CN218396453U

CN218396453U - Laser grinding device

Info

Publication number: CN218396453U
Application number: CN202222804709.XU
Authority: CN
Inventors: 吴喜泉
Original assignee: Suzhou Gaoyi Laser Technology Co ltd
Current assignee: Suzhou Gaoyi Laser Technology Co ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-01-31
Anticipated expiration: 2032-10-24

Abstract

The application provides a laser grinding device. The laser grinding device includes: a grinding assembly, the grinding assembly comprising: the gantry support arm is fixed on the gantry base, a driving part is arranged on one side of the top of the gantry support arm, the driving part is provided with an output end, the output end is connected to a connecting side plate, the side plate is driven to move in the Z direction based on the expansion and contraction of the output end, and a laser refraction assembly is arranged on the side plate and used for receiving light emitted by a laser light source and reflecting the light to the surface of a workpiece to be processed. The laser refraction component is utilized to reflect the laser emitted by the laser source, and the focus falls on the surface of the workpiece to be processed, and the diameter of the workpiece which can be processed is widened on the basis of not changing the structure of the original grinding component, so that the application range of the laser grinding device is widened.

Description

Laser grinding device

Technical Field

The application relates to the technical field of laser processing, in particular to laser grinding equipment.

Background

Most of the conventional surface machining techniques are milling or grinding using a tool having a higher hardness than a workpiece to be machined, and there are also surface machining using electric spark discharge, that is, milling using a milling cutter, a grinding wheel, electric spark discharge, or micro-powder grinding.

Recently, it has appeared that the surface of a workpiece is ablated by a laser to grind the workpiece as shown in fig. 1, and the laser 110 is directed to the surface of the workpiece 200 to grind the workpiece. Due to the limitation of the structure of the device, the current grinding device cannot be used for grinding workpieces with the diameter larger than 60mm, so that the application of the grinding equipment is limited.

The above background description is provided for clarity and completeness of description of the present application and for understanding by those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present application.

SUMMERY OF THE UTILITY MODEL

To overcome the above disadvantages, the present application aims to: a novel laser grinding apparatus is provided which can grind a current workpiece and also grind a workpiece having a diameter exceeding 100 mm.

In order to achieve the purpose, the following technical scheme is adopted in the application:

a laser milling apparatus, comprising: the grinding component is arranged on the grinding device,

the grinding assembly includes: the gantry support arm is fixed on the gantry base,

a driving part is arranged on one side of the top of the gantry support arm, the driving part is provided with an output end, the output end is connected to the connecting side plate, the side plate is driven to move in the Z direction based on the extension and contraction of the output end,

the side plate is provided with a laser refraction assembly which is connected with the laser light source in a matching way and used for receiving and reflecting light emitted by the laser light source, so that the focus of the laser falls on the surface of a workpiece to be processed. The laser refraction component is utilized to reflect the laser emitted by the laser source, and the focus falls on the surface of the workpiece to be processed, and the diameter of the workpiece which can be processed is widened on the basis of not changing the structure of the original grinding component, so that the application range of the laser grinding device is widened.

In one embodiment, the laser refraction assembly is connected to the cutter head component and is located on the lower side of the cutter head component.

In one embodiment, the laser refraction assembly is located on the upper side of the workpiece to be machined.

In one embodiment, the laser refraction assembly includes a substrate having a through hole disposed thereon,

a first mounting part is arranged on one side of the substrate, a reflecting sheet is arranged on the first mounting part, the reflecting sheet is arranged to at least partially face the through hole so as to reflect the laser incident from the through hole, and the reflected laser irradiates the surface of the workpiece.

In one embodiment, an adjusting member is disposed on the first mounting member, the adjusting member is connected to the reflective sheet,

adjusting the adjusting part to finely adjust the posture of the shooting piece.

In one embodiment, the laser polishing apparatus further includes a second mounting member disposed on the same side as the first mounting member, and the second mounting member is provided with a hollow portion for irradiating the reflected laser beam to the surface of the workpiece.

In one embodiment, the laser milling apparatus further comprises an annular preform inserted into the through hole.

In one embodiment, the stage is used to place a workpiece to be ground, the stage is connected to a drive,

the workpiece is driven to rotate based on the driving device.

In one embodiment, the laser polishing apparatus further includes a measuring mechanism disposed on the side plate for measuring a surface of the workpiece.

In one embodiment, the laser polishing apparatus further includes a blowing device disposed on the side plate for blowing a cooling gas toward the surface of the workpiece.

Has the advantages that:

the laser grinding device provided by the application utilizes the laser refraction component to reflect laser emitted by the laser source and then focus on the surface of a workpiece to be processed by the laser refraction component, so that the workpiece with a large size can be covered, fine adjustment is performed on the basis that the original grinding component is not changed, the diameter of the workpiece which can be processed can cover workpiece grinding below 150mm, and the application range of the laser grinding device is widened.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic view of a polishing assembly of a conventional laser polishing apparatus;

FIG. 2 is a schematic view of a polishing assembly of a laser polishing apparatus according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a laser refraction assembly according to an embodiment of the present application;

fig. 4, 5 and 6 are schematic views of the workpiece polished by the laser refraction assembly of fig. 3 under different viewing angles.

Detailed Description

The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions employed in the examples may be further adjusted as determined by the particular manufacturer, and the conditions not specified are typically those used in routine experimentation.

The laser grinding apparatus according to the embodiment of the present application will be described in detail with reference to fig. 2 to 6.

The laser grinding device comprises a grinding component,

the grinding assembly includes: a gantry arm 600, the gantry arm 600 is fixed in a frame (not shown) of the laser grinding device through a gantry base 610,

the gantry arm 600 is provided at one side of the top thereof with a driving part 700 having an output end (not shown) connected to the side plate 710 through a connecting member, and the side plate 710 is rotated/extended to move in the Z direction based on the output end (e.g., a lead screw). The side plate 710 is provided with a laser refraction assembly 400. Preferably, the laser refraction assembly 400 is disposed below the side plate 710, and is used for receiving the light emitted from the laser light source and reflecting the light to the surface of the workpiece 300 to be processed.

The laser refraction assembly 400 includes a substrate 402, a ring-shaped pressing plate 402 disposed on the substrate, a through hole 402a formed inside the pressing plate 402, and a groove 402c formed between the pressing plate 402 and the substrate 402. The pressing plate 402 and the substrate 402 may be an integral structure or a separate structure.

A first mounting member 403 is disposed on one side of a substrate 402, a reflective sheet 401 is disposed on the first mounting member 403, an adjustment member 405 is connected to the reflective sheet 401, and the attitude of the reflective sheet 401 is adjusted by the adjustment member so as to reflect laser light incident from a through hole 402a of a pressing sheet 402 and irradiate the reflected laser beam 410 onto the surface of a workpiece 300. In one embodiment, a second mounting component 404 is disposed on the substrate 402 and is disposed on the same side as the first mounting component 403, and a hollow portion 404a is disposed on the second mounting component 404 for irradiating the reflected laser beam 410 and irradiating the surface of the workpiece. The first mounting member 403 is fixed to one side of the base plate 402 via connectors 406/407. In one embodiment, the adjustment connection 406/407 can adjust the attitude of the first mounting member 403 and thus the reflective sheet 401 (adjust the angle of the laser beam to the surface of the workpiece).

In this embodiment, the workpiece 300 is placed on the stage 310, the stage 310 is connected to a driving device, the driving device is a DD motor (direct drive motor) electrically connected to the control module, and the driving device is driven by the control module to rotate, so as to drive the workpiece 300 to rotate. During grinding, the workpiece 300 is driven to rotate by the driving of the object stage 310, and the focal point of the laser reflected by the laser refraction assembly 400 falls on the surface of the workpiece 300 to ablate the surface to realize laser grinding. The side plate 710 is raised or lowered by the driving of the driving part 700 to grind the workpiece in the z direction.

The driving device is disposed on the fixing portion 500, the fixing portion 500 is disposed on the stacked X-displacement module 620 and Y-displacement module 630, linear motors are disposed on the X-displacement module 620 and the Y-displacement module 630, respectively, and electrically connected to a control module (not shown), so that the stage is moved to a target position in the X/Y direction based on the driving of the control module.

When the laser grinding device operates, light emitted by the laser light source is refracted by the laser refraction assembly, and then the laser beam 410 irradiates the surface of the workpiece 300 to be processed. The laser carries out spiral ablation movement along the surface of the workpiece, so as to achieve the aim of continuous grinding. Through the design, the focus of the laser emitted by the laser source falls on the surface of the workpiece to be processed after the laser is reflected by the laser refraction component, so that the workpiece with large size can be covered, fine adjustment is carried out on the basis of not changing the original grinding component, the diameter of the workpiece which can be processed can cover less than 150mm, and the application range of the laser grinding device is widened.

In one embodiment, the side plate 710 further includes a measuring mechanism for measuring the surface of the workpiece 300 to measure the machining dimension. Preferably, the measuring mechanism comprises a light range finder which scans the height of the surface of the workpiece based on the instruction and feeds back the scanning information to the control module. Preferably, the optical distance meter comprises a 0.1 micron grating scale.

In one embodiment, the side plate 710 further includes a gas blowing device for blowing gas (e.g., cooling gas) toward the surface of the workpiece.

In the present application, the terms "upper", "lower", "inside", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

The above embodiments are merely illustrative of the technical concepts and features of the present application, and the purpose of the embodiments is to enable those skilled in the art to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made according to the spirit of the present application are intended to be covered by the scope of the present application.

Claims

1. A laser grinding apparatus, comprising: the grinding component is arranged on the grinding device,

the side plate is provided with a laser refraction assembly which is connected with the laser light source in a matching way and used for receiving and reflecting light emitted by the laser light source, so that the focus of the laser falls on the surface of a workpiece to be processed.

2. The laser grinding apparatus of claim 1,

the laser refraction assembly is connected with the cutting head component and is positioned on the lower side of the cutting head component.

3. Laser grinding apparatus according to claim 1 or 2,

the laser refraction assembly is positioned on the upper side of the workpiece to be processed.

4. Laser grinding apparatus according to claim 1 or 2,

the laser refraction assembly comprises a substrate, a through hole is arranged on the substrate,

5. A laser grinding apparatus according to claim 4,

an adjusting member is disposed on the first mounting member, the adjusting member is connected to the reflector plate, and the adjusting member is adjusted to finely adjust the posture of the reflector plate.

6. The laser grinding apparatus according to claim 4, further comprising a second mounting member disposed on the same side as the first mounting member, and a hollow portion is provided on the second mounting member to irradiate the reflected laser light to the surface of the workpiece.

7. The laser grinding apparatus of claim 4, wherein an annular preform is inserted into the through-hole.

8. The laser milling apparatus of claim 1, further comprising a stage,

the object stage is used for placing a workpiece to be ground and is connected to the driving device,

the workpiece is driven to rotate based on the driving device.

9. The laser grinding apparatus of claim 1, further comprising a measuring mechanism disposed on the side plate for measuring a surface of the workpiece.

10. The laser grinding apparatus as claimed in claim 1, further comprising a blowing means disposed on the side plate for blowing a cooling gas toward the surface of the workpiece.