CN214378427U - Intelligent power module - Google Patents
Intelligent power module Download PDFInfo
- Publication number
- CN214378427U CN214378427U CN202120519645.1U CN202120519645U CN214378427U CN 214378427 U CN214378427 U CN 214378427U CN 202120519645 U CN202120519645 U CN 202120519645U CN 214378427 U CN214378427 U CN 214378427U
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- CN
- China
- Prior art keywords
- conductive
- metal oxide
- oxide semiconductor
- semiconductor transistor
- transistor chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An intelligent power module comprises a lead frame, a conductive clamp, a first metal oxide semiconductor transistor chip and a second metal oxide semiconductor transistor chip, wherein the first metal oxide semiconductor transistor chip and the second metal oxide semiconductor transistor chip are arranged between the lead frame and the conductive clamp in parallel and are mutually and electrically connected through the conductive clamp; the conductive clip is provided with a flat part and at least two connecting parts protruding from the flat part, and the connecting parts and the conductive clip are integrally formed. The utility model adds the connecting part at the side of the conductive clip, and the connecting part can be connected with the conductive clips of the adjacent packaging monomers to form a conductive clip array in the packaging process, so that the conductive clips of the adjacent packaging monomers are mutually restricted, and the risks of quality and reliability caused by the inclination and rotation of the single conductive clip during the assembly are prevented; in addition, the connecting part and the conductive clamp are integrally formed, so that the heat dissipation area of the conductive clamp can be effectively increased, and the heat dissipation efficiency is further improved.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package and specifically relates to an intelligent power module.
Background
The conventional smart power module generally includes a lead frame, a conductive clip, a first metal oxide semiconductor transistor chip and a second metal oxide semiconductor transistor chip, wherein the first metal oxide semiconductor transistor chip and the second metal oxide semiconductor transistor chip are disposed side by side between the lead frame and the conductive clip and electrically connected to each other through the conductive clip. Due to the drift of the solder during soldering, the conductive clip is often inclined, which leads to the quality problem that the conductive solder causes direct short circuit between one electrode on the surface of the chip and one electrode on the side of the chip, or the reliability problem of intermittent short circuit.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an intelligence power module is provided, can not only improve the reliability of encapsulation, can improve the radiating efficiency moreover.
In order to solve the technical problem, the technical scheme of the utility model is that: an intelligent power module comprises a lead frame, a conductive clamp, a first metal oxide semiconductor transistor chip and a second metal oxide semiconductor transistor chip, wherein the first metal oxide semiconductor transistor chip and the second metal oxide semiconductor transistor chip are arranged between the lead frame and the conductive clamp in parallel and are electrically connected with each other through the conductive clamp; the conductive clip is provided with a flat part and at least two connecting parts protruding from the flat part, and the connecting parts and the conductive clip are integrally formed. The utility model adds the connecting part at the side of the conductive clip, and the connecting part can be connected with the conductive clips of the adjacent packaging monomers to form a conductive clip array in the packaging process, so that the conductive clips of the adjacent packaging monomers are mutually restricted, and the risks of quality and reliability caused by the inclination and rotation of the single conductive clip during the assembly are prevented; in addition, the connecting part and the conductive clamp are integrally formed, so that the heat dissipation area of the conductive clamp can be effectively increased, and the heat dissipation efficiency is further improved.
As an improvement, the conductive clips form an array of conductive clips with adjacent conductive clips through the connecting portion, and the conductive clips are formed by cutting the array of conductive clips.
As an improvement, the conductive clamp has a pin portion bent toward the lead frame, and the pin portion is electrically connected to the lead frame.
As a refinement, at least one of the connecting portions projects from the foot portion.
As an improvement, the connecting part is positioned in the middle of the side edge of the conductive clip.
Compared with the prior art, the utility model the beneficial effect who brings is:
the utility model adds the connecting part at the side of the conductive clip, and the connecting part can be connected with the conductive clips of the adjacent packaging monomers to form a conductive clip array in the packaging process, so that the conductive clips of the adjacent packaging monomers are mutually restricted, and the risks of quality and reliability caused by the inclination and rotation of the single conductive clip during the assembly are prevented; in addition, the connecting part and the conductive clamp are integrally formed, so that the heat dissipation area of the conductive clamp can be effectively increased, and the heat dissipation efficiency is further improved.
Drawings
FIG. 1 is a schematic diagram of an array of conductive clips.
Fig. 2 is a schematic diagram of the mating of the array of conductive clips, the array of chips, and the array of lead frames.
Fig. 3 is a schematic view of a single conductive clip.
Fig. 4 is a schematic illustration of the mating of a single conductive clip, chip and lead frame.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 3 and 4, the smart power module includes a lead frame 2, a conductive clip 1, a first mos transistor chip 3 and a second mos transistor chip 4; the transistor chips are disposed side by side between the conductive clips 1 and the lead frames 2 and electrically connected to each other through the conductive clips 1. The conductive clip 1 has a leg portion 5 bent toward the lead frame, and the leg portion is electrically connected to the lead frame 2.
As shown in fig. 3, the conductive clip 1 has a flat portion and at least two connecting portions 11 protruding from the flat portion, and the connecting portions 11 are integrally formed with the conductive clip 1; in this embodiment, the connecting portion 11 is located at the middle position of the side of the conductive clip 1, and at least one connecting portion 11 protrudes from the pin portion.
As shown in fig. 1 and 2, the conductive clips and the adjacent conductive clips form a conductive clip array through the connecting portions, and the conductive clips and the connecting portions are formed by cutting the conductive clip array. The manufacturing process of the intelligent power module comprises the following steps:
(1) punching an array of interconnected conductive clips;
(2) welding the conductive clip array, the chip array and the lead frame array through solder paste;
(3) placing the welded semi-finished product into a mould and pouring packaging glue;
(4) cutting off the connecting parts and the packaging adhesive between the packaging single bodies;
(5) resulting in a single intelligent power module.
As shown in fig. 1 and 2, the connecting portion 11 is added at the side of the conductive clip 1, when manufacturing, the plurality of conductive clips 1 can be integrally formed by stamping, the connecting portion 11 can be connected with the adjacent conductive clips 1 of the packaging units in the packaging process to form a conductive clip array, so that the adjacent conductive clips 1 of the packaging units are constrained with each other, and the risk of quality and reliability caused by the inclination and rotation of the single conductive clip 1 during assembly is prevented; in addition, because the connecting part 11 and the conductive clip 1 are integrally formed, the heat dissipation area of the conductive clip 1 can be effectively increased, and the heat dissipation efficiency is further improved.
Claims (5)
1. An intelligent power module comprises a lead frame, a conductive clamp, a first metal oxide semiconductor transistor chip and a second metal oxide semiconductor transistor chip, wherein the first metal oxide semiconductor transistor chip and the second metal oxide semiconductor transistor chip are arranged between the lead frame and the conductive clamp in parallel and are electrically connected with each other through the conductive clamp; the method is characterized in that: the conductive clip is provided with a flat part and at least two connecting parts protruding from the flat part, and the connecting parts and the conductive clip are integrally formed.
2. The smart power module of claim 1, wherein: the conductive clips form a conductive clip array with adjacent conductive clips through the connecting portions, and the conductive clips are formed by cutting the conductive clip array.
3. The smart power module of claim 1, wherein: the conductive clamp is provided with a pin part bent towards the lead frame, and the pin part is electrically connected with the lead frame.
4. The smart power module of claim 3, wherein: at least one of the connecting portions protrudes from the foot portion.
5. The smart power module of claim 1, wherein: the connecting part is positioned in the middle of the side edge of the conductive clip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120519645.1U CN214378427U (en) | 2021-03-11 | 2021-03-11 | Intelligent power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120519645.1U CN214378427U (en) | 2021-03-11 | 2021-03-11 | Intelligent power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214378427U true CN214378427U (en) | 2021-10-08 |
Family
ID=77970942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120519645.1U Active CN214378427U (en) | 2021-03-11 | 2021-03-11 | Intelligent power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214378427U (en) |
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2021
- 2021-03-11 CN CN202120519645.1U patent/CN214378427U/en active Active
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