CN218385157U

CN218385157U - Wafer reversing device

Info

Publication number: CN218385157U
Application number: CN202222848908.0U
Authority: CN
Inventors: 姚世杰; 蒋同洋
Original assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Current assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-01-24
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses a wafer device of falling piece, including material loading slide glass platform, unloading slide glass platform, transfer mechanism and centering mechanism. The loading slide platform bears a gum production sheet frame, and a wafer is placed on the gum production sheet frame; the blanking slide glass platform bears the baking slide glass rack; the transfer mechanism is used for acquiring the wafer on the back adhesive production rack, moving the wafer to the centering mechanism for centering, and then transferring the wafer to the baking rack. The utility model provides a wafer rewinding device has enough to meet the need to toast the rack in with the wafer from gum production rack, realizes full-automatic rewinding operation, has reduced the risk that the wafer transmits the in-process contaminated, hidden split or piece, promotes the yields and the transfer speed of wafer product, and improves the production line efficiency of wafer.

Description

Wafer reversing device

Technical Field

The utility model belongs to the technical field of the semiconductor package technique and specifically relates to a wafer rewinding device is related to.

Background

In the wafer packaging technology, a back adhesive film is required to be attached to the polished surface of the wafer to protect the polished surface. The wafer can be cured only by baking after being pasted with the back glue film. Specifically, the wafer is conveyed to the back adhesive production rack after the back adhesive machine finishes back adhesive, and the back adhesive production rack cannot directly bake the wafer on the back adhesive production rack due to the fact that the back adhesive production rack is not high-temperature resistant, but the wafer needs to be transferred to the high-temperature resistant baking rack and then baked.

In the prior art, after the gum operation is finished, the wafer is manually taken from the gum production rack and then transferred to the baking rack, so that the subsequent baking process is normally carried out. In the process of manually taking the wafer and transferring the wafer to the baking rack, the wafer is easily contaminated, or the wafer is hidden and cracked, even the wafer is directly broken, and the risk of bad wafer products is increased. In addition, the wafer is taken and transferred manually, time is consumed, the gum baking speed of the wafer is influenced, and the production line efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the defect that exists among the prior art, provide a full-automatic wafer rewinding device, will place the wafer that has pasted the gum membrane on gum production rack, from gum production rack turnover to toasting the rack in, solve the problem of artifical rewinding, realize full-automatic rewinding operation.

In order to solve the technical problem, the utility model provides a wafer rewinding device, including material loading slide glass platform, unloading slide glass platform, transfer mechanism and centering mechanism. The loading slide platform bears a gum production sheet frame, and a wafer is placed on the gum production sheet frame; the blanking slide glass platform bears the baking slide glass rack; the transfer mechanism is used for acquiring the wafer on the back adhesive production rack, moving the wafer to the centering mechanism for centering, and then transferring the wafer to the baking rack.

In some embodiments, the transfer mechanism includes a mechanical arm, a rail, a driving device, and a control device, the rail is disposed from the loading slide platform to the unloading slide platform, the driving device drives the mechanical arm to move back and forth on the rail, the driving device controls the mechanical arm to acquire and place the wafer, and the control device is connected to the driving device.

In some embodiments, the transfer mechanism further includes a scanning device, the scanning device is in communication connection with the control device in a wired or wireless manner, and the scanning device acquires the number and position information of the wafers on the gum production frame and sends the information to the control device. And the control device controls the driving device to drive the mechanical arm to acquire, transfer and place the wafer under the condition that the number of the wafers on the back adhesive production rack is determined not to be 0 and the positions of the wafers are not inclined.

In some embodiments, the robotic arm comprises a base and a plurality of arms mounted on the base in series, wherein the arm at the free end is provided with a suction nozzle.

In some embodiments, the arm is a bernoulli arm.

In some embodiments, the centering mechanism includes a chassis and slide rails disposed around the chassis, the slide rails are respectively provided with moving posts moving back and forth along the slide rails, and a wafer is placed on the surface of the chassis.

In some embodiments, the centering mechanism further comprises a controller connected to the moving column and controlling the moving column to move toward or away from the central position of the chassis.

In some embodiments, the chassis is a rotatable chassis.

The utility model provides a wafer rewinding device compares with prior art, has following beneficial effect:

through the drive arrangement and the control device of the transfer mechanism, the wafer is transferred to the baking rack from the gum production rack without manual rewinding, so that full-automatic rewinding operation is realized, the risk of contamination, hidden cracking or fragments in the wafer transfer process is reduced, the yield and the transfer speed of wafer products are improved, and the production line efficiency of the wafer is improved.

Drawings

FIG. 1 is a schematic structural diagram of a wafer rewinding device according to the present invention;

fig. 2 is a schematic structural view of the centering mechanism in fig. 1.

Detailed Description

The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1, the wafer rewinding device provided by the present invention comprises a loading slide platform 1, a unloading slide platform 2, a transfer mechanism 3 and a centering mechanism 4. The loading slide platform 1 and the unloading slide platform 2 can be arranged at the same side or two sides of the transfer mechanism 3, and in fig. 1, the loading slide platform 1 and the unloading slide platform 2 are arranged at the same side of the transfer mechanism 3.

The loading slide platform 1 is a shelf for loading the back adhesive production slide rack 5. The platform of the loading slide platform 1 is provided with a structure for limiting the position of the gum production slide frame 5, and the structure can be 4 limiting bulges arranged at two opposite angles and also can be a buckle structure matched with the gum production slide frame 5 for use. When the mechanical arm 30 works, the limiting structure ensures that the gum production rack 5 is stably placed on the loading slide platform 1.

Unloading slide glass platform 2 is also a supporter, and it is used for bearing and toasts slide glass frame 6, and similarly, also sets up the structure that the restriction toasted the 6 positions of slide glass frame on unloading slide glass platform 2 to guarantee to toast that slide glass frame 6 is comparatively firm to place on unloading slide glass platform 2. The structure of the limit can be the same as that of the loading slide platform 1. Other configurations that can removably secure the adhesive backed production frame 5 or the baking frame 6 can also be used in this application.

The transfer mechanism 3 is used for acquiring the wafer 7 on the back adhesive production rack 5, moving the wafer 7 to the centering mechanism 4 for centering, and then transferring the wafer to the baking rack 6.

The transfer mechanism 3 comprises a robot arm 30, a track 31, drive means and control means. The track 31 is installed on the operation table of the transfer mechanism 3, and the track 31 is arranged from the loading slide platform 1 to the unloading slide platform 2. The drive means and the control means may be integrated inside the console, not shown in the figures. The driving device drives the robot 30 to move back and forth on the rail 31, and the driving device controls the robot 30 to acquire and place the wafer 7. The control device is connected with the driving device and sends a driving instruction to the driving device. The mechanical arm 30 comprises a base and a plurality of arms which are arranged on the base and connected in sequence, a suction nozzle 32 is arranged on the arm at the free end, the arm is a Bernoulli arm, and the mechanical arm can be directly bought with Bernoulli mechanical fingers (non-contact type) on the market and can be used for adsorbing 6-inch, 8-inch and 12-inch wafers 7; the suction force of the bernoulli mechanical finger can be dispersed on the whole surface of the wafer 7, and the bernoulli mechanical finger is very suitable for the transmission of the wafer 7 in the application; besides the contact between the edge of the wafer 7 and the clamping jaws, the Bernoulli mechanical fingers can prevent the surface of the wafer 7 from contacting other parts of the fingers, so that the wafer 7 can be prevented from being contaminated, hidden cracks or fragments in the transferring process, and the yield of the wafer 7 product is improved. The two arms are connected through a connecting pin shaft. In specific implementation, the driving device, the control device and the structure of the mechanical arm 30 can adopt the prior art. Such as: the driving device can adopt a motor to connect with the driving piece, the base of the mechanical arm 30 is installed on the track 31 through a sliding block, the driving piece is connected with the sliding block on the track 31, the motor drives the sliding block to move back and forth on the track 31 through the driving piece, and then the mechanical arm 30 can move back and forth on the track 31. These can be achieved by the prior art.

The transfer mechanism 3 further comprises a scanning device 33 for operating the wafer 7, the scanning device 33 is in communication connection with the control device in a wired or wireless mode, and the scanning device 33 acquires the number and the position information of the wafers 7 on the gum production frame 5 and sends the information to the control device. The control device sends an instruction to the driving device when determining that the number of the wafers 7 on the gum production frame 5 is not 0 and the positions of the wafers 7 are not inclined, and controls the driving device to drive the mechanical arm 30 to acquire, transfer and place the wafers 7. The wafer 7 scanner 33 may also be commercially available. The connection of the scanning means 33 to the driving means is also prior art that can be implemented by a person skilled in the art.

In order to ensure that the subsequent processing procedure of the wafer 7 is more accurate, the centering mechanism 4 is arranged, the wafer 7 is centered, and the wafer 7 is transferred to the baking rack 6 after centering is completed, so that the processing quality of the wafer 7 is ensured. The structure of the centering mechanism 4 in this application is shown in fig. 2, and it includes a bottom plate 40 and slide rails 41 disposed around the bottom plate 40, the slide rails 41 are respectively provided with moving posts 42 moving back and forth along the slide rails 41, and the wafer 7 is placed on the surface of the bottom plate 40. 4 sliding rails 41 and moving columns 42 can be provided. The centering mechanism 4 further includes a controller connected to the movable posts 42 for controlling all of the movable posts 42 to move toward or away from the center of the chassis 40. The controller can be connected to the control device, and after the wafer 7 obtained by the robot 30 from the back adhesive production frame 5 is placed on the surface of the bottom plate 40, the control device sends an instruction to the controller to drive all the moving columns 42 to be close to the central position of the bottom plate 40 at the same time, so as to realize the centering of the wafer 7; after the centering is completed, all the moving columns 42 are driven to move away from the center of the bottom plate 40 at the same time, so that the robot 30 transfers the wafer 7 on the surface of the bottom plate 40 to the baking rack 6.

In particular embodiments, the chassis 40 may be configured as a rotatable chassis. When it is desired that the wafer 7 be transferred to the bake rack 6 in the same direction, after centering, the wafer 7 may be transferred to the bake rack 6 by rotating the base 40 using the rotatable base. For example, the wafer notch is directed toward the robot 30, and then the wafer 7 is moved to the baking stage 6. The rotation and positioning mechanisms of the wafer 7 may be market mechanisms, or may be modified by market mechanisms, which are not described in detail in this application.

The utility model provides a wafer rewinding device, with wafer 7 from the 5 turnovers of gum production rack to toasting in the rack 6, realize full-automatic rewinding operation, reduced wafer 7 and forwarded the risk that the in-process was stained, hidden splits or piece, promote the yields of 7 products of wafer and the speed of forwarding, and improve wafer 7's production line efficiency.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The wafer rewinding device is characterized by comprising a loading slide platform, a blanking slide platform, a transfer mechanism and a centering mechanism, wherein the loading slide platform bears a gum production slide frame on which a wafer is placed; the blanking slide glass platform bears a baking slide glass rack; the transfer mechanism is used for acquiring the wafer on the back adhesive production rack, moving the wafer to the centering mechanism for centering, and then transferring the wafer to the baking rack.

2. The wafer rewinding device as claimed in claim 1, wherein the transfer mechanism includes a robot arm, a rail, a driving device, and a control device, the rail is disposed from the loading slide platform to the unloading slide platform, the driving device drives the robot arm to move back and forth on the rail, the driving device controls the robot arm to obtain and place the wafer, and the control device is connected to the driving device.

3. The wafer rewinding device as claimed in claim 2, wherein the transfer mechanism further comprises a scanning device, the scanning device is connected to the control device, and the scanning device obtains the number and position information of the wafers on the frame for producing the adhesive-backed film and sends the information to the control device.

4. The wafer reversing device as claimed in claim 3, wherein the robot arm comprises a base and a plurality of arms mounted on the base and connected in sequence, and a suction nozzle is arranged on the arm at the free end.

5. The wafer flipping device of claim 4, wherein the arm is a Bernoulli arm.

6. The wafer rewinding device as claimed in any one of claims 1 to 5, wherein the centering mechanism includes a base plate and slide rails disposed around the base plate, the slide rails are respectively provided with moving posts that move back and forth along the slide rails, and the surface of the base plate is used for placing the wafer.

7. The wafer rewinding device as claimed in claim 6, wherein the centering mechanism further comprises a controller connected to the moving column to control the moving column to move toward or away from the center of the chassis.

8. The wafer flipping apparatus of claim 7, wherein the chassis is a rotatable chassis.