CN218426676U - Cleaning device for integrated circuit welding - Google Patents
Cleaning device for integrated circuit welding Download PDFInfo
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- CN218426676U CN218426676U CN202222122148.5U CN202222122148U CN218426676U CN 218426676 U CN218426676 U CN 218426676U CN 202222122148 U CN202222122148 U CN 202222122148U CN 218426676 U CN218426676 U CN 218426676U
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- integrated circuit
- solder
- welding
- drainage tube
- cleaning
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Abstract
The utility model discloses a cleaning device is used in integrated circuit welding, include: a base plate on which a clamping module for clamping an integrated circuit is arranged; the electric welding module is arranged on the bottom plate and used for welding the integrated circuit; the cleaning assembly is arranged on the positioning plate fixed on the bottom plate in a sliding mode and is used for melting and collecting the solder splashed to the solder mask of the integrated circuit; the scraping component is used for cleaning the solder adhered on the cleaning component; through the fixed integrated circuit of centre gripping module centre gripping, after the location was accomplished, weld integrated circuit through electric welding module, when having the solder to splash to the solder mask in the welding process, the clearance subassembly on the sliding location board will clear up the solder that the subassembly aimed at the solder mask, start the clearance subassembly and can melt unnecessary solder and collect, avoid welding in-process solder splash to the flame retardant coating on lead to the welding of other components on the integrated circuit to receive the problem of influence.
Description
Technical Field
The utility model relates to an integrated circuit welding technology field, concretely relates to cleaning device is used in integrated circuit welding.
Background
Most of the applications in the semiconductor industry today are silicon-based integrated circuits, which are mainly soldered during processing, and often suffer from solder spatter during soldering, including solder spatter, additive spatter, which is caused by flux boiling or solder paste contamination during flow soldering, and which can spatter from a solder joint to a distance of a few millimeters or even a few tens of millimeters away from the solder joint, and solder spatter often causes problems, and if solder spatters on a solder resist, tin beads are formed.
When the existing integrated circuit welding device is used, an integrated circuit is positioned through an adjustable clamping module, and then welding operation is carried out through an electric welding module.
However, the existing integrated circuit welding process lacks a cleaning device, and can not clean the solder splashed to the solder mask, so that the welding of other elements on the integrated circuit is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cleaning device is used in integrated circuit welding solves following technical problem:
(1) The existing integrated circuit welding process is lack of a cleaning device and cannot clean the solder splashed onto the solder mask.
The purpose of the utility model can be realized by the following technical scheme:
a cleaning apparatus for integrated circuit bonding, comprising:
a base plate on which a clamping module for clamping an integrated circuit is arranged;
the electric welding module is arranged on the bottom plate and used for welding the integrated circuit;
the cleaning assembly is arranged on the positioning plate fixed on the bottom plate in a sliding mode and is used for melting and collecting the solder splashed to the solder mask of the integrated circuit; and
and the scraping assembly is used for cleaning the solder adhered to the cleaning assembly.
As a further aspect of the present invention: the cleaning assembly comprises:
the collecting box is in sliding fit with the positioning plate through a connecting piece;
the drainage tube is communicated with the bottom of the collecting box and is distributed towards the clamping module, and the drainage tube is communicated with the suction pump; and
and the heat conduction column is fixed in the drainage tube through the assembling plate and is electrically connected with the heating module arranged on the collecting box.
As a further aspect of the present invention: and the end part of the drainage tube close to the clamping module is provided with a heat insulation layer.
As a further aspect of the present invention: the scraping assembly comprises a scraping plate movably arranged in a groove in the inner surface of the drainage tube, the surface, close to the heat conducting column, of the scraping plate is flush with the inner surface of the drainage tube, the bottom of the scraping plate is fixedly connected with the heat insulating layer, the heat insulating layer is rotatably connected with the drainage tube, and the top of the scraping plate is in contact with the assembling plate.
As a further aspect of the present invention: the scraping assembly further comprises a movable plate, and the movable plate is detachably connected with the surface, close to the heat conducting column, of the scraping plate.
As a further aspect of the present invention: the collecting box is in threaded connection with the connecting piece, and the connecting piece is of a telescopic structure.
The utility model has the advantages that:
(1) In the utility model, the integrated circuit is clamped and fixed by the clamping module, after the positioning is completed, the integrated circuit is welded by the electric welding module, when solder splashes to the solder mask in the welding process, the cleaning assembly on the positioning plate is slid to align the cleaning assembly to the solder on the solder mask, the cleaning assembly is started to melt and collect the redundant solder, and the problem that the welding of other elements on the integrated circuit is influenced because the solder splashes to the flame mask in the welding process is avoided;
(2) In the utility model, the solder adhered on the cleaning component can be scraped by operating the scraping component, so that the problem that the cleaning efficiency of the solder is reduced because of the excessive solder adhered on the cleaning component after long-time use is avoided;
(3) The utility model discloses in, the heat insulation layer that the adoption heat insulation material was made is located the bottom of drainage tube, can effectively avoid removing the drainage tube or when the heat conduction post gived off the heat to the problem that normal welded region caused the influence around the unnecessary solder.
Drawings
The present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the cleaning assembly of the present invention;
fig. 3 is a schematic structural view of the scraping assembly of the present invention.
In the figure: 1. a base plate; 2. a clamping module; 3. an electric welding module; 4. cleaning the assembly; 401. a connecting member; 402. a heating module; 403. a suction pump; 404. a collection box; 405. a drainage tube; 406. a heat-conducting column; 407. assembling a plate; 5. a scraping assembly; 501. a squeegee; 502. a movable plate; 6. a thermal insulation layer; 7. and (7) positioning the plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a cleaning device for integrated circuit soldering, comprising:
a base plate 1 on which a clamping module 2 for clamping an integrated circuit is arranged;
the electric welding module 3 is arranged on the bottom plate 1 and used for welding the integrated circuit;
a cleaning assembly 4, which is slidably mounted on a positioning plate 7 fixed on the bottom plate 1, and is used for melting and collecting solder splashed to a solder mask of the integrated circuit; and
and the scraping component 5 is used for cleaning the solder adhered on the cleaning component 4.
In one aspect of the present embodiment, the clamping module 2 and the electric welding module 3 are prior art, and are not modified in the present application, so that it is not necessary to disclose their specific mechanical structures and circuit structures, and the integrity of the present application is not affected.
This embodiment is when the in-service use, through the fixed integrated circuit of 2 centre gripping of centre gripping module, the location is accomplished the back, weld integrated circuit through welding module 3, when having the solder to splash to the solder mask in the welding process, clearance subassembly 4 on the sliding location board 7, will clear up the solder that subassembly 4 aligns on the solder mask, start clearance subassembly 4 and can melt unnecessary solder and collect, the operation strikes off subassembly 5 and can strikes off the solder that adheres on clearance subassembly 4, avoid using the problem that too much solder of adhesion caused solder clearance efficiency to descend on the clearance subassembly 4 after for a long time.
As shown in fig. 1 to 3, as a preferred embodiment of the present invention, the cleaning assembly 4 includes:
the collection box 404 is in sliding fit with the positioning plate 7 through a connecting piece 401;
a drainage tube 405 communicated with the bottom of the collecting tank 404, wherein the drainage tube 405 is arranged towards the clamping module 2, and the drainage tube 405 is communicated with the suction pump 403; and
the heat-conducting column 406 is fixed in the drain tube 405 by an assembling plate 407, and the heat-conducting column 406 is electrically connected with the heating module 402 disposed on the collection tank 404.
Wherein, the drainage tube 405 is communicated with the suction pump 403 through a corrugated tube.
In one aspect of this embodiment, the heating module 402 is prior art and is not modified by the present application, and therefore, the specific mechanical structure and circuit structure thereof need not be disclosed, and the integrity of the present application is not affected.
In practical application, the connector 401 is slid on the positioning plate 7 to move the collection box 404 and the drainage tube 405 to the position above the solder to be collected, the drainage tube 405 is aligned with a solder joint formed by the solder, the heating module 402 is started to drive the heat conduction column 406 to dissipate heat so as to melt the solder joint, the suction pump 403 is started to suck the melted solder joint through the drainage tube 405, and the solder ascending through suction finally enters the collection box 404, so that the scattered solder can be cleaned, and the problem that the solder splashes to a solder mask layer in the welding process to cause the welding of other elements on the integrated circuit to be affected is avoided.
As shown in fig. 1-3, as a preferred embodiment of the present invention, the end of the drainage tube 405 near the clamping module 2 is provided with a thermal insulation layer 6.
In practical application of the present embodiment, the heat insulating layer 6 is made of a heat insulating material and is located at an end of the drainage tube 405 close to the clamping module 2, that is, at the bottom of the drainage tube 405, so as to effectively avoid the problem of influence on a normal welding area around the excessive solder when the drainage tube 405 or the heat conducting column 406 is moved to radiate heat.
As shown in fig. 2-3, as a preferred embodiment of the present invention, the scraping component 5 includes a scraper 501 movably disposed in a groove on the inner surface of the drainage tube 405, and the surface of the scraper 501 close to the heat-conducting post 406 is flush with the inner surface of the drainage tube 405, the bottom of the scraper 501 is fixedly connected to the heat-insulating layer 6, and the heat-insulating layer 6 is rotatably connected to the drainage tube 405, and the top of the scraper 501 contacts with the assembling plate 407.
In one aspect of this embodiment, the grooves and the surface of the scraper 501 are coated with magnetic paint, and the magnetic properties of the grooves and the surface of the scraper are attracted to each other.
In practical application of the present embodiment, in an initial state, the scraper 501 is located in the groove on the inner surface of the drainage tube 405, and a user holds the surface of the thermal insulation layer 6 to move the scraper 501 to the heat conducting column 406, so that the scraper 501 leaves the groove, in this process, the top of the scraper 501 slides relative to the assembly plate 407, so that solder on the surface of the assembly plate 407 can be scraped, and then the thermal insulation layer 6 is rotated to rotate the scraper 501 along the inner surface of the drainage tube 405, so that solder on the inner surface of the drainage tube 405 can be scraped in this process, and then solder on the cleaning assembly 4 can be scraped, and the problem that more solder adheres to the surface of the cleaning assembly 4 after long-time use is effectively avoided; and the magnetic attraction between recess and the scraper blade 501 can effectively drive scraper blade 501 and reset, scrape after removing, loosen 6 grip on thermal-insulation layer and with scraper blade 501 to the recess rotation, cooperation magnetic attraction can make scraper blade 501 reset.
As shown in fig. 2-3, as a preferred embodiment of the present invention, the scraping assembly 5 further includes a movable plate 502, and the movable plate 502 is detachably connected to the surface of the scraper 501 near the heat-conducting pillar 406.
In one case of this embodiment, the movable plate 502 and the surface of the scraper 501 close to the heat conducting column 406 may be assembled in a snap-fit manner, or may be connected by a bolt, as long as the movable plate and the scraper are detachably connected; in practical use, the movable plate 502 and the scraper 501 are separated from the surface close to the heat-conducting column 406, so that the new movable plate 502 can be replaced, and the problem that the movable plate 502 is seriously worn or more solder adheres to the movable plate after long-time use is avoided.
As shown in fig. 1, as a preferred embodiment of the present invention, the collecting box 404 is connected to the connecting member 401 by a screw, and the connecting member 401 is a telescopic structure.
In one aspect of this embodiment, the telescopic structure is a structure formed by nesting multiple stages of pipe fittings, and in practical applications, a structure of a rack and pinion or an electric telescopic rod may also be used.
In practical application of the present embodiment, after the collection box 404 and the connection element 401 are separated by the screw threads, the interior of the drainage tube 405 can be cleaned by water washing, so that the cleaning efficiency is improved, and the telescopic design of the connection element 401 can raise the drainage tube 405 during the welding process to reduce the influence of the drainage tube 405 on the welding operation, and when the connection element 401 is stretched to lower the drainage tube 405 and align with the solder, the connection element 401 needs to be cleaned.
The utility model discloses a theory of operation: the utility model provides an in the above-mentioned embodiment provides a cleaning device is used in integrated circuit welding, through the fixed integrated circuit of 2 centre gripping of centre gripping module, after the location is accomplished, weld integrated circuit through electric welding module 3, when having the solder to splash to the solder mask in the welding process, clearance subassembly 4 on the sliding location board 7, to clear up the solder on subassembly 4 alignment solder mask, start clearance subassembly 4 and can melt unnecessary solder and collect, operation is struck off subassembly 5 and can be struck off the solder that adheres on clearance subassembly 4, avoid using the problem that the too much solder of adhesion caused solder clearance efficiency to descend on the clearance subassembly 4 after for a long time.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (6)
1. A cleaning device for integrated circuit bonding, comprising:
a base plate (1) on which a clamping module (2) for clamping an integrated circuit is arranged;
the electric welding module (3) is arranged on the bottom plate (1) and is used for welding the integrated circuit;
the cleaning assembly (4) is slidably arranged on a positioning plate (7) fixed on the bottom plate (1) and is used for melting and collecting solder splashed to a solder mask of the integrated circuit; and
and the scraping component (5) is used for cleaning the solder adhered on the cleaning component (4).
2. Cleaning device for integrated circuit soldering according to claim 1, characterized in that the cleaning assembly (4) comprises:
the collecting box (404) is in sliding fit with the positioning plate (7) through a connecting piece (401);
the drainage tube (405) is communicated with the bottom of the collecting box (404), the drainage tube (405) is arranged towards the clamping module (2), and the drainage tube (405) is communicated with the suction pump (403); and
the heat conduction column (406) is fixed in the drainage tube (405) through an assembling plate (407), and the heat conduction column (406) is electrically connected with the heating module (402) arranged on the collection box (404).
3. The cleaning device for integrated circuit welding as claimed in claim 2, characterized in that the end of the draft tube (405) close to the clamping module (2) is provided with a thermal insulation layer (6).
4. The cleaning device for integrated circuit welding according to claim 3, wherein the scraping component (5) comprises a scraper (501) movably arranged in a groove on the inner surface of the drainage tube (405), the surface of the scraper (501) close to the heat conducting column (406) is flush with the inner surface of the drainage tube (405), the bottom of the scraper (501) is fixedly connected with the thermal insulation layer (6), the thermal insulation layer (6) is rotatably connected with the drainage tube (405), and the top of the scraper (501) is in contact with the assembly plate (407).
5. The cleaning device for integrated circuit soldering according to claim 4, wherein the scraping assembly (5) further comprises a movable plate (502), and the movable plate (502) is detachably connected with the surface of the scraper (501) close to the heat conducting column (406).
6. The cleaning device for integrated circuit welding as recited in claim 2, characterized in that the collecting box (404) is connected with the connecting piece (401) by screw threads, and the connecting piece (401) is of a telescopic structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222122148.5U CN218426676U (en) | 2022-08-11 | 2022-08-11 | Cleaning device for integrated circuit welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222122148.5U CN218426676U (en) | 2022-08-11 | 2022-08-11 | Cleaning device for integrated circuit welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218426676U true CN218426676U (en) | 2023-02-03 |
Family
ID=85093941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222122148.5U Active CN218426676U (en) | 2022-08-11 | 2022-08-11 | Cleaning device for integrated circuit welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218426676U (en) |
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2022
- 2022-08-11 CN CN202222122148.5U patent/CN218426676U/en active Active
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