sealing groove 2611 is arranged on the inner annular wall of the sealing member 261, the sealing groove 2611 is annular, the cross section of the sealing groove 2611 is arc-shaped, and the sealing groove 2611 is filled with soft media. Grease may be used as a soft medium to fill the sealing groove 2611.

The modules or units in the device of the embodiment of the invention can be combined, divided and deleted according to actual needs.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a silicon chip boils frock which characterized in that: the silicon wafer packaging structure comprises a cover plate and a base plate, wherein one side of the cover plate is rotatably connected with one side of the base plate, the base plate comprises first bulges, second bulges and first liquid circulation holes, the first bulges are in a cross shape, a plurality of first bulges are transversely arranged on the base plate in a plurality of rows and are longitudinally arranged in a plurality of rows, a distance is reserved between every two adjacent first bulges, the four adjacent first bulges form a square area for placing a silicon wafer, the size of each square area is the same, the base plate in the middle of each square area is provided with the first liquid circulation holes, the first liquid circulation holes penetrate through the base plate, the second bulges are arranged at four corners of the square area, the upper surfaces of the second bulges are lower than the upper surfaces of the first bulges, the cover plate is provided with the second liquid circulation holes, and the second liquid circulation holes are arranged at positions opposite to the first liquid circulation holes.

2. The wafer boiling tooling of claim 1, wherein: the second protrusion is L-shaped.

3. The wafer boiling tool of claim 2, wherein: the support comprises a first support montant, second support montant, support horizontal pole, portable pole, first slider, the top of first support montant is connected with the one end of portable pole, the top of second support montant is connected with the other end of portable pole, the middle part of first support montant is connected with the one end of supporting the horizontal pole, the middle part of second support montant is connected with the other end of supporting the horizontal pole, first slider is rectangular shape, first slider is connected with the bottom that first support montant, second support montant, first support montant, second support the montant and are connected with the side of bottom plate.

4. A silicon wafer boiling system, comprising: including the silicon chip boil frock and boil and wash the basin, boil and wash the basin and include cell body, heating device, baffle, inlet tube, outlet pipe, heating device establishes the bottom at the cell body, the baffle is established on the cell body of heating device's top, be equipped with the hole on the baffle, be equipped with two first spouts on the baffle, the outlet pipe is established in the below of cell body, the inlet tube is established in the top of cell body, and the silicon chip boils the frock and can put into boiling and wash the basin, the silicon chip boil the first slider of frock and boil the first spout sliding fit who washs the basin.

5. The wafer boiling system of claim 4, wherein: boil and wash basin still includes the swing subassembly, the swing subassembly includes motor, sealing member, carousel, rocker, connecting rod, second spout, second slider, the output shaft of motor passes the lateral wall of basin through the sealing member, the tip and the carousel of the output shaft of motor are connected, the outward flange of carousel is connected, the other end of rocker is connected with one side of second slider, is equipped with the second spout on the lateral wall of cell body, second slider and second spout sliding fit, the opposite side of second slider is connected with the one end of connecting rod, the other end of connecting rod and the support of silicon chip boiling frock pass through strong magnet fixed connection.

6. The wafer boiling system of claim 5, wherein: the cross-section of sealing member is the annular, and annular cavity position is used for passing the output shaft of motor, is equipped with the seal groove on the inner annular wall of sealing member, and the seal groove is cyclic annular, the cross-section of seal groove is the arc, fill soft medium in the seal groove.