CN218383863U

CN218383863U - Heat dissipation mechanism of computer equipment

Info

Publication number: CN218383863U
Application number: CN202222192868.9U
Authority: CN
Inventors: 陈再新
Original assignee: Jiangsu Institute of Economic and Trade Technology
Current assignee: Jiangsu Institute of Economic and Trade Technology
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2023-01-24
Anticipated expiration: 2032-08-19

Abstract

The utility model relates to a computer cooling technical field discloses a computer equipment's heat dissipation mechanism, the load simulator comprises a case, one side of machine case is run through fixed mounting and is had the semiconductor refrigeration piece, the heat absorption side setting of semiconductor refrigeration piece is in the inside of machine case, the heat release side of semiconductor refrigeration piece is provided with the fin, one side of fin is provided with outer fan, the machine case is totally enclosed, the inside of machine case is provided with air inner loop subassembly. The utility model discloses a semiconductor refrigeration piece and the totally closed quick-witted case that sets up, when using, can be through the heat transfer that semiconductor refrigeration piece produced when using quick-witted incasement portion hardware to quick-witted case external, and because the totally closed design of quick-witted case, can effectively avoid the dust in the air to get into quick-witted incasement, influence the heat dissipation and the life of hardware.

Description

Heat dissipation mechanism of computer equipment

Technical Field

The utility model relates to a computer heat dissipation technical field specifically is a heat dissipation mechanism of computer equipment.

Background

Along with the improvement of living standard, computers are also popularized. Computers can be classified into desktop computers, notebook computers, tablet computers, and the like. Desktop computers are generally more configured and superior to laptop computers and tablet computers at the same purchase price, and therefore, the choice of purchasing a desktop computer is often greater. The heat dissipation problem of the case of the desktop computer is always a major problem affecting the performance of the desktop computer. Inside the computer case, areas such as a CPU area, a graphics card area, and a hard disk, which generate relatively high heat, are provided.

In order to ensure the heat dissipation of the chassis, the fan is generally arranged in the chassis, and the surface of the chassis shell is also correspondingly provided with heat dissipation holes, but the fan is generally arranged at the back, one side and the bottom of the chassis, so that a linear air duct cannot be formed, and the heat dissipation effect is poor. And no matter place the machine case on the desk or the desk under the special interlayer of placing the machine case, the surface of machine case casing all can accumulate a large amount of dusts, and the louvre is too much, and a large amount of dusts can enter into the casing of machine case through the louvre in, influence the heat dissipation, are difficult to clear up, influence hardware life.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer equipment's heat dissipation mechanism to can get into a large amount of dusts in the casing of the current computer machine case that provides in solving the background art, influence the heat dissipation, be difficult to the clearance, and influence hardware life's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer equipment's heat dissipation mechanism, includes quick-witted case, fixed mounting is run through to one side of machine case has the semiconductor refrigeration piece, the heat absorption side of semiconductor refrigeration piece sets up the inside at quick-witted case, the side that releases heat of semiconductor refrigeration piece is provided with the fin, one side of fin is provided with outer fan, quick-witted case is the totally enclosed type, the inside of machine case is provided with air inner loop subassembly.

As a preferred embodiment of the present invention, the heat dissipation plate is a column-type multi-sheet heat dissipation plate, the top of the heat dissipation plate has a placement groove, and the outer fan is movably disposed in the placement groove.

As a preferred embodiment of the present invention, a magnetic ring a is fixedly mounted on the top side of the outer periphery of the outer fan, a magnetic ring b is fixedly mounted on the top side of the heat sink, and the polarities of the opposite sides of the magnetic ring a and the magnetic ring b are opposite.

As an optimal implementation mode of the utility model, the heat-releasing side of semiconductor refrigeration piece is connected with the fin through the heat-conducting layer, the heat-absorbing side of semiconductor refrigeration piece is connected with the heat conduction copper pipe through the heat-conducting layer.

As a preferred embodiment of the utility model, the air inner loop subassembly includes a plurality of interior fans, and is a plurality of interior fan constitutes circulating air duct, and is a plurality of the air inlet end of interior fan all is provided with the desicator.

As a preferred embodiment of the utility model, the desicator includes the box body, the both sides of box body all are netted, the positive activity through connection of box body has the drawer, one side that the drawer is close interior fan is netted.

As a preferred embodiment of the present invention, one side of the inside of the case is provided with a humidity sensor and an indicator light, and the front of the case is a transparent panel.

Compared with the prior art, the utility model provides a computer equipment's heat dissipation mechanism possesses following beneficial effect:

this heat dissipation mechanism of computer equipment, semiconductor refrigeration piece and totally closed quick-witted case through setting up, when using, the heat transfer that produces when using the internal hardware of machine case through the semiconductor refrigeration piece is external to quick-witted case, and because the totally closed design of machine case, can effectively avoid the dust in the air to get into quick-witted incasement, influence the heat dissipation and the life of hardware, and the detachable design of outer fan, and standing groove design on the cooling fin, the functional of quick-witted case is greatly improved, put the user crowd on the desktop to the quick-witted case, in winter, can also dismantle outer fan, place the standing groove in with the drinking cup, replace outer fan, absorb the heat of quick-witted incasement, reach the heat retaining purpose of water supply cup, excellent in use effect.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a front view of a heat dissipation mechanism of a computer device according to the present invention;

fig. 2 is a top view of a heat dissipation mechanism of a computer device according to the present invention;

fig. 3 is a schematic view of the whole dryer of the heat dissipation mechanism of the computer device of the present invention.

In the figure: 1. a chassis; 2. a semiconductor refrigeration sheet; 3. a heat sink; 4. an outer fan; 5. a placement groove; 6. a magnetic ring a; 7. a magnetic ring b; 8. a heat conductive layer; 9. a heat conducting copper tube; 10. an inner fan; 11. a dryer; 12. a case body; 13. a drawer; 14. a humidity sensor; 15. and an indicator light.

Detailed Description

In order to better understand the purpose, structure and function of the present invention, the following description is made in detail with reference to the accompanying drawings.

As shown in fig. 1, fig. 2 and fig. 3, the utility model provides a technical solution: a heat dissipation mechanism of computer equipment comprises a case 1, wherein a plurality of computer hardware 16 are arranged inside the case 1 and comprise a memory bank, a CPU, a mainboard and the like, a semiconductor refrigerating sheet 2 is fixedly installed on one side of the case 1 in a penetrating mode, the heat absorption side of the semiconductor refrigerating sheet 2 is arranged inside the case 1, a heat dissipation sheet 3 is arranged on the heat dissipation side of the semiconductor refrigerating sheet 2, an outer fan 4 is arranged on one side of the heat dissipation sheet 3, the semiconductor refrigerating sheet 2 absorbs heat inside the case 1 and transmits the heat to the heat dissipation sheet 3, the outer fan 4 is started to blow the heat on the heat dissipation sheet 3 to the air, the case 1 is totally enclosed, a plurality of interface holes 17 are formed in one side of the case 1, interfaces 18 of the computer hardware 16 penetrate through the corresponding interface holes 17 and are hermetically connected with the interface holes 17 through rubber pads 19, so that the case 1 is totally enclosed, and an air internal circulation assembly is arranged inside the case 1 and used for flowing of air inside the case 1.

In this embodiment, the heat dissipation fins 3 are cylindrical multi-sheet heat dissipation fins, the top of the heat dissipation fins 3 is provided with a placement groove 5, and the outer fan 4 is movably disposed in the placement groove 5.

In this embodiment, a magnetic ring a6 is fixedly mounted on the top side of the periphery of the outer fan 4, a magnetic ring b7 is fixedly mounted on the top side of the radiating fin 3, the polarities of the opposite sides of the magnetic ring a6 and the magnetic ring b7 are opposite, so that the outer fan 4 can be conveniently detached, the dust on the radiating fin 3 and the outer fan 4 can be cleaned, and the magnetic connection mode enables the outer fan 4 to be conveniently detached, and after the outer fan 4 is detached, for user groups who place the case 1 on a desktop, in winter, a water cup can be placed in the placing groove 5 to replace the outer fan 4, so that heat in the case 1 is absorbed, and the purpose of keeping the water cup warm is achieved.

In this embodiment, the heat release side of semiconductor refrigeration piece 2 is connected with fin 3 through heat-conducting layer 8, the heat absorption side of semiconductor refrigeration piece 2 is connected with heat conduction copper pipe 9 through heat-conducting layer 8, and heat-conducting layer 8 is the silicone grease, directly pastes the higher hardware of the other end of heat conduction copper pipe 9 and calorific capacity mutually, can effectively improve the cooling effect.

In this embodiment, the air inner loop subassembly includes three interior fan 10, and one interior fan 10 sets up at the inside left downside of quick-witted case 1, and the input up, and one interior fan 10 sets up at the inside right downside of quick-witted case 1, and the input is down, and one interior fan sets up at the inside upper right side of quick-witted case 1, and the input is towards the right side, and is three interior fan 10 constitutes the circulation wind channel, and is three the air inlet end of interior fan 10 all is provided with desicator 11, and desicator 11 can reduce the air humidity in quick-witted case 1, avoids semiconductor refrigeration piece 2 during operation, leads to the inside liquid that appears of quick-witted case 1.

In this embodiment, the dryer 11 includes a box 12, both sides of the box 12 are mesh-shaped, the drawer 13 is movably connected to the front of the box 12 in a penetrating manner, one side of the drawer 13 close to the inner fan 10 is mesh-shaped, a drying agent is disposed inside the drawer 13, when the inner fan 10 works, air enters the box 12 through the mesh-shaped surface of the box 12, passes through the drying agent, the mesh-shaped surface of the drawer 13 and the other mesh-shaped surface of the box 12, and then passes through the fan, so as to dry the air, because the case 1 encounters a situation of upgrading hardware in a continuous use process, the case 1 needs to be opened, and air with moisture enters the inside of the case 1, and when the semiconductor chilling plates 2 run, liquid is generated inside the case 1, so that the use of the computer hardware 16 is affected.

In this embodiment, one side of machine case 1 inside is provided with humidity transducer 14 and pilot lamp 15, the front of machine case 1 is transparent panel, humidity transducer 14 passes through microcontroller and 15 electric connection of pilot lamp, humidity transducer 14 can monitor the humidity of machine case 1 inside, thereby when humidity reaches a certain degree, in time carry out the early warning to pilot lamp 15, the front of machine case 1 is transparent panel, convenient to use person observes its inside, and the bolt is passed through with quick-witted case 1 detachable connection in the four corners of transparent panel, the outside limit of transparent panel passes through rubber packing pad and quick-witted case 1 sealing connection.

It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.

Claims

1. The utility model provides a heat dissipation mechanism of computer equipment, includes quick-witted case, its characterized in that: one side of machine case runs through fixed mounting and is had semiconductor refrigeration piece, the heat absorption side setting of semiconductor refrigeration piece is in the inside of machine case, the side that releases heat of semiconductor refrigeration piece is provided with the fin, one side of fin is provided with outer fan, the machine case is totally enclosed, the inside of machine case is provided with air inner loop subassembly.

2. The heat dissipation mechanism of a computer device according to claim 1, wherein: the radiating fins are column type multi-sheet radiating fins, a placing groove is formed in the top of each radiating fin, and the outer fan is movably arranged in the placing groove.

3. The heat dissipation mechanism of a computer device of claim 2, wherein: the magnetic ring a is fixedly installed on the top side of the periphery of the outer fan, the magnetic ring b is fixedly installed on the top side of the radiating fin, and the polarities of the opposite sides of the magnetic ring a and the magnetic ring b are opposite.

4. The heat dissipation mechanism of a computer device according to claim 1, wherein: the heat-releasing side of the semiconductor refrigeration piece is connected with the radiating fin through the heat conducting layer, and the heat-absorbing side of the semiconductor refrigeration piece is connected with the heat-conducting copper pipe through the heat conducting layer.

5. The heat dissipation mechanism of a computer device of claim 1, wherein: the air inner circulation assembly comprises a plurality of inner fans, the inner fans form a circulation air duct, and the air inlet ends of the inner fans are provided with dryers.

6. The heat dissipation mechanism of a computer device of claim 5, wherein: the desicator includes the box body, the both sides of box body all are netted, the positive activity through connection of box body has the drawer, one side that the drawer is close interior fan is netted.

7. The heat dissipation mechanism of a computer device according to claim 6, wherein: a humidity sensor and an indicator light are arranged on one side of the interior of the case, and a transparent panel is arranged on the front face of the case.