CN218414570U - Low-stress high-power bridge stack frame - Google Patents
Low-stress high-power bridge stack frame Download PDFInfo
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- CN218414570U CN218414570U CN202222749361.9U CN202222749361U CN218414570U CN 218414570 U CN218414570 U CN 218414570U CN 202222749361 U CN202222749361 U CN 202222749361U CN 218414570 U CN218414570 U CN 218414570U
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Abstract
And (3) a low-stress high-power bridge stack frame. To semiconductor devices. Comprises a first frame body, a second frame body, a third frame body and a fourth frame body; the second frame body is arranged below the first frame body, a second pin of the second frame body extends out of the bottom, and the top of the second frame body is provided with a first connecting part extending to the side part of the first frame body; the third frame body is arranged on the side part of the first frame body, and a chip base island IV and a chip base island III are sequentially arranged along the horizontal direction; the fourth frame body is arranged below the third frame body and is provided with a chip base island II. Through the frame of this case structure, effective encapsulation proportion reaches 90% to through on every muscle pin of cutting, increase diameter 0.4 mm's stress hole, every stress hole sets up respectively in plastic envelope body, thereby stress when reducing the pin muscle of cutting.
Description
Technical Field
The utility model relates to a semiconductor device especially relates to high-power bridge rectifier frame of low stress.
Background
With the rapid charging and the vigorous development of high-power supplies in the market; in recent years, rapid-filling products have been greatly developed and advanced; the output power of the direct current charger is gradually increased, higher requirements are also put forward for a bridge rectifier necessary in the fast charging manufacturing, larger electrifying current needs to be met, and the body is smaller and smaller.
In the bridge rectifier market today, the requirement to output current is higher and higher, and bigger output current means to need to use bigger rectifier chip, mainly satisfies the demand that the chip loaded through increase bridge rectifier frame whole area at present, causes the encapsulation inefficiency, and the bulky scheduling problem of final product.
SUMMERY OF THE UTILITY MODEL
The utility model provides a to above problem, provide a compact structure, chip chinampa interval is little, and effective packaging efficiency is high, can place the high-power bridge rectifier frame of low stress of 4 110mil chips.
The technical scheme of the utility model is that: the low-stress high-power bridge stack frame comprises:
the first frame body, the first pin of the first frame body stretches out from the top;
the second frame body is arranged below the first frame body, a second pin of the second frame body extends out of the bottom of the second frame body, a first connecting part extending to the side part of the first frame body is arranged at the top of the second frame body, and an extending position matched with the first connecting part is arranged on the first frame body; a first chip base island for bearing a first chip is arranged on the second frame body;
the third frame body is arranged on the side part of the first frame body, and a chip base island IV and a chip base island III are sequentially arranged along the horizontal direction; a fourth pin of the third frame body extends out of the top; and
the fourth frame body is arranged below the third frame body and is provided with a chip base island II; and a third pin of the fourth frame body extends out of the bottom.
Specifically, the fourth frame body is sequentially provided with a chip base island II and a connecting part II along the horizontal direction;
and the third pin extends out of the bottom of the second connecting part.
Specifically, a first tin overflow hole is formed in the first frame body.
Specifically, a third tin overflowing hole is formed in the third frame body and located between the third chip base island and the fourth chip base island.
Specifically, a second tin overflow hole is formed in the second connecting part.
Specifically, the first frame body, the second frame body, the third frame body and the fourth frame body are respectively arranged in the plastic package body.
Specifically, the first frame body is provided with a first stress hole in the plastic package body.
Specifically, the second frame body is provided with a second stress hole in the plastic package body.
Specifically, the distance between the third frame body and the second frame body is 0.3mm.
Specifically, the distance between the third frame body and the fourth frame body is 0.2mm.
The utility model comprises a first frame body, a second frame body, a third frame body and a fourth frame body; the second frame body is arranged below the first frame body, a second pin of the second frame body extends out of the bottom, and the top of the second frame body is provided with a first connecting part extending to the side part of the first frame body; the third frame body is arranged on the side part of the first frame body, and a chip base island IV and a chip base island III are sequentially arranged along the horizontal direction; the fourth frame body is arranged below the third frame body and is provided with a chip base island II. Through the frame of this case structure, effective encapsulation proportion reaches 90% to through on every muscle pin of cutting, increase diameter 0.4 mm's stress hole, every stress hole sets up respectively in plastic envelope body, thereby stress when reducing the pin muscle of cutting.
Drawings
Figure 1 is a schematic structural view of the present invention,
FIG. 2 is a schematic diagram of a frame structure used in comparison with simulation of the present invention;
in the figure, 100 is the first frame, 110 is pin one, 120 is solder overflow hole one, 130 is stress hole one,
200 is a second frame, 210 is pin two, 220 is connection portion one, 230 is chip base island one,
300 is a third frame, 310 is chip base four, 320 is chip base three, 330 is pin four, 340 is solder overflow hole three,
400 is a fourth frame body, 410 is a chip base island two, 420 is a connection portion two, 430 is a pin three,
and 500 is a plastic package body.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The utility model is shown in figure 1-2; the low-stress high-power bridge stack frame comprises:
the first frame body 100, wherein a first pin 110 of the first frame body 100 extends out from the top;
the second frame body 200 is arranged below the first frame body 100, a second pin 210 of the second frame body extends out from the bottom, a first connecting part 220 extending to the side part of the first frame body 100 is arranged at the top, and an extending position matched with the first connecting part 220 is arranged on the first frame body 100; a first chip base island 230 for bearing a first chip is arranged on the second frame body 200; in the scheme, the first connecting part 220 is used for connecting a jumper pin led out from a 310 chip base island;
a third frame 300, the third frame 300 being disposed on a side of the first frame 100, and being provided with a chip base island four 310 and a chip base island three 320 in this order along a horizontal direction; the fourth pin 330 of the third frame body 300 extends out from the top; and
a fourth frame 400, wherein the fourth frame 400 is arranged below the third frame 300 and is provided with a second chip pad 410; the third pin 430 of the fourth frame body 400 protrudes from the bottom.
Preferably, the fourth frame 400 is provided with a second chip base island 410 and a second connecting portion 420 in sequence along the horizontal direction;
the pin three 430 extends from the bottom of the connection part two 420. In the scheme, the second connecting part 420 is used for placing jumper pins led out from the 320 chip base islands;
preferably, the first frame 100 is provided with a first solder overflow hole 120.
Preferably, a third tin overflow hole 340 is formed in the third frame 300 between the third chip base island 320 and the fourth chip base island 310.
Preferably, a second solder overflow hole is formed in the second connecting portion 420.
Preferably, the first frame 100, the second frame 200, the third frame 300, and the fourth frame 400 are respectively disposed in the plastic package body 500.
Preferably, the first frame 100 is provided with a first stress hole 130 in the plastic package body 500.
Further preferably, a second stress hole is formed in the plastic package body 500 on the second frame 200.
In the scheme, the first stress hole 130 and the second stress Kong Erfen are respectively arranged on the corresponding first pin 110 and the corresponding second pin 210 and are wrapped in the plastic package body 500, so that the shearing stress of the whole structure is reduced.
Further, the third frame 300 is spaced from the second frame 200 by 0.3mm.
Further, the distance between the third frame body 300 and the fourth frame body 400 is 0.2mm.
The side lengths of chip base islands (a first chip base island 230, a second chip base island 410, a third chip base island 320 and a fourth chip base island 310) designed by the framework are respectively 3mm; the side length of a chip loaded on the chip base island is 2.8mm, the effective packaging proportion reaches 90% through the frame with the structure, stress holes (a first stress hole 130 and a second stress hole) with the diameter of 0.4mm are additionally formed in each rib cutting pin, and each stress hole is respectively arranged in the plastic package body 500.
Compared with the frame diagram 2 in the frame diagram 1, the simulation shows that the maximum stress of the chip can be reduced by about 41% during rib cutting; after the stress hole design is added (as shown in fig. 1), the stress of the frame is reduced to 191.93pa during rib cutting; in addition, a first tin overflow hole 120 and a second tin overflow hole with the side length of 1.0x0.5mm are also arranged in the diagram 1, so that the solder paste is prevented from overflowing out of the plastic package body 500; the third frame 300 is provided with a third tin overflow hole 340 with the side length of 0.7x0.3mm, so that the chips on the third chip base island 320 and the fourth chip base island 310 are prevented from being connected in parallel.
The disclosure of the present application also includes the following points:
(1) The drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) In case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
Claims (10)
1. The low-stress high-power bridge stack frame is characterized by comprising:
the first frame body, the first pin of the first frame body stretches out from the top;
the second frame body is arranged below the first frame body, a second pin of the second frame body extends out of the bottom of the second frame body, a first connecting part extending to the side part of the first frame body is arranged at the top of the second frame body, and an extending position matched with the first connecting part is arranged on the first frame body; a first chip base island for bearing a first chip is arranged on the second frame body;
the third frame body is arranged on the side part of the first frame body, and a chip base island IV and a chip base island III are sequentially arranged along the horizontal direction; a fourth pin of the third frame body extends out of the top; and
the fourth frame body is arranged below the third frame body and is provided with a chip base island II; and a third pin of the fourth frame body extends out of the bottom.
2. The low-stress high-power bridge stack frame according to claim 1, wherein the fourth frame body is provided with a second chip base and a second connecting part in sequence along the horizontal direction;
and the third pin extends out of the bottom of the second connecting part.
3. The low-stress high-power bridge rectifier frame as claimed in claim 1, wherein the first frame body is provided with a first tin overflow hole.
4. The low-stress high-power bridge stack frame according to claim 1, wherein a third tin overflow hole is formed in the third frame body between the third chip base island and the fourth chip base island.
5. The low-stress high-power bridge rectifier frame according to claim 2, wherein a second tin overflow hole is formed in the second connecting portion.
6. The low stress high power bridge stack frame according to claim 1, wherein the first frame body, the second frame body, the third frame body and the fourth frame body are respectively arranged in a plastic package body.
7. The low-stress high-power bridge stack frame according to claim 6, wherein the first frame body is provided with a first stress hole in the plastic package body.
8. The low-stress high-power bridge stack frame according to claim 6, wherein a second stress hole is formed in the plastic package body on the second frame body.
9. The low stress high power bridge stack frame according to claim 1, wherein the distance between the third frame body and the second frame body is 0.3mm.
10. The low stress high power bridge stack frame according to claim 1, wherein the distance between the third frame body and the fourth frame body is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222749361.9U CN218414570U (en) | 2022-10-19 | 2022-10-19 | Low-stress high-power bridge stack frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222749361.9U CN218414570U (en) | 2022-10-19 | 2022-10-19 | Low-stress high-power bridge stack frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218414570U true CN218414570U (en) | 2023-01-31 |
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ID=85002777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222749361.9U Active CN218414570U (en) | 2022-10-19 | 2022-10-19 | Low-stress high-power bridge stack frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218414570U (en) |
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2022
- 2022-10-19 CN CN202222749361.9U patent/CN218414570U/en active Active
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