CN218274582U

CN218274582U - Miniature bridge rectifier and rectifier frame

Info

Publication number: CN218274582U
Application number: CN202222796383.0U
Authority: CN
Inventors: 周庆卫
Original assignee: Chongqing Dabiao Electronic Science And Technology Co ltd
Current assignee: Chongqing Dabiao Electronic Science And Technology Co ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-01-10
Anticipated expiration: 2032-10-24

Abstract

The utility model discloses a miniature bridge rectifier and rectifier frame, locate last coupling assembling in the packaging body, locate the packaging body in the lower coupling assembling below of last coupling assembling and locate first chip between coupling assembling and the lower coupling assembling, the second chip, third chip and fourth chip, go up first connection piece and the second connection piece that coupling assembling includes the interval setting, lower connection piece subassembly includes third connection piece and the fourth connection piece that the interval set up, first connection piece and second connection piece can be with first chip and second chip staggered arrangement, third connection piece and fourth connection piece can be with third chip and fourth chip staggered arrangement, and the interval between first connection piece and the second connection piece can more practice thrift the space than parallel arrangement's mode, and the interval of third connection piece and fourth connection piece as the support also correspondingly reduces, practices thrift the space in the packaging body, accomplishes to reduce the size of bridge rectifier, realizes the demand of product miniaturization.

Description

Miniature bridge rectifier and rectifier frame

Technical Field

The utility model belongs to the technical field of the rectifier, concretely relates to miniature bridge rectifier and rectifier frame.

Background

The bridge rectifier is a bridge structure composed of four rectifier diodes, rectifies alternating current by utilizing the unidirectional conductive characteristic of the diodes, is a remarkable improvement on half-wave rectification of the diodes because the utilization efficiency of the bridge rectifier on input sine waves is doubled compared with that of the half-wave rectification, and is widely applied to circuits for converting alternating current into direct current.

At present, the invention with application number of CN201210575976.2 discloses an ultrathin miniature bridge rectifier, the P poles of two chips in four PN junction diode chips and the N poles of two chips are arranged on a connecting frame, two bridging chips with the same shape are respectively bridged with the connecting frames of two diode chips with different polarities and input ends, and a plastic package molding is carried out to form the bridge rectifier.

SUMMERY OF THE UTILITY MODEL

Too big in clearance between the connection bridge to prior art existence, the technical problem of the demand that can't satisfy the rectifier more miniaturized, the utility model provides a miniature bridge rectifier and rectifier frame.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a micro bridge rectifier comprises a packaging body, an upper connecting assembly arranged in the packaging body, a lower connecting assembly arranged in the packaging body and positioned below the upper connecting assembly, and a first chip, a second chip, a third chip and a fourth chip which are arranged between the upper connecting assembly and the lower connecting assembly;

the upper connecting assembly comprises a first connecting piece and a second connecting piece which are arranged at intervals, the first connecting piece comprises a first pin which is led out of the packaging body and serves as a first alternating current input end and a first connecting main body which is connected with the first pin, and the first connecting main body is provided with a first convex part which is positioned on one lateral side of the first pin and a first flat welding part which is positioned on one longitudinal side of the first convex part; the second connecting piece comprises a second pin led out of the packaging body and used as a second alternating current input end and a second connecting main body connected with the second pin, the second connecting main body is provided with a second flat welding part located on one transverse side of the second pin and a second convex part located on one longitudinal side of the second flat welding part, and the second convex part is close to the first connecting main body and located on one transverse side of the first convex part and the first flat welding part;

the lower connecting sheet assembly comprises a third connecting sheet and a fourth connecting sheet which are arranged at intervals, the third connecting sheet comprises a third pin which is led out of the packaging body and serves as a direct current positive electrode output end and a third connecting main body which is connected with the third pin, and the third connecting main body is provided with a third flat welding part which is located on one transverse side of the third pin and is matched with the first convex welding part so as to fix the first chip between the third pin and the first convex welding part and a fourth flat welding part which is located on one longitudinal side of the third flat welding part and is matched with the second convex welding part so as to fix the second chip between the third flat welding part and the second convex welding part; the fourth connecting piece comprises a fourth pin and a fourth connecting body, the fourth pin is led out of the packaging body and serves as a direct-current negative output end, the fourth connecting body is connected with the fourth pin, the fourth connecting body is provided with a third convex connecting portion and a fourth convex connecting portion, the third convex connecting portion is located on one transverse side of the fourth pin and matched with the second flat welding portion to fix the third chip between the fourth pin and the second flat welding portion, and the fourth convex connecting portion is located on one longitudinal side of the fourth pin and matched with the first flat welding portion to fix the fourth chip between the fourth pin and the first flat welding portion.

Further, first connection body include with first slope section, one end that first pin is connected with first linkage segment that first slope section is connected and with the first main part section that the first linkage segment other end is connected, the width of first linkage segment is less than the width of first main part section, first protruding connection portion with first flat welding portion connects the constitution first main part section, just the width of first protruding connection portion is less than the width of first flat welding portion, and first protruding connection portion with the hookup location department of first flat welding portion is equipped with two relative arrangement and all inside sunken depressed part.

Further, the second connection body comprises a second inclined section connected with the second pin and a second body section connected with the second inclined section, the second protruding portion and the second flat welding portion are connected to form the second body section, the second flat welding portion is adjacent to the second inclined section, the second protruding portion is located on one side of the first connection section, the width of the second protruding portion is smaller than that of the second flat welding portion, and the width of the second protruding portion is equal to that of the first protruding portion.

Further, the first convex connection part is connected with the P surface of the first chip through a first boss, and the N surface of the first chip is connected with the third flat welding part; the second convex connection part is also connected with the P surface of the second chip through a first boss, and the N surface of the second chip is connected with the fourth flat welding part.

Furthermore, the third connecting body includes a third inclined section connected to the third pin and a third main body section connected to the third inclined section, one end of the third flat-welded portion is connected to the fourth flat-welded portion to form the third main body section, the other end of the third flat-welded portion is adjacent to the third inclined section, the fourth flat-welded portion is connected to the third flat-welded portion through a bent section, the width of the bent section is smaller than that of the fourth flat-welded portion, and the width of the fourth flat-welded portion is smaller than that of the third flat-welded portion.

Further, the fourth connection main body comprises a fourth inclined section connected with the fourth pin and a fourth main body section connected with the fourth inclined section, the fourth main body section is located on one side of the fourth pin, the third convex connection portion and the fourth convex connection portion are connected with the fourth main body section, the third convex connection portion is fixedly connected to one side of the fourth main body section, and the fourth convex connection portion is fixedly connected to one side of the fourth main body section in the longitudinal direction and close to the fourth pin.

Further, the side of the longitudinal side of the third convex connection part is parallel to the side of the longitudinal side of the fourth flat welding part, the non-fixed end of the fourth convex connection part faces the third flat welding part, the side of the longitudinal side of the fourth convex connection part is parallel to the side of the longitudinal side of the third flat welding part, and the width of the fourth convex connection part is equal to that of the third convex connection part.

Further, the third protruding portion is connected to the P-side of the third chip through a second boss, and the N-side of the third chip is connected to the second flat welding portion; the fourth convex connection part is connected with the P surface of the fourth chip through a second boss, and the N surface of the fourth chip is connected with the first flat welding part.

A rectifier frame comprises a micro bridge rectifier and a frame body connected with the micro bridge rectifier, wherein a plurality of connecting frames are arranged on the frame body at intervals transversely, partition parts are arranged in the connecting frames and distributed along the longitudinal direction of the connecting frames, the internal space of each connecting frame is divided into two parts by the partition parts to form a first cavity and a second cavity, a plurality of micro bridge rectifiers are arranged in the first cavity at intervals, the first pins and the second pins are fixedly connected with the partition parts, the third pins and the fourth pins are fixedly connected with the first cavity, and a plurality of micro bridge rectifiers which are distributed in the first cavity in a one-to-one correspondence mode are fixedly connected in the second cavity.

Furthermore, a plurality of processing holes which are longitudinally arranged at intervals are formed in the separating part.

To sum up, the beneficial effects of the utility model are that: firstly, because the structure of first connection piece and second connection piece to and the structure of third connection piece and fourth connection piece, the chip can the dislocation arrange for the first connection piece and the second connection piece interval that are located the chip top is littleer, and corresponding with the interval of the third connection piece and the fourth connection piece of lower coupling assembling coincide fixed chip also littleer, practice thrift the space in the encapsulation body, make the rectifier more integrated more miniaturized. Its two, because first connection piece and second connection piece interval are nearer, third connection piece and fourth connection piece interval are nearer, but go up coupling assembling and fix the chip with lower coupling assembling after between the two, two upper and lower connection faces of all chips all are a big one little structure, help making the nearer chip of interval can have more spaces heat dissipation, increase of service life. Thirdly, when the micro bridge rectifier can be more integrated, the size of a product is changed to achieve the purpose of miniaturization, more micro bridge rectifiers can be arranged on the frame body, and processing materials are saved.

Drawings

Fig. 1 is a schematic structural diagram of a micro bridge rectifier provided by the present invention.

Fig. 2 is a vertical sectional view in fig. 1.

Fig. 3 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A in fig. 2.

Fig. 4 is a schematic structural diagram of the upper connecting assembly and the lower connecting assembly before being overlapped.

Fig. 5 is a schematic structural diagram of a rectifier frame according to the present invention.

Fig. 6 is a partially enlarged view at B in fig. 5.

In the figure, 100-a package body, 200-an upper connecting assembly, 210-a first connecting piece, 211-a first pin, 212-a first inclined section, 213-a first connecting section, 214-a first convex part, 215-a first flat welding part, 216-a concave part, 217-a first boss, 220-a second connecting piece, 221-a second pin, 222-a second inclined section, 223-a second convex part, 224-a second flat welding part, 300-a lower connecting assembly, 310-a third connecting piece, 311-a third pin, 312-a third inclined section, 313-a third flat welding part, 314-a fourth flat welding part, 315-a bent section, 320-a fourth connecting piece, 321-a fourth pin, 322-a fourth inclined section, 323-a fourth main body section, 324-a third convex part, 325-a fourth convex part, 326-a second boss, 400-a first chip, 500-a second chip, 600-a third chip, 700-a fourth chip, 800-a fourth chip, a frame body, 811-a first cavity frame 812, a second cavity separating hole 81813 and a second cavity separating hole are processed.

Detailed Description

The present invention will be further described with reference to the following specific drawings.

As shown in fig. 1-3, the present invention provides a micro bridge rectifier, which includes a package 100, an upper connecting assembly 200 disposed in the package 100, a lower connecting assembly 300 disposed below the upper connecting assembly 200 in the package 100, and a first chip 400, a second chip 500, a third chip 600 and a fourth chip 700 disposed between the upper connecting assembly 200 and the lower connecting assembly 300.

As shown in fig. 4, the upper connection assembly 200 includes a first connection piece 210 and a second connection piece 220 which are arranged at an interval, the first connection piece 210 includes a first pin 211 which is led out of the package body 100 as a first ac input end, and a first connection body connected to the first pin 211, and the first connection body has a first convex portion 214 located on one lateral side of the first pin 211 and a first flat welding portion 215 located on one longitudinal side of the first convex portion 214. The second connecting piece 220 includes a second pin 221 led out of the package 100 as a second ac input end and a second connecting body connected to the second pin 221, the second connecting body has a second flat welding portion 224 located on one lateral side of the second pin 221 and a second protruding portion 223 located on one longitudinal side of the second flat welding portion 224, and the second protruding portion 223 is close to the first connecting body and located on one lateral side of the first protruding portion 214 and the first flat welding portion 215.

As shown in fig. 4, the lower connecting sheet assembly includes a third connecting sheet 310 and a fourth connecting sheet 320 which are arranged at intervals, and the third connecting sheet 310 includes a third pin 311 which is led out of the package 100 and serves as a dc positive output terminal, and a third connecting body connected to the third pin 311. The third connection body has a third flat soldering portion 313 located at one lateral side of the third lead 311 and cooperating with the first protruding connection portion 214 for fixing the first chip 400 therebetween, and a fourth flat soldering portion 314 located at one longitudinal side of the third flat soldering portion 313 and cooperating with the second protruding connection portion 223 for fixing the second chip 500 therebetween. The fourth connecting piece 320 includes a fourth pin 321 led out of the package 100 as a dc negative output end and a fourth connecting body connected to the fourth pin 321, and the fourth connecting body has a third protruding portion 324 located on one lateral side of the fourth pin 321 and cooperating with the second flat soldering portion 224 to fix the third chip 600 therebetween and a fourth protruding portion 325 located on one longitudinal side of the fourth pin 321 and cooperating with the first flat soldering portion 215 to fix the fourth chip 700 therebetween.

With the above structure, the first convex portions 214 and the first flat welding portions 215 on the first connection piece 210 and the second convex portions 223 and the second flat welding portions 224 on the second connection piece 220 are arranged at positions such that the two connection pieces (corresponding to connection bridges) on all the chips are projected to have a structure similar to an L shape on the front plane of the bridge pile, the two L-shaped structures are arranged in a staggered manner, and the first chip 400 connected to the first convex portion 214 by solder paste and the second chip 500 connected to the second convex portion 223 by solder paste are not in the same line but are arranged in a staggered manner, so that the distance between the first connection piece 210 and the second connection piece 220 can be reduced. The third and fourth

flat solder portions

313 and 314 are disposed below all chips as support members, the third flat solder portion 313 is supported below the first chip 400, the fourth flat solder portion 314 is supported below the second chip 500, and the third and fourth protruding

portions

324 and 325 of the fourth connecting pad 320 are required to be matched with the two flat solder portions of the upper connecting assembly 200, so that the fourth connecting pad 320 is projected to have a structure similar to an F-shape in a front view plane, therefore, the third and

fourth chips

600 and 700 are not actually in the same straight line but are arranged in a staggered manner, and the distance between the third and fourth connecting

pads

310 and 320 is correspondingly reduced. The first connecting sheet 210 and the second connecting sheet 220 are configured to enable the first chip 400 and the second chip 500 to be arranged in a staggered manner, and the space between the first connecting sheet 210 and the second connecting sheet 220 can be saved more than the space between the first connecting sheet 210 and the second connecting sheet 220 in a parallel connection bridge manner, and the space between the third connecting sheet 310 and the fourth connecting sheet 320 used as supports is correspondingly reduced, so that the space in the package body 100 is saved, the size of the bridge rectifier is reduced, and the requirement for product miniaturization is met.

The first connection body includes a first inclined section 212 connected to the first pin 211, a first connection section 213 having one end connected to the first inclined section 212, and a first body section connected to the other end of the first connection section 213. The width of the first connecting section 213 is smaller than that of the first main body section, the first protruding portion 214 is connected with the first flat welding portion 215 to form the first main body section, the width of the first protruding portion 214 is smaller than that of the first flat welding portion 215, and two recessed portions 216 which are oppositely arranged and are recessed inwards are arranged at the connecting position of the first protruding portion 214 and the first flat welding portion 215. The first connecting piece 210 has different widths of each section, which is beneficial for more space for heat dissipation after being arranged close to the second connecting piece 220.

The second connecting body includes a second inclined section 222 connected to the second pin 221 and a second body section connected to the second inclined section 222. The second flat welding portion 224 and the second convex connecting portion 223 are connected to form the second main body section, and the second flat welding portion 224 is adjacent to the second inclined section 222, the second convex connecting portion 223 is located at the side of the first connecting section 213, the width of the second convex connecting portion 223 is smaller than the width of the second flat welding portion 224, and the width of the second convex connecting portion 223 is equal to the width of the first convex connecting portion 214. The second main body section is a variable cross-section structure with a larger cross-section and a smaller cross-section, and the connecting position of the second convex portion 223 and the second flat welding portion 224 is also provided with a concave portion 216, and after the chip is connected, more heat dissipation space can be left between the first connecting sheet 210 and the second connecting sheet 220 which are closer to each other.

The third connection body includes a third inclined section 312 connected to the third pin 311 and a third body section connected to the third inclined section 312, one end of the third flat-welded portion 313 is connected to the fourth flat-welded portion to form the third body section, the other end of the third flat-welded portion 313 is adjacent to the third inclined section 312, the fourth flat-welded portion 314 is connected to the third flat-welded portion 313 through a bent section 315, the width of the bent section 315 is smaller than the width of the fourth flat-welded portion 314, and the width of the fourth flat-welded portion 314 is smaller than the width of the third flat-welded portion 313. The fourth connecting body includes a fourth inclined section 322 connected to the fourth lead 321 and a fourth main section 323 connected to the fourth inclined section 322, the fourth main section 323 is located on one lateral side of the fourth lead 321, the third protruding portion 324 and the fourth protruding portion 325 are both connected to the fourth main section 323, the third protruding portion 324 is fixedly connected to one lateral side of the fourth main section 323, and the fourth protruding portion 325 is fixedly connected to one longitudinal side of the fourth main section 323 and close to the fourth lead 321. The first and second

inclined sections

212 and 222 are equal in height in the thickness direction of the product, and the first and second

inclined sections

212 and 222 are each higher than the third and fourth

inclined sections

312 and 322 that are equal in height.

The side edge of the longitudinal side of the third convex connection portion 324 is parallel to the side edge of the longitudinal side of the fourth flat welding portion 314, the non-fixed end of the fourth convex connection portion 325 faces the third flat welding portion 313, the side edge of the longitudinal side of the fourth convex connection portion 325 is parallel to the side edge of the longitudinal side of the third flat welding portion 313, and the width of the fourth convex connection portion 325 is equal to the width of the third convex connection portion 324. Two convex parts on the fourth connecting sheet 320, after the first chip 400, the second chip 500, the third chip 600 and the fourth chip 700 are fixed, on the front plane, the first chip 400 and the third chip 600 are on the same straight line, the second chip 500 and the fourth chip 700 are on the same straight line, the first chip 400 and the third chip 600 are on the same diagonal line, and the second chip 500 and the fourth chip 700 are on the same diagonal line, so that four chips arranged in this way can be more concentrated.

The first protruding portion 214 is connected to the P-side of the first chip 400 through a first protruding pad 217, and the N-side of the first chip 400 is connected to the third solder portion 313. The second bump portion 223 is also connected to the P-side of the second chip 500 through a first bump 217, and the N-side of the second chip 500 is connected to the fourth flat solder portion 314. The third protruding portion 324 is connected to the P-side of the third chip 600 through a second protruding platform 326, and the N-side of the third chip 600 is connected to the second flat welding portion 224. The fourth protruding portion 325 is connected to the P-side of the fourth chip 700 through a second boss 326 having the same structure as the first boss 217, and the N-side of the fourth chip 700 is connected to the first land portion 215. The widths of the first convex connection portion 214 and the second convex connection portion 223 are equal, but the width of the first convex connection portion 214 is smaller than that of the third flat welding portion 313, the width of the second convex connection portion 223 is smaller than that of the fourth flat welding portion 314, the width of the third convex connection portion 324 is smaller than that of the second flat welding portion 224, and the width of the fourth convex connection portion 325 is smaller than that of the first flat welding portion 215.

As shown in fig. 5, a rectifier frame includes a micro bridge rectifier and a frame body 800 connected to the micro bridge rectifier, a plurality of connection frames 810 arranged at intervals in a transverse direction are disposed on the frame body 800, and partitions 813 are disposed in the connection frames 810 and distributed along a longitudinal direction of the connection frames 810. The partition 813 divides the inner space of the connecting frame 810 into two parts to form a first cavity 811 and a second cavity 812, a plurality of micro bridge rectifiers are arranged in the first cavity 811 at equal intervals, the first pin 211 and the second pin 221 are fixedly connected with the partition 813, the third pin 311 and the fourth pin 321 are fixedly connected with the first cavity 811, and a plurality of micro bridge rectifiers distributed in one-to-one correspondence with the micro bridge rectifiers in the first cavity 811 are also fixedly connected in the second cavity 812. After the rectifier is more miniaturized and integrated, more micro bridge rectifier devices can be arranged on the frame body 800 in a matrix manner, and production materials can be saved.

Since there are cutting vacant positions around the first pin 211, the second pin 221, the third pin 311, and the fourth pin 321, all the pins can be cut by punching and cutting, and the single micro bridge rectifier can be separated from the frame body 800. As shown in fig. 6, a plurality of machining holes 8130 are formed in the partition portion 813, and the machining holes 8130 are arranged at intervals in the longitudinal direction, and are used for removing stress in a stamping process, so that a product is prevented from being deformed by punching.

In the rectifier and the rectifier frame, firstly, due to the structures of the first connecting sheet 210 and the second connecting sheet 220 and the structures of the third connecting sheet 310 and the fourth connecting sheet 320, the chips can be arranged in a staggered mode, so that the distance between the first connecting sheet 210 and the second connecting sheet 220 above the chips is smaller, and the distance between the third connecting sheet 310 and the fourth connecting sheet 320 correspondingly matched with the lower connecting assembly 300 in an overlapped mode to fix the chips is also smaller, the space in the packaging body 100 is saved, and the rectifier is more integrated and miniaturized. Secondly, because first connection piece 210 and second connection piece 220 interval are nearer, and third connection piece 310 and fourth connection piece 320 interval are nearer, but go up coupling assembling 200 and lower coupling assembling 300 and fix the chip between the two after, two upper and lower connection faces of all chips all are a big one little structure, help making the nearer chip of interval can have more heat dissipation space, increase of service life. Thirdly, when the micro bridge rectifier can be more integrated, so that the size of a product is changed to achieve the purpose of miniaturization, more micro bridge rectifiers can be arranged on the frame body 800, and processing materials are saved.

The above is only the embodiment of the present invention, not the limitation of the patent scope of the present invention, all the equivalent structures made by the contents of the specification and the drawings are directly or indirectly applied to other related technical fields, all the same principle is within the patent protection scope of the present invention.

Claims

1. A miniature bridge rectifier characterized in that: the packaging structure comprises a packaging body, an upper connecting assembly arranged in the packaging body, a lower connecting assembly arranged in the packaging body and positioned below the upper connecting assembly, and a first chip, a second chip, a third chip and a fourth chip which are arranged between the upper connecting assembly and the lower connecting assembly;

the upper connecting assembly comprises a first connecting piece and a second connecting piece which are arranged at intervals, the first connecting piece comprises a first pin which is led out of the packaging body and serves as a first alternating current input end and a first connecting main body which is connected with the first pin, and the first connecting main body is provided with a first convex part which is positioned on one lateral side of the first pin and a first flat welding part which is positioned on one longitudinal side of the first convex part; the second connecting piece comprises a second pin which is led out of the packaging body and serves as a second alternating current input end and a second connecting main body which is connected with the second pin, the second connecting main body is provided with a second flat welding part which is positioned on one side of the second pin in the transverse direction and a second convex connecting part which is positioned on one side of the second flat welding part in the longitudinal direction, and the second convex connecting part is close to the first connecting main body and positioned on one side of the first convex connecting part in the transverse direction and one side of the first flat welding part in the transverse direction;

the lower connecting piece assembly comprises a third connecting piece and a fourth connecting piece which are arranged at intervals, the third connecting piece comprises a third pin which is led out of the packaging body and used as a direct current positive electrode output end and a third connecting main body which is connected with the third pin, and the third connecting main body is provided with a third flat welding part which is positioned on one transverse side of the third pin and matched with the first convex part for fixing the first chip between the third pin and the first convex part and a fourth flat welding part which is positioned on one longitudinal side of the third flat welding part and matched with the second convex part for fixing the second chip between the third pin and the second convex part; the fourth connecting piece comprises a fourth pin and a fourth connecting body, the fourth pin is led out of the packaging body and serves as a direct-current negative output end, the fourth connecting body is connected with the fourth pin, the fourth connecting body is provided with a third convex connecting portion and a fourth convex connecting portion, the third convex connecting portion is located on one transverse side of the fourth pin and matched with the second flat welding portion to fix the third chip between the fourth pin and the second flat welding portion, and the fourth convex connecting portion is located on one longitudinal side of the fourth pin and matched with the first flat welding portion to fix the fourth chip between the fourth pin and the first flat welding portion.

2. The micro bridge rectifier of claim 1, wherein: first connection main part include with first slope section, one end that first pin is connected with first linkage segment that first slope section is connected and with the first main part section that the first linkage segment other end is connected, the width of first linkage segment is less than the width of first main part section, first protruding portion with first butt weld portion connects the constitution first main part section, just the width of first protruding portion is less than the width of first butt weld portion, and first protruding portion with the hookup location department of first butt weld portion is equipped with two relative arrangement and all inside sunken depressed part.

3. The micro bridge rectifier of claim 2, wherein: the second connection main body comprises a second inclined section connected with the second pin and a second main body section connected with the second inclined section, the second convex connection part and the second flat welding part are connected to form the second main body section, the second flat welding part is adjacent to the second inclined section, the second convex connection part is located on one side of the first connection section, the width of the second convex connection part is smaller than that of the second flat welding part, and the width of the second convex connection part is equal to that of the first convex connection part.

4. The micro bridge rectifier of claim 3, wherein: the first convex connection part is connected with the P surface of the first chip through a first boss, and the N surface of the first chip is connected with the third flat welding part; the second protruding portion is also connected with the P face of the second chip through a first boss, and the N face of the second chip is connected with the fourth flat welding portion.

5. The micro bridge rectifier of claim 1, wherein: the third connecting body comprises a third inclined section connected with the third pin and a third main body section connected with the third inclined section, one end of a third flat welding part is connected with a fourth flat welding part to form the third main body section, the other end of the third flat welding part is adjacent to the third inclined section, the fourth flat welding part is connected with the third flat welding part through a bending section, the width of the bending section is smaller than that of the fourth flat welding part, and the width of the fourth flat welding part is smaller than that of the third flat welding part.

6. The micro bridge rectifier of claim 5, wherein: the fourth connection body comprises a fourth inclined section connected with the fourth pin and a fourth main body section connected with the fourth inclined section, the fourth main body section is located on one transverse side of the fourth pin, the third convex connection portion and the fourth convex connection portion are connected with the fourth main body section, the third convex connection portion is fixedly connected with one transverse side of the fourth main body section, and the fourth convex connection portion is fixedly connected with one longitudinal side of the fourth main body section and close to the fourth pin.

7. The micro bridge rectifier of claim 6, wherein: the side of the vertical one side of the third convex connection part is parallel to the side of the vertical one side of the fourth flat welding part, the non-fixed end of the fourth convex connection part faces to the third flat welding part, the side of the vertical one side of the fourth convex connection part is parallel to the side of the vertical one side of the third flat welding part, and the width of the fourth convex connection part is equal to that of the third convex connection part.

8. The micro bridge rectifier of claim 7, wherein: the third convex part is connected with the P surface of the third chip through a second boss, and the N surface of the third chip is connected with the second flat welding part; the fourth protruding portion is connected with the P face of the fourth chip through a second boss, and the N face of the fourth chip is connected with the first flat welding portion.

9. A rectifier frame, characterized by: the bridge rectifier assembly comprises a micro bridge rectifier according to any one of claims 1 to 8 and a frame body connected with the micro bridge rectifier, wherein a plurality of connecting frames are arranged on the frame body at intervals in the transverse direction, partition parts are arranged in the connecting frames and distributed along the longitudinal direction of the connecting frames, the internal space of the connecting frames is divided into two parts by the partition parts to form a first cavity and a second cavity, a plurality of micro bridge rectifiers are arranged in the first cavity at equal intervals, the first pin and the second pin are fixedly connected with the partition parts, the third pin and the fourth pin are fixedly connected with the first cavity, and a plurality of micro bridge rectifiers distributed in the first cavity in a one-to-one correspondence manner are also fixedly connected in the second cavity.

10. A rectifier frame in accordance with claim 9, wherein: the partition part is provided with a plurality of processing holes which are longitudinally arranged at intervals.