CN218395113U - Chip detecting and cleaning equipment utilizing dry ice and snow - Google Patents

Abstract

The utility model provides a chip detecting and cleaning device using dry ice and snow, which comprises a lower frame, wherein the lower frame is covered with an upper frame, and the upper frame is provided with a human-computer interaction interface and an air purifying device which is used for inflating the interior of the upper frame; the opposite two sides of the lower frame are provided with a feeding mechanism and a discharging mechanism; be equipped with portal frame and the conveying mechanism who is located the frame above the lower carriage, install camera, preliminary examination system, dry ice snow clearance system, reinspection system in proper order from feed mechanism to unloading mechanism direction on the portal frame, the conveying mechanism both ends link up with feed mechanism, unloading mechanism and are used for carrying the chip support plate, camera, preliminary examination system, dry ice snow clearance system, reinspection system are located conveying mechanism's top. Compare with current surface granule clearance scheme in the trade, the utility model discloses it is efficient, can thoroughly clear away the granule on chip surface, and fault rate and product damage rate are low.

Description

Chip detection and cleaning equipment utilizing dry ice and snow

Technical Field

The utility model relates to a chip surface dust removes equipment technical field, concretely relates to utilize chip detection and cleaning equipment of dry ice and snow.

Background

The development of semiconductors has increasingly high dust-free requirements on silicon material products such as electronic chips, optical filters and the like. Taking a mobile phone camera as an example, the resolution is higher and higher along with the demand, wherein the surface defects of an image sensor (CMOS chip) can restrict the performance of the whole camera module. If the image sensor has tiny defects (such as dust, dead spots and the like), the photographing function can be greatly influenced, for example, the photographing effect of 4-9 pixels around the dust with 1um can be influenced on products with 6400 ten thousand pixels. ( Note: the pixel is abbreviated as px, which is a pixel unit, and is also a basic unit for image display, and is translated from "pixel". )

The detection of surface defects of the above form is currently carried out: before packaging, the packaging is mainly detected by a microscope manually and then cleaned manually. However, the method has high difficulty in detecting um-level defects, and the detection work can be completed only by adopting 30-40 times of magnifying glasses for alignment imaging, so that the detection efficiency and the detection precision are low, and the development requirement of a high-end production line is difficult to meet; at present, a single-station detection platform is adopted in the industry for detection, the efficiency is low, equipment needs to return to the previous AOI station for rechecking when rechecking is carried out, and the efficiency is seriously influenced.

In the process of removing surface particles, the following modes are basically adopted in the industry: and (3) adopting an ion wind suction and blowing mode, carrying out dust adhesion by using a dust adhesion rod, and adhering dust by using a red glue mode. When the ion wind blows, some particles attached to the surface of the chip cannot be removed. When dust and sticky dust are treated, the sticky dust rod is easy to cause secondary damage and pollution to the chip when descending the sticky dust treatment because of the position error of the sticky dust rod and the chip, and the chip is extremely fragile and easy to break once the surface is subjected to external force, so that irreversible damage is brought.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides a chip washs and check out test set, solves chip surface cleaning sometimes unable thorough cleaning, sometimes very easily causes the problem of secondary injury and pollution to the chip to it is efficient, can thoroughly clean chip surface.

The utility model provides an above-mentioned technical problem's technical scheme as follows:

the utility model provides a chip detection and cleaning device utilizing dry ice and snow, which comprises a lower frame, wherein the lower frame is covered with an upper frame, and the upper frame is provided with a human-computer interaction interface and an air purification device which is inflated into the upper frame; the opposite two sides of the lower frame are provided with a feeding mechanism and a discharging mechanism; be equipped with portal frame and the conveying mechanism who is located the frame above the lower carriage, install camera, preliminary examination system, dry ice snow clearance system, reinspection system in proper order from feed mechanism to unloading mechanism direction on the portal frame, the conveying mechanism both ends link up with feed mechanism, unloading mechanism and are used for carrying the chip support plate, camera, preliminary examination system, dry ice snow clearance system, reinspection system are located conveying mechanism's top.

The utility model has the advantages that: the utility model discloses utilize CO2 nontoxic harmless, low temperature production dry ice snow during the blowout, its dry ice snow is the characteristics of flexibility, inertia, can not take place any reaction with the product and do not harm the product, compare with the present surface particle clearance scheme in the trade, the utility model discloses it is efficient, can thoroughly clear away the granule on chip surface, and fault rate and product damage rate are low. The cleaning effect of the CO2 snow jet on striking a surface is mainly based on four mechanisms of action: 1. the impurities are embrittled by rapid cooling (sublimation point of CO2 snow at atmospheric pressure: 78.5 ℃); 2. abrasion by momentum transfer (accelerated CO2 snow crystals transfer pressure and shear forces when hitting the surface); 3. chemical dissolution of impurities such as adsorption compounds (CO 2 can be converted to a supercritical state during impact of CO2 snow crystals on the surface; in this state CO2 is a good chemical solvent); 4. as CO2 sublimes from the solid phase to the gas phase, impurities are thrown away by the volume increase (about 500 times).

Further, the method comprises the following steps: the dry ice snow removing system comprises a mounting frame arranged on the portal frame and a nozzle vertically arranged downwards and arranged on the mounting frame, and a compressed air inlet and a carbon dioxide inlet are formed in the inlet of the nozzle.

The beneficial effect of adopting this further scheme lies in: the device generates uniform free dry ice snow jet flow for cleaning the surface of the chip, has high cleaning efficiency and can not generate secondary damage and pollution.

Furthermore, a dust hood is arranged around the nozzle, and a dust suction outlet is arranged on the dust hood.

The beneficial effect of adopting this further scheme lies in: the suction of expanded dry ice snow is facilitated, so that the gas with impurities leaves the chip quickly, the floating to other chips is avoided, the cleaning efficiency is improved, the dust suction outlet can be used for communicating a fan outside the rack or outside the rack, and the dry ice snow is sucked out quickly by utilizing the positive pressure in the rack.

Furthermore, the device also comprises a control cabinet for controlling the pressure of the compressed air and the pressure of the carbon dioxide, and the outlet end of the control cabinet is respectively connected with the compressed air inlet and the carbon dioxide inlet.

The beneficial effect of adopting this further scheme lies in: and the centralized control is convenient.

Further, the method comprises the following steps: the conveying mechanism comprises a first guide rail which is fixed on the lower rack and faces the feeding mechanism and the discharging mechanism, a first sliding block is connected onto the first guide rail in a sliding mode, a second guide rail which is perpendicular to the first guide rail and is horizontally arranged is arranged on the first sliding block, a second sliding block is connected onto the second guide rail in a sliding mode, the first sliding block is connected with a first driving mechanism which drives the first sliding block to move along the first guide rail, the second sliding block is connected with a second driving mechanism which drives the second sliding block to move along the second guide rail, and a clamping assembly used for clamping the chip carrier plate is arranged on the second sliding block.

The beneficial effect of adopting this further scheme lies in: the full-plane movement of the chip carrier plate is realized, the chip can be detected and the defects can be cleaned just, and the cleaning efficiency is high.

Further, the first driving mechanism and the second driving mechanism are linear motors.

The beneficial effect of adopting this further scheme lies in: the vibration is little to linear electric motor is provided with dustless chain of taking off in order to walk the line, prevents the inside dust that produces of frame, and inside is clean, avoids polluting the chip.

Furthermore, the clamping assembly comprises a plurality of supporting shafts and two covers, the supporting shafts can rotate around the axes of the supporting shafts, the axes of the supporting shafts are perpendicular to the first guide rail, a plurality of supporting shafts which are arranged in a row along the extending direction of the first guide rail are arranged on two side walls of the second sliding block which is parallel to the first guide rail, the covers are respectively arranged on the two side walls of the second sliding block which is parallel to the first guide rail, the upper surface of the second sliding block between the two covers is used for bearing the chip carrier plate, and a gap for clamping the chip carrier plate is formed between the inner side surfaces of the top plates of the two covers and the supporting shafts.

The beneficial effect of adopting this further scheme lies in: the gap between the edge of the cover and the supporting shaft is used for placing the chip carrier plate, the chip carrier plate is easy to feed and discharge, and the chip carrier plate cannot move under the action of air flow when the dry ice snow is cleaned.

Furthermore, the clamping assembly further comprises a driving shaft and a driving motor, the driving shaft and the driving motor are both installed on the second sliding block, the driving shaft is perpendicular to the supporting shafts, the driving shaft is connected with the driving motor through a belt, and the driving shaft is linked with each supporting shaft.

The beneficial effect of adopting this further scheme lies in: when the supporting shaft rotates, the chip carrier plate can be conveyed into the gap for auxiliary feeding or conveyed out of the gap for auxiliary discharging, and the feeding and discharging processes are convenient and fast.

Furthermore, each support shaft is provided with a magnetic wheel which is mutually fitted with the opposite position of the drive shaft, and the drive wheel is linked with each support shaft through the magnetic wheel.

The beneficial effect of adopting this further scheme lies in: the magnetic wheel is adopted, so that the vibration is small during transmission, and no dust is generated.

Furthermore, an exhaust pipe is further arranged on the second sliding block, the exhaust pipe is communicated with the inner space of the cover from the lower part of the cover, and the other end of the exhaust pipe is communicated with the outer part of the upper frame.

The beneficial effect of adopting this further scheme lies in: by utilizing the positive pressure environment in the frame, the gas in the cover can be directly led out of the frame, the driving motor, the driving shaft and the like are placed to rotate to generate dust, the internal environment of the frame is kept clean, and secondary pollution to the chip is prevented. The exhaust tube can also be connected with an external air pump, so that the air exhaust efficiency is improved.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a general view of the structure of the apparatus of the present invention.

Figure 3 is a schematic illustration of the installation of the dry ice snow removal system.

Fig. 4 is a schematic structural view of a dry ice snow removing system.

Fig. 5 is a schematic plan view of the conveyance mechanism.

Fig. 6 is a schematic forward view of the conveying mechanism.

Fig. 7 is a schematic structural view of the second slider.

Fig. 8 is a schematic structural view of the clamping assembly.

In the drawings, the technical features represented by the respective reference numerals are as follows:

1, lower rack; 2, mounting a frame; 3-a feeding mechanism; 4-a blanking mechanism; 5-an air purification device; 6-human-computer interaction interface; 7-a portal frame; 8-a conveying mechanism; 801-a first guide rail; 802-a first slider; 803-a second guide rail; 804-a second slider; 805-a first drive mechanism; 806-a second drive mechanism; 807-a clamping assembly; 808-supporting the shaft; 809-a drive shaft; 810 driving a motor; 811-cover; 812-a magnetic wheel; 813-a suction pipe; 9-CCD camera; 10-initial inspection of AOI system; 11-a dry ice snow removal system; 111-a nozzle; 112-a mounting frame; 113-compressed air inlet; 114-carbon dioxide inlet; 115-dust hood; 116-a dust extraction outlet; 117-control cabinet; 12-recheck AOI system; 20-chip carrier plate.

Detailed Description

The following description is made for the purpose of illustrating the principles and features of the present invention, and is not intended to limit the scope of the invention.

The utility model is shown in figures 1-8.

Embodiment one, as shown in fig. 1-2:

the utility model provides a chip detecting and cleaning device using dry ice and snow, which comprises a lower frame 1, wherein the lower frame 1 is covered with an upper frame 2, the upper frame 2 is provided with a human-computer interaction interface 6 and an air purifying device 5 which is used for inflating the interior of the upper frame 2; a feeding mechanism 3 and a discharging mechanism 4 are arranged on two opposite sides of the lower rack 1; be equipped with portal frame 7 and conveying mechanism 8 that are located the frame above the lower frame 1, install camera 9, preliminary examination system 10, dry ice snow clearance system 11, recheck system 12 in proper order from feed mechanism 3 to 4 directions of unloading mechanism on the portal frame 7, conveying mechanism 8 both ends link up with feed mechanism 3, unloading mechanism 4 and are used for carrying chip support plate 20, camera 9, preliminary examination system 10, dry ice snow clearance system 11, recheck system 12 are located conveying mechanism 8's top.

The principle is as follows: the feeding mechanism 3 is used for providing the chip carrier 20 to the conveying mechanism 8, after the detection and the cleaning are completed, the conveying mechanism 8 conveys the chip carrier 20 to a joint with the blanking mechanism 4, and the blanking mechanism is used for blanking the chip carrier 20 on the conveying mechanism 8. When the conveying mechanism 8 obtains the chip carrier plate 20, the CCD camera 9 is firstly used for photographing to determine the position and the coordinate of the chip, then the conveying mechanism 8 passes through the primary inspection AOI system 10, each chip is sequentially arranged under the primary inspection AOI system 10 to detect the defects such as dust, stain, fingerprint and the like and the position of the defects, then the conveying mechanism 8 passes through the dry ice snow clearing system 11, the dry ice snow clearing system 11 generates snow jet flow to clean the surface of the chip when spraying carbon dioxide, and finally the conveying mechanism 8 passes through the secondary inspection AOI system 12 to detect and determine the defects to be cleaned, and then the conveying mechanism 8 conveys the chip carrier plate 20 to the joint with the blanking mechanism 4.

Explanation of the above technical features:

air purification device 5, in this embodiment, air purification device 5 is FFU fan filter unit, locates 2 tops of frame, and its effect is for continuously providing clean air to frame inner space, makes and maintains the malleation in the frame, and outside dust air can't get into, maintains inside clean environment.

The camera 9, in this embodiment, the CCD camera 9 is used, and the CCD is a short term charge coupled device (charge coupled device), which can convert light rays into charges, store and transfer the charges, and also can take out the stored charges to change the voltage, so that the CCD camera 9 is an ideal CCD camera 9 element, and the CCD camera 9 formed by the CCD camera 9 has the characteristics of small volume, light weight, no influence of a magnetic field, and vibration and impact resistance, and is widely used. Therefore, the utility model discloses in, can shoot and obtain the position and the coordinate of chip through software processing.

The primary inspection system 10 and the secondary inspection system 12 are, in the embodiment of this market, the same AOI detection system/device, and the principle of the AOI detection device is as follows: during automatic detection, the AOI detection equipment automatically scans products through a CCD high-definition camera, collects images, compares the detected points with qualified parameters in a database, detects defects on target products through image processing, and displays/marks the defects through a display or an automatic mark. The general flow of the AOI inspection equipment is the same, mostly by pattern recognition. That is, the standard digitized image stored in the AOI system is compared with the actually detected image, thereby obtaining the detection result.

Dry ice snow removal system 11, a device for generating a jet of CO2 snow, a CO2 dry ice snow system, which has proven useful in practice for gently cleaning surfaces, such as workpiece surfaces or functional surfaces in the semiconductor industry and medical technology, prior to a painting or coating process. In particular, the surface cleaning by means of CO2 snow jets (so-called "CO2 snow jets") makes it possible to remove film-like or particle-like contaminants (e.g. dust, ablation residues, cutting emulsion residues, fingerprints, etc.) in a dry (water-free), solvent-free and residue-free manner.

Feed mechanism 3, unloading mechanism 4: patent documents issued on 9/8/2020: CN 211443926U-an assembly line transfer device capable of realizing on-line and off-line switching can be used as the feeding mechanism 3 and the discharging mechanism 4 of the application. The specific combination of the above can be understood by those skilled in the art from the contents of the present application and the patent document. It should be noted that, the technical problem solved by the present application is to implement thorough cleaning when cleaning the surface of the chip, and no secondary damage and pollution are caused, so the specific feeding and discharging manner is not necessary for the present application, and those skilled in the art can easily understand that other existing manners, such as manual feeding and discharging, can also be adopted for feeding and discharging.

Adopt the beneficial effects of the utility model are that: the utility model discloses utilize CO2 nontoxic harmless, low temperature production dry ice snow during the blowout, its dry ice snow is the characteristics of flexibility, inertia, can not take place any reaction and do not harm the product with the product, compare with the present surface particle clearance scheme in the trade, the utility model discloses it is efficient, can thoroughly clear away the granule on chip surface, and fault rate and product damage rate are low. The cleaning effect of the CO2 snow jet on striking a surface is mainly based on four mechanisms of action: 1. embrittling the impurities by rapid cooling (sublimation point of CO2 snow at atmospheric pressure: 78.5 ℃); 2. abrasion by momentum transfer (accelerated CO2 snow crystals transfer pressure and shear forces when hitting the surface); 3. chemical dissolution of impurities such as adsorption compounds (CO 2 can be transformed into supercritical state during impact of CO2 snow crystals on the surface; CO2 is a good chemical solvent in this state); 4. as CO2 sublimes from the solid phase to the gas phase, impurities are thrown away by the volume increase (about 500 times).

Example two, as shown in fig. 3-4:

in the above embodiment, further:

the dry ice and snow removing system 11 comprises a mounting frame 112 installed on the portal frame 7, and a nozzle 111 vertically arranged downwards and installed on the mounting frame 112, wherein a compressed air inlet 113 and a carbon dioxide inlet 114 are arranged at the inlet of the nozzle 111.

The principle is as follows: the liquid CO2 is converted by a thermodynamic process into compacted solid CO2 snow particles having a diameter of 1 to 100 μm. The temperature of these CO2 snow particles from dry ice was-78.5 ℃. Carbon dioxide snow particles are added to the compressed air, the particles being accelerated by the compressed air flow in the nozzle 111. Under constant flow, temperature and pressure conditions, a uniform free jet can be produced. According to the nozzle 111, a circular jet (circular nozzle 111) having a cleaning ability, a flat jet (flat nozzle 111) having a width of 45 mm and a uniform cleaning performance can be generated. Such a free jet can be used for cleaning and pre-treating the surface of a workpiece.

The beneficial effect of adopting this further scheme lies in: the device generates uniform free dry ice snow jet flow for cleaning the surface of the chip, has high cleaning efficiency and can not generate secondary damage and pollution.

Furthermore, a dust hood 115 is further disposed around the nozzle 111, and a dust suction outlet 116 is disposed on the dust hood 115.

The beneficial effect of adopting this further scheme lies in: the expanded dry ice snow is sucked out conveniently, so that the gas with impurities leaves the chip quickly, the chip is prevented from floating to other chips, the cleaning efficiency is improved, the dust suction outlet 116 can be used for communicating a fan outside the rack or the outside, and the dry ice snow is sucked out quickly by utilizing the positive pressure in the rack.

Further, a control cabinet 117 for controlling the pressure of the compressed air and the pressure of the carbon dioxide is further included, and the outlet ends of the control cabinet 117 are respectively connected with the compressed air inlet 113 and the carbon dioxide inlet 114.

Note: the control cabinet 117 is used for controlling the pressure of the compressed air and the carbon dioxide, which is equivalent to centralizing the valves on the two pipelines on one cabinet body. The control cabinet will necessarily have corresponding inlets and outlets, which outlet will be readily understood by those skilled in the art.

The beneficial effect of adopting this further scheme lies in: and the centralized control is convenient.

Example three, as shown in fig. 5-8:

in the above embodiment, further:

the conveying mechanism 8 comprises a first guide rail 801 fixed on the lower frame 1 and facing the feeding mechanism 3 and the discharging mechanism 4, a first sliding block 802 is connected onto the first guide rail 801 in a sliding manner, a second guide rail 803 which is perpendicular to the first guide rail 801 and is horizontally arranged is arranged on the first sliding block 802, a second sliding block 804 is connected onto the second guide rail 803 in a sliding manner, the first sliding block 802 is connected with a first driving mechanism 805 which drives the first sliding block to move along the first guide rail 801, the second sliding block 804 is connected with a second driving mechanism 806 which drives the second sliding block to move along the second guide rail 803, and a clamping assembly 807 for clamping the chip carrier plate 20 is arranged on the second sliding block 804.

The principle is as follows: the chip carrier plate 20 is conveyed to move transversely and longitudinally through the first guide rail 801 and the second guide rail 803, each chip can be moved to the lower part of the AOI system for detection, and the defect is just opposite to the dry ice and snow removing system 11. In addition, motor screw drives can be adopted between the lower frame 1 and the first sliding block 802 and between the first sliding block 802 and the second sliding block 804.

The beneficial effect of adopting this further scheme lies in: the full-plane movement of the chip carrier plate 20 is realized, the chip detection and defect cleaning can be performed just right, and the cleaning efficiency is high.

Further, the first driving mechanism 805 and the second driving mechanism 806 are linear motors.

The beneficial effect of adopting this further scheme lies in: the vibration is little to linear electric motor is provided with dustless chain of taking off in order to walk the line, prevents the inside dust that produces of frame, and inside is clean, avoids polluting the chip.

Further, the clamping assembly 807 includes a plurality of support shafts 808 and two covers 811, the support shafts 808 can rotate around their axes and the axes are perpendicular to the first guide rail 801, two side walls of the second slider 804 parallel to the first guide rail 801 are both provided with a plurality of support shafts 808 arranged in a row along the extending direction of the first guide rail 801, two side walls of the second slider 804 parallel to the first guide rail 801 are respectively provided with a cover 811, the upper surface of the second slider 804 between the two covers 811 is used for bearing the chip carrier board 20, and a gap for clamping the chip carrier board 20 is formed between the inner side surfaces of the top plates 811 of the two covers and the support shafts 808.

The beneficial effect of adopting this further scheme lies in: the gap between the edge of the cover 811 and the support shaft 808 is used for placing the chip carrier 20, loading and unloading of the chip carrier 20 are easy, and the chip carrier 20 is not moved by the air flow during dry ice and snow cleaning.

Further, the clamping assembly 807 further comprises a driving shaft 809 and a driving motor 810, the driving shaft 809 and the driving motor 810 are both mounted on the second sliding block 804, the driving shaft 809 is perpendicular to the supporting shafts 808, the driving shaft 809 is connected with the driving motor 810 through a belt, and the driving shaft 809 is linked with each supporting shaft 808.

The beneficial effect of adopting this further scheme lies in: when the supporting shaft 808 rotates, the chip carrier plate 20 can be conveyed into the gap for auxiliary feeding or conveyed out of the gap for auxiliary discharging, and the feeding and discharging processes are convenient and fast.

Further, each of the support shafts 808 is provided with a magnetic wheel 812 fitted to each other at a position facing the drive shaft 809, and the drive wheel is linked with each of the support shafts 808 through the magnetic wheel 812.

The beneficial effect of adopting this further scheme lies in: the magnetic wheel 812 has small vibration during transmission and does not generate dust.

Furthermore, an air exhaust pipe 813 is further arranged on the second sliding block 804, the air exhaust pipe 813 is communicated with the inner space of the cover 811 from the lower part of the cover 811, and the other end of the air exhaust pipe 813 is communicated with the outside of the upper frame 2.

The beneficial effect of adopting this further scheme lies in: by utilizing the positive pressure environment in the rack, the air in the cover 811 can be directly introduced out of the rack, the driving motor 810, the driving shaft 809 and the like are placed to rotate to generate dust, the internal environment of the rack is kept clean, and the secondary pollution to the chip is prevented. The air exhaust pipe 813 can be connected with an external air exhaust pump to improve air exhaust efficiency.

In the description of the present invention, it should be understood that if descriptive terms indicating orientation, direction, or positional relationship are present, for example: "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, the positional or positional relationships indicated in this specification are based on the positional or positional relationships shown in the drawings, and are only for convenience of understanding the invention and to simplify the description, and do not indicate or imply that the parts, elements, or the whole referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Additionally, if ordinal descriptive terms appear, for example: the use of "first", "second", etc. in this specification is for ease of understanding or to simplify the description, e.g., to distinguish between technical features of the same type or function and which have to be mentioned separately, where the specification may distinguish between terms in a prefix or suffix order. Therefore, it is not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present invention, if structural relative action relation description terms are used, for example: "mounted," "connected," "secured," and the like are to be construed broadly unless expressly stated or limited otherwise. For example, "mounted," "connected," and the like, may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; the two elements can be directly connected or indirectly connected through an intermediate medium, and the two elements are communicated with each other or in an interaction relationship; the fixation can be an integrated fixation, and can also be a detachable fixation through a fastener; the fixing can be direct or through an intermediate medium. The meaning of the above description terms in the present invention can be understood by those skilled in the art according to the specific situation, the present context, the text continuity before and after, and the like.

In the present application, if a descriptive phrase containing an attached or connected meaning is presented, for example, a first feature is "on" or "under" a second feature unless explicitly stated or limited otherwise, it should not be read restrictively, for example, "on" or "under" may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediate medium. The meaning of the above description terms in the present invention can be understood by those skilled in the art according to the specific situation, the present context, the text continuity before and after, and the like.

Further, the first feature "on," "above" and "over" the second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, the various embodiments, examples, and features of the various embodiments, examples, and combinations described in this specification are capable of combinations and subcombinations by those of skill in the art without departing from the scope of the invention as defined by the claims.

While embodiments of the present invention have been shown and described, it is understood that they have been presented by way of example only, and not limitation, and that various changes, modifications, substitutions and alterations can be made herein by those skilled in the art in light of the teaching contained herein without departing from the scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides an utilize chip detection and cleaning equipment of dry ice and snow which characterized in that: the air purifier comprises a lower rack (1), wherein an upper rack (2) covers the lower rack (1), and the upper rack (2) is provided with a human-computer interaction interface (6) and an air purification device (5) for inflating air into the upper rack (2); the opposite two sides of the lower rack (1) are provided with a feeding mechanism (3) and a discharging mechanism (4); be equipped with portal frame (7) and conveying mechanism (8) that are located the frame above lower frame (1), install camera (9), just examine system (10), dry ice snow clearance system (11), recheck system (12) from feed mechanism (3) to unloading mechanism (4) direction in proper order on portal frame (7), conveying mechanism (8) both ends link up with feed mechanism (3), unloading mechanism (4) and are used for carrying chip support plate (20), camera (9), just examine system (10), snow clearance system (11), dry ice recheck system (12) and be located the top of conveying mechanism (8).

2. The chip detecting and cleaning apparatus using dry ice and snow according to claim 1, characterized in that: the dry ice and snow removing system (11) comprises a mounting frame (112) arranged on a portal frame (7), and a nozzle (111) vertically arranged downwards and arranged on the mounting frame (112), wherein a compressed air inlet (113) and a carbon dioxide inlet (114) are formed at the inlet of the nozzle (111).

3. The chip detecting and cleaning apparatus using dry ice snow according to claim 2, characterized in that: a dust hood (115) is further arranged around the nozzle (111), and a dust suction outlet (116) is formed in the dust hood (115).

4. The chip detecting and cleaning apparatus using dry ice and snow according to claim 2, characterized in that: the device also comprises a control cabinet (117) used for controlling the pressure of the compressed air and the pressure of the carbon dioxide, and the outlet end of the control cabinet (117) is respectively connected with the compressed air inlet (113) and the carbon dioxide inlet (114).

5. The chip detecting and cleaning apparatus using dry ice and snow according to claim 1, characterized in that: conveying mechanism (8) including being fixed in on lower frame (1) and towards feed mechanism (3), first guide rail (801) of unloading mechanism (4), sliding connection has first slider (802) on first guide rail (801), be equipped with second guide rail (803) perpendicular to first guide rail (801) and horizontal arrangement on first slider (802), sliding connection has second slider (804) on second guide rail (803), first slider (802) are connected with drive self along first drive mechanism (805) of first guide rail (801) motion, second slider (804) are connected with drive self along second drive mechanism (806) of second guide rail (803) motion, be equipped with centre gripping subassembly (807) that are used for centre gripping chip carrier plate (20) on second slider (804).

6. The chip detecting and cleaning apparatus using dry ice and snow according to claim 5, characterized in that: the first driving mechanism (805) and the second driving mechanism (806) are linear motors.

7. The chip detecting and cleaning apparatus using dry ice and snow according to claim 5, characterized in that: the clamping assembly (807) comprises a plurality of supporting shafts (808) and two covers (811), the supporting shafts (808) can rotate around the axis of the supporting shafts (808), the axis of the supporting shafts is perpendicular to the first guide rail (801) and is arranged, a plurality of supporting shafts (808) which are arranged in a row along the extending direction of the first guide rail (801) are arranged on two parallel side walls of the second sliding block (804) and the first guide rail (801), the covers (811) are respectively arranged on the two parallel side walls of the second sliding block (804) and the first guide rail (801), the upper surface of the second sliding block (804) between the two covers (811) is used for bearing the chip carrier plate (20), and a gap for clamping the chip carrier plate (20) is formed between the inner side surfaces of top plates of the two covers (811) and the supporting shafts (808).

8. The chip detecting and cleaning apparatus using dry ice and snow according to claim 7, wherein: the clamping assembly (807) further comprises a driving shaft (809) and a driving motor (810), the driving shaft (809) and the driving motor (810) are both installed on the second sliding block (804), the driving shaft (809) is perpendicular to the supporting shafts (808), the driving shaft (809) is connected with the driving motor (810) through a belt, and the driving shaft (809) is linked with each supporting shaft (808).

9. The chip detecting and cleaning apparatus using dry ice snow according to claim 8, characterized in that: each support shaft (808) is provided with a magnetic wheel (812) which is mutually fitted with the opposite part of the drive shaft (809), and the drive wheel is linked with each support shaft (808) through the magnetic wheel (812).

10. The chip detecting and cleaning apparatus using dry ice snow according to claim 7, characterized in that: an air exhaust pipe (813) is further arranged on the second sliding block (804), the air exhaust pipe (813) is communicated with the inner space of the cover (811) from the lower side of the cover (811), and the other end of the air exhaust pipe (813) is communicated with the outside of the upper rack (2).

Images