CN218450664U - FPC multiply wood that has consent - Google Patents
FPC multiply wood that has consent Download PDFInfo
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- CN218450664U CN218450664U CN202222040348.6U CN202222040348U CN218450664U CN 218450664 U CN218450664 U CN 218450664U CN 202222040348 U CN202222040348 U CN 202222040348U CN 218450664 U CN218450664 U CN 218450664U
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Abstract
The utility model discloses a FPC multiply wood that has consent, concretely relates to flexible line way board technical field, which comprises a mainboard, the mainboard includes the substrate, the substrate top is equipped with the enhancement layer, the enhancement layer top is equipped with the insulating layer, the insulating layer top is equipped with the shielding layer, the shielding layer top is equipped with high temperature resistant layer, high temperature resistant layer top is equipped with the protective layer, the substrate bottom is equipped with antistatic backing, the outside cover of mainboard is equipped with radiator unit. The utility model discloses a with the help of the enhancement layer that has crack resistance, insulating layer of insulating properties, interference immunity performance's shielding layer, the high temperature resistant layer of high temperature resistance and the antistatic backing of preventing static, with the help of layer upon layer cooperation, can effectively improve the utility model discloses an insulating properties, interference killing feature, antistatic backing and effective increase of service life, and then can effectively improve the utility model discloses a practicality and adaptability.
Description
Technical Field
The utility model relates to a flexible line way board technical field, the more specifically FPC multiply wood that has consent that says so.
Background
The flexible circuit board is called as a 'soft board' in short, is commonly called as FPC in the industry, is a printed circuit board made of flexible insulating base materials, and is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. The FPC is widely applied to the fields or products of aerospace, military, mobile communication, laptop, computer peripheral equipment, PDA, digital camera and the like, and plug holes are often formed in the FPC of a multilayer board during wiring so as to facilitate subsequent use.
The practicality and the adaptability of the existing FPC board are lower, and then the using effect of the FPC board can be influenced, so that the FPC multilayer board with plug holes is needed for improving the practicability and the adaptability.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's above-mentioned defect, the utility model provides a FPC multiply wood that has consent, through with the help of enhancement layer, insulating properties's insulating layer, interference immunity performance shielding layer, high temperature resistant layer that have the crack resistance performance and the antistatic backing of preventing static, with the help of cooperating layer upon layer, can effectively improve the utility model discloses an insulating properties, interference killing feature, antistatic backing and effective increase of service life, and then can effectively improve the utility model discloses a practicality and adaptability to solve the problem that appears in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a FPC multiply wood that has consent, includes the mainboard, the mainboard includes the substrate, the substrate top is equipped with the enhancement layer, the enhancement layer top is equipped with the insulating layer, the insulating layer top is equipped with the shielding layer, the shielding layer top is equipped with high temperature resistant layer, high temperature resistant layer top is equipped with the protective layer, the substrate bottom is equipped with antistatic backing, the outside cover of mainboard is equipped with radiator unit, through with the help of the enhancement layer that has the crack control ability, insulating layer of insulating properties, interference immunity ability's shielding layer, high temperature resistant layer and the antistatic backing's of antistatic backing cooperation layer upon layer, can effectively improve the utility model discloses an insulating properties, interference immunity ability, antistatic backing and effective increase of service life.
In a preferred embodiment, radiator unit includes heat conduction frame, the mainboard outside is located to the heat conduction frame cover, the heat conduction frame outside is equipped with a plurality of heat conduction framves, even interval between a plurality of heat conduction framves, the heat conduction is put up one end and the heat conduction frame fixed connection of being close to the mainboard, a plurality of louvres have been seted up to inside running through of heat conduction frame, and even interval sets up between a plurality of louvres, through heat conduction frame's setting, the heat that produces when being convenient for with the mainboard operation absorbs the guide, gives heat conduction frame with the heat conduction, and heat conduction frame is with the help of the setting of a plurality of louvres, the circulation of the air of also being convenient for when increase with air area of contact, and then can effectively improve the utility model discloses a heat dispersion.
In a preferred embodiment, the reinforcing layer is made of flexible plastic, and the anti-cracking performance of the present invention can be improved by using flexible plastic with deformability, so as to prolong the service life of the main board.
In a preferred embodiment, the insulating layer is made of a silicone rubber material, so that the present invention has better insulating performance by adopting a silicone material with insulating performance.
In a preferred embodiment, the shielding layer is an electromagnetic shielding film, and interference can be further reduced by the arrangement of the electromagnetic shielding film, so that the anti-interference performance of the mainboard is guaranteed.
In a preferred embodiment, the high temperature resistant layer is made of PET material, and the high temperature resistance of the utility model can be effectively improved by adopting the PET material with creep resistance, fatigue resistance, heat resistance and high toughness.
In a preferred embodiment, the protective layer is made of a polyethylene material, and the protective layer made of the polyethylene material can effectively improve the protection of the main board.
In a preferred embodiment, the antistatic layer is made of a nano conductive carbon black material, and the antistatic effect of the present invention can be effectively improved by using the nano conductive carbon black material with stable conductive property and high structural performance.
The utility model discloses a technological effect and advantage:
1. the utility model discloses an adopt to have deformable toughness plastics, can improve the utility model discloses an anti cracking performance, the life of extension mainboard, make through adopting the silica gel material that has insulating properties to make the insulating layer, the utility model discloses better insulating properties has, through the setting of electromagnetic shield membrane, the anti interference performance of guarantee mainboard, through adopting the PET material that has creep resistance, fatigue resistance, heat-resisting and toughness are high to make high temperature resistant layer, can effectively improve the high temperature resistance of the utility model discloses, through adopting the nanometer conductive carbon black material that possesses stable conductive property and high structural performance to make antistatic backing, can effectively improve the anti static effect of the utility model, overall structure can effectively improve the insulating properties of the utility model, anti interference performance, antistatic backing and effective increase of service life with the help of the layer upon layer cooperation of enhancement layer, insulating layer, shielding layer, high temperature resistant layer and antistatic backing;
2. the utility model discloses a heat conduction frame's setting, the heat that is convenient for produce when the mainboard moves absorbs the guide, gives the heat conduction frame heat conduction, and the heat conduction frame is with the help of the setting of a plurality of louvres, the circulation of the air of also being convenient for when increasing with air area of contact, and then can effectively improve the utility model discloses a heat dispersion.
Drawings
FIG. 1 is a front view of the overall structure of the present invention;
FIG. 2 is a front view of the heat-conducting frame of the present invention;
FIG. 3 is a front view of the main board of the present invention;
FIG. 4 is an exploded view of the main board of the present invention;
fig. 5 is a cross-sectional view of the main board of the present invention.
The reference signs are: 1. a main board; 2. a substrate; 3. a reinforcing layer; 4. an insulating layer; 5. a shielding layer; 6. a high temperature resistant layer; 7. a protective layer; 8. an antistatic layer; 9. a thermally conductive frame; 10. a heat conducting frame; 11. and (4) radiating holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to the attached drawings 1-5 of the specification, the FPC multiply wood that has consent of this embodiment, including mainboard 1, mainboard 1 includes substrate 2, 2 tops of substrate are equipped with enhancement layer 3, 3 tops of enhancement layer are equipped with insulating layer 4, 4 tops of insulating layer are equipped with shielding layer 5, 5 tops of shielding layer are equipped with high temperature resistant layer 6, 6 tops of high temperature resistant layer are equipped with protective layer 7, 2 bottoms of substrate are equipped with antistatic backing 8, the outside cover of mainboard 1 is equipped with radiator unit, and through with the help of enhancement layer 3 that has crack resistance, insulating layer 4 of insulating property, interference immunity's shielding layer 5, high temperature resistant layer 6 and the antistatic backing 8's cooperation layer upon layer, can effectively improve the utility model discloses an insulating property, interference killing feature, antistatic backing and effective increase of service life.
Insulating layer 4 is made by the silicon rubber material, through adopting the silica gel material that has insulating properties, makes the utility model discloses better insulating properties has.
High temperature resistant layer 6 is made by the PET material, has creep resistance, fatigue resistance, heat-resisting and the high PET material of toughness through the adoption, can effectively improve the utility model discloses a high temperature resistance can.
The protective layer 7 is made of polyethylene materials, and the protective force on the mainboard 1 can be effectively improved by means of the protective layer 7 made of polyethylene materials.
Through adopting to have deformable toughness plastics, can improve the utility model discloses an anti cracking property, and then can be better prevent the fracture of mainboard 1, prolong mainboard 1's life, make insulating layer 4 through adopting the silica gel material that has insulating properties, make the utility model discloses better insulating properties has, through the setting of electromagnetic shielding film, can further reduce the interference, guarantee mainboard 1's interference killing feature, through adopting to have creep resistance, fatigue resistance, high temperature resistant layer 6 is made to the PET material that heat-resisting and toughness are high, can effectively improve the utility model discloses a high temperature resistant performance can effectively improve through adopting the nanometer conductive carbon black material that possesses stable conductive property and high structural property to make antistatic backing 8, can effectively improve the utility model discloses an antistatic effect, overall structure is with the help of 3, insulating layer 4, shielding layer 5, the cooperation layer upon layer of high temperature resistant layer 6 and antistatic backing 8, can effectively improve the utility model discloses an insulating properties, interference killing feature, antistatic backing and effective increase of service life.
Referring to the attached drawings 1 and 2 of the specification, the FPC multilayer board with plugholes of this embodiment, the heat dissipation assembly includes a heat conduction frame 9, the heat conduction frame 9 is sleeved outside the motherboard 1, the heat conduction frame 9 is provided outside with a plurality of heat conduction frames 10, and a plurality of heat conduction frames 10 are evenly spaced, the heat conduction frame 10 is close to one end of the motherboard 1 and is fixedly connected with the heat conduction frame 9, a plurality of heat dissipation holes 11 are formed inside the heat conduction frame 10 in a penetrating manner, and are evenly spaced between the heat dissipation holes 11, so that the heat generated when the motherboard 1 runs can be absorbed and guided through the heat conduction frame 9, the heat is conducted to the heat conduction frame 10, and the heat conduction frame 10 is provided with the help of the plurality of heat dissipation holes 11, so that the air circulation is facilitated while the contact area with the air is increased, and the heat dissipation performance can be effectively improved.
And finally: the foregoing is illustrative of the preferred embodiments of the present invention, and is not to be construed as limiting the invention, and any modifications, equivalent alterations, improvements and the like made within the spirit and principle of the invention are intended to be included within the scope of the invention.
Claims (8)
1. The utility model provides a FPC multiply wood that has consent, includes mainboard (1), its characterized in that: mainboard (1) includes substrate (2), substrate (2) top is equipped with enhancement layer (3), enhancement layer (3) top is equipped with insulating layer (4), insulating layer (4) top is equipped with shielding layer (5), shielding layer (5) top is equipped with high temperature resistant layer (6), high temperature resistant layer (6) top is equipped with protective layer (7), substrate (2) bottom is equipped with antistatic backing (8), mainboard (1) outside cover is equipped with radiator unit.
2. The FPC multilayer board having the plug hole according to claim 1, wherein: the heat dissipation assembly comprises a heat conduction frame (9), the heat conduction frame (9) is sleeved outside the main board (1), a plurality of heat conduction frames (10) are arranged outside the heat conduction frame (9), the heat conduction frames (10) are evenly spaced, one end, close to the main board (1), of each heat conduction frame (10) is fixedly connected with the heat conduction frame (9), a plurality of heat dissipation holes (11) are formed in the heat conduction frames (10) in a penetrating mode, and the heat dissipation holes (11) are evenly spaced.
3. An FPC multilayer board with tap holes according to claim 1, wherein: the reinforcing layer (3) is made of tough plastic.
4. An FPC multilayer board with tap holes according to claim 1, wherein: the insulating layer (4) is made of a silicon rubber material.
5. The FPC multilayer board having the plug hole according to claim 1, wherein: the shielding layer (5) is an electromagnetic shielding film.
6. An FPC multilayer board with tap holes according to claim 1, wherein: the high-temperature resistant layer (6) is made of PET material.
7. An FPC multilayer board with tap holes according to claim 1, wherein: the protective layer (7) is made of polyethylene material.
8. An FPC multilayer board with tap holes according to claim 1, wherein: the antistatic layer (8) is made of a nano conductive carbon black material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222040348.6U CN218450664U (en) | 2022-08-04 | 2022-08-04 | FPC multiply wood that has consent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222040348.6U CN218450664U (en) | 2022-08-04 | 2022-08-04 | FPC multiply wood that has consent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218450664U true CN218450664U (en) | 2023-02-03 |
Family
ID=85092810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222040348.6U Active CN218450664U (en) | 2022-08-04 | 2022-08-04 | FPC multiply wood that has consent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218450664U (en) |
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2022
- 2022-08-04 CN CN202222040348.6U patent/CN218450664U/en active Active
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