CN115328288A

CN115328288A - Heat dissipation mechanism of computer equipment

Info

Publication number: CN115328288A
Application number: CN202211000970.2A
Authority: CN
Inventors: 陈再新
Original assignee: Jiangsu Institute of Economic and Trade Technology
Current assignee: Jiangsu Institute of Economic and Trade Technology
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2022-11-11

Abstract

The invention relates to the technical field of computer heat dissipation, and discloses a heat dissipation mechanism of computer equipment, which comprises a case, wherein a semiconductor refrigeration piece is fixedly installed on one side of the case in a penetrating manner, the heat absorption side of the semiconductor refrigeration piece is arranged in the case, the heat release side of the semiconductor refrigeration piece is provided with a heat dissipation piece, one side of the heat dissipation piece is provided with an external fan, the case is in a totally enclosed type, and an air internal circulation component is arranged in the case. According to the invention, through the semiconductor refrigeration piece and the totally-enclosed case, when in use, heat generated when hardware in the case is used can be transferred to the outside of the case through the semiconductor refrigeration piece, and due to the totally-enclosed design of the case, dust in air can be effectively prevented from entering the case to influence the heat dissipation and the service life of the hardware.

Description

Heat dissipation mechanism of computer equipment

Technical Field

The invention relates to the technical field of computer heat dissipation, in particular to a heat dissipation mechanism of computer equipment.

Background

Along with the improvement of living standard, computers are also popularized. Computers can be classified into desktop computers, notebook computers, tablet computers, and the like. Desktop computers are generally more configured and superior to laptop computers and tablet computers at the same purchase price, and therefore, the choice of purchasing a desktop computer is often greater. The heat dissipation problem of the case of the desktop computer is always a major problem affecting the performance of the desktop computer. Inside the computer case, areas such as a CPU area, a graphics card area, and a hard disk, which generate relatively high heat, are provided.

In order to ensure the heat dissipation of the case, the fan is generally arranged in the case, and the surface of the case shell is also correspondingly provided with heat dissipation holes, but the fan is generally arranged at the back, one side and the bottom of the case, so that a linear air duct cannot be formed, and the heat dissipation effect is poor. And no matter place the machine case on the desk or the interlayer of placing the machine case specially under the desk, the surface of machine case casing all can accumulate a large amount of dust, and the louvre is too much, and a large amount of dust can enter into the casing of machine case through the louvre, influences the heat dissipation, is difficult to the clearance, influences hardware life.

Disclosure of Invention

The invention aims to provide a heat dissipation mechanism of computer equipment, which aims to solve the problems that a large amount of dust enters a shell of the existing computer case, heat dissipation is influenced, the case is difficult to clean and the service life of hardware is influenced in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a computer equipment's heat dissipation mechanism, includes quick-witted case, fixed mounting is run through to one side of machine case has the semiconductor refrigeration piece, the heat absorption side of semiconductor refrigeration piece sets up the inside at quick-witted case, the side that releases heat of semiconductor refrigeration piece is provided with the fin, one side of fin is provided with outer fan, quick-witted case is the totally enclosed type, the inside of machine case is provided with air inner loop subassembly.

In a preferred embodiment of the present invention, the heat dissipation plate is a pillar-type multi-sheet heat dissipation plate, a placement groove is formed at a top of the heat dissipation plate, and the outer fan is movably disposed in the placement groove.

As a preferred embodiment of the present invention, a magnetic ring a is fixedly installed on a top side of an outer periphery of the outer fan, a magnetic ring b is fixedly installed on a top side of the heat sink, and polarities of opposite sides of the magnetic ring a and the magnetic ring b are opposite.

As a preferred embodiment of the present invention, the heat-releasing side of the semiconductor chilling plate is connected to the heat-dissipating fin through a heat-conducting layer, and the heat-absorbing side of the semiconductor chilling plate is connected to the heat-conducting copper tube through a heat-conducting layer.

As a preferred embodiment of the present invention, the air internal circulation component includes a plurality of internal fans, the internal fans form a circulation air duct, and air inlet ends of the internal fans are provided with dryers.

As a preferred embodiment of the present invention, the dryer includes a box body, both sides of the box body are mesh-shaped, a drawer is movably connected to the front of the box body in a penetrating manner, and one side of the drawer close to the inner fan is mesh-shaped.

In a preferred embodiment of the present invention, a humidity sensor and an indicator light are disposed on one side of the inside of the casing, and the front surface of the casing is a transparent panel.

Compared with the prior art, the invention provides a heat dissipation mechanism of computer equipment, which has the following beneficial effects:

this heat dissipation mechanism of computer equipment, semiconductor refrigeration piece and totally closed quick-witted case through setting up, when using, the heat transfer that produces when using the internal hardware of machine case through the semiconductor refrigeration piece is external to quick-witted case, and because the totally closed design of machine case, can effectively avoid the dust in the air to get into quick-witted incasement, influence the heat dissipation and the life of hardware, and the detachable design of outer fan, and standing groove design on the cooling fin, the functional of quick-witted case is greatly improved, put the user crowd on the desktop to the quick-witted case, in winter, can also dismantle outer fan, place the standing groove in with the drinking cup, replace outer fan, absorb the heat of quick-witted incasement, reach the heat retaining purpose of water supply cup, excellent in use effect.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a front view of a heat dissipation mechanism of a computer device of the present invention;

FIG. 2 is a top view of a heat dissipation mechanism of a computer device of the present invention;

fig. 3 is an overall schematic diagram of a dryer of a heat dissipation mechanism of a computer device according to the present invention.

In the figure: 1. a chassis; 2. a semiconductor refrigeration sheet; 3. a heat sink; 4. an outer fan; 5. a placement groove; 6. a magnetic ring a; 7. a magnetic ring b; 8. a heat conductive layer; 9. a heat conducting copper tube; 10. an inner fan; 11. a dryer; 12. a box body; 13. a drawer; 14. a humidity sensor; 15. and an indicator light.

Detailed Description

For better understanding of the objects, structure and functions of the present invention, a heat dissipation mechanism of a computer device will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: a heat dissipation mechanism of computer equipment comprises a case 1, wherein a plurality of computer hardware 16 are arranged inside the case 1 and comprise a memory bank, a CPU (Central processing Unit), a mainboard and the like, a semiconductor refrigerating sheet 2 penetrates through and is fixedly installed on one side of the case 1, the heat absorption side of the semiconductor refrigerating sheet 2 is arranged inside the case 1, a heat dissipation sheet 3 is arranged on the heat dissipation side of the semiconductor refrigerating sheet 2, an outer fan 4 is arranged on one side of the heat dissipation sheet 3, the semiconductor refrigerating sheet 2 absorbs heat inside the case 1 and transmits the heat to the heat dissipation sheet 3, the outer fan 4 is started to blow the heat on the heat dissipation sheet 3 to the air, the case 1 is in a totally-enclosed type, a plurality of interface holes 17 are formed in one side of the case 1, interfaces 18 of the computer hardware 16 penetrate through the corresponding interface holes 17 and are in sealed connection with the interface holes 17 through rubber pads 19, so that the case 1 is totally-enclosed, and an air internal circulation assembly is arranged inside the case 1 and used for flowing of air in the case 1.

In this embodiment, the heat dissipation fins 3 are column-type multi-sheet heat dissipation fins, the top of the heat dissipation fins 3 is provided with a placement groove 5, and the outer fan 4 is movably disposed in the placement groove 5.

In this embodiment, a magnetic ring a6 is fixedly mounted on the top side of the periphery of the outer fan 4, a magnetic ring b7 is fixedly mounted on the top side of the radiating fin 3, the polarities of the opposite sides of the magnetic ring a6 and the magnetic ring b7 are opposite, so that the outer fan 4 can be conveniently detached, the dust on the radiating fin 3 and the outer fan 4 can be cleaned, and the magnetic connection mode enables the outer fan 4 to be conveniently detached, and after the outer fan 4 is detached, for user groups who place the case 1 on a desktop, in winter, a water cup can be placed in the placing groove 5 to replace the outer fan 4, so that heat in the case 1 is absorbed, and the purpose of keeping the water cup warm is achieved.

In this embodiment, semiconductor refrigeration piece 2's the side that releases heat is connected with fin 3 through heat-conducting layer 8, semiconductor refrigeration piece 2's the heat absorption side is connected with heat conduction copper pipe 9 through heat-conducting layer 8, and heat-conducting layer 8 is the silicone grease, directly pastes heat conduction copper pipe 9's the other end and the higher hardware of giving out heat, can effectively improve the cooling effect.

In this embodiment, the air inner loop subassembly includes three interior fan 10, and interior fan 10 sets up at the inside left downside of quick-witted case 1, and the input up, and interior fan 10 sets up at the inside right downside of quick-witted case 1, and the input is down, and interior fan setting is at the inside upper right side of quick-witted case 1, and the input is right, three interior fan 10 constitutes the circulation wind channel, and is three the air inlet end of interior fan 10 all is provided with desicator 11, and desicator 11 can reduce the air humidity in quick-witted case 1, avoids semiconductor refrigeration piece 2 during operation, leads to the inside liquid that appears of quick-witted case 1.

In this embodiment, the dryer 11 includes a box 12, both sides of the box 12 are mesh-shaped, the drawer 13 is movably connected to the front of the box 12 in a penetrating manner, one side of the drawer 13 close to the inner fan 10 is mesh-shaped, a drying agent is disposed inside the drawer 13, when the inner fan 10 works, air enters the box 12 through the mesh-shaped surface of the box 12, passes through the drying agent, the mesh-shaped surface of the drawer 13 and the other mesh-shaped surface of the box 12, and then passes through the fan, so as to dry the air, because the case 1 encounters a situation of upgrading hardware in a continuous use process, the case 1 needs to be opened, and air with moisture enters the inside of the case 1, and when the semiconductor chilling plates 2 run, liquid is generated inside the case 1, so that the use of the computer hardware 16 is affected.

In this embodiment, one side of machine case 1 inside is provided with humidity transducer 14 and pilot lamp 15, the front of machine case 1 is transparent panel, humidity transducer 14 passes through microcontroller and 15 electric connection of pilot lamp, humidity transducer 14 can monitor the humidity of machine case 1 inside, thereby when humidity reaches the certain degree, in time carry out the early warning to pilot lamp 15, the front of machine case 1 is transparent panel, convenient to use person observes it inside, and the four corners of transparent panel passes through the bolt and is connected with machine case 1 is detachable, rubber packing pad and machine case 1 sealing connection are passed through to the outside limit of transparent panel.

It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a heat dissipation mechanism of computer equipment, includes quick-witted case, its characterized in that: one side of machine case runs through fixed mounting and is had semiconductor refrigeration piece, the heat absorption side setting of semiconductor refrigeration piece is in the inside of machine case, the side that releases heat of semiconductor refrigeration piece is provided with the fin, one side of fin is provided with outer fan, the machine case is totally enclosed, the inside of machine case is provided with air inner loop subassembly.

2. The heat dissipation mechanism of a computer device according to claim 1, wherein: the radiating fins are column type multi-sheet radiating fins, a placing groove is formed in the top of each radiating fin, and the outer fan is movably arranged in the placing groove.

3. The heat dissipation mechanism of a computer device of claim 2, wherein: the magnetic ring a is fixedly installed on the top side of the periphery of the outer fan, the magnetic ring b is fixedly installed on the top side of the radiating fin, and the polarities of the opposite sides of the magnetic ring a and the magnetic ring b are opposite.

4. The heat dissipation mechanism of a computer device according to claim 1, wherein: the heat-releasing side of the semiconductor refrigeration piece is connected with the radiating fin through the heat conducting layer, and the heat-absorbing side of the semiconductor refrigeration piece is connected with the heat-conducting copper pipe through the heat conducting layer.

5. The heat dissipation mechanism of a computer device according to claim 1, wherein: the air inner circulation assembly comprises a plurality of inner fans, the inner fans form a circulation air duct, and the air inlet ends of the inner fans are provided with dryers.

6. The heat dissipation mechanism of a computer device according to claim 5, wherein: the desicator includes the box body, the both sides of box body all are netted, the front activity through connection of box body has the drawer, one side that the drawer is close interior fan is netted.

7. The heat dissipation mechanism of a computer device according to claim 6, wherein: a humidity sensor and an indicator light are arranged on one side of the inside of the case, and the front face of the case is a transparent panel.