CN218446093U - Optical module - Google Patents

Abstract

The application provides an optical module, including: the light-emitting chip protective cover is buckled above the light-emitting chip and fixed on the circuit board, the light-emitting coupling protective cover is buckled above the light-emitting coupling part and fixed on the circuit board, and the light-receiving protective cover is buckled above the light-receiving chip and the light-receiving coupling part and fixed on the circuit board. In this embodiment, through the light emitting chip protective cover, the light emitting coupling protective cover and the light receiving protective cover, the gold wires connected between the light emitting chip and the circuit board and the gold wires connected between the light receiving chip and the circuit board are effectively protected from being damaged in the production process of the optical module, and the light emitting coupling part and the light receiving coupling part are also effectively protected from being damaged, so that the quality of the optical module is ensured.

Description

Optical module

Technical Field

The utility model relates to an optical communication technical field especially relates to an optical module.

Background

The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous improvement of the global bandwidth demand and the expansion of data centers and the application fields of the security monitoring optical communication industry, the optical fiber broadband access has become a mainstream communication mode. Under the promotion of popularization of terminals such as smart phones and the like and applications such as video and cloud computing, telecommunication operators continuously invest in building and upgrading mobile broadband and optical fiber broadband networks, and the investment scale of optical communication equipment is further enlarged.

The rapid development of the optical communication industry drives the updating of the optical module. Under the market competition environment where optical communication is increasingly intense at present, the demand of communication equipment for reducing the size of the equipment and increasing the interface density is also increasing. To meet this demand, optical modules are also being developed in a small package with high integration. For example, QSFP (Small Form-factor Pluggable optical module), QSFP +, CFP/CFP2/CFP4, QSFP28, QSFP-DD and the like are all optical modules with Small-sized Pluggable high-density interfaces, at present, QSFP28 optical modules have four electrical channels, the operating rate of each channel is 10Gbps or 25Gbps, 40G and 100G and network application are supported, the number of the channels is increased to 8 by a brand-new product QSFP-DD (Pluggable dual density) optical module, the operating rate of each channel is increased to 25Gbps through MRZ modulation or is increased to 50Gbps through PAM4 modulation, and thus 200Gbps or 400Gbps is supported. The QSFP-DD optical module can meet or exceed the requirements of high-speed enterprise, telecommunication and data network equipment on the density of Ethernet, optical fiber channels and InfiniBand ports, thereby meeting the continuously improved requirements on 200Gbps and 400Gbps network solutions. The high-speed high-power optical module consists of a light emission sub-module, a light receiving sub-module and a circuit board and is packaged in an optical module cavity, chips in the light emission sub-module and the light receiving sub-module are welded and connected with the circuit board by gold wires, the gold wire welding connection process and the optical coupling process can be completed in no step, the front-back sequence of gold wire welding connection and the coupling front-back sequence of optical coupling can be generated, the front welded gold wires are usually damaged in the process of welding the back gold wires, or the coupled light emission is damaged and the connected gold wires are damaged in the process of coupling light receiving, so that the optical module is required to solve the problems.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims at providing an optical module to solve the optical module and can not bump the good gold thread of welding bad in process of production, and bump the good light reception submodule or the good light emission submodule of coupling bad.

The application provides an optical module, including: a light emitting chip protective cover, a light emitting coupling protective cover, a light receiving protective cover and a circuit board,

the light emitting chip protective cover is provided with a positioning shaft, the positioning shaft is in an elliptic cylinder shape, and the light emitting chip protective cover is buckled above the light emitting chip to protect a gold wire connected between the light emitting chip and the circuit board from being damaged;

the light emission coupling protective cover is provided with an adhesive surface, the light emission coupling protective cover is buckled above the light emission coupling part to protect the coupled light emission coupling part from being damaged, the adhesive surface is contacted with the upper surface of a heat sink and the upper surface of the circuit board, and adhesive glue is adopted to be coated on the adhesive surface to ensure that the light emission coupling protective cover is adhered and fixed on the heat sink and the circuit board;

the light receiving protective cover is provided with a positioning shaft, the positioning shaft is in an elliptic cylinder shape, and the light receiving protective cover is buckled above the light receiving chip and the light receiving coupling part to protect gold wires connected between the light receiving chip and the circuit board from being damaged and also protect the coupled light receiving coupling part from being damaged;

the circuit board is provided with a positioning hole which is in an elliptical hole shape, the light-emitting chip protective cover is positioned and fixed on the circuit board after a positioning shaft of the light-emitting chip protective cover is inserted into the positioning hole, and the light-receiving protective cover is positioned and fixed on the circuit board after a positioning shaft of the light-receiving protective cover is inserted into the positioning hole.

In the optical module, the optical module is further provided with an upper cover and a bottom shell, and the upper cover and the bottom shell are assembled by screws to form an optical module cavity for accommodating and fixing the transmitter optical subassembly, the receiver optical subassembly and the circuit board.

The advantage of this application embodiment is, through transmitting optical chip protection casing, light emission coupling protection casing and light reception protection casing, the effectual gold thread of being connected between having protected optical chip and the circuit board to and the gold thread of being connected between optical chip and the circuit board is not damaged in the optical module production process, has also effectually protected optical emission coupling portion and light reception coupling portion not damaged to the quality of optical module has been guaranteed.

Drawings

FIG. 1 is an exploded view of an embodiment of an optical module according to the present application;

FIG. 2 is a schematic diagram of an assembly of a light emitting chip shield, a light emitting coupling shield, a light receiving shield, and a circuit board according to an embodiment of an optical module of the present application;

FIG. 3 is a schematic diagram illustrating an optical transmitter sub-module, an optical receiver sub-module and a circuit board according to an embodiment of the present invention;

FIG. 4 is another exploded view of an embodiment of a light module according to the present application;

FIG. 5 is a partially enlarged schematic view of a transmitter optical subassembly and a receiver optical subassembly of an embodiment of an optical module of the present application;

FIG. 6 is a schematic diagram of a circuit board of an optical module according to an embodiment of the present application;

fig. 7 is a first schematic diagram illustrating a protective cover of a light receiving chip according to an embodiment of an optical module of the present application;

fig. 8 is a second schematic diagram of a protective cover of a light receiving chip according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a light emitting chip protective cover according to an embodiment of a light module of the present application;

FIG. 10 is a schematic view of a light emission coupling shield according to an embodiment of a light module of the present application;

FIG. 11 is a schematic diagram of an upper cover of an optical module according to an embodiment of the present disclosure;

fig. 12 is a schematic bottom view of an optical module according to an embodiment of the present application;

FIG. 13 is a first assembly view (with a bottom shell removed) of an optical module according to an embodiment of the present application;

fig. 14 is a second assembly schematic diagram (after the upper cover is removed) of an optical module embodiment of the present application;

fig. 15 is a third assembly schematic diagram of an optical module embodiment of the present application;

fig. 16 is an assembly schematic diagram of a fourth optical module embodiment according to the present application.

The reference numerals are illustrated below:

100 optical module

110 light emission submodule 111 light emission chip A112 light emission chip B113 light emission coupling part

114 light emitting chip shield 115 light emission coupling shield 116 heat sink 1141 positioning shaft 1151 adhesive surface

120 light receiving sub-module 121 light receiving chip 122 light receiving coupling part 123 light receiving protective cover

1231 locating shaft 130 locating hole of circuit board 131

200 upper cover

300 bottom shell

400 zipper

910 screw 920 return spring

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 5, an optical module 100 provided in the present application includes: the tosa 110 includes a light emitting chip a111, a light emitting chip B112, a light emitting coupling portion 113, a light emitting chip protective cover 114, a light emitting coupling protective cover 115, and a heat sink 116, the tosa 120 includes a light receiving chip 121, a light receiving coupling portion 122, and a light receiving protective cover 123.

As shown in fig. 2, 4 and 8, the light emitting chip protective cover 114 is provided with a positioning shaft 1141, the positioning shaft 1141 is in an elliptic cylinder shape, the light emitting chip protective cover 114 is buckled above the light emitting chip a111 and the light emitting chip B112, and gold wires connected between the light emitting chip a111 and the light emitting chip B112 and the circuit board 130 are protected from being damaged;

as shown in fig. 2, 4 and 9, the light emission coupling protective cover 115 is provided with an adhesive surface 1151, the light emission coupling protective cover 115 is fastened above the light emission coupling portion 113 to protect the coupled light emission coupling portion 113 from being damaged, the adhesive surface 1151 is in contact with the upper surface of the heat sink 116 and the upper surface of the circuit board 130, and the adhesive surface 1151 is coated with adhesive glue to adhere and fix the light emission coupling protective cover 115 on the heat sink 116 and the circuit board 130;

as shown in fig. 2, 4 and 7, the light receiving protective cover 123 is provided with a positioning shaft 1231, the positioning shaft 1231 is in an elliptic cylinder shape, the light receiving protective cover 123 is fastened above the light receiving chip 121 and the light receiving coupling portion 122, so as to protect gold wires connected between the light receiving chip 121 and the circuit board 130 from being damaged and also protect the coupled light receiving coupling portion 122 from being damaged;

as shown in fig. 2 to 9, the circuit board 130 is provided with a positioning hole 131, the positioning hole 131 is in an elliptical hole shape, after the positioning shaft 1141 of the light emitting chip protective cover 114 is inserted into the positioning hole 131, the light emitting chip protective cover 114 is positioned and fixed on the circuit board 130, and after the positioning shaft 1231 of the light receiving protective cover 123 is inserted into the positioning hole 131, the light receiving protective cover 123 is positioned and fixed on the circuit board 130, because the circuit board 130 has dense circuits or devices, the number of the positioning holes 131 that can be opened is small (for example, the positioning shaft 1411 of the light emitting chip protective cover 114 has only one positioning hole 131 correspondingly assembled in the circuit board 130), the positioning shaft 1231 and the positioning shaft 1411 are set in an elliptical column shape, and the positioning hole 131 is set in an elliptical hole shape, which is beneficial to preventing the light receiving protective cover 123 or the light emitting chip protective cover 115 from rotating in the positioning hole 131 of the circuit board 130 after the positioning shaft 1231 or the positioning shaft 1141 is inserted into the positioning hole 131, and preventing the light receiving protective cover 123 or the light emitting chip protective cover 115 from damaging other devices or gold wires.

As shown in fig. 1, 3, 10 and 11, the optical module 100 further includes an upper cover 200 and a bottom case 300, and the upper cover 200 and the bottom case 300 are assembled by screws 910 to form an optical module cavity for accommodating and fixing the light-emitting sub-module 110, the light-receiving sub-module 120 and the circuit board 130.

The following description is made on the assembling process of the light-emitting chip shield 114, the light-emitting coupling shield 115, the light-receiving shield 123 and the circuit board 130:

as shown in fig. 3, the heat sink 116 is adhered to the circuit board 130, the light emitting chip a111 and the light emitting chip B112 of the tosa 110 are adhered to the heat sink 116, the light emitting chip a111 and the circuit board 130, and the light emitting chip B112 and the circuit board 130 are soldered by a wire bonding device, and the light emitting chip protective cover 114 is fastened and fixed in the positioning hole 131 of the circuit board 130 after the soldering and connection by gold wires; similarly, the light receiving chip 121 of the light receiving sub-assembly 120 is attached to the circuit board 130, the light receiving chip 121 and the circuit board 130 are connected by gold wire welding using a wire bonding device, then the light receiving coupling portion 122 of the light receiving sub-assembly 120 is optically coupled by using a coupling device, and after coupling, the light receiving protective cover 123 is fastened and fixed in the positioning hole 131 of the circuit board 130; then, the light emitting coupling portion 113 of the light emitting sub-module 110 is coupled by light emitting coupling using a coupling device, and after the coupling is completed, the light emitting coupling protective cover 115 is adhered to the heat sink 116 and the circuit board 130, so that the light emitting chip protective cover 114 and the light emitting coupling protective cover 115 complete the encapsulation protection of the light emitting sub-module 110, and the light receiving protective cover 123 completes the encapsulation protection of the light receiving sub-module 120 (as shown in fig. 2, 13 and 14).

As shown in fig. 13 to 15, the optical module 100 is further provided with a slider 400, and when the optical module 100 exits the cage, the optical module 100 is unlocked in the cage and exits by pulling the slider 400 with a hand, and after the optical module 100 exits the cage, the slider 400 is returned by the urging force of the return spring 920.

The embodiment of the application has the advantages that the gold wires connected between the light emitting chip a111 and the circuit board 130 and the gold wires connected between the light receiving chip B112 and the circuit board 130 are effectively protected from being damaged in the production process of the optical module through the light emitting chip protective cover 114, the light emitting coupling protective cover 115 and the light receiving protective cover 123, and the light emitting coupling part 113 and the light receiving coupling part 122 are also effectively protected from being damaged, so that the quality of the optical module 100 is ensured.

The present invention has been described in terms of the preferred embodiment, and not by way of limitation, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims (2)

1. A light module, comprising: a light-emitting chip protective cover, a light-emitting coupling protective cover, a light-receiving protective cover and a circuit board,

the light emitting chip protective cover is provided with a positioning shaft, the positioning shaft is in an elliptic cylinder shape, and the light emitting chip protective cover is buckled above the light emitting chip to protect a gold wire connected between the light emitting chip and the circuit board from being damaged;

the light emission coupling protective cover is provided with an adhesive surface, the light emission coupling protective cover is buckled above the light emission coupling part to protect the coupled light emission coupling part from being damaged, the adhesive surface is contacted with the upper surface of a heat sink and the upper surface of the circuit board, and adhesive glue is adopted to be coated on the adhesive surface to ensure that the light emission coupling protective cover is adhered and fixed on the heat sink and the circuit board;

the light receiving protective cover is provided with a positioning shaft, the positioning shaft is in an elliptic cylinder shape, and the light receiving protective cover is buckled above the light receiving chip and the light receiving coupling part to protect gold wires connected between the light receiving chip and the circuit board from being damaged and also protect the well coupled light receiving coupling part from being damaged;

the circuit board is provided with a positioning hole which is in an elliptical hole shape, the light emitting chip protective cover is positioned and fixed on the circuit board after a positioning shaft of the light emitting chip protective cover is inserted into the positioning hole, and the light receiving protective cover is positioned and fixed on the circuit board after the positioning shaft of the light receiving protective cover is inserted into the positioning hole.

2. The optical module of claim 1, further comprising an upper cover and a bottom shell, wherein the upper cover and the bottom shell are assembled by screws to form an optical module cavity for accommodating and fixing the tosa, the rosa and the circuit board.

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