CN101664894A - Polishing device and method of sapphire - Google Patents
Polishing device and method of sapphire Download PDFInfo
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- CN101664894A CN101664894A CN200910037054A CN200910037054A CN101664894A CN 101664894 A CN101664894 A CN 101664894A CN 200910037054 A CN200910037054 A CN 200910037054A CN 200910037054 A CN200910037054 A CN 200910037054A CN 101664894 A CN101664894 A CN 101664894A
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Abstract
The invention relates to polishing device and method of sapphire. The polishing device comprises a laser beam, a shoe plate, a worktable and a connecting piece, wherein the worktable is provided witha stepper motor driving the worktable to make X-direction movement and a stepper motor driving the worktable to make Y-direction movement, the connecting piece is fixed on the worktable, the shoe plate is arranged on the connecting piece, and a sapphire wafer to be polished is fixed on the shoe plate; the laser beam radiates to the sapphire wafer from the upward side of the sapphire wafer to be polished, and the stepper motor driving the worktable to make the X-direction movement and the stepper motor driving the worktable to make the Y-direction movement are respectively connected with a control device. The invention controls the X-direction movement and the Y-direction movement of a workpiece and the movement track of the workpiece relative to the laser beam by regulating the incident angle of the laser beam and controlling the worktable, thereby realizing the comprehensive scanning and polishing on the surface of the sapphire wafer. The invention can remove very little material, reduce and even eliminate the influence of heat on the sapphire material, thereby obtaining a polished surface with low surface roughness and low subsurface injury degree.
Description
Technical field
The present invention is a kind of sapphire burnishing device and finishing method thereof, and particularly a kind of burnishing device and finishing method thereof with ultraviolet laser polishing sapphire wafer belong to the innovative technology of sapphire burnishing device and finishing method thereof.
Background technology
Sapphire single-crystal is a kind of outstanding multifunctional material, has hardness height, fusing point height, characteristics such as light transmission is good, electrical insulating property is excellent, stable chemical performance.Aspect optics, sapphire single-crystal is with characteristics such as its good light transmittance and wearabilities and be used for the speculum window of high-energy laser, and simultaneously, it also is one of critical material of infrared guidance weapon.Aspect electronics, it can make the semi-conducting material of heteroepitaxial growth or the substrate of metal material, as is used for the epitaxial substrate of semiconductor silicon and the epitaxial substrate material of semiconductor GaN etc.As semiconductor substrate materials, the sapphire wafer surface quality directly influences epitaxial growth of semiconductor material quality, device performance parameter and finished product rate, so, how to guarantee that the sapphire surface quality becomes the key issue in the manufacturing technology field.Because sapphire single-crystal belongs to the trigonal system ionic crystals, be typical difficult processing hard brittle material.At present, sapphire mainly adopts methods such as machine glazed finish, chemically mechanical polishing to process, the contact finishing method that these are traditional, tend to produce problems such as brittle break in the removal process of material, often there are defectives such as surface scratch, pit and subsurface crackle in polishing back sapphire surface, chemically polishing surface also may occur polishing the mist spot, is difficult to obtain high-quality optical surface, and polishing efficiency and yield rate are low.
Summary of the invention
The objective of the invention is to consider the problems referred to above and a kind of sapphire burnishing device that significantly improves polishing efficiency and improve yield rate is provided.
Another object of the present invention is to provide a kind of finishing method of sapphire burnishing device simple to operation.
Technical scheme of the present invention is:
Sapphire burnishing device of the present invention, include laser beam, gripper shoe, workbench, drive workbench and make the stepper motor of directions X motion, drive workbench and make the stepper motor of Y direction motion, connector, it is made the stepper motor of directions X motion and drives the stepper motor that it does the motion of Y direction wherein to be equiped with driving on the workbench, connector is fixed on the workbench, gripper shoe is installed on the connector, polished sapphire wafer is fixed on the gripper shoe, laser beam is radiated on the sapphire wafer from the top of polished sapphire wafer, drives workbench and makes the stepper motor of directions X motion and drive workbench to make the stepper motor of Y direction motion and all be connected with control device.
Above-mentioned control device includes computer and driver, the control signal output of computer is connected with the control signal input of driver, the control signal output of driver with drive workbench and make the stepper motor of directions X motion and drive workbench to make the stepper motor of Y direction motion and be connected.
Above-mentioned polished sapphire wafer is placed on the gripper shoe by the workpiece setting element.
One end of above-mentioned gripper shoe is contained in connector by the articulated elements hinge, and the other end of gripper shoe is connected with connector by inclined angle regulating mechanism.
Above-mentioned inclined angle regulating mechanism is to make the connecting plate that circular arc type is regulated chute, and an end of connecting plate is fixed on the connector by fixture, and the set circular arc type of connecting plate is regulated chute and is provided with and the gripper shoe coupled fasteners.
Above-mentioned gripper shoe is accurate support plate; Workbench is a precision stage.
Above-mentioned laser beam is the pulsed ultraviolet light laser beam.
The wavelength of above-mentioned pulsed ultraviolet light laser beam is that 266～355nm, pulsewidth are more than or equal to 10ns; Above-mentioned fixing piece and securing member are threaded connector.
The finishing method of sapphire burnishing device of the present invention, it comprises the steps:
1) laser beam maintains static, and regulates the installation site of gripper shoe, and polished sapphire wafer is fixed on the gripper shoe, makes the incidence angle θ of laser beam reach setting value, realizes the surface of laser beam with different incidence angles scanning sapphire wafer;
2) setting the driving workbench in control device makes the stepper motor (7) of directions X motion and drives the kinematic parameter that workbench is made the stepper motor of Y direction motion, start the laser instrument that produces laser beam, make control device operation control program, control drives workbench and makes the stepper motor of directions X motion and drive workbench to make the stepper motor of Y direction motion by direction of setting and speed operation polishing process, sapphire wafer relative laser beam under the drive of workbench moves along desired trajectory, the polishing of realization area, by adjusting laser beam incidence angle θ and hot spot focus point position, realize main radiation of laser beam and trace removal sapphire wafer microscopic protrusions part, reduce the sapphire surface nao-and micro relief, obtain bright and clean polished surface.
Above-mentioned driving workbench is made the minimum step angle of the stepper motor of directions X motion and the stepper motor that the driving workbench is done the motion of Y direction smaller or equal to 0.09 °, and the minimum step that realizes moving is smaller or equal to 0.75 μ m; Driving workbench makes the stepper motor of directions X motion and drives workbench to make the kinematic parameter of the stepper motor of Y direction motion and comprise movement velocity, sequence of motion and the direction of motion.
The present invention is because by regulating the angle of sapphire wafer surface with respect to laser beam, the incidence angle of regulating laser beam; Thereby by the X of control workbench control workpiece, the motion of Y direction, the movement locus of the relative laser beam of control workpiece is realized comprehensive scanning polishing on sapphire wafer surface.The present invention adopts the method for pulsed ultraviolet light laser polishing sapphire wafer, its basic principle has to ultraviolet light for utilizing material that absorption coefficient and pulsed ultraviolet light single laser pulse peak power are higher preferably, the characteristics that the process heat affecting is little, after the sapphire surface of laser scanning radiation mainly absorbs photon energy by " single photon absorption " or modes such as " multi-photon absorptions ", its chemical bond interrupted or lattice structure destroyed, trace is removed the bossing of sapphire surface microcosmic, reduce the sapphire surface nao-and micro relief, obtain bright and clean polished surface.The present invention can realize that very the material of trace is removed, and can reduce even eliminate the influence of heat to sapphire material, obtains the polished surface of low surface roughness and sub-surface damage degree.In addition, owing to the polishing process laser beam maintains static, the sapphire workpiece motion s, therefore, laser system is easy to maintenance.The present invention is burnishing device and the finishing method thereof that a kind of contactless little ultraviolet laser of heat effect polishes sapphire wafer, and burnishing device of the present invention is reasonable in design, and function admirable is convenient and practical.Finishing method of the present invention is simple to operation.
Description of drawings
Fig. 1 is the structural representation of burnishing device of the present invention;
Fig. 2 is the control flow chart of control device of the present invention;
Fig. 3 is the trajectory diagram of pulsed ultraviolet light laser beam radiation scanning sapphire wafer of the present invention.
The specific embodiment
Embodiment:
The structural representation of sapphire burnishing device of the present invention as shown in Figure 1, include laser beam 1, gripper shoe 4, workbench 6, drive workbench 6 and make the stepper motor 7 of directions X motion, drive workbench 6 and make the stepper motor 8 of Y direction motion, connector 9, it is made the stepper motor 7 of directions X motion and drives the stepper motor 8 that it does the motion of Y direction wherein to be equiped with driving on the workbench 6, connector 9 is fixed on the workbench 6, gripper shoe 4 is installed on the connector 9, polished sapphire wafer 2 is fixed on the gripper shoe 4, laser beam 1 is radiated on the sapphire wafer 2 from the top of polished sapphire wafer 2, drives workbench 6 and makes the stepper motor 7 of directions X motion and drive workbench 6 to make the stepper motor 8 of Y direction motion and all be connected with control device.
In the present embodiment, above-mentioned control device includes computer 21 and driver 22, the control signal output of computer 21 is connected with the control signal input of driver 22, the control signal output of driver 22 with drive workbench 6 and make the stepper motor 7 of directions X motion and drive workbench 6 to make the stepper motor 8 of Y direction motion and be connected.
In the present embodiment, above-mentioned polished sapphire wafer 2 is placed on the gripper shoe 4 by workpiece setting element 3.One end of above-mentioned gripper shoe 4 is contained in connector 9 by articulated elements 5 hinges, and the other end of gripper shoe 4 is connected with connector 9 by inclined angle regulating mechanism 10.
In the present embodiment, above-mentioned inclined angle regulating mechanism 10 is regulated the connecting plate 13 of chute 12 for making circular arc type, one end of connecting plate 13 is fixed on the connector 9 by fixture 14, and connecting plate 13 set circular arc types are regulated chute 12 and are provided with and gripper shoe 4 coupled fasteners 11.
In the present embodiment, above-mentioned gripper shoe 4 is accurate support plate; Workbench 6 is a precision stage.
Because material has absorption coefficient preferably to ultraviolet light, and pulsed ultraviolet light single laser pulse peak power is higher, the process heat affecting is little, and in the present embodiment, above-mentioned laser beam 1 adopts the pulsed ultraviolet light laser beam.The wavelength of above-mentioned pulsed ultraviolet light laser beam is that 266～355nm, pulsewidth are more than or equal to 10ns; Above-mentioned fixing piece 14 and securing member 11 are threaded connector.
The finishing method of sapphire burnishing device of the present invention, it comprises the steps:
1) laser beam 1 maintains static, and regulates the installation site of gripper shoe 4, and polished sapphire wafer 2 is fixed on the gripper shoe 4, makes the incidence angle θ of laser beam 1 reach setting value, realizes the surface of laser beam 1 with different incidence angles scanning sapphire wafer 2;
2) setting driving workbench 6 in control device makes the stepper motor 7 of directions X motion and drives the kinematic parameter that workbench 6 is made the stepper motor 8 of Y direction motion, start the laser instrument that produces laser beam 1, make control device operation control program, control drives workbench 6 and makes the stepper motor 7 of directions X motion and drive workbench 6 to make the stepper motor 8 of Y direction motion by direction of setting and speed operation polishing process, sapphire wafer 2 under the drive of workbench 6 relatively laser beam 1 move along desired trajectory, the polishing of realization area, by adjusting laser beam incidence angle θ and hot spot focus point position, realize main radiation of laser beam and trace removal sapphire wafer 2 microscopic protrusions parts, reduce the sapphire surface nao-and micro relief, obtain bright and clean polished surface.In the present embodiment, drive workbench 6 and make the stepper motor 7 of directions X motion and drive workbench 6 to make the kinematic parameter of the stepper motor 8 of Y direction motion and comprise movement velocity, sequence of motion and the direction of motion.By computer 21 operation motion control program, movement instruction is passed to driver 22, move by direction of setting and speed by driver 22 control step motors 7,8.In the present embodiment, stepper motor 7,8 makes workbench 6 drive sapphire wafer 2 relative laser beams 1 by orbiting motion shown in Figure 3, to the surface finish of sapphire wafer 2.
In the present embodiment, above-mentioned driving workbench 6 is made the minimum step angle of the stepper motor 7 of directions X motion and the stepper motor 8 that driving workbench 6 is done the motion of Y direction smaller or equal to 0.09 °, and the minimum step that realizes moving is smaller or equal to 0.75 μ m.
Claims (10)
1, a kind of sapphire burnishing device, it is characterized in that including laser beam (1), gripper shoe (4), workbench (6), drive workbench (6) and make the stepper motor (7) of directions X motion, drive workbench (6) and make the stepper motor (8) of Y direction motion, connector (9), it is made the stepper motor (7) of directions X motion and drives the stepper motor (8) that it does the motion of Y direction wherein to be equiped with driving on the workbench (6), connector (9) is fixed on the workbench (6), gripper shoe (4) is installed on the connector (9), polished sapphire wafer (2) is fixed on the gripper shoe (4), laser beam (1) is radiated on the sapphire wafer (2) from the top of polished sapphire wafer (2), drives the stepper motor (7) that workbench (6) is done the directions X motion, the stepper motor (8) that driving workbench (6) is done the motion of Y direction all is connected with control device.
2, sapphire burnishing device according to claim 1, it is characterized in that above-mentioned control device includes computer (21) and driver (22), the control signal output of computer (21) is connected with the control signal input of driver (22), the control signal output of driver (22) with drive workbench (6) and make the stepper motor (7) of directions X motion and drive workbench (6) to make the stepper motor (8) of Y direction motion and be connected.
3, sapphire burnishing device according to claim 1 and 2 is characterized in that above-mentioned polished sapphire wafer (2) is placed on the gripper shoe (4) by workpiece setting element (3).
4, sapphire burnishing device according to claim 3, an end that it is characterized in that above-mentioned gripper shoe (4) is contained in connector (9) by articulated elements (5) hinge, and the other end of gripper shoe (4) is connected with connector (9) by inclined angle regulating mechanism (10).
5, sapphire burnishing device according to claim 4, it is characterized in that above-mentioned inclined angle regulating mechanism (10) is for making the connecting plate (13) of circular arc type adjusting chute (12), one end of connecting plate (13) is fixed on the connector (9) by fixture (14), and the set circular arc type of connecting plate (13) is regulated chute (12) and is provided with and gripper shoe (4) coupled fasteners (11).
6, sapphire burnishing device according to claim 5 is characterized in that above-mentioned gripper shoe (4) is accurate support plate; Workbench (6) is a precision stage.
7, sapphire burnishing device according to claim 6 is characterized in that above-mentioned laser beam (1) is the pulsed ultraviolet light laser beam.
8, sapphire burnishing device according to claim 7, the wavelength that it is characterized in that above-mentioned pulsed ultraviolet light laser beam are that 266～355nm, pulsewidth are more than or equal to 10ns; Above-mentioned fixing piece (14) and securing member (11) are threaded connector.
9, the finishing method of sapphire burnishing device according to claim 1 is characterized in that comprising the steps:
1) laser beam (1) maintains static, regulate the installation site of gripper shoe (4), polished sapphire wafer (2) is fixed on the gripper shoe (4), make the incidence angle θ of laser beam (1) reach setting value, realize the surface of laser beam (1) with different incidence angles scanning sapphire wafer (2);
2) setting driving workbench (6) in control device makes the stepper motor (7) of directions X motion and drives the kinematic parameter that workbench (6) is made the stepper motor (8) of Y direction motion, start the laser instrument that produces laser beam (1), make control device operation control program, control drives workbench (6) and makes the stepper motor (7) of directions X motion and drive workbench (6) to make the stepper motor (8) of Y direction motion by direction of setting and speed operation polishing process, sapphire wafer (2) relative laser beam (1) under the drive of workbench (6) moves along desired trajectory, the polishing of realization area, by adjusting laser beam incidence angle θ and hot spot focus point position, realize main radiation of laser beam and trace removal sapphire wafer (2) microscopic protrusions part, reduce the sapphire surface nao-and micro relief, obtain bright and clean polished surface.
10, the finishing method of sapphire burnishing device according to claim 9, it is characterized in that above-mentioned driving workbench (6) makes the stepper motor (7) of directions X motion and drive the minimum step angle of stepper motor (8) that workbench (6) does the motion of Y direction smaller or equal to 0.09 °, the minimum step that realizes moving is smaller or equal to 0.75 μ m; Driving workbench (6) makes the stepper motor (7) of directions X motion and drives workbench (6) to make the kinematic parameter of the stepper motor (8) of Y direction motion and comprise movement velocity, sequence of motion and the direction of motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100370544A CN101664894B (en) | 2009-02-03 | 2009-02-03 | Polishing device and method of sapphire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100370544A CN101664894B (en) | 2009-02-03 | 2009-02-03 | Polishing device and method of sapphire |
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| CN101664894A true CN101664894A (en) | 2010-03-10 |
| CN101664894B CN101664894B (en) | 2011-11-09 |
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| CN2009100370544A Expired - Fee Related CN101664894B (en) | 2009-02-03 | 2009-02-03 | Polishing device and method of sapphire |
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| CN108326432A (en) * | 2018-03-08 | 2018-07-27 | 北京工业大学 | A kind of laser polishing device and method of SLM moldings TC4 alloys |
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| CN109604833A (en) * | 2018-11-26 | 2019-04-12 | 国宏中晶集团有限公司 | A kind of sapphire device and method of ultraviolet laser polishing |
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| CN201357289Y (en) * | 2009-02-03 | 2009-12-09 | 广东工业大学 | Sapphire polishing device |
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| WO2018086148A1 (en) * | 2016-11-11 | 2018-05-17 | 北京工业大学 | Tooling jig, device and method for processing cutting edge of cutter |
| CN108326432A (en) * | 2018-03-08 | 2018-07-27 | 北京工业大学 | A kind of laser polishing device and method of SLM moldings TC4 alloys |
| CN108890138A (en) * | 2018-07-17 | 2018-11-27 | 西安交通大学 | A kind of ultrafast laser polishing processing method for ceramic matric composite |
| CN109604833A (en) * | 2018-11-26 | 2019-04-12 | 国宏中晶集团有限公司 | A kind of sapphire device and method of ultraviolet laser polishing |
| CN109604833B (en) * | 2018-11-26 | 2021-07-23 | 国宏中晶集团有限公司 | Device and method for polishing sapphire by ultraviolet laser |
| CN109693039A (en) * | 2018-12-27 | 2019-04-30 | 北京航空航天大学 | A kind of method of silicon chip surface laser polishing |
| CN112059422A (en) * | 2020-09-12 | 2020-12-11 | 北京航空航天大学 | Laser processing equipment for grinding semiconductor wafer |
| CN117483957A (en) * | 2023-12-06 | 2024-02-02 | 佛山市顺德区嘉林精密机械有限公司 | Laser polishing machine and polishing method using same |
| CN118003227A (en) * | 2024-04-10 | 2024-05-10 | 佛山市高明贝斯特陶瓷有限公司 | Ceramic polishing equipment |
| CN118003227B (en) * | 2024-04-10 | 2024-06-04 | 佛山市高明贝斯特陶瓷有限公司 | Ceramic polishing equipment |
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