CN216749880U - Combined frame for integrated driving element and integrated driving assembly - Google Patents

Combined frame for integrated driving element and integrated driving assembly Download PDF

Info

Publication number
CN216749880U
CN216749880U CN202123053339.2U CN202123053339U CN216749880U CN 216749880 U CN216749880 U CN 216749880U CN 202123053339 U CN202123053339 U CN 202123053339U CN 216749880 U CN216749880 U CN 216749880U
Authority
CN
China
Prior art keywords
frame
pin
driving element
integrated
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202123053339.2U
Other languages
Chinese (zh)
Inventor
钟玲祥
李阳
余彬
徐泉江
江琦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Hongxin Microelectronics Technology Co ltd
Original Assignee
Zhejiang Hongxin Microelectronics Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Hongxin Microelectronics Technology Co ltd filed Critical Zhejiang Hongxin Microelectronics Technology Co ltd
Priority to CN202123053339.2U priority Critical patent/CN216749880U/en
Application granted granted Critical
Publication of CN216749880U publication Critical patent/CN216749880U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

The application discloses a combined frame for an integrated driving element and an integrated driving assembly, which comprise a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame; the first frame comprises at least one first connecting body, the first connecting body comprises a first welding area, the second frame comprises at least one second connecting body, the second connecting body comprises a second welding area, and the first welding area and the second welding area are used for being electrically connected with an electrode of the first driving element; the third frame comprises at least one base island and pins, wherein the base island is used for carrying the second driving element, and the pins are used for being electrically connected with the second driving element. In the combined frame, the first connecting body of the first frame comprises a first welding area, the second connecting body of the second frame comprises a second welding area, the first driving element can be welded between the first connecting body and the second connecting body, the wire bonding connection is avoided, the situations of insufficient soldering and lead breakage are reduced, and the yield is improved.

Description

Combined frame for integrated driving element and integrated driving assembly
Technical Field
The present disclosure relates to the field of packaging, and more particularly, to a combined frame for an integrated driving device and an integrated driving assembly.
Background
Because of its characteristics of energy saving, high efficiency and environmental protection, LEDs (Light-Emitting diodes) are widely used in lighting products. The LED needs direct current driving, so a driving power supply needs to be provided in the LED lighting product to convert the commercial alternating current into direct current required by the LED lighting product, and then output the direct current to the LED lighting product.
At present, a driving element (such as a rectifying diode chip and a constant current chip) is separately installed on a driving power panel of a driving power supply, and the driving power supply is large and occupies a large space due to the fact that the driving element is large in number and complex in wiring, and the driving element needs to be integrally processed in order to reduce the volume of the driving power supply. For example, a rectifier diode chip and a constant current chip are integrated in a package with a plurality of pins, bridge rectification is realized by welding the four rectifier diode chips to a base island and performing wire bonding, and the constant current chip realizes functional connection of a circuit by base island welding or silver paste bonding and a plurality of bonding wires. The integration mode is that a copper sheet is firstly stamped into a functional frame with a plurality of base islands and pins when being manufactured, then four rectifying diode chips and a constant current chip are respectively welded on the respective base islands in a die bonding mode, the four rectifying diode chips are connected with each other in a wire bonding mode, the constant current chip is connected with the pins in the wire bonding mode, then plastic package is carried out, the pins are electroplated, and the single integrated module is formed by cutting. Due to the fact that the integrated module is subjected to routing for many times, cold joint is easily caused, the yield of the integrated module is reduced, meanwhile, leads are easily broken in the plastic packaging process, and the packaging difficulty of the power module is increased.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an integrated drive component is with combination frame, integrated drive assembly to reduce the number of times of routing, promote the yield, reduce the encapsulation degree of difficulty.
In order to solve the above technical problem, the present application provides a combined frame for integrated driving elements, including a first frame, a second frame stacked on the first frame, and a third frame stacked on the second frame;
the first frame comprises at least one first connection body, the first connection body comprises a first welding area, the second frame comprises at least one second connection body, the second connection body comprises a second welding area, and the first welding area and the second welding area are used for being electrically connected with an electrode of a first driving element;
the third frame comprises at least one base island and a pin, wherein the base island is used for carrying a second driving element, and the pin is used for being electrically connected with the second driving element.
Optionally, the first bonding area includes a first bonding pad, a second bonding pad, a first chip carrying area and a second chip carrying area, and the second bonding area includes a third bonding pad, a fourth bonding pad, a third chip carrying area and a fourth chip carrying area.
Optionally, the first connector further comprises a direct-current positive output pin and a direct-current negative output pin, the first bonding pad and the second bonding pad pass through the direct-current positive output pin and are connected with a first connecting rib of the first frame, and the first glass carrying area and the second glass carrying area pass through the direct-current negative output pin and are connected with the first connecting rib.
Optionally, the second connector further includes a first ac input pin and a second ac input pin, the third pad and the third slide area are connected to the second connecting rib of the second frame through the first ac input pin, and the fourth pad and the fourth slide area are connected to the second connecting rib through the second ac input pin.
Optionally, the second connecting rib is located in the middle of the adjacent first connecting rib.
Optionally, the pins include a ground pin, a drain pin, and a sampling pin.
Optionally, the drain pin and the sampling pin are arranged oppositely, and the drain pin and the sampling pin are connected to two adjacent third connecting ribs in the third frame respectively.
Optionally, the dc positive output pin, the dc negative output pin, the first ac input pin, the second ac input pin, the ground pin, the drain pin, and the sampling pin are all located on the same plane.
The application also provides an integrated driving assembly, which comprises any one of the combined frame for the integrated driving element, a first driving element and a second driving element.
The combined frame for the integrated driving element comprises a first frame, a second frame and a third frame, wherein the second frame is stacked on the first frame; the first frame comprises at least one first connection body, the first connection body comprises a first welding area, the second frame comprises at least one second connection body, the second connection body comprises a second welding area, and the first welding area and the second welding area are used for being electrically connected with an electrode of a first driving element; the third frame comprises at least one base island and a pin, wherein the base island is used for carrying a second driving element, and the pin is used for being electrically connected with the second driving element.
It is thus clear that the combined frame includes the first frame that adds together in the vertical direction in this application, second frame and third frame, the third frame includes base island and pin, the second drive element can set up on the base island and be connected with the pin electricity, the first connector of first frame includes first weld zone, the second connector of second frame includes the second weld zone, can make first drive element weld between first connector and second connector, avoid routing connection, reduce the condition that the rosin joint appears, promote the yield, reduce the condition that the lead wire fracture appears simultaneously, reduce the encapsulation degree of difficulty.
In addition, this application still provides an integrated drive assembly.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a combined frame for integrated driving elements according to an embodiment of the present disclosure;
FIG. 2 is a partial enlarged view of a combination frame for integrated driving components according to an embodiment of the present application
Fig. 3 is a schematic structural diagram of a first frame according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a second frame according to an embodiment of the present disclosure;
FIG. 5 is an enlarged view of a portion of a first frame according to an embodiment of the present disclosure;
FIG. 6 is an enlarged view of a portion of a second frame according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a third frame according to an embodiment of the present disclosure;
FIG. 8 is an enlarged view of a portion of a third frame provided in accordance with an embodiment of the present disclosure;
fig. 9 is a schematic circuit diagram of the first driving element in the integrated driving component when the number of the first driving elements is four in the embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background art, the driving elements are connected to the base islands or the pins by wire bonding, and need to be wire bonded for many times, which easily causes cold solder joints, reduces the yield of the integrated module, and also easily causes lead fracture in the plastic package process, thereby increasing the packaging difficulty of the power module.
In view of the above, the present application provides a combined frame for integrated driving components, please refer to fig. 1 to 8, which includes a first frame 1, a second frame 2 stacked on the first frame 1, and a third frame 3 stacked on the second frame 2;
the first frame 1 comprises at least one first connection body 11, the first connection body 11 comprises a first welding area, the second frame 2 comprises at least one second connection body 21, the second connection body 21 comprises a second welding area, and the first welding area and the second welding area are used for being electrically connected with an electrode of a first driving element;
the third frame 3 comprises at least one base island 31 and pins, the base island 31 is used for carrying a second driving element, and the pins are used for electrically connecting with the second driving element.
The first frame 1 is shown in fig. 3, and the first frame 1 further includes first side bands 12 disposed opposite to each other, a plurality of first connecting ribs 13 disposed between the first side bands 12 and arranged in parallel in the longitudinal direction, and a first connecting body 11 connected to the first connecting ribs 13.
The first land is not limited in the present application as long as it can be welded to the electrode of the first drive element, and further, the number of regions that can be welded included in the first land is not limited in the present application, as the case may be.
The second frame 2 is shown in fig. 4, and the second frame 2 further includes second side bands 22 disposed opposite to each other, a plurality of second connection ribs 23 disposed between the second side bands 22 and arranged in parallel in the longitudinal direction, and second connection bodies 21 connected to the second connection ribs 23.
The second welding area is not limited in this application as long as it can be welded to the electrode of the first driving element, and further, the number of regions that can be welded included in the second welding area is not limited in this application, and the number of regions that can be welded in the second welding area is equal to the number of regions that can be welded in the first welding area.
Optionally, as an implementation manner, referring to fig. 5 and fig. 6, the first bonding area includes a first bonding pad 111, a second bonding pad 112, a first chip region 113, and a second chip region 114, and the second bonding area includes a third bonding pad 211, a fourth bonding pad 212, a third chip region 213, and a fourth chip region 214. That is, four first driving elements may be soldered between the first soldering region and the second soldering region, for example, the negative electrode of the first driving element is soldered on the first soldering pad 111, and the positive electrode is soldered on the third chip region 213; the cathode of the second first driving element is welded on the second bonding pad 112, and the anode is welded on the fourth chip area 214; the positive electrode of the third first driving element is welded on the first chip area 113, and the negative electrode is welded on the third bonding pad 211; the positive electrode of the fourth first driving element is soldered to the second chip area 114, and the negative electrode is soldered to the fourth pad 212.
First pad 111, second pad 112, first year piece district 113 and second year piece district 114 all are connected with first splice bar 13, in an embodiment of this application, first connector 11 still includes direct current positive pole output pin 115 and direct current negative pole output pin 116, first pad 111 with second pad 112 passes through direct current positive pole output pin 115 with first splice bar 13 of first frame 1 is connected, first year piece district 113 with second year piece district 114 passes through direct current negative pole output pin 116 with first splice bar 13 is connected.
The third pad 211, the fourth pad 212, the third chip carrying area 213 and the fourth chip carrying area 214 are all connected to the second connecting rib 23, in an embodiment of the present application, the second connector 21 further includes a first ac input pin 215 and a second ac input pin 216, the third pad 211 and the third chip carrying area 213 are connected to the second connecting rib 23 of the second frame 2 through the first ac input pin 215, and the fourth pad 212 and the fourth chip carrying area 214 are connected to the second connecting rib 23 through the second ac input pin 216.
The second frame 2 is stacked on the first frame 1, and in order to facilitate the covering of the second connecting body 21 in the second frame 2 on the corresponding first connecting body 11 on the first frame 1, the second connecting rib 23 is located in the middle of the adjacent first connecting rib 13.
The third frame 3 is schematically shown in fig. 7 and 8, and the third frame 3 further includes third side belts 32 disposed opposite to each other, and a plurality of third connecting ribs 33 disposed between the third side belts 32 and arranged in parallel in the longitudinal direction. The base island 31 is connected to the third connecting rib 33 by a pin.
The pin is not limited in this application, and the specific structure of the pin is set according to the electrode of the second driving element. For example, when the second driving element is a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), the second driving element includes three electrodes, and at this time, the pins include a ground pin 34, a drain pin 35, and a sampling pin 36, one electrode is connected to the drain pin 35 by a wire bonding method, one electrode is connected to the sampling pin 36 by a wire bonding method, and one electrode is connected to the ground pin 34 by a wire bonding method, that is, the electrode of the second driving element is connected to the pins including the ground pin 34, the drain pin 35, and the sampling pin 36 by a lead 4. When two electrodes are included in the second drive element, the number of pins is two, when four electrodes are included in the second drive element, the number of pins is four, and so on.
It should be noted that, the arrangement condition of the pins is not limited in this application, as the case may be. When the pins include the ground pin 34, the drain pin 35, and the sampling pin 36, the drain pin 35 and the sampling pin 36 are disposed opposite to each other, and the drain pin 35 and the sampling pin 36 are respectively connected to two adjacent third connecting ribs 33 in the third frame 3. Wherein the base island 31 is connected to the third connection rib 33 through the ground pin 34. The ground pin 34, the drain pin 35 and the sampling pin 36 are distributed in a triangular pattern, which facilitates wire bonding of the second driving element and the pins.
There is no direct connection between the first frame 1 and the second frame 2, and the electrode of the first driving element is welded to the first welding area and the second welding area, i.e. the first frame 1 and the second frame 2 are indirectly connected through the first driving element. The third side band 32 of the third frame 3 and the second side band 22 of the second frame 2 may be connected by a connecting member such as a snap, a screw, or the like.
When the first driving element and the second driving element are disposed in the combined frame for integrated driving element, in order to facilitate the soldering fit with the subsequent external circuit board, as an implementation manner, the dc positive output pin 115, the dc negative output pin 116, the first ac input pin 215, the second ac input pin 216, the ground pin 34, the drain pin 35, and the sampling pin 36 are all located on the same plane. Specifically, the dc positive output pin 115 and the dc negative output pin 116 are bent and then connected to the first connecting rib 13; the first alternating current input pin 215 and the second alternating current input pin 216 are bent and then connected with the second connecting rib 23; the ground pin 34, the drain pin 35, and the sampling pin 36 are bent and then connected to the third connection rib 33.
The combined frame comprises a first frame 1, a second frame 2 and a third frame 3 which are overlapped together in the vertical direction, the third frame 3 comprises a base island 31 and pins, a second driving element can be arranged on the base island 31 and electrically connected with the pins, a first connecting body 11 of the first frame 1 comprises a first welding area, a second connecting body 21 of the second frame 2 comprises a second welding area, the first driving element can be welded between the first connecting body 11 and the second connecting body 21, routing connection is avoided, the occurrence of false welding is reduced, the yield is improved, the occurrence of lead fracture is reduced, and the packaging difficulty is reduced.
The present application further provides an integrated driving assembly, comprising the combined frame for integrated driving element, the first driving element, and the second driving element according to any of the above embodiments.
The first driving element is welded between the first connecting body and the second connecting body of the combined frame for the integrated driving element, and the second driving element is arranged in the third frame of the combined frame for the integrated driving element.
The second driving element integrated in the third frame is electrically connected with the direct current positive electrode output pin and the direct current negative electrode output pin in the first frame, the first alternating current input pin and the second alternating current input pin in the second frame and the first driving element without wire bonding.
It should be noted that the types of the first driving element and the second driving element are not limited in the present application, and may be set by themselves. For example, the first driving element may be a rectifying diode chip, and the second driving element may be a metal oxide semiconductor type field effect transistor.
It should also be noted that the number of the first driving element and the second driving element is not specifically limited in this application, as the case may be. For example, the number of first drive elements may be one, two, four, five, etc., and the number of second drive elements may be one, two, etc.
When the number of the first driving elements is four, a schematic circuit diagram of the first driving elements in the integrated driving assembly is shown in fig. 9.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The combined frame and the integrated driving component for the integrated driving component provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims (9)

1. The combined frame for the integrated driving element is characterized by comprising a first frame, a second frame and a third frame, wherein the second frame is stacked on the first frame;
the first frame comprises at least one first connection body, the first connection body comprises a first welding area, the second frame comprises at least one second connection body, the second connection body comprises a second welding area, and the first welding area and the second welding area are used for being electrically connected with an electrode of a first driving element;
the third frame comprises at least one base island and a pin, wherein the base island is used for carrying a second driving element, and the pin is used for being electrically connected with the second driving element.
2. The composite frame for integrated driving elements according to claim 1, wherein the first bonding area comprises a first bonding pad, a second bonding pad, a first chip area and a second chip area, and the second bonding area comprises a third bonding pad, a fourth bonding pad, a third chip area and a fourth chip area.
3. The composite frame for an integrated driving element according to claim 2, wherein the first connecting body further comprises a dc positive output pin and a dc negative output pin, the first pad and the second pad are connected to the first connecting rib of the first frame through the dc positive output pin, and the first chip carrying region and the second chip carrying region are connected to the first connecting rib through the dc negative output pin.
4. The composite frame for an integrated driving element according to claim 3, wherein the second connector further comprises a first ac input pin and a second ac input pin, the third pad and the third chip mounting region are connected to the second connection rib of the second frame through the first ac input pin, and the fourth pad and the fourth chip mounting region are connected to the second connection rib through the second ac input pin.
5. The composite frame for an integrated drive component of claim 4, wherein the second connecting rib is located intermediate adjacent first connecting ribs.
6. The combination frame for an integrated driving element according to claim 5, wherein the pins include a ground pin, a drain pin, and a sampling pin.
7. The combination frame for integrated driving element according to claim 6, wherein the drain lead and the sampling lead are disposed opposite to each other, and the drain lead and the sampling lead are respectively connected to two adjacent third connecting ribs in the third frame.
8. The composite frame for integrated drive components of claim 7,
the direct current positive electrode output pin, the direct current negative electrode output pin, the first alternating current input pin, the second alternating current input pin, the grounding pin, the drain electrode pin and the sampling pin are all located on the same plane.
9. An integrated drive assembly comprising the modular frame for integrated drive components of any of claims 1 to 8, a first drive component, and a second drive component.
CN202123053339.2U 2021-12-07 2021-12-07 Combined frame for integrated driving element and integrated driving assembly Active CN216749880U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123053339.2U CN216749880U (en) 2021-12-07 2021-12-07 Combined frame for integrated driving element and integrated driving assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123053339.2U CN216749880U (en) 2021-12-07 2021-12-07 Combined frame for integrated driving element and integrated driving assembly

Publications (1)

Publication Number Publication Date
CN216749880U true CN216749880U (en) 2022-06-14

Family

ID=81932565

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123053339.2U Active CN216749880U (en) 2021-12-07 2021-12-07 Combined frame for integrated driving element and integrated driving assembly

Country Status (1)

Country Link
CN (1) CN216749880U (en)

Similar Documents

Publication Publication Date Title
US7791208B2 (en) Power semiconductor arrangement
US6404050B2 (en) Commonly housed diverse semiconductor
US8207602B2 (en) High voltage and high power boost converter with co-packaged Schottky diode
US20120273932A1 (en) Power supply module and packaging and integrating method thereof
US7095099B2 (en) Low profile package having multiple die
US20050161785A1 (en) Semiconductor device
CN105283956A (en) Integrating multi-output power converters having vertically stacked semiconductor chips
US20100273294A1 (en) Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates
KR100719055B1 (en) Semiconductor device and manufacturing method thereof
TWI415309B (en) Preform Molded Polycrystalline Bearing Modules with Lead Frame Type
CN102263094A (en) Non-interconnected multi-chip package diode
CN88101051A (en) Component for three-phase bridge conversion circuit
US6791172B2 (en) Power semiconductor device manufactured using a chip-size package
CN216749880U (en) Combined frame for integrated driving element and integrated driving assembly
CN112701094A (en) Power device packaging structure and power electronic equipment
JP4709349B2 (en) Semiconductor die housing equipment
CN114050140A (en) Combined frame for integrated driving element, integrated driving assembly and manufacturing method thereof
JPH1154799A (en) Semiconductor light emitting device
US8946876B2 (en) Semiconductor device
CN213660391U (en) IGBT module power terminal structure
US20120267645A1 (en) Light emitting diode module package structure
CN216250715U (en) Compact multi-chip sealing frame
CN109755229B (en) IGBT module
CN113871362A (en) Drive encapsulation module
CN111584452A (en) Lead frame, integrated chip structure and power module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant