CN100479634C - Method for improving circuitboard welding quality and air knife device therefor - Google Patents
Method for improving circuitboard welding quality and air knife device therefor Download PDFInfo
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- CN100479634C CN100479634C CNB2005100346161A CN200510034616A CN100479634C CN 100479634 C CN100479634 C CN 100479634C CN B2005100346161 A CNB2005100346161 A CN B2005100346161A CN 200510034616 A CN200510034616 A CN 200510034616A CN 100479634 C CN100479634 C CN 100479634C
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- circuit board
- scaling powder
- air
- jet pipe
- air jet
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Abstract
This invention discloses a method for improving solder quality of CB and a device, in which, the method includes: spraying scaling powder on the CB, blowing the scaling powder on the lower surface of the CB in the through--ole of the CB to increase the coating volume of the powder in the through-hole and wash out the OSP coating of the hole wall to increase the solder ability of the hole, removing the scaling powder coated on the solder resistant film of the lower surface of the CB to reduce residual ions of the welded CB, preheating the CB welding the CB by a wave crest welder.
Description
Technical field
The present invention relates to circuit board and make the field, be specifically related to a kind of solder technology of circuit board.
Background technology
Along with the reinforcement of environmental requirement, the electronic product that more and more countries or area require to sell in the country one belongs to needs unleaded.For this reason, in electronic product is produced, when adopting wave-soldering to come soldered circuit board, need to adopt the non-organic solvent type of environmental protection, people adopt VOC-free (VolatilityOrganic Compound-free) scaling powder usually now.But, because the surface tension of VOC-free scaling powder is bigger, the VOC-free scaling powder of spraying is wet circuit plate through hole effectively all, particularly for adopting OSP technology to carry out the surface-treated circuit board, after welding, scolding tin in the through hole sees through highly very little, can not satisfy the soldering reliability requirement.
Existing wave-soldering system is based upon on the basis of organic solvent scaling powder to design, as shown in Figure 1, it mainly comprises heavy wall and is installed in prefluxing system, pre-heating system and welding system on the heavy wall, the surface tension of organic solvent scaling powder is little, wetability is good, on the other hand, traditional circuit board all is the surface of adopting the good metal treatment of solderability to weld, and the bad problem of the saturating tin of through hole therefore can not occur.But, adopt lead-free process after, require to adopt environmentally friendly and help the VOC-free scaling powder of the stronger non-organic solvent type of weldering ability, guarantee that conventional spray paint scaling powder system just can not meet the demands under the welding back ion residues degree prerequisite up to standard.Because increase the scaling powder spraying amount, also can improve tin, but the ion residues degree can exceed standard after the welding, will reduce the reliability of circuit board.
In addition, because the surface tension of VOC-free scaling powder is bigger, the VOC-free scaling powder of spraying is wet circuit plate through hole effectively all, especially for adopting OSP technology to carry out the surface-treated circuit board, there is not lot of V OC-free scaling powder to enter in the through hole OSP coating of washing away, dissolving hole wall surface, can not make needs the copper surface exposure of welding to come out, thereby can not obtain good saturating soldering and connect effect.
Summary of the invention
The objective of the invention is to, provide a kind of and improve the method for welding quality of circuit board and be applied to air blade device in the said method, to solve the problem that exists soldering reliability difference or saturating soldering to connect weak effect in the prior art.
Technical scheme provided by the invention is as follows:
A kind of method of improving welding quality of circuit board comprises the steps:
A, on circuit board, spray scaling powder;
B, will be sprayed on scaling powder on the circuit board lower surface and be blown in the through hole in the circuit board, to increase scaling powder coating weight in the through hole; Wash away hole wall OSP coating, improve the solderability of hole wall, improve the saturating tin ability of through hole welding;
C, the scaling powder that will be sprayed on the circuit board lower surface soldering-resistance layer remove, and reduce the ion residues degree after circuit board welds, and improve the environmental reliability of circuit board.
The described scaling powder that will be sprayed on the circuit board lower surface is blown in the step in the circuit board through-hole, is to adopt compressed air to spray from aperture, and forms swirling eddy, and make the scaling powder that is injected in lower surface be rotated air-flow and be blown in the through hole,
The described scaling powder that will be sprayed on the circuit board lower surface soldering-resistance layer removes in the step, is to adopt compressed air to spray air curtain one, and the unnecessary scaling powder that is sprayed on the circuit board lower surface soldering-resistance layer is removed.
First air blade device comprises supporting plate and air jet pipe, is symmetricly set on two pipe supports on the supporting plate, the outside at two pipe supports is respectively equipped with regulating block, described air jet pipe is supported on the regulating block, and the two ends of air jet pipe are provided with pipe joint, along at least one row's aperture of axially being drilled with of air jet pipe.
Along air jet pipe axially be drilled with four row's apertures, every row's aperture is initial point deflection 10 degree with the air jet pipe central shaft all.
Second air blade device comprises supporting plate and air jet pipe, is symmetricly set on two pipe supports on the supporting plate, the outside at two pipe supports is respectively equipped with regulating block, described air jet pipe is supported on the regulating block, and the two ends of air jet pipe are provided with pipe joint, axially has a finedraw crack along air jet pipe.
The opening in described finedraw crack parallels setting with the axis of air jet pipe.
The present invention has following advantage: method provided by the invention is to have increased twice blowing operation in traditional wave-soldering technology, and first air blade device can increase the quantity for spray that scaling powder enters through hole, can solve the low problem of the saturating tin rate of through hole in the welding; Second air blade device can clean out being sprayed on VOC-free scaling powder unnecessary on the circuit board, has reduced the ion residues degree after circuit board welds, thereby has improved the environmental reliability of circuit board.
Description of drawings
Fig. 1 is the process flow diagram of the inventive method;
Fig. 2 is the front view that is used for first air blade device of circuit board wave soldering method;
Fig. 3 is the vertical view of Fig. 2;
Fig. 4 is the end view of Fig. 3;
Fig. 5 is the cutaway view of air jet pipe in first air blade device shown in Figure 2;
Fig. 6 is the front view that is used for second air blade device of circuit board wave soldering method;
Fig. 7 is the vertical view of Fig. 6;
Fig. 8 is the end view of Fig. 7;
Fig. 9 is the cutaway view of air jet pipe in second air blade device shown in Figure 6.
Embodiment
With reference to shown in Figure 1, a kind of circuit board wave soldering method is provided, method comprises the steps: 1, sprays scaling powder on circuit board; 2, will be sprayed on scaling powder on the circuit board lower surface and be blown in the through hole in the circuit board,, improve the solderability of hole wall, improve the saturating tin ability of through hole welding to increase in the through hole scaling powder coating weight and to wash away hole wall OSP coating; 3, the scaling powder that will be sprayed on the circuit board lower surface soldering-resistance layer removes, and reduces the ion residues degree after circuit board welds, and improves the environmental reliability of circuit board; 4, preheat circuit plate; 5, circuit board is welded by crest welder, finish welding sequence.
In foregoing circuit Lamb wave peak welding method, scaling powder on will being sprayed on the circuit board lower surface is blown in the step in the circuit board through-hole, is to adopt compressed air to spray from aperture, and forms swirling eddy, making the scaling powder that is injected in lower surface be rotated air-flow is blown in the through hole
In foregoing circuit Lamb wave peak welding method, scaling powder on will being sprayed on circuit board lower surface soldering-resistance layer removes in the step, be to adopt compressed air to spray air curtain one, the air curtain that is blown out can remove the unnecessary scaling powder that is sprayed on the circuit board lower surface soldering-resistance layer.
With reference to Fig. 2, Fig. 3, Fig. 4, Fig. 5, the present invention also provides a kind of first air blade device that is used for foregoing circuit Lamb wave peak welding method, be provided with supporting plate 5 and air jet pipe 4, on supporting plate 5, be arranged with two pipe supports 3, side at two pipe supports 3 is provided with regulating block 2, symmetry has elongated hole on regulating block 2, regulating block 2 is connected with bearing 3 by screw, regulating block 2 can slide along the outside of bearing 3, be used to establish the height of joint air jet pipe 4, air jet pipe 4 is supported on the regulating block 2, and the two ends of metal tube 4 are provided with pipe joint 1, be convenient to compressed-air actuated input, along metal tube 4 axially be drilled with at least 1 row aperture 6, as Fig. 3, shown in Figure 5,2 rows or 3 rows or 4 row's apertures 6 can also be set as required, aperture 6 is an initial point deflection certain angle with the central shaft of metal tube 4, normally about 10 degree, a preferable angle is 10 degree, as shown in Figure 5, compressed air sprays from aperture 6, can form one or more strands of tiny swirling eddies.First air blade device can increase the quantity for spray that scaling powder enters each through hole of circuit board, can solve the low problem of the saturating tin rate of through hole in the welding.
With reference to Fig. 6, Fig. 7, Fig. 8, Fig. 9, the present invention also provides a kind of second air blade device that is used for circuit board wave soldering method, be provided with supporting plate 5 and air jet pipe 4, on supporting plate 5, be symmetrically arranged with two pipe supports 3, side at two pipe supports 3 is provided with regulating block 2, symmetry has elongated hole on regulating block 2, regulating block 2 is connected with bearing 3 by screw, regulating block 2 can slide along the outside of bearing 3, be used to establish the height of joint air jet pipe 4, air jet pipe 4 is supported on the regulating block 2, is provided with pipe joint 1 at the two ends of metal tube 4, be convenient to compressed-air actuated input, along metal tube 1 axially have a finedraw crack 7 that is communicated with metal tube 1 inner chamber, as shown in Figure 9, the opening in finedraw crack 7 parallels setting with the axis of metal tube 1, when compressed air sprays, can form air curtain one from this finedraw crack 7.The air curtain of second air blade device and the lower surface of circuit board form less angle; the wind-force of air knife blows unnecessary scaling powder on the lower surface soldering-resistance layer that is sprayed on circuit board off; so both quickened the volatilization of moisture content in the VOC-free scaling powder; also help to reduce preheat temperature; the protection solderability can reduce circuit board welding back ion residues degree again.
With reference to shown in Figure 1, first air blade device and second air blade device can be installed between the device and heating apparatus of spraying scaling powder successively; The swirling eddy of first air blade device ejection can increase the quantity for spray that scaling powder enters through hole, to solve the low problem of the saturating tin rate of through hole in the welding with being blown in the circuit board through-hole through the scaling powder on the circuit board lower surface after the spraying scaling powder operation; The air curtain that second air blade device is blown out can clean out being sprayed on VOC-free scaling powder unnecessary on the circuit board, has reduced the ion residues degree after circuit board welds, thereby has improved the environmental reliability of circuit board.
Beneficial effect of the present invention is:
The present invention has following advantage: method provided by the invention is to increase in traditional wave-soldering technology Added twice blowing operation, first air blade device can increase the quantity for spray that scaling powder enters through hole, can separate The low problem of the saturating tin rate of through hole in certainly welding; Second air blade device can be unnecessary being sprayed on the circuit board The VOC-free scaling powder clean out, reduced the ion residues degree behind the welding circuit board, thereby improved The environmental reliability of circuit board.
Claims (7)
1, a kind of method of improving welding quality of circuit board, it is characterized in that: described method comprises the steps:
A, on circuit board, spray scaling powder;
B, will be sprayed on scaling powder on the circuit board lower surface and be blown in the through hole in the circuit board, to increase scaling powder coating weight in the through hole; Wash away hole wall OSP coating, improve the solderability of hole wall, improve the saturating tin ability of through hole welding;
C, the scaling powder that will be sprayed on the circuit board lower surface soldering-resistance layer remove, and reduce the ion residues degree after circuit board welds, and improve the environmental reliability of circuit board.
2, the method for improving welding quality of circuit board according to claim 1, it is characterized in that, the described scaling powder that will be sprayed on the circuit board lower surface is blown in the step in the circuit board through-hole, be to adopt compressed air from aperture, to spray, and formation swirling eddy, making the scaling powder that is injected in lower surface be rotated air-flow is blown in the through hole
3, the method for improving welding quality of circuit board according to claim 1, it is characterized in that, the described scaling powder that will be sprayed on the circuit board lower surface soldering-resistance layer removes in the step, be to adopt compressed air to spray air curtain one, the unnecessary scaling powder that is sprayed on the circuit board lower surface soldering-resistance layer is removed.
4, a kind of described first air blade device that improves the method for welding quality of circuit board of claim 1 that is used for, it is characterized in that, comprise supporting plate and air jet pipe, be symmetricly set on two pipe supports on the supporting plate, the outside at two pipe supports is respectively equipped with regulating block, described air jet pipe is supported on the regulating block, and the two ends of air jet pipe are provided with pipe joint, along at least one row's aperture of axially being drilled with of air jet pipe.
5, according to described first air blade device that improves the method for welding quality of circuit board of claim 4, it is characterized in that, along air jet pipe axially be drilled with four row's apertures, every row's aperture is initial point deflection 10 degree with the air jet pipe central shaft all.
6, a kind of described second air blade device that improves the method for welding quality of circuit board of claim 1 that is used for, it is characterized in that, comprise supporting plate and air jet pipe, be symmetricly set on two pipe supports on the supporting plate, the outside at two pipe supports is respectively equipped with regulating block, described air jet pipe is supported on the regulating block, and the two ends of air jet pipe are provided with pipe joint, axially has a finedraw crack along air jet pipe.
7, second air blade device according to claim 6 is characterized in that, the opening in described finedraw crack parallels setting with the axis of air jet pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100346161A CN100479634C (en) | 2005-05-11 | 2005-05-11 | Method for improving circuitboard welding quality and air knife device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100346161A CN100479634C (en) | 2005-05-11 | 2005-05-11 | Method for improving circuitboard welding quality and air knife device therefor |
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| CN1863439A CN1863439A (en) | 2006-11-15 |
| CN100479634C true CN100479634C (en) | 2009-04-15 |
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| CNB2005100346161A Expired - Fee Related CN100479634C (en) | 2005-05-11 | 2005-05-11 | Method for improving circuitboard welding quality and air knife device therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI465168B (en) * | 2013-04-03 | 2014-12-11 | Wistron Corp | Testing apparatus and testing method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453222C (en) * | 2006-12-12 | 2009-01-21 | 深圳市深南电路有限公司 | Device and method for eliminating drillings from circuit board |
| ITMC20070018A1 (en) * | 2007-02-01 | 2008-08-02 | Cisel Srl | PROCEDURE FOR THE REALIZATION OF PRINTED CIRCUITS WITH WHICH THE ELECTRONIC COMPONENTS WITHOUT REOFORO MUST BE WELDED. |
| CN102310244B (en) * | 2010-07-09 | 2013-06-05 | 上海德朗汽车零部件制造有限公司 | Brazing flux spray device of brazed radiator |
| CN107214390B (en) * | 2017-06-02 | 2020-09-25 | 深圳市达泰丰科技有限公司 | Automatic welding machine and welding method based on selective wave soldering |
| CN109269894B (en) * | 2018-07-26 | 2021-07-06 | 深圳市泰欣能源科技有限公司 | Air knife assisted weld joint detection method |
-
2005
- 2005-05-11 CN CNB2005100346161A patent/CN100479634C/en not_active Expired - Fee Related
Non-Patent Citations (4)
| Title |
|---|
| 单面电路板通孔再流焊接技术. 褚玉福，袁娅婷.电子工艺技术，第24卷第2期. 2003 |
| 单面电路板通孔再流焊接技术. 褚玉福，袁娅婷.电子工艺技术，第24卷第2期. 2003 * |
| 表面组装焊接技术的新发展. 葛瑞.电子工艺技术，第20卷第1期. 1999 |
| 表面组装焊接技术的新发展. 葛瑞.电子工艺技术，第20卷第1期. 1999 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI465168B (en) * | 2013-04-03 | 2014-12-11 | Wistron Corp | Testing apparatus and testing method |
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| CN1863439A (en) | 2006-11-15 |
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