CN112128562A - Computer strutting arrangement - Google Patents
Computer strutting arrangement Download PDFInfo
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- CN112128562A CN112128562A CN202011083296.XA CN202011083296A CN112128562A CN 112128562 A CN112128562 A CN 112128562A CN 202011083296 A CN202011083296 A CN 202011083296A CN 112128562 A CN112128562 A CN 112128562A
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- Prior art keywords
- baffle
- supporting
- computer
- base
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 239000000428 dust Substances 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 238000005057 refrigeration Methods 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000013016 damping Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 17
- 230000002265 prevention Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 15
- 230000006870 function Effects 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000005855 radiation Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 241001233242 Lontra Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/20—Undercarriages with or without wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/04—Preventing deposition of fouling or of dust by using removable coverings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a computer supporting device, which belongs to the technical field of computers and comprises a supporting mechanism for supporting a computer host case and a heat dissipation mechanism arranged on the supporting mechanism; the supporting mechanism comprises a base and a supporting module arranged on the base; the heat dissipation mechanism comprises a refrigeration module arranged at the lower part of the base and a heat dissipation fan arranged at one side of the refrigeration module; the left and right sides of base all sets up first baffle, and both sides set up the second baffle that is connected with first baffle around the base, encloses on first baffle and the second baffle and establish the dust bag. The supporting mechanism supports the computer mainframe, adopts point support, has good heat dissipation effect and good shockproof effect, completely wraps the mainframe by the dustproof bag, can cool the computer mainframe, ensures temperature balance, is convenient to use, solves the technical problem that dust prevention and heat dissipation cannot be simultaneously ensured in the past, and prolongs the service life of the computer.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a computer supporting device.
Background
Computers are modern electronic computing machines used for high-speed computing. Computers have become indispensable electronic devices in people's lives and works because of their rich functions and intelligent operation. Common computers are desktop computers or notebooks. Among them, the desktop computer is popular because it is durable and has high cost performance. The desktop computer generally includes a display and a host, where the main body includes a case, the case refers to a main body part of the computer except for input and output devices, and is also a control box for placing a motherboard and other main components, and generally includes a CPU, a memory, a hard disk, an optical drive, a power supply, and other input and output controllers and interfaces, such as a USB controller, a video card, a network card, and a sound card, and the case located in the host is generally called as a built-in structure. The existing host is generally placed on the ground or on a base, and when the ground is vibrated by a heavy object, the service life of the host is influenced. At present, the existing market lacks a supporting mechanism which can be convenient for placing a computer host case, and the existing supporting mechanism of the host case has the advantages of simpler structure, poor heat dissipation effect, influence on the use performance of the host and very low use benefit. In addition, in order to ensure the heat dissipation of the host, the case is often provided with heat dissipation holes, and dust easily enters the heat dissipation holes, which not only easily causes the damage of the internal elements of the case, but also easily blocks the heat dissipation holes, affects the heat dissipation effect, and cannot ensure the good operation of the host.
Patent publication No. CN208566093U discloses a height-adjustable computer case supporting device, which comprises a bottom plate case; the bottom plate box is in a groove shape, and a hydraulic cylinder is arranged inside the lower part of the bottom plate box; the two first sliding blocks are arranged and are sleeved on the first sliding rod in a sliding manner; the left end and the right end of the first sliding rod are welded and fixed on the inner side groove of the fixing plate, and the left part and the right part of the first sliding rod are sleeved with damping springs; the middle part of the threaded rod is fixedly sleeved with a limiting block, the rotating directions of threads at two ends of the limiting block are opposite, and a threaded sliding block is rotatably installed on the limiting block through thread engagement; the two clamping boxes are arranged at the upper end of the supporting plate, and a connecting rod is slidably arranged in each clamping box; the connecting rod is T font, and its inboard through connection centre gripping case, and seted up the removal hole in the junction, and its left end welded fastening has buffer spring. The utility model discloses a simple structure, convenient operation, can be stable with computer machine case fixed centre gripping in the backup pad, nevertheless can not reach dustproof and radiating effect.
Patent document No. CN109828649A discloses a cooling and heat dissipating support device for a portable computer, which includes a lower support frame, an upper support frame, a lifting assembly, and a cooling and heat dissipating assembly; the lifting assembly comprises a shearing telescopic frame, a lower sliding assembly and an upper sliding assembly. The invention has simple structure and convenient operation and installation; the device cools and radiates the portable computer placed on the heat transfer supporting plate in a water cooling and heat radiation fan double cooling mode, and has good cooling effect and high cooling efficiency; the device can also adjust the height, and adjust the inclination angle of the heat transfer support plate arranged on the upper support frame according to the requirement, thereby meeting the use requirements of different use environments and different people; the device has still installed temperature sensor additional, can control opening or closing of cooling radiator unit according to the condition of generating heat in the practical use of portable computer, but the device passes through the water-cooling, makes quick-witted case wet easily, influences the life of host computer.
Disclosure of Invention
In view of the above, the present invention provides a computer supporting device.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a computer supporting device comprises a supporting mechanism for supporting a computer host case and a heat dissipation mechanism arranged on the supporting mechanism; the supporting mechanism comprises a base and a supporting module arranged on the base; the heat dissipation mechanism comprises a refrigeration module arranged at the lower part of the base and a heat dissipation fan arranged at one side of the refrigeration module; the left and right sides of base all sets up first baffle, both sides set up around the base with the second baffle that first baffle is connected, enclose on first baffle and the second baffle and establish dust bag.
Further, the support module comprises a damping plate arranged on the base, a support plate arranged on the damping plate, and a support component arranged on the support plate.
Furthermore, the refrigeration module comprises a semiconductor refrigeration piece arranged on the second baffle and a temperature sensor arranged on one side of the semiconductor refrigeration piece.
Further, the support component comprises a first support rod vertically arranged on the support plate and a second support rod arranged at the end part of the first support rod.
Furthermore, the first support rods are arranged on the support plate in two rows, one end of the second support rod is connected with the first baffle, and the other end of the second support rod is connected with the end part of the first support rod.
Furthermore, a through hole matched with the shape of the semiconductor refrigerating sheet is formed in the second baffle, and the cold end of the semiconductor refrigerating sheet faces towards the inner side of the second baffle and is embedded in the through hole.
Furthermore, the hot end of the semiconductor refrigeration piece is connected with the cooling fan through a heat conduction fin.
Furthermore, the side of the dust bag is provided with a wire inlet, the wire inlet is provided with a sealing rope, and the dust bag is provided with an opening which can be detachably connected.
In the present society, a computer is used in life, work, study and the like, the computer comprises a case and a display, and a host case of the computer is usually placed on a support in use, however, the existing host support has simple functions and only plays a role in supporting. The patent that publication number is CN211259465U discloses a computer machine case vibration damping mount based on network security belongs to computer machine case vibration damping mount technical field, and it includes the bottom plate, the upper surface of bottom plate is seted up flutedly, the spout has all been seted up to the left and right sides face of recess inner wall, sliding connection has the slider in the spout, the upper surface of slider is provided with the sliding sleeve, sliding connection has the slide bar in the sliding sleeve. The base is only added with a simple shock absorption function, and can not well protect the host machine.
The main computer is affected by heat dissipation and dust. In order to improve the operation speed of a CPU or a graphics card chip of a computer, the frequency of the CPU or the graphics card chip is higher and higher, the heat productivity of the CPU or the graphics card chip is higher and higher, and the internal space of the computer is smaller, so that after the computer runs for a long time, the heat of the CPU or the graphics card cannot be effectively discharged, which results in a series of problems such as the performance reduction of the CPU or the graphics card chip, the computer crash, the restart and the like, and in a serious case, the CPU or the graphics card chip may be damaged, which affects the service life of the computer. A commonly used heat dissipation device adopts water cooling for heat dissipation, and for example, a patent with publication number CN208521250U discloses a water cooling heat dissipation bar for a computer, which comprises an upper water chamber, a lower water chamber, a plurality of heat dissipation water service pipes, a plurality of heat dissipation fins, an inner upper protection plate, an inner lower protection plate, a first built-in lamp strip, a second built-in lamp strip, an outer upper protection plate, an outer lower protection plate, a plurality of protection plate fixing screws, a heat dissipation fan and a plurality of fan fixing screws; the heat-dissipation water service pipe and the heat-dissipation fins are arranged at intervals and connected between the upper water chamber and the lower water chamber, the inner side upper protection plate is arranged at the top of the heat-dissipation row main body, the outer side upper protection plate is arranged at the top of the inner side upper protection plate, and the first built-in lamp belt is arranged between the inner side upper protection plate and the outer side upper protection plate; the inner lower protection plate is arranged at the bottom of the heat dissipation row main body, the outer lower protection plate is arranged at the bottom of the inner lower protection plate, and the second built-in lamp is arranged between the inner lower protection plate and the outer lower protection plate; the heat radiation fan is arranged on the outer upper protective plate and the outer lower protective plate. The heat dissipation mode easily enables the host to be affected with damp, and the service life of components is influenced.
Dust in the air can enter the inside of host computer machine case through ventilation otter board, can cause the accumulation of dust after long-time the use, has influenced the normal operating of each accessory in the host computer. The traditional solution is that the host computer removes dust, most all are very simple devices, can not carry out fine cleaing away to the dust that gets into the main frame inner chamber, the inside dust of host computer has been increased, can not guarantee the good operation of host computer, safe and reliable inadequately, make the device do not have fine dust adsorption function, great reduction the device's dust removal function, the piling up that has caused the dust causes the destruction of host computer intracavity element, make the device do not have fine dust removal function, the radiating effect of the device has been reduced, convenient and fast inadequately, make the device do not have fine heat dissipation function and do not have fine convenience. For example, patent document No. CN109857216A discloses a computer host with a dust removal function, which has two functions of heat dissipation and dust removal, and combines the two functions effectively, and turns the original heat dissipation device into a direction to blow the inside of the case, and forms irregular cross flow inside the case, so as to drive the dust inside the device by wind power, and then the dust is adsorbed by an electrostatic dust removal device and transported to a dust storage box, so as to collect and transfer the dust. The method is to collect the dust, and the dust cannot be completely cleaned.
Those skilled in the art think that dust generally enters the host computer case through the heat dissipation holes, and to reduce the influence of the dust on the host computer, the heat dissipation holes need to be sealed, which affects the heat dissipation effect of the host computer. The host can keep excellent heat dissipation effect, and meanwhile, dust is reduced from entering the interior of the case, which is a technical problem that is not solved by the technical personnel in the field.
The invention has the beneficial effects that: the invention comprises a supporting mechanism and a heat dissipation mechanism for supporting the computer mainframe case. The left and right sides of base all sets up first baffle, and the front and back both sides all set up the second baffle, enclose on first baffle and the second baffle and establish dust bag, with host computer machine case parcel, reach fine dustproof effect. The side of the dustproof bag is provided with a wire inlet, a sealing rope is arranged on the wire inlet to seal the wire inlet, the dustproof bag is provided with an opening which can be detachably connected, and the dustproof bag is sealed by the dustproof bag after the host case is placed on the base.
The supporting mechanism comprises a base and a supporting module arranged on the base; the support module comprises a damping plate arranged on the base, a support plate arranged on the damping plate and a support component arranged on the support plate. The supporting component comprises a first supporting rod vertically arranged on the supporting plate and a second supporting rod arranged at the end part of the first supporting rod. The damping plate can slow down violent vibrations from the ground, strengthens the shock attenuation effect, designs the damping plate into the wavy. Set up the supporting component in the backup pad, support computer host computer machine case, a plurality of first bracing pieces are two and set up in the backup pad, and the one end of second bracing piece is connected with first baffle, and the other end of second bracing piece is connected with the tip of first bracing piece, controls and leaves the clearance between two second bracing pieces. The computer host case is placed on the second supporting rod, point contact is carried out on the case, the heat dissipation area is increased, and the heat dissipation effect is improved.
The heat dissipation mechanism comprises a refrigeration module arranged at the lower part of the base and a heat dissipation fan arranged at one side of the refrigeration module; the refrigeration module comprises a semiconductor refrigeration piece arranged on the second baffle and a temperature sensor connected with the semiconductor refrigeration piece. The semiconductor refrigeration piece cools the inside of the supporting device, and the temperature sensor senses the temperature inside the supporting device. The hot end of the semiconductor refrigeration piece is connected with the cooling fan through the heat-conducting fin, and the cooling fan cools the hot end of the semiconductor refrigeration piece.
The supporting mechanism supports the computer mainframe by adopting point support, ensures that the computer mainframe has good heat dissipation effect and good shockproof effect, completely wraps the computer mainframe by the dustproof bag, and can cool the computer mainframe by the heat dissipation mechanism so as to ensure temperature balance. The invention has stable structure and convenient use, solves the technical problem that the dust prevention and the heat dissipation cannot be ensured simultaneously in the past, and prolongs the service life of the computer.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a computer support apparatus according to the present invention.
Fig. 2 is a schematic structural view of the support mechanism of the present invention.
FIG. 3 is a left side view of the computer support apparatus of the present invention.
FIG. 4 is a rear view of the computer support apparatus of the present invention.
FIG. 5 is a front view of the computer support apparatus of the present invention.
FIG. 6 is a top view of the computer support apparatus of the present invention.
Fig. 7 is a schematic structural view of the dehumidifying mechanism of the present invention.
The meaning of the respective reference numerals is as follows:
1: base, 2: second baffle, 3: first baffle, 4: damping plate, 5: semiconductor refrigeration piece, 6: support plate, 7: second bracing piece, 8: first support rod, 9: caster, 10: sealing rope, 11: wire inlet, 12: dust bag, 13: slide fastener, 14: cooling fan, 15: temperature sensor, 16: cam, 17: roller, 18: first link, 19: second link, 20: third link, 21: storage box, 22: slide rail, 23: support, 24: cover body, 25: a gas delivery pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 7 of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Example 1
As shown in fig. 1 to 6, the present embodiment provides a computer supporting device, including a supporting mechanism for supporting a computer host case, and a heat dissipation mechanism disposed on the supporting mechanism; the supporting mechanism comprises a base and a supporting module arranged on the base 1; the heat dissipation mechanism comprises a refrigeration module arranged at the lower part of the base 1 and a heat dissipation fan 14 arranged at one side of the refrigeration module; the left and right sides of base 1 all sets up first baffle 3, both sides set up around base 1 with second baffle 2 that first baffle 3 is connected, enclose on first baffle 3 and the second baffle 2 and establish dust bag 12.
The supporting module comprises a damping plate 4 arranged on the base 1, a supporting plate 6 arranged on the damping plate 4, and a supporting component arranged on the supporting plate 6.
The refrigerating module comprises a semiconductor refrigerating piece 5 arranged on the second baffle 2 and a temperature sensor 15 arranged on one side of the semiconductor refrigerating piece 5.
The supporting part comprises a first supporting rod 8 vertically arranged on the supporting plate and a second supporting rod 7 arranged at the end part of the first supporting rod 8.
A plurality of first bracing piece 8 is two and is listed as the setting and is in backup pad 6 is last, the one end of second bracing piece 7 with first baffle 3 is connected, the other end of second bracing piece 7 with the tip of first bracing piece 8 is connected.
Set up on the second baffle 2 with 5 shape assorted through-holes of semiconductor refrigeration piece, the cold junction orientation of semiconductor refrigeration piece 5 the inboard of second baffle 2 inlay in the through-hole.
The height of the first baffle 3 and the second baffle 2 is lower than that of the computer host, and the dustproof bag 12 is arranged on the first baffle and the second baffle to wrap the host case, so that a good dustproof effect is achieved.
The damping plate 4 can slow down violent vibration from the ground, enhance the shock absorption effect, and design the damping plate 4 into a wavy shape. Set up the supporting component in the backup pad, support computer host computer machine case, a plurality of first bracing pieces 8 are two and set up in backup pad 6, and the one end of second bracing piece 7 is connected with first baffle 3, and the other end of second bracing piece 7 is connected with the tip of first bracing piece 8, controls and leaves the clearance between two second bracing pieces 7. Computer host computer machine case is placed on second bracing piece 7, and second bracing piece 7 is cylindric, and the higher authority is equipped with a plurality of bellied dots, increases the friction between host computer machine case and the second bracing piece 7, carries out the point contact to host computer machine case, and increase heat radiating area improves the radiating effect. Of course, the second support bar 7 can also be designed in other shapes. The semiconductor refrigerating sheet 5 cools the inside of the supporting device, and the temperature sensor 15 senses the temperature inside the supporting device. The inside of first baffle 3 sets up the draw-in groove, and temperature sensor 15 sets up in the draw-in groove.
Example 2
As shown in fig. 1 to 6, the present embodiment provides a computer supporting device, which is an improvement on the basis of embodiment 1: the hot end of the semiconductor refrigeration sheet 5 is connected with the heat radiation fan 14 through a heat conduction fin.
The side of dust bag 12 sets up inlet 11, set up the sealing rope 10 on the inlet 11, set up the opening of dismantling the connection on the dust bag 12.
The hot end of the semiconductor refrigerating sheet 5 is connected with a heat radiation fan through a heat conduction fin, and the heat radiation fan cools the hot end of the semiconductor refrigerating sheet.
The dustproof bag 12 is adhered to the outer sides of the first baffle plate 3 and the second baffle plate 2 and is made of dustproof cloth. The height of the first baffle 3 is slightly higher than that of the computer mainframe case, and the first baffle supports the dustproof bag 12. The side of dust bag 12 sets up inlet 11, sets up the sealing rope 10 on the inlet 11, seals the inlet, sets up the opening that can dismantle the connection on the dust bag 12, places the host computer machine case back on the base, seals with dust bag 12, should dismantle the connection and can connect for zip fastener 13, certainly also can be for other can dismantle the mode connection such as bonding. This dust bag 12 is transparent, can see the switch on the host computer machine case and temperature sensor 15's registration, and inside sets up soundproof cloth, reduces the host computer noise influence.
Example 3
As shown in fig. 1 to 7, the present embodiment provides a computer support device, which is an improvement on the basis of embodiment 2: the lower part of base 1 sets up truckle 9 and conveniently removes, and truckle 9 can be the brake truckle, and convenient the fixing simultaneously.
A dehumidifying mechanism is arranged on one side of the base 1, and comprises a motor arranged on the base 1, a cam 16 connected with an output shaft of the motor, and a dehumidifying module driven by the cam 16; the dehumidifying module includes a sliding groove 22 disposed on the base 1, a storage box 21 disposed in the sliding groove 22, and a connecting member connected to the storage box 21, wherein the connecting member includes a rotating shaft, a first connecting rod 18 and a second connecting rod 19 connected to the rotating shaft, and a third connecting rod 20 connected to the second connecting rod 19. One end of the first connecting rod 18 is provided with a roller 17 which is matched with the cam 16 to rotate through a bearing, the other end of the first connecting rod 18 is fixedly connected with one end of the second connecting rod 19, and the intersection of the first connecting rod 18 and the second connecting rod 19 penetrates through the rotating shaft. The rotating shaft is arranged on the base 1 through a bracket 23. The other end of the second connecting rod 19 is also fixedly connected with one end of the third connecting rod 20, the other end of the third connecting rod 20 is fixedly connected with the storage box 21, a net opening is formed in the storage box 21, and allochroic silica gel particles are placed in the storage box 21. Whether the silica gel granule that discolours can detect in the strutting arrangement moist, dehumidifies strutting arrangement simultaneously, wets in the strutting arrangement, and the silica gel granule that discolours absorbs moisture, becomes red.
Example 4
As shown in fig. 1 to 7, the present embodiment provides a computer support device, which is an improvement on embodiment 3: the base 1 is provided with a cover body 24 for wrapping the dehumidifying mechanism, and the cover body 24 is provided with meshes for wrapping the dehumidifying mechanism. The heat radiation fan 14 is provided with a gas collecting hood, the gas collecting hood is connected with one end of a gas pipe 25, the gas pipe 25 penetrates through the second baffle 2, the other end of the gas pipe 25 is connected with the storage box 21, the base 1 is provided with a gas outlet, and a plug is arranged on the gas outlet. The gas pipe 25 is a folding pipe, and two ends of the gas pipe are clamped in the gas collecting hood and the storage box. The hot air exhausted by the heat radiation fan 14 is conveyed into the storage box 21 through the air conveying pipe 25, and the allochroic silica gel particles are dried. The heat generated by the semiconductor refrigeration sheet is blown into the storage box through the cooling fan, and the color-changing silica gel particles after moisture absorption are dried, so that the energy is saved, and the color-changing silica gel particles are recycled.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A computer support device, characterized by: the computer mainframe comprises a supporting mechanism for supporting a computer mainframe case and a heat dissipation mechanism arranged on the supporting mechanism; the supporting mechanism comprises a base and a supporting module arranged on the base; the heat dissipation mechanism comprises a refrigeration module arranged at the lower part of the base and a heat dissipation fan arranged at one side of the refrigeration module; the left and right sides of base all sets up first baffle, both sides set up around the base with the second baffle that first baffle is connected, enclose on first baffle and the second baffle and establish dust bag.
2. A computer support apparatus as defined in claim 1, wherein: the supporting module comprises a damping plate arranged on the base, a supporting plate arranged on the damping plate and a supporting component arranged on the supporting plate.
3. A computer support apparatus as defined in claim 2, wherein: the refrigeration module comprises a semiconductor refrigeration piece arranged on the second baffle and a temperature sensor arranged on one side of the semiconductor refrigeration piece.
4. A computer support apparatus as defined in claim 2, wherein: the supporting component comprises a first supporting rod vertically arranged on the supporting plate and a second supporting rod arranged at the end part of the first supporting rod.
5. A computer support apparatus as defined in claim 4, wherein: the first support rods are arranged on the support plates in two rows, one end of each second support rod is connected with the corresponding first baffle, and the other end of each second support rod is connected with the end of the corresponding first support rod.
6. A computer support apparatus as defined in claim 4, wherein: the second baffle is provided with a through hole matched with the shape of the semiconductor refrigerating sheet, and the cold end of the semiconductor refrigerating sheet faces towards the inner side of the second baffle and is embedded in the through hole.
7. A computer support apparatus as defined in claim 6, wherein: the hot end of the semiconductor refrigeration piece is connected with the heat dissipation fan through the heat conduction fin.
8. A computer support apparatus as defined in claim 7, wherein: the side of the dust bag is provided with a wire inlet, the wire inlet is provided with a sealing rope, and the dust bag is provided with an opening which can be detachably connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011083296.XA CN112128562A (en) | 2020-10-12 | 2020-10-12 | Computer strutting arrangement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011083296.XA CN112128562A (en) | 2020-10-12 | 2020-10-12 | Computer strutting arrangement |
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CN112128562A true CN112128562A (en) | 2020-12-25 |
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CN202011083296.XA Pending CN112128562A (en) | 2020-10-12 | 2020-10-12 | Computer strutting arrangement |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113108009A (en) * | 2021-04-14 | 2021-07-13 | 浙江弘毅科技有限公司 | Electromechanical device installs protection device with shock-absorbing function |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0323194D0 (en) * | 2003-10-03 | 2003-11-05 | Lu Wen Chen | Assembly of computer and monitor |
CN206282211U (en) * | 2016-12-13 | 2017-06-27 | 成都大学 | A kind of dust-proof main frame of energy-conservation |
CN206523832U (en) * | 2017-02-26 | 2017-09-26 | 孟景 | A kind of computer heat sink |
CN107272847A (en) * | 2017-06-30 | 2017-10-20 | 河南工业职业技术学院 | A kind of main frame tank cooling device |
CN206961003U (en) * | 2017-01-19 | 2018-02-02 | 江西财经职业学院 | A kind of Shockproof radiating-type main frame base |
CN207011149U (en) * | 2017-07-31 | 2018-02-13 | 郑州工商学院 | A kind of support meanss for weak current equipment |
CN207096911U (en) * | 2017-06-21 | 2018-03-13 | 银川网曌科技有限公司 | A kind of computer radiating shell |
CN108052176A (en) * | 2017-12-12 | 2018-05-18 | 李聪颖 | A kind of security application device of computer information |
CN207867409U (en) * | 2018-01-17 | 2018-09-14 | 缙云县广华科技有限公司 | A kind of Internet of Things computer host laying rack |
-
2020
- 2020-10-12 CN CN202011083296.XA patent/CN112128562A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0323194D0 (en) * | 2003-10-03 | 2003-11-05 | Lu Wen Chen | Assembly of computer and monitor |
CN206282211U (en) * | 2016-12-13 | 2017-06-27 | 成都大学 | A kind of dust-proof main frame of energy-conservation |
CN206961003U (en) * | 2017-01-19 | 2018-02-02 | 江西财经职业学院 | A kind of Shockproof radiating-type main frame base |
CN206523832U (en) * | 2017-02-26 | 2017-09-26 | 孟景 | A kind of computer heat sink |
CN207096911U (en) * | 2017-06-21 | 2018-03-13 | 银川网曌科技有限公司 | A kind of computer radiating shell |
CN107272847A (en) * | 2017-06-30 | 2017-10-20 | 河南工业职业技术学院 | A kind of main frame tank cooling device |
CN207011149U (en) * | 2017-07-31 | 2018-02-13 | 郑州工商学院 | A kind of support meanss for weak current equipment |
CN108052176A (en) * | 2017-12-12 | 2018-05-18 | 李聪颖 | A kind of security application device of computer information |
CN207867409U (en) * | 2018-01-17 | 2018-09-14 | 缙云县广华科技有限公司 | A kind of Internet of Things computer host laying rack |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113108009A (en) * | 2021-04-14 | 2021-07-13 | 浙江弘毅科技有限公司 | Electromechanical device installs protection device with shock-absorbing function |
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